KR20150099452A - Apparatus for mounting component - Google Patents

Apparatus for mounting component Download PDF

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Publication number
KR20150099452A
KR20150099452A KR1020150024046A KR20150024046A KR20150099452A KR 20150099452 A KR20150099452 A KR 20150099452A KR 1020150024046 A KR1020150024046 A KR 1020150024046A KR 20150024046 A KR20150024046 A KR 20150024046A KR 20150099452 A KR20150099452 A KR 20150099452A
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South Korea
Prior art keywords
component
nozzle
suction
mounting
center
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KR1020150024046A
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Korean (ko)
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KR101632264B1 (en
Inventor
유스케 이마이
히데토시 아마가야
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야마하하쓰도키 가부시키가이샤
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Publication of KR20150099452A publication Critical patent/KR20150099452A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Operations Research (AREA)
  • Manipulator (AREA)

Abstract

An apparatus for mounting a component includes a mounting head with a plurality of nozzle attaching units which are formed at positions with different horizontal directions and a plurality of absorption nozzles which are attached on the nozzle attaching unit. The absorption nozzle includes a connection part which is connected to the nozzle attaching unit and a component absorption surface which includes a suction hole whose center is located in a misalignment position in the horizontal direction from the center position of the connection part. The adjacent nozzles among the absorption nozzles are attached on the nozzle attaching unit when an interval between the center positions of the suction holes of the absorption nozzles is larger than an interval between the center positions of the connection parts of the absorption nozzles.

Description

[0001] APPARATUS FOR MOUNTING COMPONENT [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting components such as electronic components on a substrate by a plurality of suction nozzles provided on a mounting head.

A component mounting apparatus for mounting a component mounting apparatus having a plurality of suction nozzles (component holding members) reciprocating between a component supply section and a substrate to pick up a plurality of components from a component supply section and mounting the components on a substrate is disclosed in, for example, Open Publication No. 2012-64781. In this component mounting apparatus, a plurality of components are picked up by the movement of the mounting head once, and the components are carried on a substrate and mounted, thereby enhancing the productivity.

However, when the size of the component to be adsorbed increases, the components adsorbed to the adjacent adsorption nozzles come into contact with or interfere with each other, making it impossible to hold the components using the entire adsorption nozzle, The number of parts (the number of parts to be absorbed) that can be used is reduced, and the fishy property is deteriorated. In order to solve this problem, it is considered to replace the mounting head with a separate mounting head having a large interval between the suction nozzles, if necessary. However, in this case, replacement of the mounting head and teaching of various kinds of data are required, which takes time for the setup change operation. Also, the cost is increased by increasing the number of mounting heads.

An object of the present invention is to provide a component mounting apparatus having a mounting head having a plurality of suction nozzles (component holding members), in which the number of parts to be attracted when a component having a large size is attracted can be suppressed The purpose is to make.

There is provided a component mounting apparatus for holding a component and mounting the component on a substrate, the component mounting apparatus comprising: a mounting head having a plurality of nozzle attaching portions formed at positions different in horizontal direction from each other; and a plurality of suction nozzles attached to the nozzle attaching portion, The suction nozzle includes a component suction surface having a connection portion connected to the nozzle attachment portion and a suction hole centered at a position shifted in the horizontal direction from the center position of the connection portion, The nozzles are attached to the nozzle attachment portions in such a state that the distance between the center positions of the suction holes of the suction nozzles is larger than the distance between the center positions of the connection portions of the suction nozzles.

1 is a plan view of a component mounting apparatus.
Fig. 2 (a) is a side view of the mounting head with the first suction nozzle, Fig. 2 (b) is a side view of the mounting head, Side view.
3 is a sectional view of the second adsorption nozzle.
4 is a side view of the mounting head showing a state in which the component is attracted by the first suction nozzle.
5 is a side view of the mounting head showing a state in which the component is attracted by the second suction nozzle.
6 is a bottom view of the mounting head showing a state in which the component is attracted by the first suction nozzle.
7 is a bottom view of the mounting head showing a state in which the component is sucked by the second suction nozzle.
8 is a side view of the mounting head showing a state in which components are sucked by the second suction nozzle.

An embodiment of the present invention will be described below with respect to a component mounting apparatus 1 for mounting a component C such as an electronic component (see Fig. 4) on a printed board P based on Fig.

The component mounting apparatus 1 includes a transfer device 2 for transferring a printed board P in a predetermined direction (X direction), component supplying devices 3A and 3B for supplying the component C, A pair of beams 4A and 4B individually moving in the Y direction orthogonal to the X direction which is the carrying direction of the beam 4A and 4B and a mounting head 6 which individually moves in the X direction along the beams 4A and 4B Respectively. The component supplying devices 3A and 3B are disposed on both sides (both sides in the Y direction) of the transfer apparatus 2, that is, on the front side and the rear side of the apparatus main body of the component mounting apparatus 1. [ The beams 4A and 4B are also disposed on both sides (both sides in the Y direction) of the transport apparatus 2. [ The mounting head 6 will be described later with reference to FIG. 2 and the like.

The transport apparatus 2 includes a feed conveyor 2A, a positioning unit 2B for positioning and fixing the printed substrate P, and a discharge conveyor 2C. The printed board 3 is received from the upstream side by the supply conveyor 2A and is conveyed to the positioning portion 2B and is conveyed to the position of the component C in the state of being positioned by the positioning device, Is carried out onto the discharge conveyor 2C, and is conveyed to the downstream device outside the figure by the discharge conveyor 2C.

The component feeding devices 3A and 3B are provided with guide units 7A and 7B each having a feeder base and a plurality of component feeding units 8 provided on the feeder bases of the guide units 7A and 7B have. The guide stands 7A and 7B are detachably connected to the apparatus main body of the component mounting apparatus 1 through a connecting port so that the front end portion (component withdrawing position) of the component supplying unit 8 faces the transfer apparatus 2 . Each component supply unit 8 is supplied with power when the guide stands 7A and 7B are appropriately connected to the apparatus main body. The guide bars 7A and 7B are provided with a caster on the lower surface thereof, and can be moved by pulling out the handle other than the figure in a state in which the connector is released.

The beams 4A and 4B extend in the X direction. Each of the beams 4A and 4B is supported by a guide extending in the Y direction (forward and backward direction) through a slider other than the drawing, and is moved in the Y direction along the guide by driving the Y-direction movement driving source composed of a linear motor . The Y-direction movement driving source is fixed to a stator other than a pair of upper and lower pairs fixed to each other along a pair of left and right base bodies 1A and 1B provided on the apparatus main body, and a mounting plate provided on both ends of the beams 4A and 4B And a movable member 9A.

The mounting heads 6 are respectively provided on the opposed surfaces of the beams 4A and 4B. The mounting heads 6 are driven by an X-direction movement driving source, which is a linear motor, (X direction) of the first and second electrodes 4A and 4B. The X-direction movement driving source is constituted by a stator other than a pair of front and rear fixed to the beams 4A and 4B, respectively, and a mover 6C installed in the mounting head 6 and disposed between the stator.

That is, each of the mounting heads 6 is disposed inside the beams 4A and 4B so as to face each other. The mounting head 6 located on the rear side of the apparatus body pulls out the component C from the component feeding unit 8 of the component feeding device 3A located on the rear side, And the mounting head 6 located on the front side of the other apparatus main body takes out the component C from the component supplying apparatus 3B positioned on the front side and mounts the component on the printed board P ).

The mounting head 6 is provided with a circumferential rotating body 6B. As shown in Figs. 2A and 6, a plurality of first suction nozzles 5, which are component holding sockets, are disposed on the peripheral edge of the lower portion of the rotating body 6B. The component C is drawn out from the component supply unit 8 by being attracted by the first suction nozzle 5 and mounted on the printed board P. [ Each of the first adsorption nozzles 5 is disposed on the same circumference at a predetermined interval as shown in FIG. Each of the first adsorption nozzles 5 can be driven up and down with respect to the rotating body 6B by driving the upper and lower shaft driving sources other than the drawing. The rotation body 6B is rotatable by driving the θ-axis driving source outside the drawing, and by revolving the first adsorption nozzles 5 about the rotation center T to be described later along with the rotation, And rotates the component (C) adsorbed and held by the nozzle (5).

The component supply unit 8 supplies the component C sequentially to the component withdrawal position set at the tip of the component supply unit with the tape as a carrier. The component feeding unit 8 is constituted so that a tape wound around a supply reel rotatably supported by the guide stands 7A and 7B, that is, a tape in which parts C are stored and held at predetermined intervals, And a cover tape peeling mechanism for peeling off the cover tape from the tape (carrier tape) in front of the component withdrawal position by driving of the peeling motor . The tape transport mechanism includes a transport sprocket having teeth engaged with the transport holes formed in the tape, and the tape is transported by rotating the sprocket by a predetermined angle by driving the transport motor.

The component recognition camera 10 is further disposed on the apparatus main body of the component mounting apparatus 1. [ Each of the component recognition cameras 10 picks up the components C picked up and held by the respective first suction nozzles 5 provided on the mounting head 6 collectively from below before mounting them on the printed board P, Are arranged at positions on both sides (both sides in the Y direction) of the transport apparatus 2.

In Fig. 1, reference numeral 30 denotes a monitor provided with a touch panel switch. In this monitor 30, there are provided various types of touch panel switches, and an operator can perform operations such as start or stop of operation of the component mounting apparatus 1 by pressing the touch pad switch.

Next, the construction of the mounting head 6 and the first and second suction nozzles 5 and 5A will be described in detail with reference to Figs. 2 to 8. Fig.

As described above, the mounting head 6 is provided with a circumferential rotating body 6B. 6A and 6, the rotating body 6B is rotatably supported by the mounting head 6 with a vertical axis passing through the center thereof as a rotation center T. As shown in Fig. A plurality of nozzle up and down shafts 31 capable of being raised and lowered with respect to the rotating body 6B are provided at equal angular intervals on the same circumference around the rotation center T in the lower part of the rotating body 6B. The nozzle vertical shaft 31 corresponds to the nozzle attaching portion of the present invention, and the first suction nozzle 5 is detachably attached.

The nozzle vertical shaft 31 is a normal member having an inner passage (corresponding to the head side inner passage of the present invention) at the center thereof. This inner passage communicates with a vacuum source or a high-pressure air source (not shown). The nozzle up-and-down shaft 31 ascends and descends in the vertical direction, and lifts up the first adsorption nozzle 5 attached to the lower end thereof. That is, each of the first adsorption nozzles 5 is rotatable together with the rotating body 6B and is not capable of raising with respect to the rotating body 6B.

The first adsorption nozzle 5 adsorbs and holds the component C by a negative pressure as shown in FIG. The first suction nozzle 5 has a connecting portion 29 connected to the nozzle upper and lower shaft 31 and a lower surface having a suction hole 35 for sucking the component C, And an inner passage (34) connected to the suction hole (35) in communication with the inner passage of the vertical shaft (31).

As shown in Figs. 4 and 6, the first adsorption nozzle 5 has a connecting portion 29, a suction hole 35 and an internal passage 34 on its axial center. The axis of the first suction nozzle 5 and the axis of the nozzle vertical axis 31 are on the same vertical axis line so that the inner passage 34 of the first suction nozzle 5 is located at the center of the axis of the nozzle vertical axis 31 And extending linearly from the nozzle vertical shaft 31 to the suction hole 35 on the extension line. The lower surface of the first adsorption nozzle 5 is circular around the axis of the first adsorption nozzle 5, and thus the suction hole 35 is formed at the center of the lower surface.

The nozzle vertical shaft 31 is not rotatable (does not rotate) with respect to the rotary body 6B. In addition, the first suction nozzle 5 is attached to the nozzle vertical shaft 31 in a non-rotatable manner. Therefore, the first suction nozzle 5 attached to the nozzle vertical shaft 31 does not rotate.

Here, the first suction nozzle 5 sucks and holds the component C by sucking the component C through the suction hole 35. At this time, as shown in FIG. 6, when the adjacent first adsorption nozzle 5 sucks the component C of less than the predetermined size, the components do not interfere with each other. However, when any one of the first adsorption nozzles 5 adjacent to the first adsorption nozzle 5 adsorbs the component C (the component indicated by the reference symbol LC in FIG. 6) exceeding the predetermined size, (The component C and the component LC) interfere with each other.

The component C includes chip components such as resistors and capacitors, ICs having terminals such as lead wires and bumps, lens components and connector components covering the LED components and the upper part thereof. As shown in FIG. 6, when a plurality of parts C are sucked by the mounting head 6, parts (C) that can be attracted by the adjacent first suction nozzles 5 C).

In this component mounting apparatus 1, in order to hold a larger component C by the same mounting head 6, a second suction nozzle 5A (shown in FIG. 3) (Corresponding to the adsorption nozzle of the invention) is used. The second suction nozzle 5A has a connecting portion 29A connected to the nozzle vertical shaft 31 and a suction hole 39 having a center at a position shifted in the horizontal direction from the center position of the connecting portion 29A (Corresponding to the component suction surface of the present invention) and a crank-shaped inner passage 37 connected to the suction hole 39 in communication with the inner passage of the nozzle vertical shaft 31 at the center position of the connecting portion 29A ) (Corresponding to the nozzle-side internal passage of the present invention). That is, the second suction nozzle 5A is located at the center A of the connection portion 29A, in this example, the center of the opening 33 of the internal passage 37 And the center (or the center of gravity B, if not circular) are shifted in the horizontal direction from each other. This shift amount becomes the additional eccentric amount of the suction hole 39 from the rotation center T when the second suction nozzle 5A is attached to the nozzle vertical shaft 31. [ 5 and 7, as compared with the case of the first adsorption nozzle 5 (in the case of FIGS. 4 and 6), when the second adsorption nozzle 5A is attached to the nozzle vertical shaft 31, It is possible to eccentrically position the hole 39 from the rotation center T toward the outside of the mounting head 6 in the radial direction. That is, the eccentric amount (P. C. D) of the suction hole 39 with respect to the rotation center T can be increased as compared with the case of the first suction nozzle 5 (conventional case).

The second adsorption nozzles 5A are arranged such that the distance between the centers B of the suction holes 39 of the second adsorption nozzles 5A adjacent to each other is smaller than the distance between the centers B of the second adsorption nozzles 5A, Are attached to the nozzle vertical shaft 31 in a state in which they are larger than the distance between the centers A.

5 and 7, the second adsorption nozzles 5A are arranged on the straight line connecting the center of rotation T and the center of the nozzle vertical shaft 31, And is attached to the nozzle up-and-down shaft 31 so that the suction hole 39 is located on the outer side. That is, the second suction nozzle 5A has the largest eccentricity PCD of the suction hole 39 with respect to the rotation center T, and the interval between the suction holes 39 of the adjacent second suction nozzles 5A Is attached to the nozzle up-and-down shaft 31 in the largest state. As a result, as shown in Fig. 7, when the adjacent second adsorption nozzle 5A sucks a relatively large component LC, the adjacent components LC are prevented from interfering with each other.

In this embodiment, the nozzle vertical shaft 31 has a structure in which both the first suction nozzle 5 and the second suction nozzle 5A can be detached. The second suction nozzle 5A is attached to the nozzle up-and-down shaft 31 and the connecting portion 29A of the second suction nozzle 5A so as to be attached to the nozzle vertical shaft 31, (31) and a connecting portion (29A). The attachment structure of the second suction nozzle 5A with respect to the nozzle vertical shaft 31 can be the same as the attachment structure of the second suction nozzle 5A except that the second suction nozzle 5A can be attached to the nozzle vertical shaft 31 Structure. When the suction hole 39 is located outside the same circumference passing through the center of each nozzle vertical shaft 31, the second adsorption nozzle 5A is located on a circumference smaller than the circumference (outward broken line) shown in FIG. 7 Or may be attached to the nozzle vertical shaft 31 in a state in which the suction hole 39 is located.

Next, the mounting operation of the component C (component LC) will be described.

First, as shown in Fig. 2A, a component C of a normal size is attached to the component supply unit (not shown) while the first suction nozzle 5 is attached to all the nozzle vertical shafts 31 of the mounting head 6 8 to be mounted at a predetermined position on the printed board P is performed. When the component mounting of the printed board P on which the larger component LC is mounted is performed, the first suction nozzle 5 is detached from the nozzle vertical shaft 31 as shown in Fig. 2 (b) And the second adsorption nozzle 5A is attached to the nozzle up-and-down shaft 31. [

Then, as shown in Fig. 2 (c), all the first adsorption nozzles 5 are exchanged with the second adsorption nozzles 5A. This exchange may be performed manually by an operator or automatically. The second suction nozzle 5A is previously loaded on the nozzle stocker other than the one arranged between the transfer device 2 and the component supply device 3A (or 3B), and the mounting head 6 are moved above the nozzle stocker, and the nozzle exchange is automatically performed by the lifting operation of the nozzle vertical shaft 31. [

When the nozzle replacement is completed, automatic operation of the component mounting apparatus 1 is started. When the automatic operation is started, the component LC supplied by the specified component supply unit 8 is sucked by each second suction nozzle 5A based on a preset mounting program. In this case, as shown in Fig. 6, if the component LC is adsorbed by the first adsorption nozzle 5, the adjacent components interfere with each other as indicated by the broken line in Fig. 4. Therefore, It is necessary to suck up the component LC by using one additional member 5. Therefore, only one of the three components LC can be held by the single suction operation of the mounting head 6. On the other hand, when the second adsorption nozzle 5A is used, as shown in Fig. 7, the components LC can be sucked to the entire five second adsorption nozzles 5A and transported to the printed substrate P for mounting have. That is, it is possible to control the reduction in the number of adsorbed parts when a plurality of relatively large components LC are adsorbed without changing the mounting head 6. Therefore, by using the second suction nozzle 5A, the mounting speed of the component LC can be increased and the throughput can be improved as compared with the case where the first suction nozzle 5 is used.

The suction surface of the lower surface 38 of the second adsorption nozzle 5A, that is, the part C (LC) is circular, and the center of the suction surface of the second adsorption nozzle 5A is circular, And is displaced in the horizontal direction from the center A of the connecting portion 29A as shown in Fig. Specifically, it is shifted in the same direction as the center B of the suction hole 39 with respect to the center A of the connecting portion 29A. Therefore, the second suction nozzle 5A can stably hold the component LC by the lower surface 38 while sucking a relatively large component LC through the suction hole 39. [0064]

The mounting head 6, which has attracted the components LC to all the second suction nozzles 5A, passes above the component recognition camera 10. At this time, the component recognition camera 10 picks up all of the components LC adsorbed on each second suction nozzle 5A collectively on one screen. The position of the component LC with respect to the mounting head 6 (second suction nozzle 5A) is recognized based on this image. When the component LC is mounted on the printed board P, the movement of the mounting head 6 in the X and Y directions and the rotation of the rotating body 6B are added to the position specified by the mounting program, The component LC is mounted. 8, when the component LC is mounted on the printed substrate P, the nozzle up-and-down shaft 31 protrudes downwardly of the rotating body 6B and the component LC absorbed by the second suction nozzle 5A ).

Similarly, when the component LC is sucked from the component supply unit 8, the second suction nozzle 5A descends along with the nozzle vertical shaft 31, and the inner passage 337 and the suction hole 39 The component C in the tape is sucked by the negative pressure supplied through the tape. The operation when the first adsorption nozzle 5 is used is also the same.

In the present embodiment, the case where the nozzle up-and-down shaft 31 does not rotate, that is, the second adsorption nozzle 5A does not rotate. However, when the second adsorption nozzle 5A is configured to rotate, That is, when the second suction nozzle 5A rotates together with the nozzle vertical shaft 31 about its central axis, the second suction nozzle 5A is arranged so that the suction hole 39 is disposed at the eccentric position as shown in FIG. With the nozzle up-and-down shaft 31, and the component is sucked and mounted on the printed board P in this state.

Further, the suction nozzles 5A may be attached to the nozzle vertical shaft 31 with their eccentric directions being different from each other. The second adsorption nozzle 5A may be configured to cause the eccentric direction of the second adsorption nozzle 5A to attract the component C with the suction hole 39 approaching the rotation center T of the rotation axis 6B.

In the present embodiment, the component mounting apparatus 1 having the mounting head 6 provided with the plurality of nozzle vertical shafts 31 on the same circumference around the rotation center T has been described. However, the component mounting apparatus 1 may have a mounting head 6 in which the nozzle up-and-down shaft 31 or an attaching portion equivalent thereto is arranged in a line. In this case, in the direction in which the suction holes 39 of the second suction nozzle 5A attached to the upper and lower nozzles 31 adjacent to each other are opposite to each other, that is, in the direction perpendicular to the arrangement direction of the nozzle upper and lower shafts 31, And the second suction nozzle 5A is attached so as to be positioned on the opposite side of the vertical shaft 31. [ As a result, the distance between the suction holes 39 of the adjacent second suction nozzles 5A can be made different.

In the present embodiment, the component mounting apparatus 1 of the type that adsorbs, holds, and conveys components by negative pressure has been described. However, the component mounting apparatus 1 is not limited to the suction nozzles 5 (5A) And a component holding member having a component holding surface for holding the component C (LC) by the method of Fig. In this case, the component holding surface is provided so that its center position is shifted in the horizontal direction from the center position of the connecting portion (corresponding to the connecting portion 29, 29A). The component holding member is attached to the mounting head 6 so that the distance between the center positions of the component holding faces of the component holding members adjacent to each other is larger than the distance between the center positions of the connecting portions of the component holding members. With this configuration, it is possible to suppress the interference of the components (LC) held by the adjacent component holding members with respect to the component mounting apparatus (1) provided with the component holding member. Thus, the component mounting apparatus 1) can be enjoyed.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Modifications or variations are included.

The present invention described above can be summarized as follows.

According to an aspect of the present invention, there is provided a component mounting apparatus for mounting a component on a substrate while holding the component, comprising: a mounting head having a plurality of nozzle mounting portions formed at positions different in horizontal direction; Wherein the suction nozzle has a connecting portion connected to the nozzle attaching portion and a component attracting surface having a suction hole centered at a position shifted in the horizontal direction from a center position of the connecting portion, The adsorption nozzles adjacent to each other are attached to the nozzle attachment portion in such a state that the distance between the center positions of the suction holes of the suction nozzles is larger than the distance between the center positions of the connection portions of the suction nozzles.

According to this configuration, even when a relatively large component is sucked by the adjacent suction nozzles, the gap between the center positions of the suction holes of the suction nozzles adjacent to each other is larger than the interval between the center positions of the connection portions of the suction nozzles, It is possible to suppress interferences between each other. Therefore, in the component mounting apparatus having the mounting head having a plurality of suction nozzles, it is possible to suppress the decrease in the number of the suction components when the component having a large size is sucked, without replacing the mounting head.

In this component mounting apparatus, the nozzle attachment portion has a head side internal passage for supplying a negative pressure to the suction nozzle, and the mounting head communicates with the suction hole at the center position of the connection portion, And a nozzle-side internal passage connected thereto.

According to this configuration, in the component mounting apparatus in which the head-side inner passage and the nozzle-side inner passage communicate with each other at the center position of the connection portion of the suction nozzle, when the above action, that is, a relatively large component is attracted by the adjacent suction nozzle It is possible to suppress the interference of the components with each other.

In addition, it is preferable that the component mounting apparatus has the plurality of nozzle attachment portions on the same circumference around the vertical axis.

According to this configuration, it is possible to provide the mounting head with more suction nozzles in a state in which the distance between the center positions of the suction holes of the suction nozzles adjacent to each other is larger than the distance between the center positions of the connecting portions of the suction nozzles.

In this case, it is preferable that the suction holes of the plurality of suction nozzles are located radially outward of the circumference.

According to this configuration, the plurality of suction nozzles arranged on the circumference are provided in the mounting head in such a state that the distance between the center positions of the suction holes of the suction nozzles adjacent to each other is larger than the distance between the center positions of the connection portions of the suction nozzles Lt; / RTI >

In the component mounting apparatus, it is preferable that the component attracting surface has a center at a position shifted in the horizontal direction from the center position of the connecting portion.

According to this configuration, it is possible to stably adsorb the component with the component adsorption surface while sucking the component through the suction hole.

According to another aspect of the present invention, there is provided a component mounting apparatus for holding a component and mounting the component on a substrate, the component mounting apparatus comprising: a mounting head having a plurality of mounting portions formed at positions different from each other in the horizontal direction; Wherein the component holding member has a connecting portion connected to the attaching portion and a component holding surface having a center at a position shifted in the horizontal direction from the center position of the connecting portion, The component holding members adjacent to each other are attached to the mounting head in such a state that the distance between the center positions of the component holding faces of these component holding members is larger than the distance between the center positions of the connecting portions of the component holding members.

With this configuration, since the distance between the center positions of the component holding surfaces of the adjacent component holding members is larger than the distance between the center positions of the connecting portions of the component holding members, a relatively large component is sucked It is possible to suppress the interference of the parts with each other. Therefore, in the component mounting apparatus having the mounting head having a plurality of component holding members, it is possible to suppress the decrease in the number of the suction components when the component having a large size is sucked, without replacing the mounting head.

Claims (6)

1. A component mounting apparatus for mounting and holding components on a substrate,
A mounting head having a plurality of nozzle attaching portions formed at different positions in the horizontal direction, and a plurality of suction nozzles attached to the nozzle attaching portion,
Wherein the suction nozzle has a connection part connected to the nozzle attachment part and a component suction surface having a suction hole centered at a position shifted in the horizontal direction from an intermediate position of the connection part,
The suction nozzles adjacent to each other among the plurality of suction nozzles are attached to the nozzle attachment portion in a state in which the distance between the center positions of the suction holes of the suction nozzles is larger than the distance between the center positions of the connection portions of the suction nozzles . The method according to claim 1,
Wherein the nozzle attachment portion has a head side internal passage for supplying a negative pressure to the suction nozzle,
Wherein the mounting head has a nozzle-side internal passage communicating with the suction hole at a center position of the connecting portion, the nozzle-side internal passage communicating with the head-side internal passage. 3. The method according to claim 1 or 2,
Wherein the plurality of nozzle attaching portions are provided on the same circumference with the vertical axis as the center. The method of claim 3,
And the suction holes of the plurality of suction nozzles are located radially outward of the circumference. 3. The method according to claim 1 or 2,
Wherein the component attracting surface has a center at a position shifted in the horizontal direction from the center position of the connecting portion. 1. A component mounting apparatus for mounting and holding components on a substrate,
A mounting head having a plurality of mounting portions formed at positions different from each other in the horizontal direction, and a plurality of component holding members attached to the mounting portion,
Wherein the component holding member has a connecting portion connected to the attaching portion and a component holding surface having a center at a position shifted in the horizontal direction from the center position of the connecting portion,
The component holding members adjacent to each other among the plurality of component holding members are attached to the mounting head in such a state that the distance between the center positions of the component holding faces of the component holding members becomes larger than the distance between the center positions of the connecting portions of the component holding members And the component mounting device is mounted on the component mounting apparatus.
KR1020150024046A 2014-02-21 2015-02-17 Apparatus for mounting component KR101632264B1 (en)

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JPJP-P-2014-031775 2014-02-21
JP2014031775A JP6263413B2 (en) 2014-02-21 2014-02-21 Electronic component mounting device

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KR20150099452A true KR20150099452A (en) 2015-08-31
KR101632264B1 KR101632264B1 (en) 2016-06-21

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DE102018122593B3 (en) * 2018-09-14 2020-02-06 Asm Assembly Systems Gmbh & Co. Kg Placement head with intermeshing rotors, placement machine, method for loading a component carrier

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