CN109526197A - A kind of device for repairing for optics COB encapsulation - Google Patents
A kind of device for repairing for optics COB encapsulation Download PDFInfo
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- CN109526197A CN109526197A CN201811158434.9A CN201811158434A CN109526197A CN 109526197 A CN109526197 A CN 109526197A CN 201811158434 A CN201811158434 A CN 201811158434A CN 109526197 A CN109526197 A CN 109526197A
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- Prior art keywords
- heating
- component
- pcba board
- optics
- repairing
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 97
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 79
- 238000012544 monitoring process Methods 0.000 claims abstract description 7
- 238000013016 damping Methods 0.000 claims description 9
- 230000001276 controlling effect Effects 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 13
- 239000003292 glue Substances 0.000 abstract description 8
- 230000033001 locomotion Effects 0.000 abstract description 8
- 229920000297 Rayon Polymers 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 3
- 208000028804 PERCHING syndrome Diseases 0.000 description 12
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- 238000009434 installation Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000012958 reprocessing Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012913 prioritisation Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
Abstract
The present invention relates to technical field of photo communication, provide: a kind of device for repairing for optics COB encapsulation, including workbench, and fixation kit, heating component, observation assembly and removing component are equipped on workbench；Fixation kit, for fixing PCBA board；The heating component, for heating the PCBA board；Observation assembly, for PCBA board situation described in real-time monitoring；The removing component, for removing the PD chip loosened after heating in the PCBA board.A kind of device for repairing for optics COB encapsulation of the invention, PCBA board fixed on fixation kit can be heated by heating component, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce the curing degree between PD chip and the PCBA board, it makes it easier to remove PD chip from PCBA board by removing component, the process of removing is observed in real time under observation assembly, and whole process is all completed by mechanical component, it is more accurate than pure craft, the SMD components in PCBA board will not be damaged.
Description
Technical field
The present invention relates to technical field of photo communication, specially a kind of device for repairing for optics COB encapsulation.
Background technique
COB encapsulates full name chip on board encapsulation (Chips on Board, COB), exactly by bare chip conduction or non-leads
Electric gluing is attached on interconnection substrates, this processing step of encapsulation field is referred to as die bond (Die bond), then carries out lead key (Wire
Bond it) closes and realizes the transmission of its signal.
As shown in Figure 2,1 is PD to a kind of typical COB packaging model of optical communication field, and 2 be LENS, and 3 be PCBA.It is producing
First PD and PCBA is bonded as one through die bond technological operation in the process, then by PD and PCBA line lead key (Wire bond),
The PD on LENS and PCBA is finally subjected to coupling operation, realizes the transmission of optical path and electric signal.
It can be because the coupling operation damage reasons such as PD or deficient purchase cause the module coupled cannot in production process
Work or parameter situation not up to standard, just need to reprocess module at this time.Shape is encapsulated for COB in production process at present
The measure of reprocessing that the device of formula is taken is substantially based on pure manual operations, or considers the problems of that reprocess yield rate does not return substantially
It repairs, directly scraps；Because reprocessing the patch that can be damaged on PCBA when rooting out PD, causes PCBA also to damage, finally result in device
Part is scrapped, and it is not high to reprocess yield.
Summary of the invention
The purpose of the present invention is to provide a kind of device for repairing for optics COB encapsulation, can be added by heating component
Fixed PCBA board on heat fixation component, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce PD chip
With the curing degree between the PCBA board, makes it easier to remove PD chip from PCBA board by removing component, remove
Process observed in real time under observation assembly, and whole process all by mechanical component complete, it is more accurate than pure craft,
The SMD components in PCBA board will not be damaged.
To achieve the above object, the embodiment of the present invention provides the following technical solutions: a kind of reprocessing for optics COB encapsulation
Device, including workbench are equipped with fixation kit, heating component, observation assembly and removing component on the workbench,
The fixation kit, for fixing PCBA board；
The heating component, for heating the PCBA board, to reduce the solidification path between PD chip and the PCBA board
Degree；
The observation assembly, for PCBA board situation described in real-time monitoring；
The removing component, for that will be removed by the PD chip in the PCBA board after heating component heating.
Further, the fixation kit includes fixed platform for carrying the PCBA board and described for clamping
The clamping components of PCBA board, the fixed platform are mounted in the heating component, and the fixed platform is equipped with for transmitting
The heat-conducting piece of heat, one end of the heat-conducting piece are connect with the heating component, and the other end and the PCBA board have PD chip
Position connection.
Further, the clamping components include movable block, fixed block and for drive the movable block close to or far from
First actuator of the fixed block forms the clamp area for clamping the PCBA board between the movable block and fixed block
Between.
Further, the heating component includes heater body, and heating tube, the heater body are equipped in the heater body
Top is equipped with the heating region for fixation kit installation, and the side of the heater body is equipped with insulated thermal insulating layer.
Further, the heating component further includes the regulating base board for adjusting the position of the heater body.
Further, the observation assembly includes CCD camera and the second drive for driving the CCD camera mobile
Moving part.
Further, it is described removing component include for push away fall PD chip push away tool, the fixing seat for pushing away tool described in fixation
And the third actuator for driving the fixing seat mobile.
Further, further include computer heating control component for controlling the degree of heat of the heating component.
Further, the computer heating control component includes shell, and the temperature controller for showing and adjusting temperature；The temperature
Control instrument installation on the housing, the shell is equipped with heating lamp for showing energized state, for the temperature control
The start button of instrument start and stop and power switch for power supply, the temperature controller are electrically connected with the heating component.
Further, the workbench includes damping bottom plate, the fixation kit, the heating component, the observation group
Part and the removing component are set on the damping bottom plate.
Compared with prior art, the beneficial effects of the present invention are: can be heated by heating component fixed on fixation kit
PCBA board, heating can accelerate the molecular motion of viscose glue between PD and PCBA, to reduce between PD chip and the PCBA board
Curing degree, make it easier to remove PD chip from PCBA board by removing component, the process of removing is in observation assembly
Lower observation in real time, and whole process is all completed by mechanical component, it is more accurate than pure craft, it will not damage in PCBA board
SMD components.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of device for repairing for optics COB encapsulation provided in an embodiment of the present invention；
Fig. 2 be it is provided in an embodiment of the present invention it is a kind of for optics COB encapsulation device for repairing PCBA board on PD is installed
The structural schematic diagram of chip；
Fig. 3 is a kind of structure of the observation assembly of device for repairing for optics COB encapsulation provided in an embodiment of the present invention
Schematic diagram；
Fig. 4 is a kind of computer heating control component of device for repairing for optics COB encapsulation provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 5 is a kind of structure of the heating component of device for repairing for optics COB encapsulation provided in an embodiment of the present invention
Schematic diagram；
Fig. 6 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided in an embodiment of the present invention is mounted on fixation
Structural schematic diagram on seat；
Fig. 7 is a kind of structure of the removing component of device for repairing for optics COB encapsulation provided in an embodiment of the present invention
Schematic diagram；
Fig. 8 is a kind of structure of the fixation kit of device for repairing for optics COB encapsulation provided in an embodiment of the present invention
Schematic diagram；
Fig. 9 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided in an embodiment of the present invention pushes PD chip
The main view of amplification；
Figure 10 is that a kind of tool that pushes away of device for repairing for optics COB encapsulation provided in an embodiment of the present invention pushes PD chip
The top view of amplification；
In appended drawing reference: 1- damping bottom plate；2- fixation kit；20- fixed platform；21- heat-conducting piece；22- movable block；23-
Fixed block；24- clamps section；25- locating piece；26- swingle；3- heating component；30- heater body；31- heating region；32-
Insulated thermal insulating layer；33- regulating base board；34- aviation socket；40-CCD video camera；50- pushes away tool；51- movable plate；52- pinboard；
The first mounting hole of 53-；The second mounting hole of 54-；6- computer heating control component；60- temperature controller；61- shell；62- heating lamp；
63- start button；64- power switch；65- thermovent；66- outlet hole；67- fixed screw；70-PCBA plate；71-PD chip；
72-LENS (lens)；80- micropositioning stage；81- linear guide；82-X axis direction micropositioning stage；83-Y axis direction micropositioning stage；84-Z axis
Directional trim frame；85- micropositioning stage pinboard.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention provides a kind of device for repairing for optics COB encapsulation, including workbench,
Fixation kit 2, heating component 3, observation assembly and removing component are installed on the workbench.Wherein, described fixed group
Part 2 is for fixing PCBA board 70, to reduce the curing degree between PD chip 71 and the PCBA board 70；The heating component 3
For heating the PCBA board 70；The observation assembly is for 70 situation of PCBA board described in real-time monitoring；The removing component is used
It is removed in by the PD chip 71 in the PCBA board 70 after the heating component 3 heating.In the present embodiment, foundation
The glue used in COB technique can accelerate the molecular motion of viscose glue to first pass through fixation to reduce the characteristic of curing degree after heated
Component 2 fixes PCBA board 70, is then heated to PCBA board 70 by heating component 3 again, after heating PCBA board 70 with
The curing degree of glue between PD chip 71 will reduce, at this time, it will be able to by removing component easily by PD chip 71
It is removed from PCBA board 70, the process of removing is observed in real time under observation assembly, will not damage the patch member device in PCBA board 70
Part.Whole process is all completed by mechanical component, more accurate than pure craft, and will not damage PCBA board 70.
Optimize above-mentioned fixation kit 2, please refer to Fig. 1 and Fig. 8, the fixation kit 2 includes for carrying the PCBA board
70 fixed platform 20 and clamping components for clamping the PCBA board 70, the fixed platform 20 are mounted on the heating
On component 3, and the fixed platform 20 is equipped with the heat-conducting piece 21 for transmitting heat, and one end of the heat-conducting piece 21 adds with described
Hot component 3 connects, and the other end with the PCBA board 70 there is the position of PD chip 71 to connect.In the present embodiment, such as Fig. 2 institute
Showing, PD chip 71 is mounted on the front of PCBA board 70, upper cover LENS 72 (lens), therefore when installing PCBA board 70,
The back side for the PCBA board 70 reprocessed is mounted in fixed platform 20, heat-conducting piece 21 is bonded the back side of PCBA board 70,
And the position of the fitting is exactly the position that PD chip 71 is mounted on front, therefore heat-conducting piece 21 can be rapidly by heating
The heat that component 3 generates reaches at PD chip 71, and this point-to-point heat transfer efficiency is heated compared with monolith PCBA board 70
It is more efficient.As a preferred scheme of the embodiment of the present invention, which is made from a material that be thermally conductive, such as copper, it
Be preferably shaped to column structure, end face can contact PCBA board 70 in relatively large area.Preferably, the quantity of heat-conducting piece 21 can
It is multiple to have.Preferably, fixed platform 20 is made of heat-conducting metal.
Optimize above-mentioned clamping components, referring to Fig. 8, the clamping components include movable block 22, fixed block 23 and are used for
Drive the movable block 22 close to or far from the first actuator of the fixed block 23, between the movable block 22 and fixed block 23
Form the clamping section 24 for clamping the PCBA board 70.In the present embodiment, movable block 22 is driven by the first actuator, when
It when needing to clamp, just drives the movable block 22 close to the fixed block 23, when needing to unclamp, just drives the movable block 22
Far from the fixed block 23.As a preferred scheme of the embodiment of the present invention, first actuator include with it is described solid
The swingle 26 that fixed platform 20 is threadedly coupled, the length direction of the swingle 26 and the movable block 22 to the fixed block 23
Direction it is consistent, swingle 26 connect with the movable block 22, therefore can drive movable block 22 by rotation swingle 26
It is mobile.Certainly, in addition to this, the movement of movable block 22 can also be controlled using electric pushrod.
Optimize above-mentioned fixed platform 20, referring to Fig. 8, in the fixed platform 20 other than being equipped with heat-conducting piece 21, also
Equipped with can be with the matched locating piece 25 of mounting hole in the PCBA board 70.There is mounting hole, in fixed platform in PCBA board 70
After setting locating piece 25 on 20, location and installation can be rapidly carried out in order to staff, save the time for finding installation site.
Optimize above-mentioned heating component 3, referring to Fig. 5, the heating component 3 includes heater body 30, the heater body
It is equipped with heating tube in 30, the heating region 31 for the fixation kit 2 installation, the heating are equipped at the top of the heater body 30
The side of ontology 30 is equipped with insulated thermal insulating layer 32.In the present embodiment, it is generated by the heating tube being set in heater body 30
Heat, to achieve the purpose that heating.It is equipped with the aviation socket 34 of controlling cable access in the side of heater body 30, it is for connecing
The control instruction that computer heating control component 6 is transmitted by controlling cable is received, and is transferred to the output work for controlling heating tube
In the control piece of rate.It is equipped with heating region 31 at the top of heater body 30, which is the region of fixing seat installation, in addition to this
Other than a region, it is covered with insulated thermal insulating layer 32 elsewhere, on the one hand prevents electric leakage from damaging to staff, it is another
Aspect can be effectively by shield heat away, so that heat is more intensively issued from heating region 31.
Above-mentioned heating component 3 is advanced optimized, referring to Fig. 5, the heating component 3 further includes for adjusting the heating
The regulating base board 33 of the position of ontology 30.In the present embodiment, which has the function of coarse regulation, so that heating is originally
Body 30 can carry out adjustment appropriate in X-Y plane.Mobile mode has very much, such as screw rod transmission, cylinder promotion etc..
Optimize above-mentioned observation assembly, referring to Fig. 3, the observation assembly includes CCD camera 40 and for driving
State the second mobile actuator of CCD camera 40.In the present embodiment, the feelings heated by CCD camera 40 come real-time monitoring
Condition and the case where remove.During monitoring, the position of CCD camera 40 can be adjusted by the second actuator, with
Guarantee the most accurately monitors.As the preferred embodiment of the embodiment of the present invention, the second actuator can drive CCD camera 40 to exist
X-Y-Z is moved in tri- directions to heating state and to remove situation and be monitored.Preferred side as the embodiment of the present invention
Case also uses two CCD cameras 40, wherein one is set on workbench, in addition one passes through bracket-suspending, which can
Think linear guide 81, this two CCD cameras 40 can be made all to carry out in tri- directions X-Y-Z by the second actuator micro-
The case where adjusting, can more precisely monitoring heating from multiple angles using two CCD cameras 40 and the case where removing.It is preferred that
, the second actuator can provide power using cylinder or screw rod transmission.
Optimize above-mentioned removing component, please refers to Fig. 6 and Fig. 7, the removing component includes falling pushing away for PD chip 71 for pushing away
Tool 50, the fixing seat for pushing away tool 50 described in fixation and the third actuator for driving the fixing seat mobile.In this reality
It applies in example, pushes away tool 50 and be mounted in fixing seat, third actuator drives fixing seat mobile, and it pushes away tool 50 and just and then moves together, from
And PD chip 71 can be pushed, to achieve the purpose that make it to fall off from PCBA board 70.Preferred side as the embodiment of the present invention
Case, the tool 50 that pushes away can have the knife edge for being inserted into gap between PD chip 71 and PCBA board 70 using perching knife, the perching knife,
And the perching knife uses high-speed tool steel, the knife edge is more slim and firm, other any are inserted into this other than perching knife
Firm object in gap can substitute, and this embodiment is not limited.As the preferred embodiment of the embodiment of the present invention, fixing seat includes
Movable plate 51 and pinboard 52 have the first mounting hole 53 install for pinboard 52 on the movable plate 51 and for third drive
Second mounting hole 54 of moving part installation, perching knife is mounted on pinboard 52, the pinboard 52 be with an inclined surface, it is described
Perching knife is installed in parallel on the inclined surface, has angle between the inclined surface and the movable plate 51, which is preferably acute angle,
As shown in Figure 9 and Figure 10 you so that between the knife edge of perching knife and the movable plate 51 also have angle, in this way, in 51 water of movable plate
When translation is dynamic, drive perching knife mobile, the power that perching knife acts on PCBA can be analyzed to power and horizontal direction on vertical direction
On power convenient for scooping up PD chip 71 from PCBA board 70, be also convenient for removing and be bonded in PCBA to play the role of " shoveling "
Extra glue on plate 70.As the preferred embodiment of the embodiment of the present invention, third actuator includes that the power in tri- directions X-Y-Z is defeated
Out, it is composed of X-direction micropositioning stage 82, X-direction micropositioning stage 83 and Z-direction micropositioning stage 84, wherein X-direction
Power output of the power output either in Y direction be used to that the movable plate 51 is driven to move, to push perching knife mobile,
The movement in movement and the present embodiment in above-described embodiment can realize that they are this using this micropositioning stage 80
Field common knowledge, is just not described in detail, and equally, power output can also be using screw rod transmission either cylinder driving, it
Be general knowledge known in this field, be also not described in detail.Third actuator is mounted on micropositioning stage pinboard 85, which turns
Fishplate bar 85 is mounted on damping bottom plate 1.
It further include for controlling adding for the degree of heat of the heating component 3 as the prioritization scheme of the embodiment of the present invention
Thermal control component 6.In the present embodiment, in order to control the heating state of heating component 3, computer heating control component can be passed through
6 control it.
Optimize above-mentioned heating component 3, referring to Fig. 4, the computer heating control component 6 includes shell 61, and for showing
With the temperature controller 60 for adjusting temperature；The temperature controller 60 is mounted on the shell 61, and the shell 61 is equipped with for showing
The heating lamp 62 of energized state, for the start button 63 of 60 start and stop of temperature controller and for the power switch of power supply
64, the temperature controller 60 is electrically connected with the heating component 3.In this embodiment, shell 61 is similarly located on workbench, temperature
Control instrument 60 be existing instrument, it can displays temperature and for staff operate to adjust temperature, temperature controller 60 is mounted on shell
On 61, staff is facilitated to operate.It is equipped with thermovent 65 and outlet hole 66 in the side of shell 61, which, which is used as, dissipates
Heat, controlling cable are led in the aviation socket 34 of heating component 3 by the outlet hole 66.61 bottom of shell is equipped with fixed screw
67, it enables to this shell 61 to be stably installed on workbench.The specific work process of this computer heating control component 6 are as follows:
It is first turned on power switch 64, entire computer heating control component 6 is powered, then striking start button 63 again, at this time heating lamp
62 light, and indicate that this computer heating control component 6 carries out heating work in control heating component 3, staff can be at this time
The temperature of the heating of heating component 3 is observed according to the temperature that temperature controller 60 is shown, and is raised according to actual needs in temperature controller 60
Whole temperature level.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 1, the workbench includes damping bottom plate 1, it is described solid
Determine component 2, the heating component 3, the observation assembly and the removing component to be set on the damping bottom plate 1.At this
In embodiment, since heating component 3, observation assembly and removing component are required to move, it can be disappeared using damping bottom plate 1
Except the vibration that they are generated when moving, convenient for accurately operating.
The specific implementation of the present apparatus are as follows:
It is first turned on Switching Power Supply, presses start button 63, heating lamp 62 is bright, and the heating tube in heater body 30 is logical
Electricity, heat-conducting piece 21 of the heat on fixation kit 2 reaches PCBA after heater body 30 is thermally conductive；Adjust the CCD on workbench
Video camera 40 is to 71 position of PD chip on PCBA, in the height for adjusting another CCD camera 40 to appropriate observation position,
It is concordant with the bottom of PD chip 71 on PCBA to observe perching knife point of a knife plane, starts to drive movable plate 51 mobile, to drive perching knife
It is moved along generation shearing force, when shearing force is greater than the bonding force between PD chip 71 and PCBA, PD chip 71 just loosens,
It observes that PD chip 71 starts to loosen on CCD camera 40 and stops movement, to complete what PD chip 71 was rooted out from PCBA
Process, next, can be coupled in again on PCBA after having cleaned the removing residual glue tumor on PCBA and carry out die bond and gold wire bonding behaviour
Make.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of device for repairing for optics COB encapsulation, including workbench, it is characterised in that: pacify on the workbench
Equipped with fixation kit, heating component, observation assembly and component is removed,
The fixation kit, for fixing PCBA board；
The heating component, for heating the PCBA board, to reduce the curing degree between PD chip and the PCBA board；
The observation assembly, for PCBA board situation described in real-time monitoring；
The removing component, for that will be removed by the PD chip in the PCBA board after heating component heating.
2. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the fixation kit
Including the fixed platform for carrying the PCBA board and the clamping components for clamping the PCBA board, the fixed platform
It is mounted in the heating component, and the fixed platform is equipped with the heat-conducting piece for transmitting heat, one end of the heat-conducting piece
It is connect with the heating component, the other end with the PCBA board there is the position of PD chip to connect.
3. a kind of device for repairing for optics COB encapsulation as claimed in claim 2, it is characterised in that: the clamping components
It is described including movable block, fixed block and for driving the movable block close to or far from the first actuator of the fixed block
The clamping section for clamping the PCBA board is formed between movable block and fixed block.
4. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the heating component
Including heater body, it is equipped with heating tube in the heater body, is equipped at the top of the heater body and is installed for the fixation kit
Heating region, the side of the heater body is equipped with insulated thermal insulating layer.
5. a kind of device for repairing for optics COB encapsulation as claimed in claim 4, it is characterised in that: the heating component
It further include the regulating base board for adjusting the position of the heater body.
6. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the observation assembly
The second actuator including CCD camera and for driving the CCD camera mobile.
7. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the removing component
Including for push away fall PD chip push away tool, the fixing seat for pushing away tool described in fixation and for driving the fixing seat mobile
Third actuator.
8. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: further include for controlling
Make the computer heating control component of the degree of heat of the heating component.
9. a kind of device for repairing for optics COB encapsulation as claimed in claim 8, it is characterised in that: the computer heating control
Component includes shell, and the temperature controller for showing and adjusting temperature；The temperature controller is installed on the housing, the shell
Body is equipped with for showing the heating lamp of energized state, for the start button of the temperature controller start and stop and for powering
Power switch, the temperature controller is electrically connected with the heating component.
10. a kind of device for repairing for optics COB encapsulation as described in claim 1, it is characterised in that: the workbench
Including damping bottom plate, the fixation kit, the heating component, the observation assembly and the removing component are set to described
On damping bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811158434.9A CN109526197A (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811158434.9A CN109526197A (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
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|---|---|
| CN109526197A true CN109526197A (en) | 2019-03-26 |
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|---|---|---|---|
| CN201811158434.9A Pending CN109526197A (en) | 2018-09-30 | 2018-09-30 | A kind of device for repairing for optics COB encapsulation |
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| CN (1) | CN109526197A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524468A (en) * | 2020-05-19 | 2020-08-11 | 温州啃途电子科技有限公司 | Self-maintenance LED display screen equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4832250A (en) * | 1987-05-28 | 1989-05-23 | Srtechnologies, Inc. | Electronic circuit board rework and repair system |
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