JPH0256946A - Electronic parts mounting device - Google Patents

Abstract

PURPOSE:To precisely perform automatic mounting on a board by sucking a bump forming face of a flip chip equipped to a chip supply part such as a wafer by a chip sucking part to turn over the flip chip. CONSTITUTION:When an arm 26 is moved to rotate clockwise and a chip suction part 27 of the edge part thereof approaches a wafer 5, a pin 7a of a downward die ejector 7 projects to push up a flip chip F, and a suction part 7 sucks a bump forming face to take up it. Next, the arm 26 is moved to rotate unclockwise, flip chip F is turned over, a nozzle 6a of a transfer head 6 approaches it and the flip chip F is taken up. In this case, the flip chip F, with the bump forming face downward, is sucked to the nozzle 6a. XY- directional moving devices 8, 9 and a theta-directional driving device 18 are controlled so that the position discrepancy of an xytheta-direction of a printed pattern of a board 4 can be corrected. Thereby automatic mounting can precisely be performed on the board 4.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an electronic component mounting apparatus, in which a flip chip is mounted on a board by turning it upside down.

(Conventional technology) As a type of electronic component, bumps (
Flip chips with protruding electrodes are known.

FIG. 8 shows a conventional means for mounting this type of flip chip on a substrate, in which a flip chip 102 is mounted on the bottom surface of a wafer 101 with the surface on which bumps 103 are formed on the front surface, and an operator can push the flip chip 102 onto a substrate. Hold the stick 104 in your hand,
While visually checking the work point with the microscope 105, press the pin 106.
The chip 102 is pushed down and mounted on the substrate 107.

(Problems to be Solved by the Invention) However, since the above-mentioned conventional means is performed manually, there is a problem that mounting efficiency and mounting accuracy cannot be improved.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus that can automatically and accurately mount a flip chip mounted on a wafer or the like with the bump formation surface facing up onto a substrate.

(Means for Solving the Problems) For this purpose, the present invention includes a chip supply unit equipped with a flip chip with its bump forming surface facing up, and a chip supply section that adsorbs the flip chip onto the bump forming surface and ticks it up. A front-side reversing device equipped with a chip suction unit that reverses the front and back sides of the flip chip adsorbs it on the non-bump-formed surface of the reversed flip chip, ticks it up, and moves the flip chip to the positioning unit by driving an XY direction moving device. An electronic component mounting apparatus is comprised of a transfer head that transfers and mounts the electronic component onto a positioned board.

(Function) In the above configuration, the chip suction section of the flipping device attracts the bump forming surface of the flip chip mounted on the chip supply section such as a wafer, ticks up the flip chip, and flips the chip upside down. Next, the transfer head approached the tip of the chip that had been turned upside down, attracted it to the non-bump-formed surface, picked it up from the chip suction section, and was driven by the XY direction moving device to position it in the positioning section. Transfer and mount it on the board.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus, where 1 is a table and 2 is a main body box placed on the table. 3 is a conveyance path for a board 4 consisting of an endless chain;
A board 4 on which electronic components are mounted is carried onto a table and taken out from there. 14 is a substrate 4 provided on the conveyance path 3
The positioning part consists of a clamp plate. 5
is a wafer serving as a chip supply unit placed on a platform 13 in front of the conveyor 3, and a large number of flip chips are mounted on the upper surface of the wafer. 6 is a transfer head,
A nozzle 6a protrudes to attract the flip chip.

8°9 is an X point for moving the transfer head 6 in the XY force direction.
The Y direction moving device, 10.11 is its driving motor. Reference numeral 18 denotes a θ-direction drive device installed in the transfer head 6, which is composed of a motor 18a and a belt 18b, and rotates the nozzle 6a in the θ-direction about its axis. 17
A camera is integrally equipped with the transfer head 6, and moves together with the transfer head 6 to observe the positional deviation of the printed pattern on the substrate 4. 7 is a gouer ejector disposed below the wafer 5; 7a is a pin thereof; the pin 7a pushes up the flip chip on the wafer 5;

Reference numeral 20 is a box located on the side of the wafer 5 in which a flip-chip reversing device is housed, and 21 is an appearance inspection device.Next, these will be described in detail with reference to FIG.

Reference numeral 22 denotes a front-back reversing device disposed inside the box 20, 23 a fan-shaped gear, 24 a gear that meshes with and rotates along this gear 23, and 25 a rotation rod. Reference numeral 26 denotes an arm extending from the gear 24, and a tip suction section 27 is attached to the tip end of the arm. F is a flip chip mounted on the wafer 5, B is a bump thereof, and the flip-knob chips F are arranged in parallel on the wafer 5 with the bump forming surface facing up. The nozzle 6a of the transfer head 6 approaches the flip chip F which has been turned over by the front-back reversing device 22, and ticks up the flip chip by adsorbing it to the bump-free surface.

The appearance inspection device 21 includes a camera 21a and a reflecting mirror 21.
1b, and a light source section 21C. The transfer head 6 that has picked up the flip chip F is driven by the XY direction moving device 8.9 and moves to the eyepiece section 21.
b, and once stopped there, the flip chip F is observed from below by the camera 21a, and its positional deviation in the xyθ directions is detected. Reference numeral 30 denotes a control device such as a computer, which is connected to each camera 17 213, and controls each of the above-mentioned motors as a positional deviation correcting device to correct the positional deviation of the flip chip F based on the observation results. Control 10.11.18a.

This device has the above-mentioned configuration, and its operation will be explained next.

First, the XY direction moving devices W8 and 9 are driven, and the camera 17
is moved above the substrate 4 positioned by the positioning section 14, and the positional shift of the printed pattern printed on the substrate 4 is detected. Next, in FIG. 2, when the arm 26 is rotated clockwise by the drive of the motor M and the chip suction part 27 at the tip approaches the wafer 5, the pin 7a of the lower dienizift protrudes and is placed on the wafer 5. The flip chip F is pushed up, and the suction part 27 adsorbs it to the bump forming surface and ticks it up (indicated by ■ in the figure). Next, the arm 26 rotates counterclockwise to turn the flip chip F upside down (symbol ■). Therefore, the nozzle 6 of the transfer head 6
a approaches this and ticks up this flip chip F (symbol ■). In this case, since the flip chip F is turned upside down as described above, it is attracted to the nozzle 6a with the bump forming surface facing downward.

Next, the transfer radar 6 moves to the visual inspection device 21 and temporarily stops above the eyepiece 21b, and in this state, the positional shift in the xyθ directions of the flip chip F attracted to the nozzle 6a is observed (reference numeral ■.

■). Next, the transfer head 6 moves onto the substrate 4 positioned by the positioning section 14, and transfers the flip chip F onto the substrate 4.
(symbol ■). In this case, xyθ of the flip chip F detected by the appearance inspection device 21 as described above.
The motors 10, 11.18a of the XY direction moving devices 8, 9 and the θ direction driving device 18 are used to correct the positional deviation in the XY direction and the positional shift in the xYθ directions of the printed pattern of the substrate 4 detected in advance by the camera 17. is controlled to mount the flip chip F on the substrate 4. In this way, according to the present means, the flip chip F mounted on the wafer 5 with the bump formation surface facing upward can be reversed and subjected to positional correction, and then automatically mounted on the substrate 4 with high accuracy. Note that the chip supply section may be one in which a tray 28 is equipped with a flip chip F as shown in FIG.

(Example 2) The apparatus shown in FIG.
This embodiment differs from the first embodiment in that an external inspection camera 35 is provided above the chip suction section 27 in the inverted state.

Next, the operation will be explained. With the flip chip F on the wafer 5 being ticked up and reversed by the front-back reversing device 22 as described above, the position shift of the flip chip F in the xyθ directions is detected by the camera 35. is observed. FIG. 5 shows the observation state, and the FA
.

OA is the ideal flip chip position stored in advance in the computer and its center, F and O are the actual flip chip position and its center ΔX, Δy, and Δθ are positional deviations in the xyθ directions.

When the positional deviations ΔX, Δy, and Δθ are detected in this manner, the transfer radar 6 moves between the camera 35 and the flip chip F, and picks up the flip chip F held by the chip suction section 27. In this case, by driving the XY direction moving device 8.9 so that the nozzle 6a lands on the center 0 of the flip chip F, the position shift in the xy force direction Δ
Correct X and △y. In FIG. 5, reference numeral 6a indicates the landing position of the nozzle that is corrected in this way and lands on the center 0 of the flip chip F. In FIG. 4, the symbols ■ to ■ represent the order of operation.

The transfer head 6 that has ticked up the flip chip F is
The flip chip F is moved onto the board 4 and mounted on the board 4, but in the middle of the process, the θ direction drive bag! 1B is driven to correct the positional deviation in the θ direction of the printed pattern on the flip chip F and the substrate 4, and also to
XY direction moving device 8.9 to correct positional deviation in force direction
is driven to mount the flip chip F on the substrate 4.

If the nozzle installed in the transfer head 6 is Daicholera 1-6b which has a box-shaped suction part as shown in FIG. If we correct not only the positional deviations ΔX and Δy in the xy force direction but also the positional deviation Δθ in the θ direction and land the Daicolella 1-6b on the flip chip F, as shown in FIG. 7, the Daicollet 6b rectangular suction hole 61
Tick-up can be performed with the four sides of b completely aligned with the four sides of flip chip F.

(Effects of the Invention) As explained above, the present invention includes a chip supply section in which a flip chip is equipped with the bump forming surface facing up, and a chip supply unit that is equipped with a flip chip with the bump forming surface facing up, and a chip feeding section that adsorbs the flip chip to the bump forming surface, ticks it up, and turns it upside down. A front-side reversing device equipped with a chip adsorption unit picks up the non-bump-formed surface of the reversed flip chip by adsorbing it, and the flip chip is positioned in the positioning unit by driving an XY direction moving device. It consists of a transfer head that transfers and loads the board onto the board.
A flip chip installed in the chip supply unit with the bump formation side facing up can be turned over and automatically mounted on a substrate.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is an overall perspective view of an electronic component mounting apparatus, Fig. 2 is an exploded view showing the working state, and Fig. 3 is an illustration of another embodiment of the supply section. A side view, FIGS. 4 and 5 are a developed view and an external plan view showing the working state of another embodiment, and FIGS. 6 and 7 are a front view of the transfer head of another embodiment and a diagram showing it during tick-up. FIG. 8 is a side view of the conventional means. 4... Substrate 5.28... Chip supply section 6... Transfer head 8.9... B...Bump F...Flip chip

Claims (1)

[Claims] A chip supply unit that equips a flip chip with the bump forming surface facing up; a flipping device equipped with a chip suction unit that sucks the flip chip onto the bump forming surface, takes it up, and flips it inside out; The present invention is characterized by comprising a transfer head that adsorbs and picks up the non-bump-formed surface of the flip chip, and transfers and mounts the flip chip onto a substrate positioned in a positioning section by driving an XY direction moving device. electronic component mounting equipment.