JPH0236599A - Packaging system of electronic component - Google Patents

Abstract

PURPOSE:To correct the positional deviation of an electronic component through a simple system by a method wherein the positional deviation of the component on a recognizing stage is detected by a camera, which is corrected to enable the component to be transferred and mounted on the substrate of a positioning section. CONSTITUTION:X-Y direction transferring devices 13 and 14 are driven to monitor the printed pattern of a substrate 16 by a camera 18 to detect its positional deviation. A mass-consumed type electronic component P is taken up from a tape unit 4 of a second feed section 5 through a nozzle 20 of a transferring head 19 and mounted on the substrate 6. In this process, a transferring head 26 transfers a small-consumed type electronic component P to a recognizing stage 30, and the positional deviation of the component P is recognized by a camera 33. The devices 13 and 14 are driven to make the nozzle 20 descend and touch the center O of the component P and take it up, the nozzle 20 is made to rotate about its axis, and the component P is packaged on the substrate 6 as the positional deviation of the printed pattern is corrected.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a mounting system for electronic components, which uses a camera to collectively recognize positional deviations of electronic components, corrects them, and then mounts them on a board. This is what I did.

(Prior Art) Conventionally, as shown in FIGS. 5 and 6, an electronic component mounting apparatus includes a supply section 101 for electronic components P in which a supply unit for electronic components such as a tray 100 is placed, and a base tffE10.
1) A stage 106 for correcting the positional deviation of the electronic component P is provided between the positioning sections 103, and the nozzle 104 of the transfer head transfers the electronic component P in the tray pocket 105 to the correction stage 106, where the position correction chuck 10
7 to the corners of the electronic component P, the positional deviation of the electronic component P in the XYθ directions is mechanically corrected, and then the nozzle 104 is used again to tick up the substrate
There is a known device that can be transferred and mounted on the 02.

(Problems to be Solved by the Invention) However, the above-mentioned conventional device requires the chuck 107 and its driving device, which makes the device complicated, and the chuck 107 is pressed against the electronic component P to correct misalignment. Therefore, there was a problem in that the electronic component P was easily damaged.

Therefore, an object of the present invention is to provide a means for correcting the positional deviation of an electronic component in the XYθ directions and mounting the electronic component on a board using a simple system.

(Means for Solving the Problems) To this end, the present invention provides an electronic component supply section, a board positioning section, an appearance recognition stage, a camera for observing electronic components on this appearance recognition stage, and a camera that moves in the X and Y directions. An electronic component mounting apparatus is constituted by a transfer head that is driven by the device to transfer electronic components from a supply section to a recognition stage, and from this appearance recognition stage to a substrate of a positioning section. Then, the camera detects the positional deviation in the XYθ directions of the electronic component transferred to the appearance recognition stage, and the nozzle of the transfer head lands on the center of the electronic component to correct the positional deviation in the XY force direction, After correcting the positional deviation in the θ direction by driving the θ direction driving device of the nozzle, the nozzle is transferred and mounted on the substrate of the positioning section.

(Function) In the above configuration, the camera detects the positional shift in the XYθ directions of the electronic component transferred from the electronic component supply section to the appearance recognition stage, and based on the detection result, the XY direction moving device is driven to move the nozzle electronically. By landing on the center of the component and ticking it up, the positional deviation of the electronic component in the XY force direction is corrected, and the θ-direction drive device of the nozzle is driven to correct the θ-direction before mounting it on the board. .

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus, in which reference numeral 1 denotes a table on both sides of its upper part.

A supply section 3 for a first electronic component P consisting of a magazine 2 and a supply section 5 for a second electronic component consisting of a tape unit 4 are arranged between the re-supply section 3.5. A positioning portion 7 for the substrate 6 is provided. As will be described later, by arranging supply units of different types or the same type, such as the magazine 2 and the tape unit 4, on both sides of the positioning unit 7, electronic components can be attached to the board 6 in various ways. can be advantageously implemented. 8 is a conveyor for carrying the board 6 into the positioning section 7 and carrying it out from there; 9 is a tray for storing electronic components installed in the magazine 2;

Reference numeral 12 denotes a main body box erected on the side of the table 1, and XY direction moving devices 13 and 14 are arranged on the upper part of the main body box. 15 and 16 are the driving motors. 17
19 is a first transfer head connected to this mounting portion 17; 20 is its nozzle; and 21 is attached to the side of the mounting portion 17. This is a light source consisting of a LED surface light emitter. 2
Reference numeral 2 denotes a θ-direction drive device consisting of a motor 22a and a belt 22b, which rotates the nozzle 20 around its axis to move the θ-direction of the electronic component attracted to the lower end of the nozzle 20.
30 is an electronic component appearance recognition stage provided between the supply section 3 and the positioning section 7, which performs direction correction; 26 is a second transfer head that transfers the electronic components on the tray 9 to this appearance recognition stage 30; 27 and 28 are its drive motor and traction wire.

FIG. 2 shows details of the appearance recognition stage 30, in which a reflecting plate 32 is diagonally installed below a transparent stage plate 31 such as a glass plate on which electronic components P are placed.
A camera 33 is arranged on the side thereof. Reference numeral 34 denotes a transparent plate disposed directly below the stage plate 31, and both plates 31
A space 35 is secured between the angles 34 and 34. In addition, an intake hole 36 is formed in the center of the stage plate 31.
By suctioning air from a pipe 37 connected to the space 35 using a pump (not shown) or the like, the electronic component P is fixed on the stage plate 31 by negative pressure. Reference numeral 38 denotes a seating portion made of an elastic material and provided around the intake hole 36. By moving the light source 21 above the stage 30 and irradiating light downward, the electronic component P is observed as a silhouette with the camera 33, and a positional shift of the electronic component P in the XYθ directions is detected.

This device has the above-mentioned configuration, and the mounting work will be explained next.

First, the camera 18 is moved by driving the XY direction moving devices 13 and 14.
is transferred above the substrate 6, and the camera 18
The printed pattern is observed and its positional shift in the XYθ directions is detected. Fig. 4 shows the detection method, where 6 is the above board and 6'' is the master board that serves as a reference. A, B, A'' B + are the reference points of each board 6°6'. Based on the deviation of the reference points A and A', the positional deviation amount of the printed pattern on the board 6 in the XY force direction △x 2 + △y
2 is detected, and a line 1.2 connecting each point is detected. A positional deviation amount θ2 in the θ direction is detected from l'.

Next, the XY direction moving devices 13 and 14 are driven, and the nozzle 20 of the first transfer head 19 picks up the electronic component P at the tip of the tape unit 4 of the second supply section 5 and mounts it on the board 6. do.

Generally, this type of tape unit includes mass-consumption type electronic components, and therefore, the electronic components P of this tape unit 4 are mounted by the first transfer head 19 being placed in the supply section 5.
This is done at high speed by reciprocating between the and substrate 6. Meanwhile, the second transfer head 26 transfers the electronic component P in the tray 9, which generally stores electronic components of a small consumption type, to the appearance recognition stage 30, and uses the camera 33 to detect the positional deviation of the electronic component P in the XYθ directions. Recognize it. Figure 3 shows this situation, where P is the actual electronic component placed on the recognition stage 30, P'' is the ideal position of the electronic component, and 0.0° is the center of each. The electronic component P moves in the XYθ directions at △x1°△y1. θ1
This is causing a positional shift.

Next, based on the observation result of the camera 33, the XY direction moving device 13.14 is driven to make the nozzle 20 land on the center 〇 of the electronic component P which has been displaced and perform a tick-up (Nozzle symbol in Fig. 3). 20), positional deviation △x
1. Correct Δy1. In addition, if the nozzle is a Guicolette type nozzle equipped with a box-shaped suction part, if θ1 is also corrected at the same time and the suction part lands on the electronic component, the four sides of the suction part 50 can be It can be landed in perfect alignment with the four sides of the electronic component P.

Next, while the nozzle 20 picks up the electronic component P on the recognition stage 30 and transfers it to the board 6, the motor 22a is driven to rotate the nozzle 20 around the axis, thereby changing the angles of θ1 and θ2. After performing correction, the positional deviation Δx2 of the printed pattern on the substrate 6 is further corrected. Drive the XY direction moving device 13.14 to correct Δy2,
The electronic component P is mounted on the board 6. In this way, according to this means, the positional deviation of the electronic components P is recognized at once on the appearance recognition stage 30 by the camera 33, and the motor 15 of each of the above-mentioned devices 13, 14, 22 as the positional deviation correction means,
16. By driving 22a, the XY
Positional deviation in the θ direction can be easily corrected. Note that each motor 15, 16, 22a, etc. is controlled by a control device such as a computer (not shown).

In the above-mentioned mounting mode, the electronic components of the tape unit 4, which are often equipped with electronic components that consume a large amount, are mounted at high speed by high-speed reciprocating motion between the supply section 5 and the substrate 6 of the first transfer head 19. The electronic components on the tray 9, which is often equipped with electronic components of low consumption, are mounted on the substrate 6 at low speed by the second transfer head 26 and the first head 19. However, as in this device, different types of supply parts 3.5 such as a tray and a tape unit are arranged on both sides of the positioning part 7 of the substrate 6, and two transfer heads 1 are provided.
If 9.26 is installed, electronic components can be mounted in even more various ways. That is, for example, the first transfer head 19 transfers the electronic components of the tape unit 4 of the supply section 5 to the recognition stage 30 and transfers them to the camera 3 as described above.
3 recognizes the positional deviation in the XYθ directions, and then the nozzle 20 of this transfer head 19 lands on the center of the electronic component on the stage 30 to correct the positional deviation in the XY force direction. It is also possible to correct the electronic component in the θ direction while it is being picked up from above 30 and transferred to the board 6, and then to mount it on the board 6. In this case, the other transfer head 26 is therefore completely at rest.

In addition, when the electronic components in one of the two supply sections 3 and 5 are out of stock, the supply of electronic components from that supply section is stopped and the tray or tape unit is replaced. During the supply of components, electronic components may be supplied only from the other supply section, and in this way, the mounting work can be continued while the device is in continuous operation without stopping the operation of the device. In addition, by equipping multiple supply units and multiple transfer heads with the positioning unit of the board in between, as in this device, the stroke of the transfer head required to transfer electronic components from the supply unit to the board can be shortened. , it can be implemented easily. Further, the present device can be modified in various ways; for example, the first and second supply sections may be equipped with the same supply unit, such as by disposing the same tape unit or tray. In this way, when one supply section runs out of electronic components, the apparatus can be continuously operated more advantageously while supplying electronic components from the other supply section.

(Effects of the Invention) As explained above, the present invention provides a stage for recognizing the external appearance of electronic components. A camera detects the positional deviation of the electronic component on the recognition stage, and the nozzle of the transfer head lands on the center of the electronic component to correct the positional deviation in the XY force direction, and the θ direction drive device of the nozzle is driven to After correcting the positional deviation in the direction, the parts are transferred and mounted on the board in the positioning section, so the positional deviation of electronic components can be recognized all at once using a camera, and the electronic components can be easily corrected and mounted on the board. can.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of an electronic component mounting apparatus, Fig. 2 is a sectional view of an external appearance recognition stage, and Figs. 3 and 4 are plan views during observation. , Figure 5, Figure 6
The figures are a side view and a plan view of a conventional device. 3.5... Electronic component supply section 6... Board 7... Positioning section 13.14... XY direction moving device 19... Transfer head 20... Nozzle 22... θ direction drive Device 30...Appearance recognition stage 33...Camera P...Electronic component ○...Electronic component center agent! (Nikko 7) Takashi No Shige and 1 other figure

Claims (1)

[Claims] An electronic component supply section, a board positioning section, an appearance recognition stage, a camera for observing electronic components on this appearance recognition stage, and an XY direction moving device to move the electronic components in the supply section to the appearance recognition stage. and a transfer head for transferring and mounting the electronic component from the appearance recognition stage to the substrate of the positioning section, the camera detects the positional deviation in the XYθ directions of the electronic component transferred to the appearance recognition stage, and the transfer head By landing the nozzle on the center of this electronic component, the positional deviation in the X and Y directions is corrected, and after correcting the positional deviation in the θ direction by driving the nozzle θ direction drive device, the nozzle is placed on the substrate of the positioning section. A mounting system for electronic components characterized by being adapted to be transferred and mounted.