JPH0760841B2 - Electronic component mounting device - Google Patents

Description

The present invention relates to an electronic component mounting apparatus, in which a flip chip is turned upside down, its misalignment is corrected, and then the flip chip is transferred and mounted on a substrate. is there.

(Prior Art) As a type of electronic component, a flip chip in which bumps (protruding electrodes) are provided on a die by soldering or the like is known. FIG. 6 shows a conventional means for mounting a flip chip of this type on a substrate. A flip chip 102 is mounted on the lower surface of a wafer 101 with the surface on which bumps 103 are formed as the front surface. Hold the stick 104 in your hand, microscope 1
While visually recognizing the working point by 05, the chip 102 is pushed down by the pin 106 and mounted on the substrate 107.

(Problems to be Solved by the Invention) However, since the above-mentioned conventional means is a manual work, there is a problem that mounting efficiency and mounting accuracy are not improved.

Therefore, an object of the present invention is to provide an apparatus capable of accurately and automatically mounting a flip chip mounted on a wafer or the like with a bump forming surface as a surface on a substrate with high accuracy.

(Means for Solving the Problem) To this end, the present invention provides a chip supply unit equipped with a flip chip with a bump forming surface as a surface, and a front / back reversing device for taking up the flip chip and reversing the front and back.
A visual inspection device for observing the positional displacement of the flip chip that has been turned upside down, a transfer head that is driven by an XY direction moving device to take up the flip chip that has been turned upside down and transfer it to a substrate, and the appearance inspection device Based on the observation result, the electronic component mounting apparatus is composed of a control device that controls the XY direction moving device so that the nozzle of the transfer head lands on the center of the flip chip.

(Operation) In the above-described configuration, the front / back reversing device takes up the flip chip mounted on the chip supply unit such as a wafer with the bump formation surface as a front surface and reverses it. In that state, the visual inspection apparatus observes the flip chip and detects the positional deviation. Next, the transfer head approaches the flip chip whose surface is turned upside down, lands on the center of the bump non-formed surface and takes it up to correct the positional deviation and transfer and mount it on the substrate.

Example 1 Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus, in which 1 is a table and 2 is a main body box installed on the table. 3 is a transport path for the substrate 4 consisting of an endless chain,
The board 4 on which the electronic component is mounted is carried in on the table and carried out from here. Reference numeral 14 denotes a positioning portion for the substrate 4 provided on the transport path 3, which is composed of a clamp plate. Reference numeral 5 denotes a wafer as a chip supply unit arranged on the platform 13 in front of the conveyor 3, and a large number of flip chips are mounted on the upper surface thereof. The chip supply unit may be a tray containing chips.

A transfer head 6 has a nozzle 6a for adsorbing a flip chip. Numerals 8 and 9 are XY direction moving devices for moving the transfer head 6 in XY directions, and numerals 10 and 11 are driving motors thereof. Reference numeral 17 denotes a camera integrally equipped with the transfer head 6, which is moved integrally with the transfer head 6 by driving the XY direction moving devices 8 and 9, and displays the print pattern of the substrate 4 positioned by the positioning unit 14. Observe misalignment.
Reference numeral 18 denotes a θ-direction driving device mounted on the transfer head 6, which includes a motor 18a and a belt 18b, and rotates the nozzle 6a in the θ-direction about its axis. Reference numeral 7 is a die ejector arranged below the wafer 5, and 7a is a pin thereof. The pin 7a pushes up a flip chip on the wafer 5. Reference numeral 20 denotes a box on the side of the wafer 5, in which a front / back flip device for flip chips is housed, and 35 is an appearance inspection device including a camera arranged above the box.

FIG. 2 is a development view showing a working state, in which 22 is a front / back reversing device disposed in the box 20, 23 is a fan-shaped gear, and 24 is meshed with the gear 23 and rotated along it. The gear, 25 is a rotating rod. Reference numeral 26 denotes an arm extending from the gear 24, and a tip suction portion 27 is attached to the tip of the arm. F is a flip chip mounted on the wafer 5,
B is a bump, which is arranged in parallel on the wafer 5 with the bump forming surface as the front surface. The appearance inspection device 35 is above the flip chip F flipped by the front / back flip device 22 and observes the displacement of the flip chip F in the xyθ direction. Reference numeral 30 is a control device such as a computer that controls the motors 10, 11, 18a based on the observation results of the cameras 17 and the appearance inspection device 35.

The present apparatus has the above-mentioned configuration, and its operation will be described below.

First, the XY-direction moving devices 8 and 9 are driven to move the camera 17 above the substrate 4 positioned by the positioning unit 14, and the displacement of the print pattern of the substrate 4 is observed. Next, referring to FIG. 2, by driving the motor M, the front / back reversing device 22
The arm 26 of the
When 27 approaches the wafer 5, the lower die ejector 7
Pin 7a protrudes to push up the flip chip F on the wafer 5, and the suction portion 27 sucks on the bump forming surface to take up the flip chip F (see reference numeral in the figure).
Next, the arm 26 rotates counterclockwise and the flip chip F
In the state in which is reversed, the visual inspection apparatus 35 observes the positional deviation of the flip chip F by the xyθ method (see reference numeral). FIG. 3 is an observation view thereof, where FA and OA are ideal flip-chip positions and their centers pre-stored in the computer, F and O are actual flip-chip positions and their centers, and Δx and Δy. , Δθ is the displacement in the xyθ direction.
Note that, in FIG. 2, reference numerals 1 to 3 indicate work orders.

Based on this observation result, the transfer head 6 has the appearance inspection device 35.
To the flip chip F, and the flip chip 27 held by the chip suction portion 27 is taken up (see reference numeral). In this case, by driving the XY direction moving devices 8 and 9 so that the nozzle 6a lands on the center O of the flip chip F, the positional deviations Δx and Δy in the xy direction are corrected. Third
In the figure, reference numeral 6a indicates a nozzle landed on the center O in this manner.

The transfer head 6 that has taken up the flip chip F is
The flip chip F is moved onto the substrate 4 and transferred and mounted on the substrate 4 (see reference numeral), and the θ direction drive device 18 is driven in the middle of the process to drive the flip chip F and the printed pattern of the substrate 4 in the θ direction. While correcting the positional deviation,
The XY direction moving devices 8 and 9 are driven so as to correct the displacement of the print pattern in the xy direction, and the flip chip F is mounted on the substrate 4.

When the transfer head 6 is a die collet 6b having a box-shaped suction section as shown in FIG. 4, the suction section 27 of the arm 26 is used.
When taking up the flip chip F held by the die collet 6b, displacement in the xy direction Δx, Δy
If not only the positional deviation Δθ in the θ direction is also corrected and the die collet 6b is landed on the flip chip F, the fifth
As shown in the drawing, the four sides of the rectangular suction hole 61b of the die collet 6b can be perfectly matched with the four sides of the flip chip F for take-up.

(Effects of the Invention) As described above, according to the present invention, the chip supply unit equipped with the flip chip with the bump forming surface as the surface, the front and back reversing device for taking up the flip chip and reversing the front and back. The appearance inspection device that observes the displacement of the flip chip, the transfer head that drives the XY direction moving device to take up the flip chip that has been turned upside down and transfers it to the substrate, and the observation result of the appearance inspection device. Based on the above, since the electronic component mounting device is configured by the control device that controls the XY direction moving device so that the nozzle of the transfer head lands on the center of the flip chip, the bump forming surface is used as the surface of the wafer, etc. The flip chip mounted in the chip supply unit can be flipped over and mounted on the substrate with high accuracy.

[Brief description of drawings]

1 shows an embodiment of the present invention. FIG. 1 is an overall perspective view of an electronic component mounting apparatus, FIG. 2 is a developed view showing a working state, FIG. 3 is an external view, and FIG. 4 is a die. FIG. 5 is a side view of the collet, FIG. 5 is an external view, and FIG. 6 is a side view of conventional means. 4 ... Substrate 5 ... Chip supply unit 6 ... Transfer heads 6a, 6b ... Nozzles 8, 9 ... XY direction moving device 14 ... Positioning unit 22 ... Front / back reversing device 35 ... Appearance inspection device B ... Bump F ... Flip chip

Claims (1)

[Claims] 1. A chip supply unit equipped with a flip chip with a bump forming surface as a surface, a front and back reversing device for taking up the flip chip and reversing the front and back, and observing a positional deviation of the flip chip that has been reversed. The appearance inspection device, the transfer head that is driven by the XY direction moving device and takes up the flip chip that has been turned upside down and transfers it to the substrate, and based on the observation result of the appearance inspection device, the nozzle of the transfer head is An electronic component mounting apparatus comprising a control device that controls the XY direction moving device so that the device is landed on the center of a flip chip.