JPH0477233U - - Google Patents

Info

Publication number
JPH0477233U
JPH0477233U JP12090790U JP12090790U JPH0477233U JP H0477233 U JPH0477233 U JP H0477233U JP 12090790 U JP12090790 U JP 12090790U JP 12090790 U JP12090790 U JP 12090790U JP H0477233 U JPH0477233 U JP H0477233U
Authority
JP
Japan
Prior art keywords
semiconductor device
positioning mechanism
pushing
operates
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12090790U
Other languages
Japanese (ja)
Other versions
JP2527284Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990120907U priority Critical patent/JP2527284Y2/en
Publication of JPH0477233U publication Critical patent/JPH0477233U/ja
Application granted granted Critical
Publication of JP2527284Y2 publication Critical patent/JP2527284Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す側面図、第2
図は本考案の他の実施例を示す要部の上面図、第
3図a,bは本考案の対象となる半導体装置の上
面図及び側面図、第4図は従来の半導体装置の位
置決め機構を示す側面図、第5図は従来の半導体
装置の位置決め機構の上面図である。 1……半導体装置、2……位置決めステージ、
3……位置決めプレート、4……バネ、5……ス
トロークベアリング、6……ローラーベアリング
、7……カム、8……シヤフト、9……シヤフト
固定プレート、10……ACモーター、11……
上下用段付プレート、12……上下用シヤフト。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a top view of essential parts showing another embodiment of the present invention, Figures 3a and b are top and side views of a semiconductor device to which the present invention is applied, and Figure 4 is a conventional positioning mechanism of a semiconductor device. FIG. 5 is a top view of a conventional positioning mechanism for a semiconductor device. 1... Semiconductor device, 2... Positioning stage,
3... Positioning plate, 4... Spring, 5... Stroke bearing, 6... Roller bearing, 7... Cam, 8... Shaft, 9... Shaft fixing plate, 10... AC motor, 11...
Upper and lower stepped plate, 12...Upper and lower shaft.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置の側面周辺を水平方向に押して位置
決めをおこなう位置決め機構において、垂直方向
と水平方向に動作する機構を有することを特徴と
する半導体装置の位置決め機構。
A positioning mechanism for a semiconductor device that positions the semiconductor device by pushing the periphery of the side surface of the semiconductor device in the horizontal direction, the mechanism comprising a mechanism that operates in the vertical and horizontal directions.
JP1990120907U 1990-11-19 1990-11-19 Positioning device for semiconductor devices Expired - Fee Related JP2527284Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990120907U JP2527284Y2 (en) 1990-11-19 1990-11-19 Positioning device for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990120907U JP2527284Y2 (en) 1990-11-19 1990-11-19 Positioning device for semiconductor devices

Publications (2)

Publication Number Publication Date
JPH0477233U true JPH0477233U (en) 1992-07-06
JP2527284Y2 JP2527284Y2 (en) 1997-02-26

Family

ID=31868789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990120907U Expired - Fee Related JP2527284Y2 (en) 1990-11-19 1990-11-19 Positioning device for semiconductor devices

Country Status (1)

Country Link
JP (1) JP2527284Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623598A (en) * 1985-06-28 1987-01-09 Sharp Corp Driving method for piezoelectric speaker
JPH01172244A (en) * 1987-12-28 1989-07-07 Kawasaki Steel Corp Method for classifying water-granulated slag
JPH0336799A (en) * 1989-07-03 1991-02-18 Matsushita Electric Ind Co Ltd Correcting device for positional deviation of chip with lead in electronic component mounting apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623598A (en) * 1985-06-28 1987-01-09 Sharp Corp Driving method for piezoelectric speaker
JPH01172244A (en) * 1987-12-28 1989-07-07 Kawasaki Steel Corp Method for classifying water-granulated slag
JPH0336799A (en) * 1989-07-03 1991-02-18 Matsushita Electric Ind Co Ltd Correcting device for positional deviation of chip with lead in electronic component mounting apparatus

Also Published As

Publication number Publication date
JP2527284Y2 (en) 1997-02-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees