JP6263413B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component on a substrate by a plurality of suction nozzles provided in the mounting head.

  A component mounting apparatus that reciprocates between a component supply unit and a substrate and sucks electronic components from the component supply unit with a plurality of suction nozzles of a single mounting head and mounts them on the substrate is disclosed in, for example, Patent Document 1 It is disclosed. In this case, productivity is increased by attracting and transporting a large number of electronic components by one movement of the mounting head and mounting them on the substrate.

JP 2012-64781 A

  However, if the size of the electronic component to be sucked and held increases, adjacent electronic components sucked by a plurality of suction nozzles provided on the mounting head come into contact with each other and interfere with each other, and the electronic components are held by all the suction nozzles of the mounting head. However, there is a problem that the number of electronic components that can be transported by one mounting head is reduced and productivity is lowered. In this case, it may be possible to replace the suction nozzle with a larger mounting head with a larger interval between the suction nozzles, but there is a risk that it takes time to replace the mounting head and to change the teaching of various data. In addition, the number of mounting heads may increase and the cost may increase.

  Accordingly, an object of the present invention is to suppress a decrease in the number of components that the suction nozzle sucks without replacing the mounting head even when the size of the component held by the mounting head increases.

The component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component on a substrate by holding the component with a plurality of suction nozzles provided in the mounting head, wherein the connection portion of the suction nozzle is connected to the nozzle mounting portion of the mounting head. by attached, it connects the internal passageway of the mounting head side and vacuum passages of the suction nozzle side are those suction nozzle is attached to the mounting head, vacuum passages at the lower surface of the suction nozzle for sucking an electronic component the opening to the suction hole, provided at a position where the vacuum passages of the suction nozzle side is spaced horizontally from the position for connecting the internal passage of the mounting head side, the mounting head is rotatable about a vertical axis, rotating body is provided with an opening of the mounting head side of the internal passage arranged on a concentric circle around the center of rotation, the suction Roh adjacent attached to the mounting head The suction holes of Le is, as the electronic components to each other which are respectively adsorbed to the suction hole does not interfere, each said of said suction nozzle as separated from the spacing of the opening position of the internal passage adjacent the suction nozzle is connected The suction nozzle is attached to the rotating body at a rotational position.

In the above component mounting apparatus, the opening of the internal passage provided at equal intervals on a concentric circle, the suction hole of the suction nozzle is preferably located at a position apart from the concentric from the rotation center of the rotating body.

  The present invention can suppress a decrease in the number of components sucked by the suction nozzle without replacing the mounting head even when the size of the component held by the mounting head is increased.

It is a top view of an electronic component mounting apparatus. It is a side view of the mounting head to which the suction nozzle is attached. It is a sectional side view of an eccentric suction nozzle. It is a side view which shows the state which the normal adsorption nozzle was attached to the mounting head and the electronic component was adsorbed. It is a side view which shows the state which attached the suction nozzle eccentric to the mounting head of a prior art, and adsorb | sucked the electronic component. It is the top view which looked at the mounting head of the state which attached the normal adsorption nozzle and adsorb | sucked the electronic component from the downward direction. It is the top view which looked at the mounting head of the state which attached the eccentric suction nozzle and attracted | sucked the electronic component from the downward direction. It is a side view which shows the state which attaches the eccentric suction nozzle to a mounting head, and mounts an electronic component.

  An embodiment of the present invention will be described below with reference to FIG. 1 for an electronic component mounting apparatus 1 that mounts an electronic component C (see FIG. 4) on a printed circuit board P as a substrate. The electronic component mounting apparatus 1 includes a transport device 2 that transports each printed circuit board P, component supply devices 3A and 3B that are disposed on the front side and the back side of the main body of the device, and supply an electronic component C. Is provided with a pair of beams 4A, 4B that can move in one direction (reciprocating in the Y direction) and a mounting head 6 that can be moved separately by each drive source in a direction along each of the beams 4A, 4B. ing. The mounting head 6 will be described later with reference to FIG.

  The transport device 2 includes a supply conveyor 2A, a positioning portion 2B that positions and fixes the printed circuit board P, and a discharge conveyor 2C. Then, the supply conveyor 2A conveys each printed circuit board P received from the upstream to the positioning unit 2B, and after the electronic component C is mounted on each substrate P positioned by the positioning device in each positioning unit 2B, the discharge conveyor It is the structure conveyed to 2C, and is conveyed to a downstream apparatus after that.

  The component supply devices 3A and 3B are arranged at the back side position and the near side position of the transport device 2, and a large number of component supply units 8 are arranged side by side on the feeder bases of the cart bases 7A and 7B as mounting bases. is there. Each cart base 7A, 7B is detachably disposed on the apparatus main body via a connector so that the tip on the component supply side of the component supply unit 8 faces the conveyance path of the printed circuit board P, and each cart base 7A, When 7B is properly attached to the apparatus main body, power is supplied to the component supply unit 8 mounted on the cart bases 7A and 7B, and when the handle is released and the handle is pulled, the structure can be moved by a caster provided on the lower surface. It is.

  The pair of front and rear beams 4A and 4B that are long in the X direction are sliders fixed to the beams along a pair of left and right front and rear guides driven by a Y-direction moving drive source constituted by each linear motor. Slide and move individually in the Y direction. The Y-direction moving drive source includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. Consists of

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by an X direction moving drive source constituted by a linear motor, and move in the X direction. The drive source includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover 6C provided between the stators and provided on the mounting head 6.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and the mounting head 6 on the back side takes out the electronic component C from the corresponding component supply unit 8 of the component supply device 3A on the back side. The front mounting head 6 can take out the electronic component C from the corresponding front component supply device 3B and mount it on the printed circuit board P. .

Each mounting head 6 is provided with a rotating body 6B having a cylindrical shape and a circular shape in plan view, and is movably attached to the beams 4A and 4B. Then, the lower portion of the peripheral portion of the rotary member 6B, the suction nozzle 5 as component holder (see FIGS. 2 and 6) is a plurality of arranged at predetermined intervals on a concentric circle. The suction nozzle 5 can be moved up and down by a vertical axis drive source, and the electronic component C to be sucked and held can be rotated by rotating the rotating body 6B by a θ-axis drive source (not shown). The electronic component C is taken out from 8 and the taken out electronic component C is mounted on the printed circuit board P.

  Here, the component supply unit 8 is a feed in which teeth are fitted into feed holes opened at predetermined intervals on a storage tape that is sequentially wound in a state of being wound around a supply reel that is rotatably mounted on the cart bases 7A and 7B. A tape feed mechanism that rotates the sprocket by a predetermined angle and intermittently feeds the storage tape to the component suction / extraction position of the electronic component C by the feed motor, and the peeling tape is driven to peel the cover tape from the carrier tape before the suction / extraction position. The cover tape is peeled off by the cover tape peeling mechanism, and the electronic components C loaded in the carrier tape storage portion are sequentially supplied to the component suction and take-out position.

  Each component recognition camera 10 picks up an image from the bottom before mounting the electronic component C sucked and held by each suction nozzle 5 provided in each mounting head 6 on the printed circuit board P.

  Reference numeral 30 denotes a monitor provided with a touch panel switch, and the operator operates the electronic component mounting apparatus 1 to start and stop by pressing various touch panel switches formed on the screen of the monitor 30. be able to.

Hereinafter, the mounting head 6 and the suction nozzle 5 will be described with reference to FIGS. As shown in FIGS. 2 and 6, a rotating body 6B is provided inside the mounting head 6 so as to be rotatable about a vertical axis, and a concentric circle around the rotation center T is provided below the rotating body 6B. A plurality of nozzle vertical shafts 31 as a plurality of nozzle mounting portions that can be attached to the suction nozzle 5 at equal angular intervals and can be moved up and down with respect to the rotating body 6B. The nozzle vertical shaft 31 is a hollow cylinder, and its hollow internal passage (vacuum passage) communicates with a vacuum source (not shown) or a high-pressure air source. The nozzle vertical shaft 31 moves up and down in the vertical direction at a mounting position on the circumference of a predetermined radius from the rotation center T, and moves up and down the suction nozzle 5 attached to the lower end thereof. Accordingly, a plurality of suction nozzles 5 attached to the rotating body 6B can be rotated by the rotation of the rotating body 6B and can be moved up and down.

  As shown in FIG. 4, the lower surface of the suction nozzle 5 abuts against the electronic component C and sucks the electronic component C by negative pressure, and is connected to the internal passage of the nozzle vertical shaft 31 attached by the connecting portion 29. A vacuum passage opens at the center of the lower surface. The connecting portion 29 is formed around the head side opening of the vacuum passage of the suction nozzle 5. The suction nozzle 5 shown in FIGS. 2 (a) and 4 has a vacuum passage extending linearly downward from the internal passage of the nozzle vertical shaft 31, and a suction hole 35 opened substantially at the center of the lower end surface is a nozzle. It is located on the extension of the axis of the vertical shaft 31.

  The nozzle vertical shaft 31 does not rotate with respect to the rotating body 6B (that is, does not rotate), and therefore the suction nozzle 5 attached thereto does not rotate. Further, the suction nozzle 5 is fixedly attached so that the rotational angle position with respect to the nozzle vertical axis 31 does not shift.

As shown in FIG. 6, the electronic component C is sucked and held in each of the plurality of suction nozzles 5 attached to the mounting head 6. The suction nozzles 5 do not interfere with each other even if each of the electronic components C having the size shown in FIG. 6 is sucked, but if one suction nozzle 5 tries to suck a larger electronic component LC, the suction nozzles 5 The suction nozzle 5 comes into contact with and interferes with the electronic component C to be sucked. Such electronic parts C include chip parts such as resistors and capacitors, ICs having terminals such as leads and bumps , LED elements and lens members that cover the upper parts of the LED elements, and connector parts and the like are also attracted. obtain. The sizes of such electronic components are different, and when adsorbing a plurality of electronic components C with the adsorbing nozzles 5 of the mounting head 6 as shown in FIG. There is.

In order to hold a larger electronic component with the same mounting head 6, an eccentric suction nozzle 5A is used as shown in FIG. Suction nozzle 5A exhibits a vacuum passage 37 is crank-shaped opening into the lower face 38 of the communication with the suction nozzle 5A by connection of the connecting portion 29A of the same structure as the connecting portion 29 described above to the nozzle vertical shaft 31, the vacuum passage 37 the position of the suction holes 39 opened in the lower surface 38 of the portion with the suction nozzle 5A communicating with the upper side of the nozzle vertical shaft 31 is shifted in the horizontal direction.

Although the opening 33 in the connecting portion 29A for connecting the nozzle vertical axis 31 of the vacuum passage 37 is circular, the center (if not circular centroid) A and the center of the suction hole 39 (if not circular center of gravity) B is at a position shifted in the plane direction. This deviation amount becomes a further eccentric amount from the rotation center T when the suction nozzle 5A is attached to the nozzle vertical shaft 31. That is, when mounting the suction nozzle 5A to the rotating body 6B of the mounting head 6, the suction hole at a position farther to a more eccentric than the suction nozzle 5 with respect to the rotational center T of the rotary member 6B as shown in FIGS. 5 and 7 39 can be located. As shown in FIG. 3, the suction hole 39 is provided eccentrically at the position B with respect to the position A of the opening of the internal passage of the nozzle vertical shaft 31.

Eccentricity for the rotation center T (P.C.D) is a suction nozzle as the center of rotation T and the nozzle vertical shaft 31 and the suction holes 39 on the outside of the straight line connecting as shown in FIG. 5 and FIG. 7 is positioned The case where 5A is attached is the largest, the interval between the suction holes 39 of the adjacent suction nozzles 5A is the largest, and the electronic component LC having a large plan view can be sucked and held in each suction nozzle 5A. The suction nozzle 5A is fixed to the nozzle vertical shaft 31 so as to be in the position of FIG. Is this way to fixed, fits upon fixation of the suction nozzle 5A to the nozzle vertical axis 31 at the direction of FIG. 7, a structure such as the rotation stop is, the suction nozzle 5A in the direction It may be fixed so as to maintain this rotational positional relationship after being inserted into the nozzle vertical shaft 31. Alternatively, if the normal suction nozzle 5 is fixed while being fixed to the nozzle vertical shaft 31, the suction structure is the same as that of the suction structure at the position shown in FIG. The suction nozzle 5A may be formed so that 39 faces.

  As shown in FIG. 7, the suction nozzle 5A is fixed to the rotating body 6B so that the suction hole 39 is located on a concentric circle having the largest radius with respect to the rotation center T, but on the concentric circle having a smaller radius. You may make it locate in.

  Next, the mounting operation of the electronic component will be briefly described. Initially, as shown in FIG. 2A, the electronic component C having a normal size is taken out from the component supply unit 8 by using the plurality of suction nozzles 5 attached to all the nozzle vertical shafts 31 of the mounting head 6, and the printed board P The operation of mounting at a predetermined position is performed. Next, when mounting a component of the printed circuit board P on which a larger electronic component LC is mounted, the suction nozzle 5 is removed from the rotating body 6B as shown in FIG. Attach to 31.

  In this way, all the suction nozzles 5 are replaced with suction nozzles 5A as shown in FIG. For this replacement, for example, the suction nozzle 5A is placed on a nozzle stocker (not shown) disposed between, for example, the conveying device 2 and the component supply device 3A or 3B of the electronic component mounting device 1, and the mounting head 6 moves and the nozzles move up and down. It may be automatically performed by raising and lowering the shaft 31.

Next, when the automatic operation of the electronic component mounting apparatus 1 is started, the electronic components LC supplied by the specified component supply unit 8 are sucked by the suction nozzles 5A based on a preset mounting program. In this case, when sucking with the suction nozzle 5 shown in FIG. 6, only three electronic components LC are held using every other suction nozzle 5 by one suction of the mounting head 6 in order to prevent interference between adjacent ones. In contrast to this, as shown in FIG. 7, the electronic component LC can be adsorbed to all five adsorbing nozzles 5A and carried on the printed circuit board P. The mounting speed of the component LC can be increased, and the throughput can be increased.

The mounting head 6 that sucks the electronic component LC to all the suction nozzles 5 </ b > A passes above the component recognition camera 10. At this time, the component recognition camera 10 picks up all the electronic components LC sucked by all the suction nozzles 5A on a single screen, and the position of the electronic components LC relative to the mounting head 6 is recognized based on this image. When the electronic component LC is mounted on the printed circuit board P, the angle specified at the position specified in the mounting program in consideration of the positional deviation recognized by the movement of the mounting head 6 in the X and Y directions and the rotation of the rotating body 6B. It is installed with. As shown in FIG. 8, the mounting operation is performed when the nozzle vertical shaft 31 protrudes downward from the rotating body 6B and the electronic component LC sucked by the suction nozzle 5A is lowered.

  Similarly, when the electronic component LC is sucked, the suction nozzle 5A is lowered to take out the electronic component from the tape storage portion, and suction is performed by the negative pressure through the vacuum passage 37 and the suction hole 39. Similarly, when the suction nozzle 5 is used, the nozzle vertical axis 31 moves up and down.

  In the present embodiment, the case where the nozzle vertical axis 31 does not rotate, that is, the suction nozzle 5A does not rotate has been described. However, even if the suction nozzle 5A is rotatable with respect to the rotating body 6B, the suction hole 39 is illustrated. The electronic component can be sucked and attached to the printed circuit board P by rotating to be eccentric to the position 7.

  Alternatively, the suction nozzles 5A may be attached to the nozzle vertical shaft 31 with different eccentric directions. Further, it is conceivable that the suction direction of the suction nozzle 5A is set in the direction in which the suction hole 39 approaches the rotation center T of the rotating body 6B.

In addition, the suction nozzle 5A with the suction hole 39 eccentric may be attached to a mounting head that is not a rotating rotating body, but is a mounting head in which attachment portions corresponding to the nozzle vertical shaft 31 are arranged in a straight line. In this case, the suction nozzle 5A is attached between the adjacent suction nozzles 5A by positioning the suction holes 39 so as to face in opposite directions in, for example, the attachment parts adjacent in the direction orthogonal to the direction in which the attachment parts are arranged. It may be possible to increase the distance.

  In the present embodiment, the suction nozzle that sucks and holds the electronic component with negative pressure has been described. However, the present invention is not limited thereto, and the suction nozzle is formed on the suction nozzle attachment portion (nozzle vertical axis 31) of the mounting head. The suction holes of the suction nozzles attached by the connecting parts are provided at positions horizontally apart from the connection parts, and the suction holes of the adjacent suction nozzles are located between the nozzle mounting parts (opening of the internal passage of the nozzle vertical axis). The suction nozzle may be attached to the mounting head at a rotation position of the suction nozzle that is separated from the interval. In this case, not only the suction nozzle by negative pressure but also the holding member has a holding surface for some parts, and the holding surface is located at a position separated in the horizontal direction from the connecting portion for connecting to the holder mounting portion of the mounting head. You may make it the same.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Adsorption nozzle 5A Adsorption nozzle 6 Installation head 6B Rotating body 29 Connection part 29A Connection part 31 Nozzle vertical axis 33 Opening 37 Vacuum passage 39 Suction hole C, LC Electronic component T Rotation center

Claims (2)

In a component mounting apparatus that holds components on a substrate by holding a plurality of suction nozzles provided on the mounting head,
By connecting portion of the suction nozzle is attached to the nozzle mounting portion of the mounting head, which suction nozzle connects the internal passageway of the mounting head side and vacuum passages of the suction nozzle side is attached to the mounting head,
The suction holes vacuum passage opens at the lower surface of the suction nozzle for sucking an electronic component, provided at a position where the vacuum passages of the suction nozzle side is spaced horizontally from the position for connecting the internal passage of the mounting head side,
The mounting head is provided with a rotating body that is rotatable about a vertical axis and has an opening of an internal passage on the mounting head side that is arranged concentrically around the rotation center.
Opening positions of adjacent internal passages to which the respective suction nozzles are connected so that the suction holes of the adjacent suction nozzles attached to the mounting head do not interfere with each other of the electronic components sucked into the suction holes. A component mounting apparatus , wherein the suction nozzle is attached to the rotating body at a rotational position of the suction nozzle that is further away from the interval. 2. The component mounting according to claim 1 , wherein the openings of the internal passage are provided at equal intervals on a concentric circle, and the suction holes of the suction nozzle are located at positions away from the concentric circle from the rotation center of the rotating body. apparatus.

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