JPH07142535A - Method and device for chip mounting - Google Patents

Abstract

PURPOSE:To provide a means which automatically bonds the lead of a chip manufactured by TAB method to the electrode of a display panel at high speed and with high accuracy. CONSTITUTION:After correcting the positions of the chips 13 on a tray 12 by a presetter 24, the chip 13 is transferred to a first chip receiving table 27 by a second transfer head 3 and a separator adhered to the film carrier of the chip 13 is peeled off. At that time, the chip 13 and the separator peeling are recognized by a first camera 44. Then, the chip 13 is transferred to a second chip receiving table 51 by a third transfer head 4, and the lead of the chip 13 is aligned with the electrode of a display panel fixed on a vacuum block 82 and the lead is bonded to the electrode by a thermocompression bonder 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus and a mounting method for bonding a chip manufactured by the TAB method to a substrate such as a display panel.

[0002]

2. Description of the Related Art In a display panel such as a liquid crystal panel or a plasma panel used as a display for electronic devices, two transparent plates are attached to each other, and a chip is attached to electrodes arranged in parallel at the edges of the transparent plate. Manufactured by bonding.

As a chip, a TAB (Tape) is used.
Those manufactured by the Automated Bonding method are often used. The TAB method is a method in which a lead is attached to the surface of a film carrier, a semiconductor cut out from a wafer is mounted on the lead, and the film carrier is further punched by a die to manufacture a chip. It has the advantage of being compact and thin.

Generally, in a display panel, a large number of chips are bonded by aligning the leads of the chips with electrodes formed with narrow pitches on the edges of a plurality of sides, so that the bonding work can be performed at high speed. Therefore, high bonding position accuracy is required. In recent years, as this type of chip, an anisotropic conductive tape (hereinafter referred to as "ACF") is attached to a bonding portion near the tip of the lead in order to bond the lead to an electrode of a display panel. Is becoming popular. ACF is a tape with adhesiveness, and since dust and dirt are likely to adhere to it, a separator is usually attached to protect it. Just before bonding the leads to the electrodes of the display panel, this separator is used. It is designed to be peeled off.

[0005]

As described above, the bonding of this type of chip to the electrodes of the display panel requires high speed and high bonding position accuracy. A feasible automatic chip mounting technology has not been established yet, and therefore, a large part of the work process depends on the manual work of the worker.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a chip mounting apparatus and mounting method capable of bonding a chip of this type to a substrate such as a display panel at high speed and with high positional accuracy.

[0007]

To this end, a chip mounting apparatus according to the present invention includes a transfer head having a collet for vacuum-sucking a chip supplied from a chip supply section, and a substrate for positioning the substrate horizontally. A moving table for moving the transfer head in the direction, a movable table for moving the transfer head above the electrode formed on the upper surface of the substrate, and a moving table below the moving path of the transfer head and attached to the lower surface of the film carrier. Whether the separator was peeled correctly by observing the anisotropic conductive tape under the moving path and the adhesive tape that comes in contact with the separated separator from below and peeled this separator from the anisotropic conductive tape. And an thermocompressor for thermocompression-bonding the anisotropic conductive tape to the electrodes of the substrate by pressing the upper surface of the tip of the film carrier.

[0008]

According to the above structure, the ACF attached to the chip
It is possible to perform a series of processes from peeling the separator to peeling the separator to aligning the chip lead with the electrode of the substrate and performing bonding with high speed and high positional accuracy.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall perspective view of a chip mounting device. A movable table 1 has a first transfer head 2, a second transfer head 3, and a third transfer head 4 on its front surface.
Is held, and when the motor 5 is driven, it horizontally moves in the Y direction along a guide rail 6a provided on the front surface of the fixed table 6. The first transfer head 2, the second transfer head 3 and the third transfer head 4 are provided with collets 7, 8 and 9 for vacuum suctioning chips.

A pedestal 11 is provided on the rear side of the movable table 1. A tray 12 is held on the pedestal 11. Chips 13 are stored in a matrix pocket of the tray 12. FIG. 2 is a plan view of the chip 13. The chip 13 is manufactured by the TAB method, and the leads 15, 1 are formed on the surface of the film carrier 14.
6 is formed, and the semiconductor 17 cut out from the wafer is further mounted thereon to be manufactured. An anisotropic conductive tape (ACF) 18 is attached to the tip of one lead 16 that is bonded to a display panel (described later) 53. The ACF 18 has an adhesive property, and a separator 19 is attached to the surface of the ACF 18 for protection thereof so that dust and the like do not adhere thereto. Position reference marks 20 are formed in spots on both sides of the lead 16. The position reference mark 20 serves as a target when the position of the lead 16 is detected by the first camera (described later) 44.

In FIG. 1, reference numeral 21 denotes a take-out head, which is held on a moving table (not shown), vacuum picks up the chips 13 of the tray 12 and picks them up, and temporarily stands on the front of the receiving table 11. 22 is transferred. Two
Reference numeral 3 denotes an adsorption hole formed on the upper surface of the temporary placing table 22, which is lightly vacuum-adsorbed and fixed so that the chip 13 transferred on the upper surface does not fluctuate.

A pre-center 24 is erected in front of the temporary table 22. On the upper surface of the pre-center 24, a hook-shaped fixed claw 25 and two movable claws 26 arranged so as to be orthogonal to each other are provided. The collet 7 of the first transfer head 2 vacuum-sucks and picks up the chip 13 on the temporary mounting table 22, and transfers it onto the pre-center 24. Two
The movable claws 26 are driven by the driving means incorporated in the pre-center 24 to move in the X direction and the Y-direction, and press the chip 13 on the pre-center 24 against the fixed claw 25 to correct the position of the chip 13. To do.

A first chip holder 27 is provided in front of the pre-center 24. The second transfer head 3 collects the position-corrected chip 13 on the pre-center 24 by the collet 8
It is vacuum-adsorbed on and picked up, and as shown in FIG.
It is placed on the chip receiving stand 27. As detailed later,
With the chip 13 placed on the first chip support 27, the separator 19 attached to the surface of the ACF 18 is peeled off. Reference numeral 28 is a suction hole for vacuum-sucking and fixing the film carrier 14.

Next, a stripping mechanism for stripping the separator 19 from the ACF 18 will be described. In FIG.
A frame 31 is installed on the X table 32. 33 is a motor for driving the X table 32,
When the motor 33 is driven, the frame 31 moves in the X direction. FIG. 4 is a front view of the frame 31, and FIG. 5 is a partially enlarged front view. A supply reel 34 and a take-up reel 35 are pivotally mounted on the front surface of the frame 31. An adhesive tape 36 is wound around the supply reel 34. When the motor 37 is driven and the take-up reel 35 rotates, the adhesive tape 36 is taken out from the supply reel 34 and taken up by the take-up reel 35.

The adhesive tape 36 is fed along the pressing roller 38a and the guide roller 38b. Pushing roller 38a
The guide roller 38b is pivotally mounted on the bracket 39. The bracket 39 is pivotally attached to the front surface of the frame 31 by a pin 40 so as to be vertically rotatable. In FIG. 1, a cylinder 41 is mounted on the back surface of the frame 31. The rod 42 of the cylinder 41 is connected to one end of the arm 43. The other end of the arm 43 is joined to the pin 40 (see also FIG. 4 above). Therefore, when the rod 42 of the cylinder 41 protrudes and retracts, the arm 43
Swings vertically, and the pressing roller 38a and the guide roller 38b swing vertically in FIG. 4 (see arrow N1).

FIG. 5 shows a state in which the pressing roller 38a and the guide roller 38b are raised and the pressing roller 38a is in contact with the lower surface of the separator 19. In this state, the motor 33 (FIG. 1) is driven to move the pressing roller 38a and the guide roller 38b in the longitudinal direction (X direction) of the separator 19, and the motor 37 (FIG. 4) is driven to move the adhesive tape 3
6 by moving in the direction of the arrow, the adhesive tape 36
Transfer the separator 19 to the
Strip from 18. When the stripping is completed, the cylinder 41 is operated in the reverse direction to lower the pressing roller 38a and the guide roller 38b, and the motor 33 is driven in the reverse direction to return to the original position.

In FIGS. 1 and 4, a first camera 44 is mounted on the end of the frame 31. By driving the X-table 32, the first camera 44 is moved to the position shown in FIG.
As shown in FIG. 7, the collet 8 is horizontally moved in the X direction below the tip 13 vacuum-adsorbed. Then, the first camera 44 observes whether or not the separator 19 is correctly separated from the ACF 18, and also observes the position reference mark 20 (FIG. 2) of the chip 13 to temporarily recognize the position of the chip 13. The first camera 44 moves in the X direction together with the pressing roller 38a and the guide roller 38b to move the separator 1
The above observation is performed immediately after 9 is peeled off by the adhesive tape 36. The first camera 44 includes an ACF 18 and a separator 19
It is to inspect whether the separator 19 has been peeled off from the difference in the brightness of the ACF 18, but the inspection means is not limited to this embodiment. For example, a laser device is used instead of the first camera 44, and the ACF 18 is used. It may be possible to inspect whether or not the separator 19 is peeled off by measuring the height up to the separator 19 or the height up to the separator 19. Further, the position reference mark 20 serves as a target for recognizing the position of the chip 13, but the target may be a characteristic part, for example, the leads 16 located at both ends of the film carrier 14 may be targets. The target is not limited to this embodiment.

Next, the receiving mechanism of the chip 13 at the time of bonding will be described. In FIGS. 1 and 7, reference numeral 51 is a second chip holder provided in front of the frame 31. The third transfer head 4 includes the chip 1 on which the separator 19 is peeled off on the first chip support 27 as described above.
The collet 3 is vacuum-sucked to the collet 9 and picked up, and is mounted on the second chip holder 51 as shown in FIG. Although the third transfer head 4 includes the collet 9 and the thermocompression bonding element 10, the thermocompression bonding element 10 may be provided in a head separate from the third transfer head 4. Reference numeral 52 denotes a suction hole, which is vacuum-sucked and fixed so that the chip 13 on the second chip receiving base 51 does not sway. Second chip holder 5
As shown in FIG. 7, 1 supports the tip 13 vacuum-adsorbed by the collet 9 by being lifted by a vertically moving means (not shown), and is lowered to release the supporting state.

In FIG. 7, reference numeral 53 is a display panel.
The display panel 53 is made by bonding a lower plate 54 and an upper plate 55 together. The lower plate 54 and the upper plate 55 are made of a transparent plate such as a glass plate. FIG. 8 is a partial plan view of the display panel 53, and a large number of electrodes 56 are arranged side by side at a narrow pitch on the edges of a plurality of sides of the lower plate 54. Position reference marks 57 are formed in spots at appropriate places between the electrodes 56. The position reference mark 57 serves as a target for observation by the second camera 72 and the third camera 73 (both will be described later). The chip 13 is bonded to the edge of the lower plate 54 with the lead 16 of the chip 13 aligned with the electrode 56.

In FIG. 1, reference numeral 61 is a lower support member for supporting the edge portion of the display panel 53 from below. This base member 6
1 is mounted on a U-shaped receiving portion 62 having a planar shape so as to be slidable in the Y direction. The lower support member 61 is a cylinder 63
When the rod 64 is projected and retracted, the lower receiving member 61 slides in the Y direction. Also the receiving part 6
Reference numeral 2 is connected to the upper end of a rod 66 of a vertical cylinder 65, and when the rod 66 projects and retracts, the receiving portion 62 moves up and down. In FIG. 7, the lower receiving member 61 shown by a solid line is in a retracted state. The rod 64 of the cylinder 63 retracts,
When the rod 66 of the cylinder 65 projects, the lower receiving member 61 moves to the position indicated by the chain line, and supports the lower surface of the edge portion of the lower plate 54 of the display panel 53 from below. With the lower plate 54 supported in this manner, the thermocompressor 10 is lowered,
ACF 18 attached to the tip of the film carrier 14
Is pressed against the electrode 56 of the lower plate 54 to attach the lead 16 to the electrode 5
Connect to 6. When the work is completed, the cylinder 63 and the cylinder 65 operate in the opposite directions, and the lower receiving member 61 returns to the solid line position. 67 is a heater built in the thermocompression bonding element 10.

In FIG. 1, a movable box 71 is provided below the lower receiving member 61. A second camera 72 and a third camera 73 are provided inside the movable box 71. A motor 74 is provided on both sides of the movable box 71.
When the motors 74 and 75 are driven, the second camera 72 and the third camera 73 move in the X direction independently of each other to adjust the position of each field of view. In FIG. 7, the second camera 72 and the third camera 73 are located below the thermocompressor 10, and the position reference mark 20 of the chip 13 and the position reference mark 57 of the display panel 53 are observed.
The relative displacement of the lead 16 of the chip 13 and the electrode 56 of the display panel 53 in the X direction, Y direction, and θ direction (horizontal rotation direction) is detected.

In FIG. 1, 80 is a mounting device for the display panel 53, and FIG. 9 is a side view of the mounting device 80. Next, the structure of the mounting device 80 will be described. Reference numeral 81 is a turntable, and suction blocks 82 as substrate supporting portions are provided at both ends thereof. The display panel 53 is vacuum-sucked and supported by the upper surface of the suction block 82. 82a
Is a suction hole for vacuum suction so that the display panel 53 does not fluctuate. A shaft 81a is attached to the center of the lower surface of the turntable 81, and the shaft 81a is supported by a bearing 83 so as to be horizontally rotatable. Reference numeral 84 denotes a support bracket for the bearing 83, which is a rotary actuator 85.
It is installed on top. The rotary shaft 85a of the rotary actuator 85 and the rotary shaft 81a of the turntable 81 are connected by a coupling 85b. Therefore, when the rotary actuator 85 is driven, the turntable 81
Rotates 180 ° horizontally. Although the turntable 81 of the present embodiment has a long plate shape, the turntable 81 has a cross shape in a plan view, and the suction blocks 8 are provided at the four tip portions thereof.
2 may be provided, and the shape structure of the turntable 81 is not limited to this embodiment.

86 is an X table, 87 is a Y table, and the rotary actuator 85 is installed on the X table 86 via a base plate 88. Reference numeral 89 is a drive motor for the X table 86, and 90 is a drive motor for the Y table 87. When the X table 86 and the Y table 87 are driven,
The display panel 53 placed on the suction block 82 horizontally moves in the X direction and the Y direction.

In FIGS. 1 and 9, the suction block 82 on the left side (on the side of the lower receiving member 61) is at the bonding position a, and the chip 13 is bonded to the display panel 53 on this suction block 82. The suction block 82 on the right side
Is at the standby position b, and makes the display panel 53 to which the chip 13 is to be bonded next stand by. That is, by horizontally rotating the turntable 81 by 180 °, the suction block 82 at the standby position b moves to the bonding position a on the lower receiving member 61 side, and the chip 13 is bonded onto the lower plate 54 thereof. Further, the display panel 53 to which the chip 13 is bonded is moved to the standby position b when the turntable 81 is horizontally rotated again by 180 °, and is taken out from the suction block 82 by a manual operation of an operator or an automatic removing means.

In the display panel 53, electrodes 56 are formed on the edges of two or three sides of the lower plate 54 which are orthogonal to each other. Therefore, the chip 13 is bonded to the electrodes 56 on the two or three sides one after another. Thus, the display panel 53
In order to bond the chip 13 to a plurality of sides of the display panel 53, the display panel 53 on the suction block 82 must be horizontally rotated 90 ° at the bonding position a in FIG. 9 (see arrow N2). Then, next, the suction block 82 is set to 90 °.
A rotation mechanism for horizontally rotating will be described.

FIG. 10 is a partial sectional view. 9 and 10, a coupling 91 and a flange 92 are attached to both ends of the turntable 81. A vertical shaft 93 is inserted in the center of the coupling 91 and the flange 92. The upper end of the shaft 93 is joined to the lower surface of the suction block 82. Flange 92
A cylindrical rotating body 94 is interposed between the shaft 93 and the shaft 93. 95 and 96 are bearings. Shaft 93
A joint 97 is attached to the lower end of the. A protrusion 98 is provided on the lower surface of the joint 97. Rotating body 94 and joint 9
A spring 99 is interposed between 7 and the joint 97.
Is blasting downwards.

In FIGS. 1 and 9, a cylinder 100 is installed at the tip of the base plate 88. Cylinder 10
An actuator 102 for 90 ° rotation is attached to the upper end of the rod 101 of No. 0. Actuator 102
A joint 104 is connected to the upper end of the output shaft 103 of FIG. The joint 104 has a recess 105 into which the protrusion 98 is fitted. Therefore, when the rod 101 of the cylinder 100 projects and the joint 104 rises, the protrusion 98 fits in the recess 105. When the actuator 102 is driven in that state, the shaft 93 moves 90
° rotate.

In FIG. 10, a coupling 106 is attached to the lower surface of the suction block 82. FIG. 20 is a perspective view of the couplings 91 and 106. On the upper surface of the coupling 91 and the lower surface of the coupling 106, V-shaped protrusions 106a and concave grooves 91a that engage with each other are radially formed. 91b and 106b are the shaft 9
3 is a through hole. The projecting portion 106a and the concave groove portion 91a are 90 ° from each other at the centers of the through holes 91b and 106b.
Accurately formed along the orthogonal straight line, the protrusion 1
06a and the suction block 82 when the concave groove portion 91a is engaged
It is designed to be accurately positioned at 90 ° pitch. Therefore, the actuator 102 that rotates the suction block 82 by 90 ° may be inexpensive and has a low resolution, and the cost can be reduced. In FIG. 10, the projection 106a and the groove 91a are engaged with each other and the coupling 9
1 shows the state in which 1 and the coupling 106 are engaged. In this state, the protrusion 106a and the concave groove 91a are
The suction block 82 is firmly engaged with each other by its own weight and the force of the spring 99, and even if the chip 13 is bonded to the electrode 56 of the display panel 53, the suction block 8
2 is prevented from rattling in the horizontal direction.

Further, as shown in FIG. 9, when the rod 101 of the cylinder 100 projects upward, the shaft 93 is pushed up while compressing the spring 99 via the joints 104 and 97, and is attached to the upper end of the shaft 93. The suction block 82 also rises. In this state, the coupling 91
The engagement state between the coupling block 106 and the coupling 106 is released, and when the actuator 102 is driven in this state, the suction block 8
2 horizontally rotates in the direction of arrow N2 by 90 °. Therefore, the display panel 53 vacuum-sucked by the suction block 82 is also 90
° Rotate horizontally and change its direction. Then cylinder 10
When the rod 101 of No. 0 is lowered, the concave portion 91a of the coupling 91 is engaged with the inclined portion of the protrusion 106a of the coupling 106, and the orientation of the suction block 82, that is, the display panel 53 is accurately changed by 90 °. It By changing the direction of the display panel 53 in this manner, the chips 13 are bonded to the electrodes 56 on the plurality of sides.

The chip mounting apparatus is configured as described above, and the chip mounting method will be described next. Figure 11
19 to 19 show a series of steps for mounting the chip 13 in the order of steps. FIG. 11 shows a pressing roller 38a and a guide roller 38.
b is raised, and the adhesive tape 36 is pressed against the separator 19 attached to the lower surface of the film carrier 14 of the chip 13 vacuum-absorbed by the collet 8 of the second transfer head 3 to peel off the separator 19. The state is shown (see also FIG. 3). The stripping mechanism of the separator 19 is as described with reference to FIGS. 4 and 5. At this time, the position reference mark 57 (see FIG. 8) of the display panel 53 is taken by the second camera 72 and the third camera 73.
(See reference) to detect the position of the electrode 56 of the display panel 53. At this time, the take-out head 21 is moved to the tray 1
The second chip 13 is picked up and transferred to the temporary placing table 22, and the collet 7 of the first transfer head 2 is also picked up.
Picks up the chip 13 on the temporary table 22 and transfers it to the pre-center 24.

Next, in FIG. 12, the movable claw 26 on the pre-center 24 moves in the X and Y directions to press the chip 13 against the fixed claw 25, thereby correcting the position of the chip 13. Further, at this time, the first camera 44 observes the chip 13 on the first chip receiving base 27 to inspect whether the separator 19 is correctly peeled from the ACF 18, and the position reference mark 20 ( Observe (Fig. 2) and recognize its rotation angle and position. At this time, the take-out head 21 moves the chip 13 onto the temporary table 22 and then picks up the next chip 13 from the tray 1.
Moving towards 2.

Next, in FIG. 13, the movable table 1 is moved leftward by driving the motor 5 (FIG. 1). During this movement, the collet 9 of the third transfer head 4 is rotated by θ. The collet 9 in the direction of the first chip holder 27.
Match the orientation of the tip 13 above. In the step shown in FIG. 12, the rotation angle of the tip 13 is obtained in advance by observing the tip 13 with the first camera 44, and according to the result, the collet 9 is rotated by θ and its direction is changed. By matching the orientation,
The chip 13 on the first chip holder 27 can be securely vacuum-sucked by the collet 9 and picked up.

Next, as shown in FIG. 14, the first transfer head 2, the second transfer head 3, and the third transfer head 4 are respectively provided with a temporary mounting table 22, a pre-center 24, and a first chip. It stops just above the pedestal 27, then each collet 7,
The chips 13 are vacuum-sucked by lowering the chips 8 and 9, respectively. At this time, the pressing roller 38a is moved to the first
The chip 13 is moved to a position below the chip 13 on the chip support 27, and the separator 19 stands by at the lower position for peeling.

Next, in FIG. 15, the movable table 1 is moved to the right. Here, in the step shown in FIG.
The display panel 53 includes the second camera 72 and the third camera 73.
By observing the position reference mark 57, the angle in the rotation direction of the display panel 53 has already been obtained. Further, in the step shown in FIG. 12, by observing the position reference mark 20 of the chip 13 with the first camera 44,
The angle of the rotation direction is required. Therefore, based on the two rotation angles thus obtained, the collet 9 is rotated in the θ direction to correct the positional deviation between the chip 13 and the display panel 53 in the rotation direction. Note that this correction is a temporary correction. Further, at this time, the display panel 5 is arranged so as not to interfere with chip recognition by the second camera 72 and the third camera 73 performed in the next step shown in FIG.
3 moves to the right.

Next, referring to FIG. 16, the take-out head 21
Moves between the tray 12 and the temporary placing table 22 to supply the chips 13, the pressing roller 38a rises to separate the separator 19, and the second camera 72 and the third camera 73 move to the second position. The chip 13 on the chip receiving base 51 is fully recognized, and the positional deviation of the chip 13 in the X direction, the Y direction, and the θ direction is precisely detected.

Then, in FIG. 17, the movable claw 26 on the pre-center 24 is moved in the same manner as in the step of FIG.
The same recognition as in the case of FIG. 12 is performed by the camera 44 of FIG. At this time, the display panel 53 moves to the left and stops immediately below the thermocompression-bonding element 10. At this time, the second chip holder 51 is
In order not to obstruct the entry of the display panel 53, the chip 13 which is moved upward and vacuum-adsorbed by the collet 9 is pushed up and retracted upward. The display panel 53 is driven by an X table 86 and a Y table 87 (FIG. 1) to move the X
The movement of the lead 16 of the chip 13 and the electrode 56 of the display panel 53 in the X and Y directions is corrected by adjusting the movement stroke. It should be noted that this positional deviation is obtained from the position of the electrode 56 of the display panel 53 detected in the process of FIG. 11 and the position of the chip 13 detected in the process of FIG.

Next, in FIG. 18, the lower receiving member 61 moves obliquely upward to support the edge portion of the display panel 53 from below. Therefore, the second chip holder 51 descends and
The thermocompressor 10 also descends, and the ACF 18 attached to the lower surface of the film carrier 14 is thermocompression bonded to the electrodes 56 of the display panel 53.

Next, referring to FIG. 19, the collet 9 and the thermocompression-bonding member 10 retreat upward, and the lower receiving member 61 retreats obliquely downward, thus completing a series of operations. Next X table 86
Is driven, the display panel 53 moves in the X direction by one pitch of the chip 13, the process returns to the process of FIG. 12 and the above-described operation is repeated.

After the chip 13 is bonded to one side of the display panel 53 as described above, the display panel 53 is horizontally rotated 90 ° as shown by an arrow N2 in FIG. The chip 13 is also bonded to the side. When the bonding of the chips 13 on the display panel 53 is completed, the turntable 81
Is horizontally rotated by 180 °, the display panel 53 which has been in the standby position b until then is moved to the bonding position a, the bonding of the chip 13 to the display panel 53 is started, and the bonding position a is moved to the standby position b. The bonded display panel 53 of the chip 13 is taken out from the suction block 82 and collected. As described above, according to the chip mounting apparatus, a large number of steps from taking out the chips 13 provided on the tray 12 to bonding to the display panel 53 can be performed as a series of continuous work with good workability.

FIG. 21 shows another embodiment of the couplings 91 and 106. On the upper surface of the coupling 91, four taper pins 91c are erected on straight lines that are orthogonal to each other at the center of the through hole 91b.
Four positioning holes 106c corresponding to the taper pin 91c are formed in the. Therefore, the taper pin 91c is fitted and positioned in the positioning hole 106c.

The present invention is not limited to the above-mentioned embodiments. For example, in the above-mentioned embodiments, the display panel 5 is used as the substrate.
3 has been described as an example, it goes without saying that the chip 13 can be bonded to a substrate other than the display panel 53. Further, in the above-described embodiment, the chip 13 previously provided on the tray 12 is taken out by the take-out head 21 and bonded to the display panel 53.
The chip 13 on the die punched out of the film carrier 14 may be taken out by the take-out head 21, and therefore the chip supply unit is not limited to the tray 12.

[0042]

As described above, according to the chip mounting apparatus and mounting method of the present invention, a series of steps from picking up the chip manufactured by the TAB method to bonding to the substrate at high speed is performed. And the chip can be bonded to the substrate with high positional accuracy.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a chip according to an embodiment of the present invention.

FIG. 3 is a sectional view of the vicinity of a first chip pedestal of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a front view of a separator peeling mechanism of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 5 is a partially enlarged front view of a separator peeling mechanism of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 6 is a side view of the first camera of the chip mounting apparatus according to the embodiment of the present invention.

FIG. 7 is a cross-sectional view of the vicinity of a second chip holder of the chip mounting apparatus according to the embodiment of the present invention.

FIG. 8 is a partial plan view of a display panel according to an embodiment of the present invention.

FIG. 9 is a side view of a display panel placement device of a chip mounting device according to an embodiment of the present invention.

FIG. 10 is a partial cross-sectional view of a display panel mounting device of a chip mounting device according to an embodiment of the present invention.

FIG. 11 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 12 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 13 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 14 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 15 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 16 is a front view of a main portion of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 17 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 18 is a front view of a main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 19 is a front view of the main part of the chip mounting apparatus of the embodiment of the present invention during chip mounting.

FIG. 20 is a perspective view of a coupling of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 21 is a perspective view of a coupling of a chip mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 1 Movable Table 4 Third Transfer Head 9 Collet 10 Thermocompressor 12 Tray (Chip Supply Section) 13 Chip 14 Film Carrier 15, 16 Lead 17 Semiconductor 18 Anisotropic Conductive Tape (ACF) 19 Separator 20 Position Reference Mark ( Target) 36 Adhesive tape 44 First camera (optical device) 53 Display panel (substrate) 56 Electrode of substrate 80 Placement device 86 X table (moving table) 87 Y table (moving table)

Claims (3)

[Claims] 1. A chip mounting apparatus for mounting a chip, which comprises an anisotropic conductive tape and a separator attached to the tip of a lead of a film carrier on which a semiconductor is mounted, on a substrate, which is supplied from a chip supply unit. A transfer head having a collet for vacuum-sucking the transferred chip, a moving table for positioning the substrate and moving the substrate in the horizontal direction, and a transfer head above the electrode formed on the upper surface of the substrate. A movable table to be moved to and a separator that is below the moving path of the transfer head and is in contact with the separator adhered to the lower surface of the film carrier from below, and the separator is peeled off from the anisotropic conductive tape. An optical device for inspecting whether or not the separator is correctly peeled off by observing the tape and the anisotropic conductive tape below the moving path. And a thermocompressor for thermocompression-bonding the anisotropic conductive tape to the electrodes of the substrate by pressing the upper surface of the tip of the film carrier. 2. A chip mounting method for mounting a chip, which comprises an anisotropic conductive tape and a separator attached to the tip of a lead of a film carrier on which a semiconductor is mounted, on a substrate, which is supplied from a chip supply unit. The chip is vacuum-sucked to the collet of the transfer head, the adhesive tape is pressed against the lower surface of the separator of the chip, and the separator is peeled from the anisotropic conductive tape, and the chip is arranged below the chip. A step of inspecting whether or not the separator has been peeled off from the anisotropic conductive tape by a camera; and a step of vacuum-adsorbing the chip on a collet of a transfer head to attach an electrode of the substrate mounted on a mounting device. After moving upward, after aligning the lead and the electrode of the substrate,
Bonding the lead to the electrode, and mounting the chip. 3. A chip mounting method for mounting a chip, which comprises an anisotropic conductive tape and a separator attached to the tip of a lead of a film carrier on which a semiconductor is mounted, on a substrate, which is supplied from a chip supply unit. The chip is vacuum-sucked to the collet of the transfer head, the adhesive tape is pressed against the lower surface of the separator of the chip, and the separator is peeled from the anisotropic conductive tape, and the chip is arranged below the chip. A step of inspecting whether or not the separator has been peeled off from the anisotropic conductive tape by a camera, and observing a target provided on the chip to detect the position of the chip, and the step obtained in the step. The step of correcting the relative displacement of the lead of the chip with respect to the electrode of the substrate based on the position of the chip, and After moving the chip above the electrodes of the substrate mounted on the mounting device by vacuum suction, and aligning the lead and the electrodes of the substrate,
Bonding the lead to the electrode, and mounting the chip.