WO2015040701A1

WO2015040701A1 - Component pickup nozzle and component mounting device

Info

Publication number: WO2015040701A1
Application number: PCT/JP2013/075176
Authority: WO
Inventors: 崇史宮澤; 洋志西城
Original assignee: ヤマハ発動機株式会社
Priority date: 2013-09-18
Filing date: 2013-09-18
Publication date: 2015-03-26
Also published as: JPWO2015040701A1; CN105519251B; CN105519251A; JP6047239B2

Abstract

Provided are a component pickup nozzle and a component mounting device such that it is possible to shorten the takt time in picking up a component, changing the orientation thereof, and then mounting the component. The component pickup nozzle (5) is provided with a nozzle main body part (51) which is fitted to a mounting head (122), and a component pickup part (52) which picks up a component (3a) and is fitted to the nozzle main body part (51) so as to be rotatable about a substantially horizontal direction as a rotation axis line (54a). Then, the component pickup part (52) has a pickup face (521) which abuts the component (3a) when picking up the component (3a), the component pickup part (52) being constituted so as to rotate between a first rotation position at which the component (3a) can be picked up and a second rotation position at which the component (3a) can be mounted.

Description

Component suction nozzle and component mounting device

The present invention relates to a component suction nozzle and a component mounting apparatus.

Conventionally, a component suction nozzle is known. Such a component suction nozzle is disclosed, for example, in Japanese Unexamined Patent Publication No. 2011-685.

JP-A-2011-685 discloses a bin picking system including a suction nozzle (component suction nozzle) attached to a compound hand tool so as to be rotatable about a horizontal axis as a rotation axis and to suction components. . In this bin picking system, after suctioning a component by a suction nozzle, the suction nozzle is rotated about a horizontal axis as a rotation axis to change the posture of the component and then temporarily placed, and the suction nozzle sucks the component again It is comprised so that components may be mounted in a components mounting position.

JP, 2011-685, A

However, after the suction nozzle (component suction nozzle) of the above-mentioned JP-A-2011-685 suctions the component, it is rotated with the horizontal direction as the rotation axis to change the posture of the component, and then temporarily placed again. There is a problem that the tact time is extended by temporarily placing the part because the part is sucked and placed at the part mounting position.

The present invention has been made to solve the problems as described above, and one object of the present invention is to shorten the tact time when mounting a part after suctioning the part and changing its posture. Component suction nozzle and component mounting apparatus capable of

In order to achieve the above object, the component suction nozzle according to the first aspect of the present invention is rotatably attached to a nozzle main body attached to the mounting head and the nozzle main body with a substantially horizontal direction as a pivot axis. A component suction unit for suctioning a component is provided, and the component suction unit has a suction surface that abuts the component when suctioning the component, and it is possible to mount the first rotation position and the component capable of suctioning the component It is comprised so that it may rotate between 2nd rotation position.

In the component suction nozzle according to the first aspect of the present invention, as described above, the component suction portion is between the first rotation position where the component can be held and the second rotation position where the component can be mounted. Since it is not necessary to temporarily place the part by mounting the part after suctioning the part and changing its posture by configuring so as to rotate at the time tact time can be shortened accordingly. In addition, since it is not necessary to provide a space for temporarily placing a component, it is possible to suppress an increase in the size of an apparatus for mounting the component.

In the component suction nozzle according to the first aspect, preferably, the component suction unit sucks the surface of the component other than the component mounting surface and the component mounting surface, and mounts the component mounting surface. It is configured to be able to be mounted so as to turn so as to face an object. With this configuration, even if the surface opposite to the component mounting surface can not be adsorbed, the component mounting surface and the component other than the surface opposite to the component mounting surface can be adsorbed easily. Parts can be mounted.

In this case, preferably, the component suction unit sucks a surface substantially orthogonal to the mounting surface of the component with the suction surface in the substantially horizontal direction at the first rotation position to mount the mounting surface of the component It is configured to be able to mount a component by rotating the suction surface so as to be substantially perpendicular to the mounting object at the second rotation position so as to face the object. According to this structure, even if the surface opposite to the mounting surface of the component can not be adsorbed, the adsorption surface is substantially horizontal and the surface substantially orthogonal to the mounting surface of the component is adsorbed. Since the component can be mounted with the suction surface substantially vertical so that the mounting surface is on the bottom, even if it is difficult to place the mounting surface downward, it is easily adsorbed to change the posture It can be implemented.

In the component suction nozzle according to the first aspect, preferably, the component suction unit further has a protrusion projecting in a direction intersecting with the suction surface, and the protrusion is a mounting surface of the component when mounting the component. It is configured to abut on the opposite surface of. According to this structure, when the component is mounted by attracting the surface other than the surface opposite to the mounting surface of the component, pressing the surface on the opposite side of the component mounting surface to the mounting surface by the projecting portion The components can be reliably mounted on the mounting object.

In the component suction nozzle according to the first aspect, preferably, a suction shaft for communicating the component suction portion with a rotation axis along a substantially horizontal rotation axis of the component suction portion and a negative pressure for suctioning the component. The apparatus further includes a negative pressure passage, the component suction portion includes a pivoting portion pivoting about the pivoting axis, and the suction negative pressure passage is a first adsorption provided along the pivoting axis of the pivoting axis A negative pressure passage, a second suction negative pressure passage provided in the rotating portion of the component suction portion, and a negative pressure passage connection portion connecting the first suction negative pressure passage and the second suction negative pressure passage; The pressure passage connection portion is formed such that the component suction portion communicates the first suction negative pressure passage and the second suction negative pressure passage at any position of the first rotation position and the second rotation position. . According to this structure, even when the component suction unit is rotated, the negative pressure for suctioning the component can be easily supplied to the suction surface of the component suction unit. The parts can be reliably suctioned regardless of the situation.

In the component suction nozzle according to the first aspect, preferably, the component suction unit is configured to rotate about a substantially horizontal direction as a pivot axis by air pressure of a system different from a negative pressure for suctioning the component. There is. According to this structure, the component suction portion can be easily rotated using an air pressure independent of the negative pressure for sucking the component.

The component mounting apparatus according to the second aspect of the present invention includes a component suction nozzle, an elevating device for raising and lowering the component suction nozzle, and a mounting head for mounting the component on the substrate with the component suction nozzle lowered. The suction nozzle includes a nozzle main body attached to the mounting head, and a component suction part rotatably attached to the nozzle main body about a substantially horizontal direction as a pivot axis, and adsorbs a component. And is configured to rotate between a first rotation position capable of adsorbing the component and a second rotation position capable of mounting the component when the ing.

In the component mounting apparatus according to the second aspect of the present invention, as described above, the component suction unit is between the first pivoting position at which the component can be chucked and the second pivoting position at which the component can be mounted. Since it is not necessary to temporarily place the parts by mounting the parts after adsorbing the parts and changing the attitude by configuring so as to rotate at the time, it is possible to shorten the tact time accordingly A component mounting apparatus can be provided. In addition, since it is not necessary to provide a space for temporarily placing components, it is possible to suppress an increase in the size of the component mounting apparatus.

In the component mounting apparatus according to the second aspect, preferably, the component suction unit sucks the surface of the component other than the component mounting surface and the surface opposite to the component mounting surface to mount the component mounting surface on the substrate. It is configured to turn to face and mount the component. With this configuration, even if the surface opposite to the component mounting surface can not be adsorbed, the component mounting surface and the component other than the surface opposite to the component mounting surface can be adsorbed easily. Parts can be mounted.

In this case, preferably, the component suction portion sucks a surface substantially orthogonal to the mounting surface of the component with the suction surface in the substantially horizontal direction at the first rotation position, and the component mounting surface is a substrate The component is mounted by rotating the suction surface so as to be substantially perpendicular to the substrate at the second rotation position so as to face. According to this structure, even when the surface opposite to the component mounting surface can not be adsorbed, the component can be easily mounted by adsorbing the surface substantially orthogonal to the component mounting surface.

In the component mounting apparatus according to the second aspect, preferably, the component suction unit further includes a projection projecting in a direction intersecting with the suction surface, and the projection is a mounting surface of the component when mounting the component. It is configured to abut on the opposite surface of. According to this structure, when the component is mounted by attracting the surface other than the surface opposite to the mounting surface of the component, pressing the surface on the opposite side of the component mounting surface to the mounting surface by the projecting portion The components can be reliably mounted on the mounting object.

According to the present invention, as described above, it is possible to shorten the tact time in the case of mounting a part after suctioning the part and changing its attitude.

It is the top view which showed the outline of the component mounting apparatus by 1st Embodiment of this invention. It is the side view which showed the outline of the component mounting apparatus by 1st Embodiment of this invention. It is sectional drawing which showed the shaft of the head of the component mounting apparatus by 1st Embodiment of this invention. It is the perspective view which showed the nozzle of the component mounting apparatus by 1st Embodiment of this invention. FIG. 6 is a cross-sectional view (cross-sectional view taken along the line 200-200 in FIG. 4) showing a state of a first rotational position of a nozzle of the component mounting device according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view (cross-sectional view taken along the line 200-200 in FIG. 4) showing the state of the second rotational position of the nozzle of the component mounting device according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line 210-210 of FIG. 5; FIG. 6 is a cross-sectional view taken along line 220-220 of FIG. 5; It is the figure which showed the mounted component of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the components mounting process by the controller of the components mounting apparatus by 1st Embodiment of this invention. It is the figure which showed the mounted component of the component mounting apparatus by 2nd Embodiment of this invention. It is a flowchart for demonstrating the components mounting process by the controller of the components mounting apparatus by 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described based on the drawings.

First Embodiment
The configuration of the component mounting apparatus 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 9.

As shown in FIG. 1 and FIG. 2, the component mounting apparatus 100 conveys the printed circuit board 2 from the X2 direction side to the X1 direction side by the pair of conveyors 11 and places

components

3a and 4a on the printed circuit board 2 at a predetermined work position Is a device that implements The printed circuit board 2 is an example of the “mounted object” and the “board” in the present invention.

In addition, as shown in FIG. 1, the component mounting apparatus 100 includes a base 1, a pair of conveyors 11, a head unit 12, a support 13, a rail 14, a camera unit 15, and a controller 16 (see FIG. 2) and. Further, on both sides (Y1 direction side, Y2 direction side) of the conveyor 11, trays 3 for supplying the components 3a and a plurality of tape feeders 4 for supplying the components 4a are disposed. The head unit 12 has a function of acquiring the component 3 a from the tray 3, acquiring the component 4 a from the tape feeder 4, and mounting the

components

3 a and 4 a on the printed circuit board 2 on the conveyor 11. Further, as shown in FIG. 2, the head unit 12 is provided with a nozzle 5 for sucking the component 3 a and a nozzle 6 for sucking the component 4 a. The nozzle 5 is an example of the “component suction nozzle” in the present invention.

As shown in FIGS. 1 and 9, in the tray 3, a plurality of parts 3a are horizontally arranged at predetermined intervals and mounted. The component 3a has a lead 31a, a mounting surface 32a, and a side surface 33a. A plurality of leads 31 a are provided to protrude from the mounting surface 32 a. The component 3a is placed on the tray 3 with the side surface 33a, which is a surface substantially perpendicular to the mounting surface 32a, facing upward (in the Z2 direction).

The tape feeder 4 holds a reel (not shown) around which a tape holding a plurality of parts 4a at a predetermined interval is wound. The tape feeder 4 is configured to supply the component 4a from the tip of the tape feeder 4 by rotating the reel and sending out a tape that holds the component 4a. Here, the component 4a is, for example, a small electronic component such as an IC, a transistor, a capacitor, and a resistor.

The pair of conveyors 11 have a function of transporting the printed circuit board 2 in the horizontal direction (X direction). Further, the conveyor 11 is configured to stop the printed circuit board 2 being conveyed at the mounting operation position, and the stopped board 2 is held by a substrate holding device (not shown).

The head unit 12 includes a ball nut 121, six heads 122, a camera 123, and a Z-axis drive motor 124, as shown in FIGS. The head unit 12 is configured to be movable in the X direction along the support portion 13. Specifically, the support portion 13 has a ball screw shaft 131, an X-axis drive motor 132 for rotating the ball screw shaft 131, and a guide rail (not shown) extending in the X direction. Thus, the head unit 12 is moved in the X direction together with the ball nut 121 with which the ball screw shaft 131 is screwed. The head 122 is an example of the “mounting head” in the present invention, and the Z-axis drive motor 124 is an example of the “lifting device” in the present invention.

As shown in FIG. 2, the six heads 122 are arranged in a line along the X direction on the lower surface side (the Z1 direction side) of the head unit 12. The nozzle 5 or the nozzle 6 is attached to the tip (end on the Z1 direction side) of each head 122, respectively. The

nozzles

5 and 6 are parts supplied from the tray 3 by the negative pressure generated at the tip of the

nozzles

5 and 6 by a negative pressure generator (not shown), and parts supplied from the tape feeder 4 respectively. It is possible to adsorb and hold 4a. The nozzle 5 and the nozzle 6 are each detachably attached to the head 122. That is, the nozzles 5 and the nozzles 6 are configured to be selected and attached to the head 122 according to the components to be mounted.

Each head 122 is configured to be able to move up and down (move in the Z-axis direction) with respect to the head unit 12. Specifically, the head 122 is configured to be able to move up and down between the lowered position when suctioning or mounting (mounting) the

components

3a and 4a and the raised position when transporting or photographing the

components

3a and 4a. It is done. Further, the heads 122 are configured to be separately raised and lowered by the Z-axis drive motor 124 provided in the head unit 12 for each head 122. Further, the head 122 is configured to be able to rotate around the central axes (around the Z axis) of the

nozzles

5 and 6 by an R axis drive motor (not shown).

Further, as shown in FIG. 3, the head 122 has a shaft 122a, an adsorption negative pressure passage 122b, and a rotating air passage 122c. The shaft 122a is formed to extend in the vertical direction (Z direction). Further, at the lower end of the shaft 122a, a shock absorbing shaft 122d which is slidable upward with respect to the shaft 122a is mounted via a resilient member for cushioning the shock when the component 3a is mounted. The

nozzle

5 or 6 is configured to be attached to the lower side (Z1 direction side) 122d. The suction negative pressure passage 122b passes through the interiors of the shaft 122a and the shock absorbing shaft 122d, and is in communication with a suction negative pressure passage 511 of the nozzle 5 described later, for suctioning the component 3a (4a) by the nozzle 5 (6). It is configured to supply a negative pressure. The air pressure passage 122c for rotation passes through the insides of the shaft 122a, the shock absorbing shaft 122d, and the connection pipe 53, communicates with the air pressure passage 512 for rotation of the nozzle 5 described later, and rotates the component suction portion 52 (negative pressure) ) Is configured to supply. Further, the pivoting air passage 122c is a passage of air pressure of a system different from the negative pressure for attracting the component 3a (4a). That is, negative pressure is independently supplied to the suction negative pressure passage 122b and the rotating air pressure passage 122c.

As shown in FIGS. 1 and 2, the camera 123 is configured to capture a fiducial mark (not shown) of the printed circuit board 2. As a result, the position and direction of the printed circuit board 2 can be accurately obtained, and mounting position correction and mounting direction correction of components can be performed at the time of mounting. In addition, the camera 123 is configured to be able to capture an image of the component 3 a on the tray 3 and the component 4 a of the tape feeder 4. Thereby, it is possible to acquire the position and posture of the

components

3a and 4a to be adsorbed.

The support portion 13 is configured to be movable in the Y direction orthogonal to the X direction along the rail portions 14 fixed on the base 1 and arranged so as to straddle the pair of conveyors 11. Specifically, as shown in FIG. 1, the rail portion 14 includes a guide rail 141 which supports the both end portions (X direction) of the support portion 13 so as to be movable in the Y direction, and a ball screw shaft 142 extending in the Y direction. And a Y-axis drive motor 143 for rotating the ball screw shaft 142. Further, the support portion 13 is provided with a ball nut 133 into which the ball screw shaft 142 is screwed. Thus, the head unit 12 is moved on the base 1 along the Y direction. Thus, the head unit 12 can move on the base 1 along the XY plane to any position.

As shown in FIGS. 1 and 2, the camera unit 15 is fixedly installed on the upper surface of the base 1. In addition, the camera unit 15 detects the

components

3a and 4a absorbed by the

nozzles

5 and 6 of each head 122 from the lower side to recognize the adsorption state of the

components

3a and 4a prior to the mounting of the

components

3a and 4a. It is configured to shoot.

As shown in FIG. 2, the controller 16 is mounted on the component mounting apparatus 100 with a computer as a component. The controller 16 controls the drive of the X-axis drive motor 132, the Y-axis drive motor 143, the Z-axis drive motor 124, and the R-axis drive motor (not shown) according to a program stored in advance. It is configured to perform the mounting work of 3a and 4a. Specifically, the controller 16 moves the head unit 12 above the tray 3 and the tape feeder 4 to cause the

nozzles

5 and 6 of the heads 122 to suck the

components

3 a and 4 a.

Then, the controller 16 moves the head unit 12 onto the printed circuit board 2. During this movement, the

parts

3a and 4a adsorbed by the

nozzles

5 and 6 of the heads 122 are taken by the camera unit 15 with the head unit 12 passing above the camera unit 15 for part recognition. Based on the photographed image, mounting position correction and mounting direction correction of the

components

3a and 4a adsorbed to the respective heads 122 (nozzles 5 and 6) are performed. Then, when the head unit 12 reaches onto the printed circuit board 2, each head 122 is driven downward and the components 3a attracted by stopping supply of the negative pressure to the

nozzles

5 and 6 at a predetermined timing, and 4a is mounted on the printed circuit board 2 and then each head 122 is driven to ascend.

Here, in the first embodiment, as shown in FIG. 4, the nozzle 5 includes the nozzle body 51, the component suction portion 52, the pivoting portion 53, and the pivoting shaft 54 (see FIG. 5). . As shown in FIG. 5, the nozzle body 51 has a suction negative pressure passage 511, a rotating air pressure passage 512, a piston 513, a spring 514, and a link 515. The component suction unit 52 has a suction surface 521, a protrusion 522, and a suction unit 523. The pivoting portion 53 includes a suction negative pressure passage 531. The pivot shaft 54 includes a suction negative pressure passage 541 and a negative pressure passage connection portion 542. The suction negative pressure passage 531 is an example of the “second suction negative pressure passage” in the present invention, and the suction negative pressure passage 541 is an example of the “first suction negative pressure passage” in the present invention.

The nozzle body 51 is configured to be attached to the head 122. The component suction unit 52 is rotatably attached to the nozzle main body 51 with respect to a pivot axis 54 a in a substantially horizontal direction (direction A), and is configured to suction the component 3 a. Further, the component suction unit 52 can mount the component 3a at a second rotation position (see FIG. 6) rotated about 90 degrees from the first rotation position (see FIG. 5) where the component 3a is sucked. Is configured.

Specifically, the component suction portion 52 is provided at the tip of the pivoting portion 53, and the pivoting portion 53 pivots about the pivot shaft 54 (the pivot axis 54a) in the C direction. It is configured to rotate. Further, as shown in FIG. 5, the component suction portion 52 sucks the component 3a in the state of the first rotation position rotated in the C1 direction, and rotates in the C2 direction as shown in FIG. The component 3a is configured to be mounted on the printed circuit board 2 in the state of the second rotation position.

The component suction unit 52 is configured to rotate in the C direction by moving the piston 513 connected via the rotating unit 53 and the link 515 up and down (moving in the Z direction). Specifically, as shown in FIG. 5, when the piston 513 is lowered by the biasing force of the spring 514, the component suction portion 52 rotates in the C1 direction and rotates to the first rotation position. Is configured as. Further, as shown in FIG. 6, in the component suction portion 52, due to the negative pressure supplied via the pivoting pneumatic passage 512, the piston 513 is a spring 514 in the cylindrical portion at the end of the pivoting pneumatic passage 512. When raised against the biasing force, it is configured to rotate in the C2 direction and to rotate to the second rotation position. As shown in FIG. 3, the rotation intake pressure passage 512 is connected to the rotation air pressure passage 122 c of the head 122. Further, the rotation radius of the component suction portion 52 is about half of the width (length in the B direction) of the nozzle 5.

Further, as shown in FIGS. 5 and 6, the component suction unit 52 sucks the surface of the component 3a other than the mounting surface 32a of the component 3a and the surface on the opposite side of the mounting surface 32a of the component 3a. The component 3 a can be mounted by rotating the mounting surface 32 a so as to face the printed circuit board 2. Specifically, the component suction unit 52 sucks the side surface 33a substantially orthogonal to the mounting surface 32a of the component 3a, and rotates the component mounting surface 32a of the component 3a so that the mounting surface 32a faces the printed circuit board 2 It is possible to implement. That is, the component suction unit 52 sucks the component 3a by setting the suction surface 521 substantially horizontal (substantially parallel to the XY plane and the AB plane) at the first rotation position, and substantially holding the suction surface 521 at the second rotation position. The component 3a is mounted vertically (substantially parallel to the Z direction).

When the component suction unit 52 can suction the surface opposite to the mounting surface of the component, the component suction unit 52 suctions the component at the first rotation position, and the component at the first rotation position without rotating. It is possible to implement.

Further, in the first embodiment, as shown in FIGS. 4 to 6, the protrusion 522 is formed to protrude in the direction intersecting with the suction surface 521. Specifically, the protrusion 522 is formed to project perpendicularly to the suction surface 521 along the end of one side of the suction surface 521. Further, as shown in FIG. 6, when the component 3a is mounted, the protruding portion 522 is configured to abut on the opposite surface of the mounting surface 32a of the component 3a. That is, when mounting the component 3a, the protrusion 522 faces the printed circuit board 2 in a state where the component suction unit 52 is in the second rotation position, and presses the component 3a to the printed circuit board 2 side. It is made possible.

The suction unit 523 is connected to the suction negative pressure passage 531 of the rotating unit 53, and is configured to be supplied with a negative pressure. Further, as shown in FIG. 8, the suction portion 523 has a substantially rectangular shape in a plan view (as viewed from the direction orthogonal to the suction surface 521 (see FIG. 5)), as shown in FIGS. 5 and 6. As shown, it is formed to be recessed with respect to the suction surface 521.

The suction negative pressure passage 531 is provided in the rotation portion 53, and is connected to the suction negative pressure passage 541 along the rotation axis 54a via the negative pressure passage connection portion 542 of the rotation shaft 54. The suction negative pressure passage 541 is connected to the suction negative pressure passage 511 of the nozzle body 51. The suction negative pressure passage 511 is connected to the shock absorbing shaft 122 d and a suction negative pressure passage 122 b formed in the shaft 122 a. As a result, negative pressure is supplied to the adsorption unit 523.

Further, in the first embodiment, the negative pressure passage connection portion 542 is rotated at any position of the component suction portion 52 at the first rotation position (see FIG. 5) and the second rotation position (see FIG. 6). The suction negative pressure passage 541 of the moving shaft 54 and the suction negative pressure passage 531 of the rotating portion 53 are communicated with each other. Specifically, as shown in FIG. 7, a communication hole is formed as a negative pressure passage connection portion 542 near the center (direction A) on the lower side (Z1 direction side) of the rotation shaft 54. Thereby, as shown in FIG. 5 and FIG. 6, the suction negative pressure passage 541 and the suction negative pressure passage 531 at any turning position when the turning portion 53 (the component suction portion 52) turns in the C direction. Are in communication.

Next, the component mounting process performed by the controller 16 of the component mounting apparatus 100 will be described with reference to FIG. In addition, although mounting of components is performed in parallel by the six heads 122, the mounting process of the head 122 in which the nozzle 5 was attached is demonstrated here.

In step S1, the nozzle 5 is moved to the upper side (in the X, Y, R directions) of the component 3a to be attracted, with the component adsorption unit 52 positioned at the first rotation position (see FIG. 5). It is lowered in the Z1 direction. With the suction surface 521 in contact with or in proximity to the component 3a, the vacuum is turned ON (negative pressure is supplied) to suck the component 3a. Specifically, negative pressure is supplied to the component suction unit 52 via the suction negative pressure supply passage 122b.

In step S2, the suction posture of the component 3a is changed. Specifically, negative pressure is supplied to the pivoting air passage 512 via the pivoting air passage 122c, and the component suction portion 52 is moved from the first pivoting position (see FIG. 5) to the second pivoting position (see FIG. 6). (Refer to). Further, in parallel with the rotation of the component suction unit 52, the nozzle 5 is lifted (moved in the Z2 direction) and moved in the XY direction, and the component 3a is moved to the upper side of the camera unit 15.

In step S3, the camera unit 15 photographs and recognizes the part 3a sucked by the nozzle 5. In step S4, the nozzle 5 is moved in the X and Y directions, and is rotated in the R direction as necessary, so that the component 3a is moved above the mounting position of the printed circuit board 2.

In step S5, the nozzle 5 is lowered in the Z-axis direction, and the component 3a is mounted on the printed circuit board 2. Thereafter, in step S6, the vacuum is turned off (supply of negative pressure is stopped). In step S7, the nozzle 5 ascends in the Z-axis direction and is retracted with respect to the printed circuit board 2 and the mounted components. The component 3 a is mounted on the printed circuit board 2 by these steps.

In step S8, the posture of the component suction unit 52 is changed. That is, the supply of negative pressure to the pivoting air passage 512 via the pivoting air passage 122c is stopped, and the component adsorption portion 52 is moved from the second pivoting position (see FIG. 6) by the resilient force of the spring 514. 1) It is pivoted to the pivot position (see FIG. 5). Further, in parallel with the rotation of the component suction unit 52, the head unit 12 is moved in the horizontal direction (X and Y directions) to the retracted position. Thereafter, the component mounting process is finished. The processes in steps S1 to S8 are repeated until the predetermined number of components 3a are mounted on the printed circuit board 2, and the head unit 12 is not moved to the retracted position in step S8. You will be taken to

In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, the component suction portion 52 having the suction surface 521 that contacts the component 3a when suctioning the component 3a is a first rotation position (see FIG. 5) capable of sucking the component 3a. And the second rotation position (refer to FIG. 6) capable of mounting the component 3a so that the component 3a is adsorbed and the posture is changed, and then the component 3a is mounted. In this case, since it is not necessary to temporarily place the component 3a, the tact time can be shortened accordingly. Further, since it is not necessary to provide a space for temporarily placing the component 3a, it is possible to suppress the component mounting apparatus 100 from being enlarged.

In the first embodiment, as described above, the component suction unit 52 sucks the surfaces of the components other than the mounting surface 32a of the component 3a and the surface on the opposite side of the mounting surface 32a of the component 3a. It is possible to mount the component 3 a by rotating the mounting surface 32 a so as to face the printed circuit board 2. Thus, even if the surface on the opposite side of the mounting surface 32a of the component 3a can not be adsorbed, the surfaces of the component 3a other than the surfaces on the opposite side of the mounting surface 32a of the component 3a and the mounting surface 32a of the component 3a are adsorbed. The component 3a can be easily mounted.

In the first embodiment, as described above, the component suction unit 52 is a surface 33a substantially orthogonal to the mounting surface 32a of the component 3a with the suction surface 521 in the substantially horizontal direction at the first rotation position. To mount the component 3a by turning the suction surface 32a substantially perpendicular to the printed circuit board 2 at the second rotation position so that the component mounting surface 32a faces the printed circuit board 2 Is configured to be possible. Thereby, even when the surface on the opposite side of the mounting surface 32a of the component 3a can not be sucked, the suction surface is substantially horizontal, and the side surface 33a substantially orthogonal to the mounting surface 32a of the component 3a is suctioned. The component 3a can be mounted.

In the first embodiment, as described above, the projecting portion 522 of the component suction unit 52 is configured to abut on the opposite surface of the mounting surface 32 a of the component 3 a when the component 3 a is mounted. Thus, when the component 3a is mounted by attracting the surface other than the opposite surface of the mounting surface 32a of the component 3a, the surface on the opposite side of the mounting surface 32a of the component 3a to the mounting surface 32a side by the protrusion 522 As it can be pressed, the component 3a can be reliably mounted on the printed circuit board 2.

Further, in the first embodiment, as described above, the negative pressure passage connection portion 542 of the pivot shaft 54 is attracted regardless of whether the component suction portion 52 is at the first pivot position or the second pivot position. The negative pressure passage 541 and the suction negative pressure passage 531 are formed to communicate with each other. Thus, even when the component suction unit 52 is rotated, a negative pressure for suctioning the component 3a can be easily supplied to the suction surface 521 of the component suction unit 52. Therefore, the rotation position of the component suction unit 52 Regardless of this, the component 3a can be reliably adsorbed, and the component adsorption unit 52 can continue to adsorb and hold the component 3a from the adsorption of the component 3a to the placement of the component 3a on the printed circuit board 2.

Further, in the first embodiment, as described above, the component suction unit 52 is pivoted about the substantially horizontal rotation axis 54a by the air pressure of a system different from the negative pressure for suctioning the component 3a. Configure to As a result, the component suction portion 52 can be easily rotated using an air pressure independent of the negative pressure for suctioning the component 3a.

In the first embodiment, as described above, the component suction unit 52 is configured to suction the component 3a with the suction surface 521 substantially horizontal and to mount the component 3a with the suction surface 521 substantially vertical. Do. As a result, after the component 3a is sucked with the suction surface 521 substantially horizontal and the component 3a can be mounted with the suction surface 521 substantially vertical so that the mounting surface 32a of the component 3a is on the bottom, the mounting surface can be mounted Even in the case of a part 3a where it is difficult to place 32a downward, it can be easily attracted and changed in attitude for mounting.

Second Embodiment
Next, with reference to FIGS. 11 and 12, a component mounting apparatus 100 according to a second embodiment of the present invention will be described. In the second embodiment, unlike the first embodiment in which the components 3a are arranged and placed on the tray 3, a configuration in which the components 3a are randomly mounted on the tray 30 will be described.

Here, in the second embodiment, as shown in FIG. 11, the tray 30 has a plurality of components 3a placed at random. The component 3a has a lead 31a, a mounting surface 32a, and a side surface 33a. A plurality of leads 31 a are provided to protrude from the mounting surface 32 a. The component 3a is placed on the tray 3 with the side surface 33a, which is a surface substantially perpendicular to the mounting surface 32a, facing upward (in the Z2 direction).

In the second embodiment, as shown in FIG. 12, before the component 3a is sucked, the component 3a on the tray 30 is photographed by the camera 123 of the head unit 12 in step S11, and the position and orientation of the component 3a are Is recognized. Thereafter, the process proceeds to step S1, and in a state where the component suction unit 52 is positioned at the first rotation position (see FIG. 5), the nozzle 5 is above the component 3a to be suctioned in the X, Y, R directions. ) And then descend in the Z1 direction. With the suction surface 521 in contact with or in proximity to the component 3a, the vacuum is turned ON (negative pressure is supplied) to suck the component 3a. Thereafter, the processes of steps S2 to S8 similar to those of the first embodiment are performed. The processes in steps S11 and S1 to S8 are repeated until the predetermined number of components 3a are mounted on the printed circuit board 2, and the head unit 12 is not moved to the retracted position in step S8. , And proceeds to step S11.

The remaining structure of the second embodiment is similar to that of the aforementioned first embodiment.

In the second embodiment, the following effects can be obtained.

Also in the configuration of the second embodiment, as in the first embodiment, the second suction position in which the component suction portion 52 is rotated from the first rotation position (see FIG. 5) at which the component 3a is suctioned (see Since it is possible to mount the component 3a in FIG. 6), there is no need to temporarily place the component 3a when mounting the component 3a after attracting and changing the posture of the component 3a. The tact time can be shortened by minutes. Further, since it is not necessary to provide a space for temporarily placing the component 3a, it is possible to suppress the component mounting apparatus 100 from being enlarged.

Furthermore, in the second embodiment, as described above, even when the component 3a is randomly placed on the tray 30, the position and orientation of the component 3a can be easily recognized by photographing the component 3a with the camera 123. Since the side surface 33a of the component 3a can be easily suctioned by the nozzle 5, it is possible. Furthermore, the protrusion 522 can be positioned on the opposite side of the mounting surface 32 a by movement in the R-axis direction, and the protrusion 522 can press the opposite side of the mounting surface 32 a during mounting.

The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the description of the embodiment described above but by the scope of the claims, and further includes all modifications within the meaning and scope equivalent to the scope of the claims.

For example, although the example which applies this invention to the component mounting apparatus which mounts components in a board | substrate in said 1st and 2nd embodiment was shown, this invention is not limited to this. For example, the present invention may be applied to an apparatus for mounting a component on a mounting target other than a substrate.

In the first and second embodiments, the component suction unit is rotatably attached to the nozzle body with the horizontal direction as the rotation axis, but the present invention is not limited to this. In the present invention, the component suction unit may be attached to the nozzle body rotatably around a pivot axis slightly inclined from the horizontal direction.

In the first and second embodiments, the component suction unit sucks a surface substantially orthogonal to the mounting surface of the component. However, the present invention is not limited to this. In the present invention, for example, the component suction unit may be configured to suction a side surface not orthogonal to the mounting surface of the component.

Moreover, although the example which provides the protrusion part formed so that it might protrude from the adsorption | suction surface of a components adsorption | suction part was shown in said 1st and 2nd embodiment, this invention is not limited to this. In the present invention, it is not necessary to provide a protrusion which protrudes from the suction surface of the component suction unit.

In the first and second embodiments, the protrusion of the component suction portion is formed to protrude in the direction orthogonal to the suction surface. However, the present invention is not limited to this. . In the present invention, the protrusion may be formed to protrude in a direction not perpendicular to the suction surface.

In the first and second embodiments, the component suction unit is configured to be rotatable by 90 degrees with respect to the nozzle body, but the present invention is not limited to this. In the present invention, the component suction unit may be rotated by a rotation angle other than 90 degrees with respect to the nozzle body in accordance with the angle of the mounting posture of the component.

In the first and second embodiments, an example is shown in which the component suction unit is rotated relative to the nozzle main body by air pressure, but the present invention is not limited to this. In the present invention, the component suction unit may be rotated relative to the nozzle body by means other than air pressure. For example, the component suction unit may be rotated by a motor or the like, or the component suction unit may be mechanically rotated in conjunction with the movement of the nozzle (component suction nozzle).

In the first and second embodiments, an example is shown in which the component suction unit is rotated relative to the nozzle body according to the presence or absence of negative pressure supply, but the present invention is not limited to this. In the present invention, the component suction unit may be rotated with respect to the nozzle body according to the presence or absence of supply of positive pressure, or the component suction unit may be rotated with respect to the nozzle body by both positive pressure and negative pressure. May be

In the first and second embodiments, for convenience of explanation, the processing operation of the controller has been described using a flow driven flow chart in which processing is sequentially performed along the processing flow, but the present invention is limited to this. Absent. In the present invention, the processing operation of the controller may be performed by event-driven (event-driven) processing that executes processing on an event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

In the first and second embodiments, the pivoting pneumatic passage 122c is in communication with the pivoting pneumatic passage 512 of the nozzle 5 through the insides of the shaft 122a, the shock absorbing shaft 122d, and the connection pipe 53. However, the pivoting pneumatic passage 122c passing through the interiors of the shaft 122a, the shock absorbing shaft 122d, and the connection pipe 53 may be eliminated, and 122b in FIG. 3 may be used as the pivoting pneumatic passage. In this case, 511 in FIG. 5 communicates with the end of the rotary air passage 512 for housing the piston 513 and the spring 514, but does not communicate with the negative suction passage 541 along the rotation axis 54a. . A suction negative pressure inlet opening communicating with the suction negative pressure passage 541 is provided in the nozzle body 51, a flexible pipe is connected to the suction negative pressure inlet opening, and the flexible pipe is guided to the head unit 12 . With this configuration, the suction negative pressure supplied from the head unit 12 at any position of the first and second rotation positions of the component suction portion 52 is the flexible pipe, the suction negative pressure passage 541, the rotation The suction portion 523 can be reached through the negative pressure passage connection portion 542 of the moving shaft 54 and the suction negative pressure passage 531.

2 Printed circuit board (mounting target, board)
3a parts 5 nozzles (part suction nozzle)
32a mounting surface 51 nozzle main body 52 component suction unit 53 rotation unit 54 rotation shaft 54a rotation axis 100 component mounting device 122 head (mounting head)
124 Z axis drive motor (lifting device)
511 suction negative pressure passage 521 suction surface 522 protruding portion 531 suction negative pressure passage (second suction negative pressure passage)
541 Suction negative pressure passage (1st suction negative pressure passage)
542 negative pressure passage connection

Claims

A nozzle body (51) attached to the mounting head (122);
And a component suction unit (52) attached to the nozzle main body so as to be rotatable about a substantially horizontal direction as a rotation axis (54a), and suctioning the component (3a),
The component suction unit has a suction surface (521) that contacts the component when the component is suctioned, and the first rotation position capable of sucking the component and the component can be mounted A component suction nozzle that is configured to pivot between pivot positions.
The component suction unit sucks the surface of the component other than the mounting surface (32a) of the component and the surface on the opposite side of the mounting surface of the component so that the mounting surface of the component faces the mounting target (2) The component suction nozzle according to claim 1, wherein the component suction nozzle is configured to be able to pivot to mount the component.
The component suction unit sucks a surface (33a) substantially orthogonal to the mounting surface of the component in a state where the suction surface is substantially horizontal at the first rotation position, and the component mounting surface is The component can be mounted by rotating the suction surface so as to be substantially perpendicular to the mounting object at the second rotation position so as to face the mounting object. The component suction nozzle according to Item 2.
The component suction unit further includes a protrusion (521) protruding in a direction intersecting with the suction surface,
The component suction nozzle according to claim 1, wherein the protrusion is configured to abut on a surface opposite to a mounting surface of the component when the component is mounted.
A pivot shaft (54) along a substantially horizontal pivot axis of the component suction portion;
And a suction negative pressure passage (511, 531, 541, 542) for communicating the negative pressure for suctioning the component to the component suction unit,
The component suction unit includes a rotation unit (53) that rotates around the rotation axis,
The suction negative pressure passage includes a first suction negative pressure passage (541) provided along the rotation axis of the rotation shaft, and a second suction negative pressure passage provided in the rotation portion of the component suction portion. (531), and a negative pressure passage connection (542) connecting the first suction negative pressure passage and the second suction negative pressure passage,
The negative pressure passage connection unit communicates the first suction negative pressure passage and the second suction negative pressure passage regardless of whether the component suction unit is at the first rotation position or the second rotation position. The component suction nozzle according to claim 1, wherein the component suction nozzle is formed to:
The component suction nozzle according to claim 1, wherein the component suction unit is configured to turn about a substantially horizontal direction as a pivot axis by an air pressure different from a negative pressure for suctioning the component.
A component suction nozzle (5), a lifting device (124) for raising and lowering the component suction nozzle, and a mounting head (122) for mounting the component (3a) on the substrate (2) with the component suction nozzle lowered. Equipped with
The component suction nozzle is rotatably attached to a nozzle main body (51) attached to the mounting head and the nozzle main body with a substantially horizontal direction as a pivot axis (54a), and component suction for adsorbing the component Part (52), and
The component suction unit has a suction surface (521) that contacts the component when the component is suctioned, and the first rotation position capable of sucking the component and the component can be mounted A component mounting apparatus configured to pivot between a pivot position.
The component suction unit sucks the surface of the component other than the mounting surface (32a) of the component and the surface opposite to the mounting surface of the component, and rotates the component mounting surface to face the substrate. The component mounting apparatus according to claim 7, wherein the component mounting apparatus is configured to mount the component.
The component suction unit sucks a surface (33a) substantially orthogonal to the mounting surface of the component in a state where the suction surface is substantially horizontal at the first rotation position, and the component mounting surface is 9. The component according to claim 8, wherein the component is mounted by rotating the suction surface so as to be substantially perpendicular to the substrate at the second rotation position so as to face the substrate. Component mounting device.
The component suction unit further includes a protrusion (521) protruding in a direction intersecting with the suction surface,
The component mounting apparatus according to claim 7, wherein the protrusion is configured to abut on a surface opposite to the mounting surface of the component when the component is mounted.