JP3633493B2 - Device bonding apparatus and bonding method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a device bonding apparatus and bonding method for bonding device electrodes to display panel electrodes.
[0002]
[Prior art]
A liquid crystal panel or the like is used as a display panel of a display of an electronic device. The display panel is assembled by bonding outer leads (electrodes) of a driver to electrodes formed at bonding positions on a plurality of sides of a panel made of a glass plate or the like. As the driver, a device manufactured by a TAB (Tape Automated Bonding) method is generally used. In the TAB method, a lead is formed by a conductive material on the surface of a film carrier, a chip cut from a wafer is bonded onto the lead, and then an outer lead portion of the lead is punched out with a cutting device to obtain a device. The film carrier is formed of an extremely thin synthetic resin film such as polyimide.
[0003]
Various devices have been proposed as device bonding apparatuses for bonding outer leads, which are device electrodes, to electrodes of a display panel. For example, the device described in Japanese Patent Application Laid-Open No. 3-217033 is vacuum-adsorbed to the mounting head 47 and transported to the vicinity of the mounting position 44, and the camera 51 uses the outer lead 10 x of the device 10 and the electrode 7 of the display panel 5. Are imaged within the same field of view to determine the amount of deviation between the two. Then, after the substrate stage 1 is moved and the displacement is corrected and aligned, the lower surface of the display panel 5 is received by the backup 60 of the backup mechanism 52, the mounting head 47 is lowered, and the outer surface of the device 10 is moved. The lead 10x is bonded to the display panel 5. When the bonding is completed, the backup mechanism is returned to the original state, the substrate stage 1 is moved, and the bonding of the next device 10 is repeated by repeating the above-described operation.
[0004]
In addition to a device manufactured by the TAB method, a flip chip is also used as a display panel driver. A flip chip has bumps (electrodes) formed on its circuit surface. The bump is generally bonded to the electrode of the display panel via an anisotropic conductive sheet (hereinafter referred to as “ACF”). In this case, the ACF is first bonded to the electrodes of the display panel, and then the flip chip bumps are aligned and bonded to the electrodes formed on the sides of the display panel, or the ACF is attached to the flip chip bumps. After deposition, flip chip bumps must be accurately aligned and bonded to display panel electrodes. Of course, in this case as well, it is desirable to perform the bonding operation as fast as possible.
[0005]
[Problems to be solved by the invention]
The outer leads of the device are very thin and the pitch is very small. Thus, when bonding the outer leads with a narrow pitch to the electrodes of the display panel, the outer leads must be accurately aligned with the electrodes. In addition, since a large number of devices must be bonded to the display panel, it is desirable to perform the bonding operation as fast as possible. That is, high accuracy and high speed are required for a bonding apparatus for bonding a device to a display panel.
[0006]
However, in the conventional bonding apparatus, the display panel 5 and the device 10 are imaged with a camera and the positional deviation between the two is obtained, and then the display panel 5 is received by the backup mechanism. The position of the display panel 5 is shifted in contact with the display panel 5, and bonding cannot be performed with high accuracy. In addition, since it is necessary to operate the backup device every time one device 10 is bonded, the bonding work is delayed accordingly.
[0007]
The display panel has a quadrangular shape, and a device is bonded to the side of the display panel. A device bonded to one side (long side) and a device bonded to the other side (short side). Variety is different. Therefore, it is desirable in terms of work efficiency that the device bonding apparatus is capable of bonding two types of devices of different varieties to the display panel. In addition, it is desirable that bonding work can be continuously performed on a plurality of sides.
[0008]
Accordingly, a first object of the present invention is to provide a device bonding apparatus and bonding method capable of bonding a device to a display panel with high accuracy and high speed. It is a second object of the present invention to provide a device bonding apparatus and bonding method capable of bonding two kinds of devices to the electrodes of the display panel at high speed and with high accuracy.
[0009]
[Means for Solving the Problems]
For this reason, the present invention is a bonding apparatus for aligning and bonding a device electrode to electrodes formed at a plurality of bonding positions on a side portion of a display panel, and supports the center portion of the display panel from below. 1st support part Display panel moving means comprising a θ table device, an X table device, and a Y table device In addition, the side of the display panel is vacuum-sucked by the suction hole formed on the upper surface, and the bonding positions of the plurality of sides of the side are supported from below, and can be moved horizontally together with the display panel while being supported. In addition, when the support is released, the horizontal distance from the θ table device can be changed by the Y direction table device. A second support portion, alignment means for aligning the electrode of the device with the electrode formed on the upper surface of the end portion of the display panel, and aligning the electrode of the device with the electrode of the display panel And bonding means for pressing and bonding.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a device bonding apparatus according to a first embodiment of the present invention. 2 is a perspective view of a display panel moving mechanism of the device bonding apparatus according to the first embodiment of the present invention. FIG. 3 is a sectional view of a bonding station of the device bonding apparatus according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view of a pole lifting mechanism of the device bonding apparatus according to the first embodiment of the present invention, and FIG. 5 is a front view of the first supply unit of the device bonding apparatus according to the first embodiment of the present invention. 6 is a cross-sectional view of the device bonding apparatus in the first embodiment of the present invention during pick-up, and FIG. 7 is a first head of the device bonding apparatus in the first embodiment of the present invention. FIG. 8 is a sectional view of the first head of the device bonding apparatus according to the first embodiment of the present invention, and FIG. FIG. 10 is a perspective view of an observing apparatus of a device bonding apparatus according to the first embodiment of the present invention, and FIG. 11 is a first embodiment of the present invention. FIG. 12A is a plan view of a first device being observed by the device bonding apparatus according to the first embodiment of the present invention, and FIG. FIG. 12C is a view of the second camera of the device bonding apparatus according to the first embodiment of the present invention. FIG. 12C is a view of the second camera of the device bonding apparatus according to the first embodiment of the present invention. 13A, 13B, and 13C are cross-sectional views of a display panel positioning mechanism of the device bonding apparatus according to the first embodiment of the present invention, and FIG. FIGS. 15A and 15B are schematic plan views of the device bonding apparatus according to the first embodiment, and FIG. 15A and FIG. 15B show that the first device of the device bonding apparatus according to the first embodiment of the present invention is being bonded to the display panel. 16 (a) and 16 (b) are cross-sectional views during bonding of the first device of the device bonding apparatus to the display panel in the first embodiment of the present invention, and FIG. 17 is the first embodiment of the present invention. FIG. 18 is a cross-sectional view of the device bonding apparatus in the embodiment of the present invention when the first device is bonded to the display panel, FIG. 18 is a schematic plan view of the device bonding apparatus in the first embodiment of the present invention, and FIGS. ) Is a plan view of a display panel and a third long plate of the device bonding apparatus according to the first embodiment of the present invention.
[0011]
In FIG. 1, moving means 1 for moving the display panel 10 in the X direction, the Y direction, and the θ direction is provided at the front part of the upper surface of the base 5. This moving means 1 mounts a Y table device 3 on an X table device 2, and mounts a θ table device 4 (see FIG. 2) having a suction part 12 on the upper portion of the Y table device 3. (Hereinafter simply referred to as X table 2, Y table 3, and θ table 4). The θ table 4 is a first support portion that supports the central portion of the display panel 10 from below. The X table 2 and the Y table 3 are installed orthogonal to each other. The X table 2 includes a motor MX1, and the Y table 3 includes a motor MY1. 1 and 2, an X-direction guide rail 2 a is provided on the upper surface of the X table 2. Further, a slider 3a fitted to the guide rail 2a is provided on the lower surface of the Y table 3. When the motor MX1 is driven, the Y table 3 moves horizontally in the X direction along the guide rail 2a.
[0012]
In FIG. 2, a base plate 6 is provided on the Y table 3. A Y-direction guide rail 3 b is provided on the upper surface of the Y table 3. A slider 6a is provided on the lower surface of the base plate 6 to be fitted to the guide rail 3b. When the motor MY1 is driven, the base plate 6 moves horizontally in the Y direction along the guide rail 3b. When the motor MX1 is driven, the base plate 6 moves together with the Y table 3 in the X direction. That is, the X table 2 and the Y table 3 move the base plate 6 horizontally in the X direction and the Y direction.
[0013]
In FIG. 2, a θ table 4 is provided on a base plate 6. The θ table 4 is composed of a suction portion 12 that holds the display panel 10 by vacuum suction through the suction holes 13 and a motor Mθ that horizontally rotates the suction portion 12. The suction hole 13 is connected to a vacuum device (not shown). As shown in FIG. 9, the display panel 10 is disposed on the suction unit 12 of the θ table 4. Accordingly, when the motors MX1 and MY1 are driven, the display panel 10 is horizontally moved in the X direction and the Y direction, and when the motor Mθ is driven, the display panel 10 is horizontally rotated in the θ direction. As will be described later, by rotating the display panel 10 horizontally by 90 ° with the θ table 4, the device is bonded to the electrodes formed on the long side and the short side perpendicular to the display panel 10.
[0014]
As shown in FIGS. 1 and 2, a box 20 is provided in parallel with the X table 2. FIG. 3 shows a device bonding station c. In FIG. 3, two plates 21 a and 21 b are arranged on the left and right sides inside the box 20. X-direction guide rails 22a and 22b are provided on the bottom surface of the box 20, and sliders 23a and 23b provided on the lower surfaces of the plates 21a and 21b are fitted to the guide rails 22a and 22b. Nuts 24a and 24b are fixed to the outer ends of the plates 21a and 21b. Ball screws 25a and 25b in the X direction are screwed onto the nuts 24a and 24b. The ball screws 25a and 25b are driven to rotate by motors MXa and MXb (FIGS. 1 and 2) provided on the side surface of the box 20. When the motors MXa and MXb are driven to rotate the ball screws 25a and 25b, the plates 21a and 21b move in the X direction along the guide rails 22a and 22b.
[0015]
2 and 3, guide rings 27a and 27b are provided on the upper surfaces of both sides of the box 20, and poles 26a and 26b are inserted in the guide rings 27a and 27b so as to be movable up and down. A first long plate 28 that is long in the X direction is provided on the top of one pole 26a. As will be described later, the first long plate 28 serves as a support member that supports the devices P1 and P2 vacuum-sucked by the nozzles 84 and 85 from below.
[0016]
In FIG. 3, a second long plate 29 is provided above the other pole 26b. Blocks 31a and 31b are fixed to the lower portions of the poles 26a and 26b, and coil springs 32a and 32b are mounted on the blocks 31a and 31b. The poles 26a and 26b are springed downward by the spring force of the coil springs 32a and 32b. Rollers 33a and 33b are rotatably mounted on the sides of the blocks 31a and 31b. Plate plates 34a and 34b elongated in the X direction are installed at the inner ends of the plates 21a and 21b (FIG. 4). The rollers 33a and 33b roll on the inclined upper surfaces of the plate cams 34a and 34b. Move. Therefore, when the motors MXa and MXb are driven to rotate the ball screws 25a and 25b, the plate cams 34a and 34b move in the X direction. Then, the rollers 33a and 33b roll on the inclined upper surfaces of the plate cams 34a and 34b, and the poles 26a and 26b, the first long plate 28, and the second long plate 29 move up and down.
[0017]
2 and 3, a slide plate 41 is provided above the second long plate 29. An X-direction guide rail 42 is provided on the upper surface of the second long plate 29. A slider 43 provided on the lower surface of the slide plate 41 is fitted to the guide rail 42. A third long plate 44 is provided on the slide plate 41. The third long plate 44 is formed with a suction hole 45 for vacuum-sucking the side portion of the display panel 10. The suction hole 45 is connected to a vacuum device (not shown). As will be described later, the third long plate 44 is a support member that supports the side of the display panel 10 from below when bonding a device to the display panel 10.
[0018]
As shown in FIG. 3, a slider 46 is provided on the upper surface of the slide plate 41. Further, a guide rail 47 in the Y direction that fits with the slider 46 is provided on the lower surface of the third long plate 44. In FIG. 2, a pin 51 projects from the side surface of the third long plate 44, and a pin 52 projects from the end of the slide plate 41. The pin 51 and the pin 52 are coupled by a coil spring 53. A stopper 50 is erected on the upper surface of the slide plate 41. The third long plate 44 is urged to the right in FIG. 3 by the spring force of the coil spring 53 and stops by hitting the stopper 50 (see the chain line in FIG. 3). In this way, the third long plate 44 is attached on the second long plate 29 so as to be movable in the horizontal direction.
[0019]
In FIG. 2, a key-shaped first bracket 61 is coupled to the side surface of the third long plate 44. A key-shaped second bracket 62 is provided above the base plate 6. A slider 64 provided on the outer surface of the second bracket 62 is fitted to a guide rail 63 in the Z direction provided on the front surface of the first bracket 61. A slider 66 provided on the lower surface of the second bracket 62 is fitted to a guide rail 65 in the Y direction provided on the upper surface of the base plate 6.
[0020]
In FIG. 2, when the motor MX1 is driven, the Y table 3 and the base plate 6 move in the X direction along the guide rail 2a. At this time, the base plate is interposed via the first bracket 61 and the second bracket 62. The third long plate 44 and the slide plate 41 coupled to 6 move in the X direction along the guide rail 42. When the motor MY1 of the Y table 3 is driven, the base plate 6 moves in the Y direction along the guide rail 3b. At this time, since the slider 66 slides on the guide rail 65, the third long plate 44 is It remains stopped. When the motor MXb is driven, the pole 26b moves up and down as described with reference to FIG. 3, and the third long plate 44 moves up and down together with the pole 26b. At this time, the guide rail 63 (FIG. 2) also moves up and down along the slider 64.
[0021]
As described above, when the motor MXb shown in FIG. 2 is driven, the ball screw 25b rotates in FIG. 3 and the plate 21b moves in the X direction. Then, the roller 33b rolls on the inclined upper surface of the plate cam 34b, and the pole 26b and the third long plate 44 supported by the pole 26b move up and down. FIG. 3 shows a state in which the pole 26b and the third long plate 44 are raised, and the third long plate 44 supports the long side of the display panel 10 from below. As shown in FIG. In this state, the outer lead L, which is the electrode of the device P1, is bonded to the electrode 30a formed at the bonding position 10L on the long side of the display panel 10. When the bonding is completed, the motor MXb operates in the reverse direction, the plate 21b moves in the reverse direction, the pole 26b and the third long plate 44 descend, and the support state of the long side of the display panel 10 is released. . That is, the pole 26b, the roller 33b, the plate cam 34b, the plate 21b, the nut 24b, the ball screw 25b, and the motor MXb serve as a lift driving means for moving the third long plate 44 up and down.
[0022]
In FIG. 9, the display panel 10 is made by laminating an upper plate 10b on a lower plate 10a. A long side which is one side of the lower plate 10a has a plurality of electrodes at a plurality of bonding positions 10L. 30a is formed, and a plurality of electrodes 30b are formed at a plurality of bonding positions 10S on the short side which is the other side. The first devices P1 are bonded one by one at the bonding position 10L, and the second devices P2 (not shown) are bonded one by one at the bonding position 10S. Although not shown, anisotropic conductive sheets (ACFs) are attached in advance to the bonding positions 10L and 10S. As shown in FIGS. 3 and 8, the first device P1 and the second device P2 have a chip C cut out from the wafer and an outer lead L extending forward from the chip C. As will be described later, the first device P1 is picked up by the first nozzle 84, and the outer lead L is bonded to the electrode 30a on the long side of the display panel 10. The second device P2 is picked up by the second nozzle 85, and the outer lead L is bonded to the electrode 30b on the short side of the display panel 10.
[0023]
In FIG. 1, behind the base 5, a first supply unit 70a for supplying the first film carrier 74a to the first cutting device 55a and a second film carrier 74b for supplying the second cutting device 55b are provided. A second supply unit 70b is provided. The first supply unit 70a includes a first case 71a. Inside the first case 71a, a first supply reel 72a and a first take-up reel 73a are provided. A first film carrier 74a and a first interlayer tape 75a are wound around the first supply reel 72a. The first take-up reel 73a takes up the interlayer tape 75a. Further, a first guide roller 76a and a first sprocket 77a for guiding the travel of the first film carrier 74a are provided in the first case 71a. Chips C are bonded to the first film carrier 74a with a pitch. The first film carrier 74a is supplied to the first cutting device 55a through the opening 78a of the first case 1a. The first tab device P1 obtained by punching the first film carrier 74a by the first cutting device 55a is bonded to the electrode 30a formed on the long side of the display panel 10.
[0024]
The second supply unit 70b has the same structure as the first supply unit 70b, and includes a second case 71b. The second supply reel 72b, the second take-up reel 73b, A second film carrier 74b, a second interlayer tape 75b, a second guide roller 76b, and a second sprocket 77b are provided. Chips C are bonded to the second film carrier 74b with a pitch. The second tab device P2 obtained by punching the second film carrier 74b with the second cutting device 55b is bonded to the electrode 30b formed on the short side of the display panel 10.
[0025]
In FIG. 1, the 1st cutting device 55a is provided in the side of the 1st case 71a. A first cylinder 57a is provided on the first frame 56a which is the main body of the first cutting device 55a. A first upper mold 58a, which is a mold, is provided inside the frame 56a. A Y-direction guide rail 60a is provided below the first frame 56a, and a first lower mold 59a, which is a mold, is provided on the guide rail 60a.
[0026]
1 and 5, when driven by a motor (not shown) provided behind the first case 71a and the first supply reel 72a, the first take-up reel 73a, and the sprocket 87 are rotated, The first film carrier 74a and the interlayer tape 75a wound around the first supply reel 72a are led out from the first supply reel 72a, and the first film carrier 74a goes around the guide roller 76a and the first sprocket 77a. Are introduced below the first upper mold 58a. At this time, the first lower mold 59a slides on the first guide rail 60a and is located directly below the first upper mold 58a. Therefore, when the rod 61a of the first cylinder 57a protrudes downward, the first upper mold 58a is lowered, and the first film carrier 74a is punched out by the first upper mold 58a and the first lower mold 59a, and the first 1 device P1 is obtained. Next, when the rod 61a of the first cylinder 57a rises and the first upper die 58a rises, the first device P1 punched from the first film carrier 74a is placed on the first lower die 59a. Placed. Reference numeral 69 denotes a collection box for the film carrier 74a from which the device P1 has been punched, and is installed below the first upper mold 58a.
[0027]
FIG. 6 shows the moving means of the lower mold 59a. The first device P1 punched from the film carrier 74a is placed on the lower mold 59a. A key-shaped nut 151 is mounted on the side surface of the lower mold 59a. A ball screw 152 that is horizontal in the Y direction is screwed onto the nut 151. The ball screw 152 is supported by the frame 153. The ball screw 152 is driven by the motor 155 via the belt 154 to rotate. When the motor 155 is driven to rotate the ball screw 152, the first lower die 59a is located along the guide rail 60a between the pickup station a directly below the first nozzle 84 and the punching station b directly below the upper die 58a. Is moved in the Y direction.
[0028]
Below the pickup station a of the first device P1, push-up means 160 for the first device P1 is installed. The push-up means 160 includes a vertical cylinder 161, a frame 163 supported by the rod 162 of the cylinder 161, a motor 164 mounted on the frame 163, and a push-up pin coupled to the rotation shaft of the motor 164. It consists of 165. A slider 166 is mounted on the back surface of the frame 163. The slider 166 is fitted to a vertical guide rail 167.
[0029]
In FIG. 6, when the first device P1 is punched from the first film carrier 74a at the punching station b, the motor 155 is driven to rotate the ball screw 152, and the first lower mold 59a is moved from the punching station b. Move to pickup station a. Next, when the rod 162 of the cylinder 161 protrudes, the frame 163 rises along the guide rail 167, the pin 165 enters the inside of the lower die 59a, and pushes up the first device P1 on the lower die 59a (see the chain line). ). Then, the first nozzle 84 vacuum picks up and picks up the first device P1 pushed up by the pin 165. Alternatively, the motor 164 is driven while the pin 165 pushes up the first device P1, and the first device P1 supported by the pin 165 is rotated 90 ° or 180 ° horizontally to change its direction. Thus, the first nozzle 84 may pick up the first device P1. When the nozzle 84 picks up the device P1, the rod 162 of the cylinder 161 is lowered and the pin 165 is retracted downward.
[0030]
In FIG. 1, a second cutting device 55b is also provided on the side of the second case 71b. The structure of the second cutting device 55b is the same as that of the first cutting device 55a, and includes a second frame 56b, a second cylinder 57b, a second upper mold 58b, a second lower mold 59b, and the like. ing. By the second upper mold 58b and the second lower mold 59b, the second device P2 is punched from the second film carrier 74b. A push-up means similar to the push-up means 160 described above is also provided below the second cutting device 55b. The second device P2 punched from the second film carrier 74b and positioned on the second lower die 59b is vacuum picked up by the second nozzle 85 and picked up.
[0031]
In FIG. 1, a turntable 80 is provided between the box 20 and the box 69. The turntable 80 is supported by the support column 81. The support column 81 is erected on a moving table 86 in the X direction. Inside the moving table 86, a ball screw, a nut (not shown) or the like is incorporated, and when the motor MX2 is driven, the turntable 80 moves on the moving table 86 in the X direction.
[0032]
On the turntable 80, a first arm 82 and a second arm 83 are held in a cross shape orthogonal to each other. A first nozzle 84 for picking up the first device P1 on the first lower mold 59a by vacuum suction is provided at the tip of the first arm 82 (see also FIG. 6). A second nozzle 85 for picking up the second device P2 on the second lower mold 59b by vacuum suction is provided at the tip of the second arm 83. The dimensions of the first device P1 and the second device P2 are different, and therefore the first device P1 and the second device P2 cannot be vacuum-sucked by the same size nozzle. Therefore, a first arm 82 and a second arm 83 are provided on the turntable 80, and a first nozzle 84 and a second nozzle 85 having different dimensions at both ends of the first arm 82 and the second arm 83, respectively. The first device P1 is picked up by the first nozzle 84, and the second device P2 is picked up by the second nozzle 85. As shown in FIG. 2, a motor 82a as a rotating means for horizontally rotating the first nozzle 84 is built in the first arm 82 so that the direction of the device P1 can be finely adjusted. Yes. Such a rotating means is also incorporated in the second arm 83. In the present embodiment, the rotating means 82a and the moving means 1 described above function as positioning means for aligning the device electrodes (outer leads) and the display panel electrodes.
[0033]
In FIG. 1, when the motor MX2 is driven and the turntable 80 slides to the left, the first nozzle 84 moves above the first lower mold 59a (see also FIG. 14). In FIG. 1, when the turntable 80 is rotated 90 ° horizontally, the second arm 83 is in the Y direction. Therefore, when the motor MX2 is driven and the turntable 80 slides to the right, the second nozzle 85 moves above the second lower mold 59b (see also FIG. 18).
[0034]
In FIG. 1, a frame 90 is installed on the side of the base 5. The frame 90 is provided with a first head 91a and a second head 91b. The first head 91a and the second head 91b connect the outer leads L of the first device P1 and the second device P2 that are vacuum-sucked by the first nozzle 84 and the second nozzle 85 to the display panel 10. The electrodes 30a and 30b are pressed and bonded. FIG. 7 is a perspective view of the first head 91a, and FIG. 8 is a sectional view thereof. The first head 91 a includes a case 92, a vertical ball screw 93 provided in the case 92, and a nut 94 that is screwed into the ball screw 93. The slider 95 formed integrally with the nut 94 slides along a vertical guide rail 96 provided on the inner surface of the case 92.
[0035]
A key-shaped bracket 97 is fitted to the ball screw 93. The upper surface of the case 92 is attached to the frame 90, and a motor 99 a that rotates the ball screw 93 is installed on the upper surface of the frame 90. Accordingly, when the motor 99 a is driven and the ball screw 93 rotates, the nut 94 moves up and down along the ball screw 93. A cylinder 101 is mounted on the lower surface of the frame 90. The rod 102 of the cylinder 101 is coupled to the shoulder portion of the bracket 97 via the metal fitting 103.
[0036]
A slider 104 is mounted on the inner surface of the bracket 97. The slider 104 is fitted to a guide rail 105 in the Z direction provided on the outer surface of the case 92. Flange 106, 107 protrudes from the front surface of the bracket 97. A rod 108 is inserted into the flanges 106 and 107. A long plate-shaped pressing element 109 is coupled to the lower end of the rod 108. A thermocompressor 111 is attached to the outer surface of the bracket 97. The height of the lower surface of the thermocompression bonding element 111 is slightly higher than the height of the lower surface of the pressing element 109. A cartridge heater 112 is housed inside the thermocompression bonding element 111, and the thermocompression bonding element 111 is heated to about 110 ° C. by the cartridge heater 112. When the outer lead L is bonded to the electrode 30a by the thermocompressor 111, the presser 109 temporarily holds the outer lead L on the electrode 30a or corrects the deformation of the outer lead L of the devices P1 and P2. .
[0037]
The two rods 108 and 108 are connected by a plate 113 that determines the height of the lowering limit of the presser 109. The plate 113 is attached to the upper surface of the flange 107 by coil springs 110 and 110 attached to the rods 108 and 108. It is pressed.
[0038]
The cylinder 101 always presses the bracket 97 against the upper surface of the nut 94 with a predetermined bonding load. That is, the cylinder 101 is a bonding load applying means. This bonding load can be changed freely. The motor 99a, the ball screw 93, and the nut 94 are elevating means for elevating and lowering the thermocompressor 111, and adjust the descending speed and height of the thermocompressor 111. The second head 91b has the same structure as the first head 91a and is provided on the frame 90. The second head 91b is driven by the motor 99b, depending on the dimensions of the first device P1 and the second device P2. Thus, the dimensions of the presser 109 and the thermocompressor 111 of the first head 91a and the second head 91b are different. In the present embodiment, the first head 91a and the second head 91b are fixed to the frame 90, but the first head 91a and the second head 91b are provided on a movable table and moved in the horizontal direction. It may be possible.
[0039]
2 and 3, an observation apparatus including a first camera 121 and a second camera 122 is provided below the bonding station c. These cameras 121 and 122 observe the positions of the electrodes 30a and 30b of the display panel 10 and the outer leads L of the devices P1 and P2.
[0040]
10 is a perspective view of the observation apparatus 120, and FIG. 11 is a cross-sectional view. A first nut 123 and a second nut 124 are attached to the lower part of the first camera 121 and the lower part of the second camera 122. A ball screw 125 in the X direction is inserted into the first nut 123 and the second nut 124. The ball screw 125 is formed with a right screw 126 and a left screw 127, the first nut 123 is screwed with the right screw 126, and the second nut 124 is screwed with the left screw 127. . The ball screw 125 is supported by the first frame 128. A motor 129 that rotates the ball screw 125 is attached to the side of the frame 128. When the motor 129 is driven, the ball screw 125 rotates, the first camera 121 and the second camera 122 move in opposite directions along the ball screw 125, and the distance between the first camera 121 and the second camera 122 is reached. Is adjusted. That is, the nuts 123 and 124, the ball screw 125, and the motor 129 serve as a distance adjusting unit between the first camera 121 and the second camera 122.
[0041]
A slider 131 is attached to the lower part of the first frame 128. As shown in FIG. 2, the slider 131 is fitted to a guide rail 132 in the X direction provided on the box 20. A second frame 133 is provided behind the first frame 128. A ball screw 134 in the X direction is supported on the second frame 133. A motor 135 that rotates the ball screw 134 is provided on the side surface of the second frame 133. The ball screw 134 is screwed into a nut 136 provided on the back surface of the first frame 128. Therefore, when the motor 135 is driven and the ball screw 134 rotates, the first frame 128 moves along the guide rail 132 in the X direction. Here, when the motor 135 rotates forward, the cameras 121 and 122 move below the first head 91a shown in FIGS. 3 and 14, and are vacuum-adsorbed to the lower end portion of the first nozzle 84 to be applied to the display panel 10. The outer lead L of the first device P1 to be bonded and the electrode 30a of the display panel 10 are observed. When the motor 135 rotates in the reverse direction, the cameras 121 and 122 move below the second head 91b shown in FIG. 18 and are vacuum-adsorbed to the lower end of the second nozzle 85 and bonded to the display panel 10. The outer lead L of the second device P2 and the electrode 30b of the display panel 10 are observed.
[0042]
10 and 11, a lens barrel 141 that is long in the X direction is provided above the first camera 121 and the second camera 122. Inside the lens barrel 141, a light source 142, a half mirror 143, and a mirror 144 are provided. A window 145 is opened above the mirror 144. Through the window 145, the electrodes 30a and 30b of the display panel 10 and the outer leads L of the devices P1 and P2 are observed. By driving the motor 135 and moving the first frame 128 in the X direction, the two cameras 121 and 122 are positioned below the outer lead L. The lateral width W of the outer lead L varies depending on the type of device. Therefore, the motor 129 is driven in accordance with the width W to move the first camera 121 and the second camera 122 in the opposite directions along the ball screw 125, so that the window 145 and the window 145 are outer leads. The distance D is adjusted so as to be positioned below both ends of L.
[0043]
This device bonding apparatus has the above-described configuration, and the overall operation will be described next. First, the case where the outer lead L of the first device P1 is bonded to the long-side electrode 30a of the display panel 10 will be described. First, a method of moving the long-side electrode 30a of the display panel 10 directly below the thermocompressor 111 of the first head 91a will be described with reference to FIGS. First, the display panel 10 is transferred to the upper surface of the θ table 4 by a transfer device (not shown). Next, the motors MX1 and MY1 (FIG. 1) are driven to move the display panel 10 in the X direction and the Y direction, and the side portion of the display panel 10 is moved above the third long plate 44 (FIG. 13 (FIG. 13). a)). In this case, as shown in FIG. 19A, the side of the display panel 10 is protruded from the third long plate 44 by a predetermined length d1, so that the electrode 30a of the display panel 10 can be observed with the observation device 120. Keep it. At this time, the third long plate 44 is moved downward so as not to obstruct the movement of the display panel 10.
[0044]
Next, the motor MXb (FIG. 1) is driven to move the plate 21b shown in FIG. 3 in the X direction. Then, the roller 33b is pushed up by the plate cam 34b, the pole 26b rises, the third long plate 44 comes into contact with the lower surface of the side portion of the display panel 10, and the display panel 10 is vacuum-adsorbed and fixed by the suction holes 45. (FIG. 13B). Next, the motor MY1 (FIG. 1) is driven again to move the display panel 10 horizontally, and the long-side electrode 30a is positioned within the field of view of the first camera 121 and the second camera 122 (FIG. 13C). )reference). At this time, as shown in FIG. 9, the suction portion 12 of the θ table 4 and the third long plate are connected by the display panel 10. Therefore, when the θ table 4 is moved in the arrow N direction, the third long plate 44 is also moved horizontally in the N direction together with the display panel 10.
[0045]
Next, a method for punching the first film carrier 74a will be described. 1 and 5, the first film carrier 74a is led out below the upper die 58a by rotating the first supply reel 72a, the first take-up reel 73a, and the sprocket 87 in the direction of the arrow. At this time, the first lower mold 59a slides along the guide rail 60a and is located at the punching station b immediately below the upper mold 58a (see the chain line in FIG. 6). Next, when the first cylinder 57a is operated, the first upper mold 58a is lowered, and the film carrier 74a is punched out by the first upper mold 58a and the first lower mold 59a.
[0046]
Next, the rod of the first cylinder 57a is pulled in, the first upper die 58a is retracted upward, and the first supply reel 72a and the sprocket 87 are rotated so that the first film carrier 74a is fed by one pitch. And collected in the box 69. Further, the first lower mold 59a moves along the guide rail 60a to the pickup station a indicated by a solid line in FIGS. 1 and 6 with the first device P1 punched from the film carrier 74a placed thereon. FIG. 14 shows a plan view at this time. At this time, when the motor MX2 shown in FIG. 1 is driven, the turntable 80 moves in the X direction, and the first nozzle 84 at the tip of the first arm 82 is located above the first lower mold 59a. That is, it waits in advance at the position shown in FIGS.
[0047]
Next, as described with reference to FIG. 6, the rod 162 of the cylinder 161 protrudes, so that the pin 165 pushes up the first device P1 on the lower mold 59a from below, and the first nozzle 84 The first device P1 is picked up by vacuum suction.
[0048]
Next, in FIG. 14, the turntable 80 horizontally rotates by 180 ° in the direction of the arrow, and the first device P1 vacuum-adsorbed by the first nozzle 84 is moved above the long-side electrode 30a of the display panel 10 ( (See FIG. 3). In the present embodiment, the nozzles 84 and 85 are held on the turntable 80, and the turntable 80 is rotated to move the devices P1 and P2 from the pickup station b to the bonding station c. Instead of 80, the devices P1 and P2 may be moved from the pickup station e to the bonding station c by holding the nozzles 84 and 85 on a linearly moving table and moving the nozzles 84 and 85 linearly.
[0049]
Next, a method of bonding the first device P1 vacuum-adsorbed by the first nozzle 84 to the electrode 30a of the display panel 10 will be described with reference to FIGS. 15, 16, and 17. FIG. 15 to 17 show a series of operations.
[0050]
FIG. 15A shows the first device in which the first device P1 on the first lower mold 59a is picked up, the first arm 82 is rotated by 180 °, and is vacuum-sucked by the first nozzle 84. The outer lead L of P <b> 1 shows a state where the outer lead L of the first camera 121 and the second camera 122 is located immediately above the window portion 145 of the lens barrel 141. Here, as indicated by a chain line in the figure, the presser 109 is lowered to press the outer lead L against the electrode 30a, and the outer lead L and the electrode 30a are observed by the first camera 121 and the second camera 122. . As shown in FIG. 12A, the left end portion of the outer lead L is taken into the visual field A of the first camera 121. The right end portion is captured in the field of view B of the second camera 122. 12B and 12C are enlarged views of the visual fields A and B, and positional deviations ΔX, ΔY, and Δθ between the outer lead L and the electrode 30a in the X, Y, and θ directions are detected. The detected positional deviations ΔX, ΔY, Δθ are corrected as follows.
[0051]
As shown in FIG. 15B, the arm 82 is lifted by a lifting means (not shown), and the nozzle 84 is slightly rotated in the θ direction by a motor 82a as a rotating means built in the arm 82. The positional deviation Δθ is corrected. In this state, the motors MX1 and MY1 (FIG. 1) are driven to move the display panel 10 in the X direction and the Y direction, thereby correcting the positional deviation ΔX in the X direction and the positional deviation ΔY in the Y direction.
[0052]
If the positional deviations ΔX, ΔY, Δθ are corrected in this way, the first nozzle 84 is lowered to land the outer lead L on the electrode 30a of the display panel 10, and then the presser 109 is lowered. The outer lead L1 is pressed against the electrode 30a to correct the deformation of the outer lead L (see FIG. 16A). In this state, the first camera 121 and the second camera 122 detect whether or not the outer lead L and the electrode 30a match. This detection method is the same as the method shown in FIG. If the positional deviation between the outer lead L and the electrode 30a is within an allowable value, the thermocompression bonding element 111 is lowered as it is and the outer lead L is pressed against the electrode 30a for bonding (see the chain line in FIG. 16A).
[0053]
By the way, in outer lead bonding, the required accuracy in the X direction (the direction in which the outer leads L are parallel) is much stricter than the accuracy in the Y direction and the θ direction. Therefore, when the positional deviation Δx in the X direction between the outer lead L and the electrode 30a is equal to or larger than the allowable value, the positional deviation Δx is corrected again as follows. That is, as shown in FIG. 16B, the motor MXa (FIG. 2) is driven to push up the plate 21a of FIG. 3, thereby raising the pole 26a and pushing up the device P1 with the first long plate 28. Therefore, the motor MX1 is driven to move the display panel 10 in the X direction to correct the positional deviation Δx. Next, the first long plate 28 is lowered to the original height so that the outer lead L and the electrode 30a are overlapped, and then the thermocompressor 111 is lowered to bond the outer lead L to the electrode 30a (see FIG. 17). . This bonding is performed as follows. That is, the ball screw 93 is rotated by the motor 99a, and the nut 94, the bracket 97, and the thermocompressor 111 are lowered according to a predetermined speed pattern. When the thermocompression bonding member 111 lands on the outer lead, the lowering of the thermocompression bonding member 111 and the bracket 97 stops, but the nut 94 further descends. A bonding load generated by the cylinder 101 in this state is applied to the outer lead L via the rod 102, the bracket 97, and the thermocompressor 111. In this way, if the first device P1 is bonded to the first bonding position 10L on the long side of the display panel 10, the display panel is driven by driving the motor MX1 of the X table 2 in FIG. 10 is moved in the X direction by the pitch of the bonding position 10L, and the next first device P1 is bonded to the bonding position 10L adjacent to the previously bonded first device P1. Thus, by repeating the series of operations shown in FIGS. 15 to 17, the first devices P <b> 1 are bonded one after another to each bonding position 10 </ b> L on the long side of the display panel 10. In this case, since the plurality of bonding positions 10L on the long side of the display panel 10 are supported from below by the third long plate 44, each time one device is bonded as in the prior art, the third long plate 44 is used. Therefore, the bonding operation can be continuously performed at a high speed.
[0054]
If the first device P1 is bonded to the long-side electrode 30a of the display panel 10, the second device P2 is then bonded to the short-side electrode 30b. FIG. 18 shows a state in which the outer lead L of the second device P2 is bonded to the electrode 30b on the short side of the display panel 10. In this case, the vacuum suction state by the suction hole 45 of the third long plate 44 is released, the third long plate 44 is lowered, and then the display panel 10 is horizontally rotated 90 ° by the θ table 4 shown in FIG. Then, as shown in FIG. 19B, the short side of the display panel 10 is moved above the third long plate 44. Further, the motor MY1 is driven so that the short side protrudes from the third long plate 44 by a predetermined length d2, the third long plate 44 is raised again, and is fixed by vacuum suction through the suction hole 45. Further, the motor MX2 is driven to move the turntable 80 in the X direction (right direction), and the second nozzle 85 at the tip of the second arm 83 is positioned above the second lower mold 59b. The motor 129 of FIG. 10 is driven, and the two window portions 145 are positioned below both side portions of the outer lead L.
[0055]
Since the method of bonding the second device P2 to the short side of the display panel 10 is the same as the method of bonding the first device P1 to the long side of the display panel 10, the description thereof is omitted. If the first device P1 and the second device P2 are all bonded to the long side and the short side of the display panel 10, the suction holes 13 of the θ table 4 (FIG. 2) and the suction holes of the third long plate 44 are used. The vacuum suction state of the display panel 10 by 45 is released, and the display panel 10 is removed from the θ table 4 by a transfer device (not shown). Then, a new display panel 10 is placed on the θ table 4 and the first device P1 and the second device P2 are bonded to the display panel 10 by the same method as described above.
[0056]
As described above, the center portion of the display panel 10 is supported by the θ table 4 and the distance between the θ table 4 and the third long plate 44 in the horizontal direction is changed by the motor MY1, whereby the long side and the short side of the display panel are changed. The bonding operation of the devices P1 and P2 to the bonding position on the side can be automatically performed.
[0057]
Next, another embodiment of the present invention will be described. FIG. 20 is a partial cross-sectional view of the device bonding apparatus according to the second embodiment of the present invention during bonding of the ACF, and FIG. 21 is a portion of the device bonding apparatus of the second embodiment of the present invention during bonding of the flip chip. It is sectional drawing. First, as shown in FIG. 20, an ACF (anisotropic conductive sheet) 201 is vacuum-adsorbed to a nozzle 200 and attached to the electrode 30 a on the long side of the lower plate 10 a of the display panel 10. At this time, the side of the lower plate 10 a is supported from below by the third long plate 44. Next, the θ table 4 is driven to rotate the display panel 90 by 90 °. Similarly, the side of the short side of the lower plate 10a is supported from below by the third long plate 44, and the ACF 201 is placed on the electrode 30b. Adhere.
[0058]
If the ACF 201 is attached in this manner, then a flip chip as a device is bonded onto the ACF 201. FIG. 21 shows a state where the flip chip is bonded. As shown in the figure, the flip chip 202 is vacuum-adsorbed on the collet 203 and bonded onto the ACF 201. In this case, as shown in FIG. 21, the first camera 121 or the second camera 122 observes the bump (electrode) formed on the lower surface of the flip chip 202 and the electrode 30a on the long side of the lower plate 10a, and observes the observation. The flip chip 202 is bonded to the ACF 201 after the bump and the electrode 30a are aligned based on the result. Of course, in this case as well, the side of the lower plate 10 a is supported from below by the third long plate 44.
[0059]
Next, the θ table 4 is driven to rotate the display panel 10 by 90 °, and in the same manner, a flip chip is bonded onto the ACF 201 attached to the short-side electrode 30b. Note that when flip chip bonding is performed, one camera may be used, and the first head 91a and the second head 91b shown in FIG. 3 are not necessary. As described above, the present invention can be applied not only to a device manufactured by the TAB method but also to a bonding apparatus for bonding a flip chip.
[0060]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0061]
(1) Since a plurality of bonding positions provided on the side part of the display panel are supported from below by the second support part, a plurality of bonding positions are maintained while the display panel is supported by the second support part. Since devices can be bonded continuously, bonding work to one side can be performed efficiently and at high speed.
[0062]
(2) Since the displacement of the electrode of the display panel and the outer lead of the device is detected with the side portion of the display panel supported by the second support portion, the second support portion is brought into contact with the display panel. Since alignment can be performed in consideration of the generated displacement, highly accurate bonding can be realized.
[0063]
(3) The center portion of the display panel is supported by the θ table, and the horizontal distance between the θ table and the second support portion is adjusted by the Y table, so the orientation of the display panel is changed by the θ table and bonding is performed. Since the lower side of the side on the station side is accurately supported by the second support, bonding work to different sides of the display panel can be performed automatically and continuously. In addition, the display panel can be easily changed in size.
[0064]
(4) Supplying unit for supplying film carrier, cutting device for punching device from film carrier, nozzle for transferring device above display panel, head for bonding outer lead of device to electrode of display panel By providing, the first device and the second device of different varieties can be automatically bonded to the long side and the short side of the display panel.
[Brief description of the drawings]
FIG. 1 is a perspective view of a device bonding apparatus according to a first embodiment of the present invention.
FIG. 2 is a perspective view of a display panel moving mechanism of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 3 is a sectional view of a bonding station of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 4 is a cross-sectional view of a pole lifting mechanism of a device bonding apparatus according to a first embodiment of the present invention.
FIG. 5 is a front view of a first supply unit of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 6 is a cross-sectional view of the device bonding apparatus according to the first embodiment of the present invention during pickup of the first device;
FIG. 7 is a perspective view of the first head of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 8 is a sectional view of the first head of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 9 is a perspective view of a main part during bonding of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 10 is a perspective view of an observation apparatus for a device bonding apparatus according to the first embodiment of the present invention.
FIG. 11 is a cross-sectional view of an observation apparatus for a device bonding apparatus according to the first embodiment of the present invention.
FIG. 12A is a plan view of the first device being observed by the device bonding apparatus according to the first embodiment of the present invention.
(B) Field of view of the first camera of the device bonding apparatus according to the first embodiment of the present invention.
(C) Field of view of the second camera of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 13A is a sectional view of a display panel positioning mechanism of the device bonding apparatus according to the first embodiment of the present invention.
(B) Sectional drawing of the positioning mechanism of the display panel of the device bonding apparatus in the first embodiment of the present invention.
(C) Sectional view of the display panel positioning mechanism of the device bonding apparatus according to the first embodiment of the present invention.
FIG. 14 is a schematic plan view of a device bonding apparatus according to the first embodiment of the present invention.
15A is a cross-sectional view of the first device of the device bonding apparatus according to the first embodiment of the present invention when the first device is bonded to the display panel; FIG.
(B) Sectional view in which the first device of the device bonding apparatus in the first embodiment of the present invention is bonded to the display panel.
FIG. 16A is a cross-sectional view during bonding of the first device of the device bonding apparatus to the display panel in the first embodiment of the present invention;
(B) Sectional view in which the first device of the device bonding apparatus in the first embodiment of the present invention is bonded to the display panel.
FIG. 17 is a cross-sectional view of the device bonding apparatus according to the first embodiment of the present invention when the first device is bonded to the display panel;
FIG. 18 is a schematic plan view of a device bonding apparatus according to the first embodiment of the present invention.
19A is a plan view of a display panel and a third long plate of the device bonding apparatus according to the first embodiment of the present invention. FIG.
(B) The top view of the display panel and 3rd long board of the bonding apparatus of the device in 1st embodiment of this invention
FIG. 20 is a partial cross-sectional view during bonding of an ACF of the device bonding apparatus according to the second embodiment of the present invention.
FIG. 21 is a partial cross-sectional view of the device bonding apparatus according to the second embodiment of the present invention during bonding of the flip chip.
[Explanation of symbols]
1 Moving means
2 X table device
3 Y table device
4 θ table device (first support part)
10 Display panel
30a electrode
30b electrode
44 3rd long plate (2nd support part)
55a First cutting device
55b Second cutting device
58a First upper mold
58b Second upper mold
59a First lower mold
59b Second lower mold
70a first supply section
70b second supply section
74a first film carrier
74b second film carrier
80 turntable
82a Motor (rotating means)
84 First nozzle
85 Second nozzle
91a First head
91b Second head
111 thermocompression bonding
120 Observation device
201 ACF (device)
202 Flip chip (device)
P1 first device
P2 second device
L Outer lead

Claims (4)

The electrode formed on the bonding position of the plurality of locations of the side portion of the display panel, a bonding apparatus for bonding to align the electrodes of the device, a first support portion supporting a central portion of the display panel from below A display panel moving means comprising a certain θ table device, X table device, and Y table device and a suction hole formed on the upper surface are used to vacuum-suck the side portion of the display panel to lower the bonding positions at a plurality of locations on the side portion. Can be horizontally moved together with the display panel while being supported, and in a state in which the support is released, the horizontal distance from the θ table device can be changed by the Y direction table device. A support unit, alignment means for aligning the electrode of the device with the electrode formed on the upper surface of the end of the display panel, and alignment A bonding apparatus for a device, comprising: bonding means for pressing and bonding the electrode of the device against the electrode of the display panel. The device bonding apparatus according to claim 1, further comprising an elevating drive means for causing the second support portion to perform an elevating operation to support and release the bonding position of the display panel. A device bonding method using the device bonding apparatus according to claim 1, wherein the first support portion on which the display panel is mounted is moved to move the display panel to a bonding station;
A step of supporting the side of the display panel by vacuum suction from below with a second support provided in the bonding station;
Positioning the electrode of the device vacuum-adsorbed on the nozzle at the bonding station;
The bonding position of the display panel that is vacuum-sucked and supported by the support member is observed by an observation device provided below the bonding station, and is supported by the device electrode vacuum-sucked by the nozzle and the second support part. Detecting a positional deviation of the electrodes of the display panel in the X direction, Y direction, and θ direction;
In order to correct misalignment in the X direction, Y direction, and θ direction detected in the step, the display panel supported by the device and the second support portion is relatively moved in the X direction, Y direction, and θ direction. A process of moving to
Bonding the electrode of the device vacuum-adsorbed to the nozzle to the electrode of the display panel supported by the second support part;
A device bonding method characterized by comprising: If bonding to the bonding position of the plurality of locations of the side portion of the display panel is completed, according to claim 3, by releasing the vacuum suction by the second supporting portion, characterized in that lowering the second support portion The bonding method of the described device.

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