JPH0336799A - Correcting device for positional deviation of chip with lead in electronic component mounting apparatus - Google Patents

Abstract

PURPOSE:To advantageously correct the positional deviation of a chip with leads by bringing the upper face of a mold into contact with a positioning unit, pressing a correction pawl to the upper part of the wall of the mold in this state, and corrects the positional deviations of the chip in directions X, Y, theta. CONSTITUTION:When a second transfer head 6 transfers a chip P of a chip supply unit 7 to a placing unit 24, a table 21 is rotated at 90 deg. to transfer the chip P to a position directly under a correction unit 31. When the rod 44 of a cylinder 43 protrudes, the chip P is lifted by a pin 49, the upper face of a mold M is brought into contact with the lower face of a positioning unit 35, thereby positioning the chip P in the vertical directions. Spring materials 46, 48 absorb an impact when the chip P is pressed to the unit 35. Then, when a cylinder 40 is operated, a rotary blade 36 is rotated, correction pawls 34a-34d are moved forward toward the chip P. Thus, the pawls 34a-34d are pressed to the top of the wall of the mold M of the chip P to correct the positional deviations of the chip P in directions X, Y, theta.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a device for correcting the positional deviation of a chip having leads in an electronic component mounting apparatus, and in particular to a device for correcting the positional deviation of a chip having leads such as a QFP or SOP in the XYθ directions. This invention relates to a deviation correction means.

(Prior art) (Electronic component mounting equipment that mounts electronic components such as C chips and LSI chimps on substrates picks up chips from a chip supply section such as a tray or tape feeder by adsorbing them to the nozzle of a transfer head. After correcting the positional deviation in the XYθ directions, the substrate is mounted on the substrate positioned in the positioning section.

As a means for correcting positional deviation in the XYθ directions, the
The one disclosed in Japanese Patent No. 3598, particularly in FIG. 15, is known. This device mechanically corrects the positional deviation of the chip in the XYθ directions by pressing position regulating claws (correction claws) from four directions against the wall surface of the mold body of the chip that is attracted to the nozzle. There is.

(Problem to be solved by the invention) By the way, chips such as QFP and SOP,
Some types have leads protruding from the side wall surface of the molded body.

In the case of such a chip, if the correction water hits the leads when pressed against the wall surface of the mold, the leads will be damaged and misalignment will not be corrected properly.

Therefore, an object of the present invention is to provide a means that can advantageously correct the positional deviation of a chip having leads.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component mounting apparatus that transfers and mounts a chip having leads from a chip supply section to a substrate positioned in a positioning section. A chip positional deviation correction device is provided between the positioning unit and the positioning unit, and includes a table on which the chip is transferred by the transfer head, and a positional deviation correction unit installed above the table. It is composed of a positioning body that abuts the upper surface of the mold to position the upper surface, and a correction water that presses against the upper wall surface of the mold from the side to correct positional deviation in the xyθ directions.

(Function) In the above configuration, the chips in the chip supply section are transferred onto the table by the transfer head. Next, the upper surface of the mold body comes into contact with the positioning body, and in this state, correction water is pressed against the upper wall surface of the mold body, thereby correcting the positional deviation of the chip in the XYθ directions.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of the electronic component mounting apparatus, in which ``■'' is a main body box, and a positioning section 4 for clamping and positioning a board 3 is provided on its upper surface. Reference numeral 5 denotes a conveyor that carries the substrate 3 into and out of the positioning section 4. A chip supply section 7 is provided on the side of the positioning section 4 and is comprised of a tray containing chips such as QFP having leads in four directions. In addition to trays, tape feeders and tube feeders are commonly used as chip supply units.

Reference numeral 8.8 denotes two chip transfer devices installed above the main body box 1, which include an XY table 9 that is moved from the X table 9a and a Y table 9b, and a transfer device that is attached to the tip of the Y table 9b. The warning is from the head IO and the board observation camera 2. Although only one chip transfer device 8 may be used, in this embodiment, two are provided to double the chip mounting efficiency, and the chips P are mounted on two substrates 3°3 at the same time. There is.

MX and MY are motors for driving the x and X tables 9a and 9b.

15 is a laser device provided between the chip supply section 7 and the positioning section 4, and 17 is a defective stock soaker. Reference numeral 20 denotes a chip misalignment correcting device comprising a table 21 and the like provided between the laser device 15 and the chip supply unit 7, and the details thereof will be explained next with reference to FIGS. 2 and 3. .

The table 21 is a turntable rotatably supported by a base portion 22, and is driven by a motor 23 serving as a drive portion to horizontally rotate. At both ends of this table 21,
A mounting section 24 for the chip P is provided. Reference numeral 6 denotes a second transfer head, which is driven by an XY table (not shown) and moves in the XY force direction to pick up the chips P in the chip supply section 7 and move them to the transfer position a! 1 device 24. This mounting portion 24 has an air intake hole 25 that communicates with a suction device (not shown), and the chip P placed ia thereon is attracted to the air intake hole 25 so as not to shake. 26 is a suction tube. Reference numeral 29 denotes a correction section provided in the middle of the transfer path of the chip P by the table 21, and its details will be explained next.

FIG. 4 is a plan view of the correction unit 31 housed in the main body box 30 of the correction section 29, and FIG. 5 is a perspective view of the correction unit 31 inverted vertically. Reference numeral 32 denotes a rectangular plate which is the main body of the correction unit 31, and has four grooves 33 formed in a substantially cross shape.
b.

34c and 34d are slidably attached.

Further, at the center of the lower surface of the plate 32, there is a positioning body 35 that abuts against the upper surface of the chip P to position the upper surface of the chip P.
is installed protrudingly.

In FIG. 4, two rotating blades 36 are disposed on the upper surface of the plate 32 so as to be rotatable about a bottle 37. A rotor 38 is pivotally attached to the tip of each rotating blade 36, and the bifurcated tip of the rotor 38 is connected to the correction water 34a.
It engages with the bin 39 erected at ~34d. 40 is a cylinder for rotating the rotating blade 36.

In FIG. 3, reference numeral 42 denotes a device for pushing up the chip P disposed below the correction unit 31, and the cylinder 43
A plate body 45 is moved up and down by the rod 44 of the cylinder 43, a bottle 47 is vertically movable on the plate body 45 via a spring material 46, and a spring material 48 is attached to the mounting portion 24. The bottle 49 is vertically movable via the bottle 49.

Therefore, when the second transfer head 6 transfers the chips P from the chip supply section 7 onto the mounting section 24, the table 21
In the figure, the chip P is rotated 90° counterclockwise and transferred directly below the correction unit 31. Therefore cylinder 43
When the rod 44 protrudes, the chip P is pushed up by the bottle 49, and the upper surface of the mold body M is placed on the positioning body 35.
The chip P is positioned in the vertical direction by being brought into contact with the lower surface of the chip P. Note that the spring members 46 and 48 absorb the impact when the chip P is pressed against the positioning body 35. Next, when the cylinder 40 operates, the rotary blade 36 rotates, and the correction water 34a to 34d advances toward the chip P, and the correction water 34a to 34d press against the upper part of the wall surface of the mold body M of the chip P. , the positional deviation of the chip P in the XYθ directions is corrected (see the chain line in FIG. 3). Next, the correction waters 34a to 34d retreat, the rod 44 of the cylinder 43 descends, and the chip P lands on the mounting section 24. In this way, the upper surface of the molded body M is fixed to the positioning body 3 so that the upper surface of the molded body M becomes a height reference plane.
Since the correction waters 34a to 34d are moved forward after being positioned by step 5, the correction waters 34a to 34d
The molded body M can be reliably pressed against the upper wall surface of the molded body M without hitting the lead L. Note that as means for bringing the upper surface of the molded body M into contact with the positioning body 35, the positioning body 35 may be lowered with respect to the molded body M without pushing up the molded body M.

The positional deviation correction of the chip P performed in this manner is a rough correction performed prior to precise positional deviation detection of the chip P and the board L by the laser device 15. In addition, in order to be able to press even a small chip P, one of the correction water 34a, 3
The width of the correction water 4b is considerably smaller than that of the other correction water 34c and 34d.

The laser device 15 is located on the side of the table 21, and irradiates a laser beam from the chip P adsorbed to the nozzle 16 of the transfer head 10 toward the leads protruding laterally, and detects the reflected light. It is something. If the positional deviation of the chip P adsorbed by the nozzle 16 is too large, the laser beam will not be able to accurately hit the predetermined location of the lead L. This is a rough correction. In Figure 2, 11
is a motor that rotates the nozzle 16, and is integrally installed in the transfer head IO.

Observation of the lead L is performed as follows.

That is, when the rough correction of chip P is completed, table 2
1 further rotates 90'', and the chip P is transferred to the take-off hub position b (see Figure 2) of the transfer head 10.Then, the nozzle 16 of the transfer head 10 lands on the center of the chip P and ticks it. Then, by driving the XY table 9, a large number of chips L protruding at a pitch from one side A of the mold body M of the chip P are irradiated with laser light. , observe the reflected light. In the partially enlarged view of FIG.
The chip P is rotated 906 times around the nozzle 16 by driving, and the leads L on the sides B, C, and D are similarly observed. In the case of a sop with leads in two directions,
Rotate 180°.

FIG. 7 is a diagram showing the output waveform of the reflected light from the sides A, B, C, and D on the sides L observed by the laser device 15 in this manner, and t is the rotation time of the motor 11. Waveform e with a short amplitude indicates that there is a float in the lead. Further, f with no output indicates that the lead L was bent and was not irradiated with laser light. Also, from the bisectors N1 to N4 of the waveform of the lead rows on each side A to D, points 1 to 4 are detected at the points that bisect the lead rows on each side A to D, as shown in Figure 8. Then, by detecting the center G of the chip P from the intersection G of the lines Ql and Q2 connecting points 1 and 3 and points 2 and 4, and comparing it with the center reference point GA, this center Positional deviation in XY force direction of 〇 △X.

You can get 40 Δy. Further, by comparing this line Ql and the reference line QA, a positional deviation Δθ in the θ direction can be detected. Such calculations are performed by a computer connected to the laser device 15.

This device has the above-mentioned configuration, and the overall operation will be explained below.

In FIG. 2, when the transfer head 6 transfers the chip P from the chip supply section 7 to the mounting section 24 at the transfer position a of the table 21, the table 21 rotates 90'' and transfers the chip P to the correction unit. 31. There, cylinder 4
3 operates, pushes up the tip P, and then the correction water 34
a to 34d are pressed against the mold body M of the chip P to perform rough correction thereof.

Next, the rod 44 of the cylinder 43 is withdrawn and the chip P lands on the mounting portion 24, the table 21 is further rotated by 90 degrees, and the chip P is transferred to the pick-up position. Next, the first transfer head 10 arrives above this chip P, ticks it up, transfers it onto the laser device 15, observes the lead L, and detects whether the lead L is floating or bent. At the same time, the positional deviations of the chip P △X, △y,
Detect Δθ. If floating or bending of the laminated board L exceeding the allowable value is detected, the chip P is collected as a defective product in the stocker 1F.

Next, the transfer head 10 moves above the substrate 3 and mounts this chip P on the substrate 3. At this time, the positional deviations ΔX and Δy in the XY force direction are adjusted by adjusting the movement stroke of the XY table 9. The positional deviation in the θ direction △θ
is corrected by rotating the nozzle 16 with the motor 11.

(Effects of the Invention) As described above, the present invention provides an electronic component mounting apparatus in which a chip having leads is transferred and mounted from a chip supply section to a substrate positioned in a positioning section. A chip misalignment correction device is provided between the transfer section and the chip misalignment correction device, which consists of a table on which the chips are transferred by the transfer device and a misalignment correction unit installed above the table. It consists of a positioning body that abuts the upper surface of the mold body to position the upper surface, and a correction water that presses against the upper wall surface of the mold body from the side to correct positional deviation in the xyθ directions. Therefore, after positioning a chip with leads such as a QFP in the vertical direction using the top surface of the mold as a reference plane, apply correction water to the upper part of the wall of the mold above the leads. It is possible to reliably correct misalignment without damaging the product.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of an electronic component mounting apparatus, Fig. 2 is a plan view of a table, Fig. 3 is a sectional view of a correction device, and Fig. 4 is a correction device. A plan view of the unit, FIG. 5 is a perspective view of the same, and FIG. 6 is a perspective view of the laser device.
FIG. 7 is a waveform diagram, and FIG. 8 is a plan view of the chip. 3... Board 4... Positioning unit 6... Transfer head 7... Chip supply unit 20... Misalignment correction device 21... Table 31... Correction units 34a, 34b, 34c, 34d--Correction claw 35...
・Positioning body 42...Pushing device L...Lead M...Mold body/chip

Claims (1)

[Claims] In an electronic component mounting apparatus that transfers and mounts a chip having leads from a chip supply section to a substrate positioned in a positioning section, a transfer head is provided between the chip supply section and the positioning section. A chip positional deviation correction device is provided, which includes a table on which the chip is transferred and a positional deviation correction unit provided above this table. A lead in an electronic component mounting apparatus characterized by comprising a positioning body for positioning the upper surface and a correction claw that presses against the upper wall surface of the mold body from the side to correct positional deviation in the XYθ directions. Chip misalignment correction device.