JPH03102738U - - Google Patents
Info
- Publication number
- JPH03102738U JPH03102738U JP1216590U JP1216590U JPH03102738U JP H03102738 U JPH03102738 U JP H03102738U JP 1216590 U JP1216590 U JP 1216590U JP 1216590 U JP1216590 U JP 1216590U JP H03102738 U JPH03102738 U JP H03102738U
- Authority
- JP
- Japan
- Prior art keywords
- tray
- semiconductor wafer
- spring
- similar
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 claims 6
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の半導体ウエハ梱包トレイの一
実施例を示す説明図、第２図及び第３図は夫々従
来の梱包トレイの分解図及び組立図である。
１……トレイ、２，２Ａ，２Ｂ……ウエハ、５
……カバー、６……スプリング。
FIG. 1 is an explanatory diagram showing one embodiment of the semiconductor wafer packaging tray of the present invention, and FIGS. 2 and 3 are an exploded view and an assembled view, respectively, of a conventional packaging tray. 1...Tray, 2, 2A, 2B...Wafer, 5
...Cover, 6...Spring.
Claims (1)
スプリングで押え、その上をカバーで蓋をして梱
包する半導体ウエハ梱包トレイにおいて、前記ス
プリングが上下相似の形状を有し、前記カバーの
内面が前記トレイの内面と相似の形状を具え、前
記トレイに前記半導体ウエハが収納された後その
上面に前記上下相似形スプリングが配置され、該
スプリングの上方には別の半導体ウエハが載せら
れてその上方より内面形状がトレイ内面形状と相
似の前記カバーが被せられ、前記二枚の半導体ウ
エハが前記上下相似形スプリングにより上下方向
に押圧されてなる構造を有することを特徴とする
半導体ウエハ梱包トレイ。 In a semiconductor wafer packaging tray in which a semiconductor wafer is stored in a tray and pressed from the upper surface with a spring, and then covered with a cover for packaging, the spring has a top and bottom similar shape, and the inner surface of the cover is pressed against the tray. After the semiconductor wafer is stored in the tray, the upper and lower similar springs are disposed on the upper surface of the tray, and another semiconductor wafer is placed above the spring, and the inner surface is formed from above. A semiconductor wafer packaging tray, characterized in that the tray is covered with the cover having a shape similar to the inner surface of the tray, and the two semiconductor wafers are pressed in the vertical direction by the upper and lower springs having similar shapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1216590U JPH03102738U (en) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1216590U JPH03102738U (en) | 1990-02-09 | 1990-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102738U true JPH03102738U (en) | 1991-10-25 |
Family
ID=31515655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1216590U Pending JPH03102738U (en) | 1990-02-09 | 1990-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014507072A (en) * | 2011-02-16 | 2014-03-20 | テックスチェム アドバンスド プロダクツ インコーポレイテッド スンディリアン ブルハド | 1-stage and 2-stage wafer cushioning materials |
-
1990
- 1990-02-09 JP JP1216590U patent/JPH03102738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014507072A (en) * | 2011-02-16 | 2014-03-20 | テックスチェム アドバンスド プロダクツ インコーポレイテッド スンディリアン ブルハド | 1-stage and 2-stage wafer cushioning materials |