WO2016103800A1

WO2016103800A1 - Component removal device, substrate, component removal method, component repairing device and component mounting substrate

Info

Publication number: WO2016103800A1
Application number: PCT/JP2015/075700
Authority: WO
Inventors: 研足立; 大鳥居　英
Original assignee: ソニー株式会社
Priority date: 2014-12-24
Filing date: 2015-09-10
Publication date: 2016-06-30

Abstract

In order to reduce the time required to remove a component using a component removal device, a proposed component removal device is provided with a laser light irradiation unit and a suction unit, and removes a component from a substrate to which the component has been bonded by means of a thermoplastic bonding agent such as solder. The laser light irradiation unit radiates laser light for melting the thermoplastic bonding agent which bonds the component to the substrate. The suction unit sucks the component through an opening larger than the component after the thermoplastic bonding agent has been melted by the laser light irradiation. In this way the component is removed from the substrate.

Description

Component removal device, substrate, component removal method, component repair device, and component mounting substrate

This technology relates to a component removal device. Specifically, the present invention relates to an apparatus and a component removal method for removing chip components mounted on a substrate by soldering or the like from the substrate.

Conventionally, when a defect is found by visual inspection of a board on which an electronic component is mounted, it is necessary to replace the soldered electronic component. At this time, for example, electronic parts are manually removed using a soldering iron. However, in recent years, it has become difficult to manually remove components due to the miniaturization of electronic components and the adoption of wafer level package shapes. Therefore, a component removal apparatus that facilitates removal of electronic components has been proposed. For example, an apparatus has been proposed in which a component holding pin is fixed to a component, solder is melted, and the pin and the component are removed from the substrate (for example, see Patent Document 1).

Japanese Patent Application No. 2007-523281

The above-described conventional technology is to fix a component holding pin to a component with a thermosetting adhesive, and remove the component by the following procedure. First, by irradiating light (soft beam) of a halogen lamp, the thermosetting adhesive is cured and the component holding pin is fixed to the component. Next, by irradiating the electronic component with the soft beam, the solder is melted and the component is removed together with the component holding pin. Thus, according to the prior art, it is possible to remove components without using a soldering iron. However, this conventional technique has a problem that it takes time to remove parts because it is necessary to dissolve the solder after the thermosetting adhesive is cured.

This technology was created in view of such a situation, and aims to shorten the time required for component removal.

The present technology has been made to solve the above-described problems, and a first side thereof includes a laser beam irradiation unit that irradiates a laser beam that dissolves a thermoplastic bonding agent that bonds a component to a substrate, and A component removing apparatus comprising: a suction portion that removes the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by the laser light irradiation. This brings about the effect | action that the said components are inhaled, after the said thermoplastic joining agent is melt | dissolved.

Further, in the first aspect, the apparatus may further include a measuring unit that measures a state of air inflow into the suction unit accompanying the suction. This brings about the effect | action that the state of the inflow of the air to the said suction part is measured.

In the first aspect, the measuring unit measures a pressure sensor that measures the air inflow state by measuring a pressure difference between the outside and the inside of the suction unit, or measures a flow rate in the air inflow. May include at least one of the flow sensors for measuring the air inflow state. This brings about the effect that at least one of the differential pressure inside and outside the suction part or the air inflow state is measured.

Further, in the first aspect, a control unit that controls the inflow of the air based on the measurement result of the measurement unit may be further provided. This brings about the effect | action that the inflow of the said air is controlled based on the said measurement result.

The first aspect further includes a distance adjusting unit that adjusts a distance between the substrate and the opening, and the control unit controls the inflow of the air by causing the distance adjusting unit to adjust the distance. May be. This brings about the effect | action that the inflow of the said air is controlled by adjusting the said distance.

Further, in the first aspect, the control unit controls the inflow of air and causes the laser beam irradiation unit to start irradiation with the laser beam when the inflow of air reaches a predetermined state. When the air inflow state changes after the start of laser beam irradiation, the laser beam irradiation unit may stop the laser beam irradiation. Thereby, the irradiation of the laser beam is started when the inflow of the air reaches a predetermined state, and the irradiation of the laser beam is stopped when the inflow state of the air changes after the irradiation of the laser beam is started. It brings about the effect of being.

Further, in the first aspect, a capture unit that captures the inhaled part may be further provided. Thereby, the effect | action that the said inhaled said components are capture | acquired is brought about.

In addition, in the first aspect, an exhaust unit that performs the inhalation by exhausting the air in the intake unit may be further provided. This brings about the effect | action that the said suction | inhalation is performed by exhausting the air in the said suction part.

In the first aspect, the suction portion includes a transmission portion that transmits the laser light on a surface facing the opening, and the laser light irradiation portion is attached to the component through the transmission portion and the opening. You may irradiate the said laser beam. This brings about the effect | action that the said laser beam is irradiated to the said components.

In the first aspect, the laser beam irradiation unit may irradiate the laser beam on the surface of the substrate opposite to the surface where the component is bonded. This brings about the effect | action that the said laser beam is irradiated to the surface on the opposite side to the surface where the said components in the said board | substrate were joined.

In addition, the second aspect of the present technology provides a bonding pad in which a component is bonded by a thermoplastic bonding agent and a laser beam that dissolves the thermoplastic bonding agent is applied to the component to dissolve the thermoplastic bonding agent. After that, when the component is removed by being sucked through an opening larger than the component, the heating member is disposed near the bonding pad and absorbs the laser light to generate heat, the bonding pad and the bonding pad. And a base material on which a heat generating member is disposed. This brings about the effect that the heat generating member generates heat by the laser beam.

In the second aspect, the heat generating member may be Si, Ti, Cr, Ni, Pt, Sn, W, Fe, Al, or an alloy thereof. Thereby, the effect | action that the said endothermic material is comprised by either of Si, Ti, Cr, Ni, Pt, Sn, W, Fe, or Al, or these alloys is brought about.

In this second aspect, the bonding pad to which the component is bonded by a thermoplastic bonding agent and the laser beam that dissolves the thermoplastic bonding agent is irradiated to the component to dissolve the thermoplastic bonding agent. A reflection member that reflects the laser beam when the component is removed by being sucked through an opening larger than the component, and a base material on which the bonding pad and the reflection member are disposed may be provided. . This brings about the effect | action that the said laser beam is reflected by the said reflecting material.

In the second aspect, the reflecting member may be any one of Al, Cu, Au, Ag, or an alloy thereof. This brings about the effect | action that the said reflection member is comprised by either Al, Cu, Au, Ag, or these alloys.

Further, according to a third aspect of the present technology, the thermoplastic adhesive is dissolved by the laser light irradiation procedure for irradiating the laser light for dissolving the thermoplastic adhesive for joining the component to the substrate, and the laser light irradiation. A component removal method comprising: an inhalation procedure for removing the component from the substrate by later inhaling through an opening larger than the component. This brings about the effect | action that the said components are inhaled, after the said thermoplastic joining agent is melt | dissolved.

In addition, according to a fourth aspect of the present technology, a laser beam irradiation unit that irradiates a laser beam that dissolves a thermoplastic bonding agent for bonding a component to a substrate, and the thermoplastic bonding agent is dissolved by the laser beam irradiation. A component removing device including a suction unit that removes the component from the substrate by sucking through an opening larger than the component later, a substrate transport device that transports the substrate, and the substrate from which the component has been removed. A flux application device for applying a flux, a component mounting device for mounting a new component on a substrate from which the component has been removed, and a reflow device for solidifying the thermoplastic bonding agent and then solidifying it to bond the component to the substrate A component repair device comprising at least one of the above. This brings about the effect | action that the said components are inhaled after the said thermoplastic joining agent is melt | dissolved in the components removal apparatus in the said components repair apparatus.

In addition, according to a fifth aspect of the present technology, a laser beam irradiation process for irradiating a laser beam for dissolving a thermoplastic bonding agent for bonding a component to a substrate, and the thermoplastic bonding agent is dissolved by the laser beam irradiation. A component mounting board comprising the substrate used in a component removal method including a suction step of removing the component from the substrate by sucking through an opening larger than the component later. Thereby, the effect | action that the component mounted in the said component mounting board | substrate is removed by the said component removal method is brought about.

In this fifth aspect, the component may be a chip component, a semiconductor chip, a MEMS, or a wafer level package. As a result, the chip component, the semiconductor chip, the MEMS, or the wafer level package is removed by the component removal method.

In the fifth aspect, the component may be a sensor, and the component mounting board may be a sensor array device. This brings about the effect | action that the said sensor mounted in the said sensor array device is removed by the said component removal method.

In the fifth aspect, the sensor may be a light receiving sensor. As a result, the light receiving sensor mounted on the sensor array device is removed by the component removing method.

According to the present technology, it is possible to achieve an excellent effect that the time required for removing the parts can be shortened. Note that the effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

It is a figure showing an example of composition of a parts removal device in a 1st embodiment of this art. It is a figure showing an example of composition of inhalation part 230 in a 1st embodiment of this art. It is a figure showing an example of composition of a parts removal device in a 2nd embodiment of this art. It is a figure showing an example of composition of a parts removal device in a 3rd embodiment of this art. It is a figure showing other examples of composition of a parts removal device in a 3rd embodiment of this art. It is a figure showing an example of parts removal procedure in a 3rd embodiment of this art. It is a figure showing an example of composition of a parts removal device in a modification of a 3rd embodiment of this art. It is a figure showing an example of composition of a parts removal device in a 4th embodiment of this art. It is a figure showing an example of composition of substrate 410 in a 5th embodiment of this art. It is a figure showing an example of composition of substrate 410 in a 5th embodiment of this art. It is a figure showing an example of composition of a parts repair device in a 6th embodiment of this art. It is a figure showing an example of composition of a component mounting board in a 7th embodiment of this art.

Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described. The description will be made in the following order.
1. First embodiment (basic configuration example)
2. Second embodiment (example in which inhalation of parts is detected by a camera)
3. Third embodiment (an example in which inhalation of a component is detected based on a change in pressure or air flow rate)
4). Fourth embodiment (example in which laser light is irradiated from the back surface of the substrate)
5. Fifth embodiment (example of substrate to be used)
6). Sixth embodiment (example of repair device)
7). Seventh embodiment (example of component mounting board)

<1. First Embodiment>
[Configuration of parts removal equipment]
FIG. 1 is a diagram illustrating a configuration example of a component removal apparatus according to the first embodiment of the present technology. The component removing apparatus shown in FIG. 1 includes a laser light generation unit 110, an optical waveguide 120, a laser light emission unit 130, a camera 140, and an optical unit 150. In addition, the component removing apparatus shown in the figure includes a distance adjusting unit 210, a suction unit holding unit 220, a suction unit 230, an exhaust tube 240, a substrate holding unit 250, a filter 310, a vacuum pump 330, and a control unit. 340. The laser light generation unit 110, the optical waveguide 120, and the laser light emission unit 130 constitute a laser light irradiation unit.

Note that a component 420 bonded to the substrate 410 with a thermoplastic bonding agent is assumed as a sample. Here, the thermoplastic bonding agent is a conductive bonding agent that dissolves by heating, and corresponds to, for example, a bonding agent in which solder or conductive fine particles are dispersed in a thermoplastic adhesive. In the embodiment of the present technology, a sample in which the component 420 is bonded to the substrate 410 by solder is assumed. The component 420 corresponds to a chip component such as a chip resistor, a semiconductor chip for bare chip mounting, a MEMS (Micro Electro Mechanical Systems), or a wafer level package. Note that a semiconductor chip on which bumps are formed corresponds to a semiconductor chip for bare chip mounting. In the following description, this is referred to as a bare chip component. The wafer level package is a concept including an IC having a shape in which a semiconductor chip or the like is enclosed in a package. For example, an IC having a chip size package shape is also included in the wafer level package.

The laser beam generator 110 generates and outputs a laser beam for heating the component 420 and the solder that joins the component 420 to the substrate 410. The laser beam generator 110 includes a laser oscillator and a power supply device. The laser oscillator is constituted by, for example, a semiconductor laser oscillator, and oscillates and outputs laser light. As this semiconductor laser oscillator, a semiconductor laser oscillator that oscillates near infrared or ultraviolet laser light can be used. Since ultraviolet rays have a higher absorption rate in solder, the efficiency of the entire apparatus can be improved by employing a semiconductor laser that oscillates ultraviolet rays. On the other hand, when a semiconductor laser that oscillates near infrared rays is employed, the cost can be reduced. The power supply device supplies power to the laser oscillator. By changing the electric power, it is possible to control on / off of the laser light.

The optical waveguide 120 is a waveguide that guides the laser light output from the laser light generation unit 110 to a laser light emission unit 130 described later. As the optical waveguide 120, for example, an optical waveguide constituted by an optical fiber can be used. Further, for example, an optical waveguide of a reflection optical system that reflects laser light with a mirror can be used.

The laser light emitting unit 130 irradiates the component 420 and the like with laser light. The laser beam emitting unit 130 includes an objective lens, condenses the laser beam to a desired spot diameter, and emits the laser beam from an emitting unit (not shown) provided below. As the spot diameter, it is necessary to make the whole part 420 heatable.

The camera 140 is a camera that outputs an image of the component 420 or the like. This camera 140 is used for observing the surface state of the substrate 410 before and after removing the component 420, determining the irradiation position of the laser light, and the like. The optical unit 150 has a function of shaping laser light into a predetermined spot diameter and a function of taking an image from the emission part of the laser light emission part 130 and guiding it to the camera 140.

The inhalation unit 230 inhales the part 420. The suction portion 230 is for sucking and removing the component 420 from the substrate after the solder is melted by the laser light emitted from the laser light emitting portion 130. In the first embodiment of the present technology, the laser light emitted from the laser light emitting unit 130 is applied to the component 420 via the suction unit 230. For this reason, the surface of the suction unit 230 on which the laser light is incident needs to be a member that transmits light. Further, in order to inhale the part 420, an opening larger than the part 420 is provided below the inhalation part 230. In order to suck the component 420 adhering to the substrate 410 with the melted solder into the suction part 230, it is necessary to generate buoyancy in the part 420 and pull it into the suction part 230. In order to generate this buoyancy, the inside of the suction portion 230 is depressurized during suction, and the air around the component 420 is caused to flow into the suction portion 230 so that the air flows around the upper surface of the component 420. It is necessary to generate an air flow. Details of the configuration and the like of the suction unit 230 will be described later.

The substrate holding unit 250 holds the substrate 410. The substrate holder 250 can be configured to move the substrate 410 in the X and Y directions. As a result, it is possible to perform alignment by moving the substrate 410 so that the optical axis of the laser light irradiated by the laser light emitting unit 130 and the component 420 are aligned. In this case, the control unit 340 described later controls the substrate holding unit 250 to perform this alignment. As a result, the part 420 is arranged at the spot of the laser light, and the whole part 420 is heated evenly. In addition, as a holding method of the substrate 410 in the substrate holding unit 250, for example, a suction method such as vacuum suction and electrostatic suction or a method of fixing with a mounting bracket can be used.

The suction part holding part 220 holds the suction part 230. The distance adjusting unit 210 holds the suction unit holding unit 220 and adjusts the height of the suction unit holding unit 220. Thereby, the distance adjustment part 210 can adjust the distance between the board | substrate 410 and the opening part of the suction | inhalation part 230 mentioned above.

The vacuum pump 330 is a pump that exhausts the air inside the suction unit 230 in order to depressurize the inside of the suction unit 230.

The exhaust tube 240 is a tube that connects the suction unit 230 and the vacuum pump 330 and guides the gas inside the suction unit 230 to the vacuum pump 330. A filter 310 described later is disposed in the middle of the exhaust tube 240. As the exhaust tube 240, for example, a tube made of hard resin can be used.

The filter 310 is a filter that captures the part 420 sucked by the suction unit 230. The removed part 420 is sucked into the suction part 230 together with the surrounding air and moves in the exhaust tube. This part 420 is captured by the filter 310 before reaching the vacuum pump 330. Thereby, damage to the vacuum pump 330 can be prevented.

The control unit 340 controls the substrate holding unit 250, the vacuum pump 330, and the laser light generation unit 110. The control unit 340 controls on / off of the vacuum pump 330 and the laser light generation unit 110.

The filter 310 is an example of a capturing unit described in the claims. The vacuum pump 330 is an example of an exhaust unit described in the claims.

[Configuration of suction section]
FIG. 2 is a diagram illustrating a configuration example of the suction unit 230 according to the first embodiment of the present technology. In the drawing, a represents a top view of the suction portion 230, and b in the drawing represents a cross-sectional view taken along the line AA ′ in FIG. Further, in FIG. 5b, a sectional view of the component 420, the substrate 410, and the substrate holding portion 250 in addition to the suction portion 230 is further described. Note that the component 420 is a bare chip component and is assumed to be bonded to a bonding pad (not shown) of the substrate 410 by solder 421. Further, the size of the upper surface of the chip portion of the component 420 is assumed to be 0.2 mm × 0.2 mm. Further, b in the figure represents a state in which the component 420 is removed from the substrate 410 by being irradiated with the laser light 501.

As shown in the figure, the suction part 230 includes a suction nozzle 231 and a transparent member 232. The suction nozzle 231 has a cylindrical shape with a mortar-shaped bottom, and has openings 233 and 235 at the top and bottom, respectively. The suction nozzle 231 has an opening 234 on the side surface of the cylindrical portion. The exhaust tube 240 is connected to a position where the opening 234 and the hole of the exhaust tube 240 coincide. The transparent member 232 is attached to the opening 233 and closes the opening 233 and transmits the laser light 501. As the transparent member 232, for example, a disk-shaped plate made of glass can be used.

The laser beam 501 that has passed through the transparent member 232 is irradiated to the component 420 through the opening 235. For this reason, the optical axis of the laser beam 501 and the opening 235 need to be arranged at substantially coaxial positions. Further, as described above, since the part 420 needs to pass through, the opening 235 needs to be larger than the part 420. When the component 420 has the above-described size, the opening 235 can have a diameter of 1 mm, for example. Further, the spot diameter of the laser beam 501 can be set to 0.4 mm, for example. Note that the size of the hole in the opening 234 and the exhaust tube 240 also needs to be larger than that of the component 420, and can be, for example, 10 mm in diameter.

A method of removing the part 420 using the suction part 230 having such a shape will be described. When the vacuum pump 330 is operated, the pressure inside the suction part 230 is reduced to a negative pressure by being depressurized through the exhaust tube 240. For this reason, air flows from the opening 235. At this time, when the two are brought close to each other so that the distance d between the opening 235 and the substrate 410 becomes a value close to the height of the component 420, the opening 235 is blocked by the component 420 and apparently opens. The portion 235 is narrowed. For this reason, the pressure difference inside and outside the opening 235 increases, and the flow rate of the air flowing in increases and the flow rate decreases. In FIG. 6B, this air flow is represented by a white arrow.

In this state, the control unit 340 causes the laser light generation unit 110 to generate laser light. Then, the component 420 is irradiated with the laser beam 501 emitted from the laser beam emitting unit 130, and the component 420 is heated. When the solder 421 is melted by this heating, the component 420 is attached to the substrate 410 by the melted solder. For this reason, buoyancy arises in the component 420 by the above-mentioned fast air flow. Due to this buoyancy, the component 420 is peeled from the substrate 410 and sucked from the opening 235. The sucked component 420 is discharged from the opening 234 together with the inflowing air.

After a predetermined time has elapsed, the control unit 340 stops the laser light generation unit 110 from generating the laser light and stops the irradiation of the laser light 501. With this procedure, the component 420 can be removed from the substrate 410. In addition, it is necessary to acquire in advance a value of the distance d between the opening 235 that enables the component 420 to be sucked and the substrate 410 and to control the distance adjusting unit 210 so as to be this distance. Similarly, the irradiation time of the laser beam that can dissolve the solder 421 that joins the component 420 needs to be acquired in advance. These vary depending on the size of the component 420, the number of soldered portions, and the like.

Specifically, when the power supplied to the laser light generation unit 110 is 3 W, laser light having a wavelength of 940 nm is generated and irradiated to the component 420, the solder 421 is melted after about 0.5 seconds and the component 420 is melted. Is sucked into the suction part 230.

Thus, the part 420 can be removed in a short time. In addition, since laser light irradiation can be completed in a short time, thermal damage to the substrate 410 is reduced. Furthermore, since the component 420 can be removed without contact, the component 420 having a complicated shape or a fine shape can be easily removed.

In the first embodiment of the present technology, as described above, the distance d is adjusted to set the pressure inside the suction unit 230 and the flow rate of the inflowing air. In order to prevent the occurrence of errors, the suction unit 230 is required to have high airtightness. That is, it is necessary to provide an O-ring or the like at the joint between the suction nozzle 231 and the exhaust tube 240 and the joint between the suction nozzle 231 and the transparent member 232 to prevent inflow of air from the outside.

Further, when the component 420 is heated by the laser beam, contaminants due to solder fume and heated flux residue are generated and adhere to the transparent member 232. For this reason, the transparent member 232 needs to be configured to be easy to clean. Specifically, it is necessary to make the configuration easy to remove from the suction nozzle 231. Further, the exhaust tube 240 needs to have a relatively large diameter, for example, a 10 mm diameter so as not to hinder the exhaust by the vacuum pump 330. Similarly, the filter 310 needs to select the filtration diameter so that the part 420 can be captured and the exhaust is not hindered. In the first embodiment of the present technology, as the filter 310, for example, a filter having a filtration diameter of 5 μm or more and a flow rate of 30 L / min or less can be used.

As described above, according to the first embodiment of the present technology, the time required for removing the component is obtained by heating the component with the laser beam and sucking and removing the component with the suction portion having an opening larger than the component. Can be shortened. Further, since the heating time is shortened, damage to the substrate can be reduced.

<2. Second Embodiment>
In the above-described embodiment, the irradiation of the laser beam is stopped based on the irradiation time acquired by the preliminary examination. On the other hand, in the second embodiment of the present technology, the suction of the component 420 is confirmed and the irradiation of the laser light is stopped.

[Configuration of parts removal equipment]
FIG. 3 is a diagram illustrating a configuration example of the component removing device according to the second embodiment of the present technology. The component removal apparatus shown in the figure is different from the component removal apparatus described in FIG. 1 in that a camera 160 and a control device 360 are provided instead of the camera 140 and the control device 340. Since the configuration other than this is the same as that of the component removing apparatus described in FIG.

Also in the component removing apparatus shown in FIG. 2, when removing the component 420, the laser pump is operated to exhaust and the laser beam is irradiated to melt the solder 421 and the laser beam is sucked after the component 420 is sucked. Stop irradiation. At that time, after confirming the suction of the component 420, the irradiation of the laser light is stopped. Confirmation of inhalation of the component 420 is performed as follows. The camera 160 converts the acquired image into an image signal and outputs it to the control unit 360. The control unit 360 analyzes the output image signal and detects that the component 420 has been removed from the substrate 410. Thereafter, the control unit 360 controls the laser beam generation unit 110 to stop the irradiation of the laser beam. Thereby, removal of components can be ensured. In addition, since unnecessary laser light irradiation can be prevented, damage to the substrate 410 after the component 420 is inhaled can be reduced.

On the other hand, in the component removing apparatus described with reference to FIG. 1, the irradiation of the laser beam is stopped without confirming the suction of the component 420, and in order to ensure the suction of the component 420, the laser obtained by prior examination is used. It is necessary to make the irradiation time longer than the light irradiation time. For this reason, the substrate 410 is irradiated with laser light for a relatively long time, and the substrate 410 is greatly damaged by heating.

As described above, according to the second embodiment of the present technology, since the suction of the component 420 is confirmed by the image acquired by the camera 160 and the irradiation of the laser beam is stopped, the removal of the component 420 is surely performed. In addition, damage to the substrate 410 can be reduced.

<3. Third Embodiment>
In the second embodiment described above, inhalation of the part 420 is detected by the camera 160. On the other hand, in the third embodiment of the present technology, the suction of the component 420 is detected based on the detection result of the pressure sensor 320 or the flow sensor 350.

[Configuration of parts removal equipment]
FIG. 4 is a diagram illustrating a configuration example of the component removing device according to the third embodiment of the present technology. The component removing apparatus shown in the figure is different from the component removing apparatus described in FIG. 1 in that a pressure sensor 320 is disposed in the exhaust tube 240 and a control unit 370 is provided instead of the control unit 340. Since the configuration other than this is the same as that of the component removing apparatus described in FIG.

FIG. 5 is a diagram illustrating another configuration example of the component removing device according to the third embodiment of the present technology. 1 is different from the component removal apparatus described in FIG. 1 in that a flow sensor 350 is disposed in the exhaust tube 240 and a control unit 370 is provided instead of the control unit 340. Since the configuration other than this is the same as that of the component removing apparatus described in FIG. Note that the pressure sensor 320 and the flow rate sensor 350 constitute a measurement unit that measures the state of the inflow of air into the suction unit 230 accompanying suction.

The pressure sensor 320 is a sensor that measures the differential pressure inside and outside the suction unit 230. The pressure sensor 320 measures the differential pressure between the outside and the inside of the suction unit 230 by measuring the differential pressure between the atmospheric pressure and the pressure of the air in the exhaust tube 240. As the pressure sensor 320, for example, a differential pressure gauge can be used.

The flow sensor 350 is a sensor that measures the flow rate of air inflow in the suction unit 230. In the first embodiment of the present technology, the flow sensor 350 measures the flow rate of the inflow of air in the suction unit 230 by measuring the flow rate of the exhaust gas flowing through the exhaust tube 240. In addition, the control unit 370 causes the distance adjustment unit 210 to control the distance d between the suction unit 230 and the substrate 410 based on the measurement result of the pressure sensor 320 or the flow rate sensor 350.

[Detection of inhalation of parts]
4 and 5, the laser light is irradiated while exhausting by operating the vacuum pump 330. After confirming the suction of the component 420, the laser light irradiation is stopped. Confirmation of inhalation of the component 420 can be performed as follows. When the part 420 is sucked up and passes through the opening 235 in a state where the above-described distance d is adjusted and the differential pressure between the outside and the inside of the suction part 230 and the flow rate of air in the suction are set to predetermined values, A change occurs in the air flow in the opening 235. With this change, the above-described differential pressure and air flow rate change. Therefore, this change can be detected by the pressure sensor 320 or the flow sensor 350, and the suction of the component 420 can be detected.

This will be explained with specific examples. A case is assumed in which inhalation is performed under the same inhalation conditions using the same component 420 as in the first embodiment of the present technology. That is, the distance adjustment unit 210 is controlled to adjust the distance d between the suction unit 230 and the substrate 410. The differential pressure and flow rate at this time are -85 KPa and 4 L / min, respectively. Next, when the laser beam is irradiated and the component 420 is heated, the solder is melted and the component 420 is sucked. At this time, the differential pressure was -87 KPa, and the flow rate was 3.8 L / min. That is, the suction of the component 420 changes the differential pressure and the flow rate by 2 KPa and 0.2 L / min, respectively. Therefore, it is possible to determine inhalation of the component 420 by capturing this change. The controller 340 monitors the measurement result of the pressure sensor 320 or the flow sensor 350 and stops the laser light irradiation at the timing when the change is captured.

By adopting this procedure, the component removing apparatus shown in FIGS. 4 and 5 can detect inhalation of the component 420 without analyzing the image of the camera 140. This is compared with the component removal apparatus in FIG. A filter is disposed in the optical unit 150 in order to prevent harmful laser light from entering the camera. Due to this filter, the image obtained by the camera 160 in FIG. 2 is unclear. Furthermore, since the size of the component 420 is small, it is difficult to confirm inhalation by image processing, and advanced image processing is required, and processing takes time. At the same time, it is necessary to use a camera with high resolution as the camera 160. On the other hand, in the component removing apparatus shown in FIGS. 4 and 5, since the camera 140 is used for observation of the surface state of the substrate 410, a normal monitoring camera can be used. Further, when it is not necessary to observe the surface state of the substrate 410, the camera 140 can be omitted. In addition, when irradiating with ultraviolet laser light, it is necessary to employ the method for confirming component removal according to the third embodiment of the present technology because confirmation of component removal cannot be performed with an ordinary camera.

In addition, since the component removal apparatus according to the third embodiment of the present technology includes the pressure sensor 320 or the flow rate sensor 350, the control unit 370 controls the distance adjustment unit 210 while confirming the differential pressure or the air flow rate. Thus, the distance d can be adjusted. For this reason, it is possible to set the suction conditions of the component 420 more precisely. In order to eliminate the influence of a change in pressure (so-called pressure loss) caused by the filter 310, it is desirable to dispose the pressure sensor between the suction unit 230 and the filter 310. On the other hand, the flow sensor 350 is preferably disposed between the filter 310 and the vacuum pump 330 to prevent malfunction due to the component 420 and contaminants.

[Part removal processing]
FIG. 6 is a diagram illustrating an example of a component removal process according to the third embodiment of the present technology. First, the control unit 370 operates the vacuum pump 330 (step S901). Thereby, inhalation in the inhalation unit 230 is started. Next, the control unit 370 performs alignment by controlling the substrate holding unit 250 (step S902). Next, the control unit 370 determines whether or not the pressure or flow rate is a predetermined value (step S903). Specifically, it is determined whether or not the measured value of the pressure sensor or the flow rate sensor is a predetermined value. As a result, when the predetermined pressure or flow rate is not reached (step S903: No), the control unit 370 adjusts the distance between the suction unit 230 and the substrate 410 (step S904).

On the other hand, when the predetermined pressure and flow rate are reached (step S903: Yes), the control unit 370 controls the laser light generation unit 110 to start laser light irradiation (step S905). Next, the control unit 370 waits until the component 420 is sucked into the suction unit 230 (step S906). When the component 420 has been inhaled (step S906: Yes), the control unit 370 controls the laser light generation unit 110 to stop the laser light irradiation (step S907). Thereafter, when there are more components to be removed (step S903: Yes), the control unit 370 executes the processing from step S902 again. On the other hand, when the removal process has been completed for all the parts that need to be removed (step S908: No), the control unit 370 stops the vacuum pump 330 (step S909) and ends the part removal process.

As described above, according to the third embodiment of the present technology, since the removal of the component is confirmed without performing the image analysis by the camera, the configuration of the component removing apparatus can be simplified. In addition, the pressure sensor 320 or the flow rate sensor 350 makes it possible to set a precise suction condition.

[Modification]
In the above-described embodiment, the air inflow state is detected using either the pressure sensor 320 or the flow sensor 350. On the other hand, in this modification, both the pressure sensor 320 and the flow sensor 350 are used.

[Configuration of parts removal equipment]
FIG. 7 is a diagram illustrating a configuration example of the component removing device according to a modification of the third embodiment of the present technology. The part removing apparatus shown in the figure is different from the parts removing apparatus shown in FIGS. 4 and 5 in that both the pressure sensor 320 and the flow rate sensor 350 are provided. That is, the measurement unit in the modification of the third embodiment of the present technology includes both the pressure sensor 320 and the flow sensor 350. Since the configuration other than this is the same as that of the component removing apparatus described with reference to FIGS.

Since the component removing apparatus shown in the figure includes both the pressure sensor 320 and the flow rate sensor 350, it is possible to set a more precise suction condition as compared with the component removing apparatuses shown in FIGS.

<4. Fourth Embodiment>
In the above embodiment, the component 420 is irradiated with the laser light. On the other hand, in the fourth embodiment of the present technology, laser light is irradiated on the surface of the substrate 410 opposite to the surface where the component 420 is bonded.

[Configuration of parts removal equipment]
FIG. 8 is a diagram illustrating a configuration example of the component removing device according to the fourth embodiment of the present technology. The component removing apparatus shown in the figure includes a substrate holding unit 260 and a suction unit 270 instead of the substrate holding unit 250 and the suction unit 230. The substrate holding unit 260 is disposed immediately below the laser beam emitting unit 130, and the substrate 410 is held by the substrate holding unit 260 so that the component 420 faces downward. Further, the suction part 270 is held by the suction part holding part 220 so that the opening part faces upward, and is arranged below the substrate holding part 260. The rest of the configuration of the component removal apparatus is the same as that of the component removal apparatus described with reference to FIG.

The substrate holding part 260 has an opening 261. The component 420 is sucked into the suction portion 270 through the opening 261.

The suction part 270 has an opening similar to the opening 235 of the suction part 230 described in FIG. 2, and the component 420 is sucked through the opening. However, since there is no need to allow laser light to pass therethrough, the suction part 270 need not include the transparent member 232.

Next, the procedure for removing the component 420 will be described. Position alignment is performed in the substrate holding portion 260 so that the openings of the component 420 and the suction portion 270 are substantially coaxial. Next, the control unit 340 controls the distance adjustment unit 210 to adjust the distance between the opening of the suction unit 270 and the substrate 410. Thereafter, the substrate 410 is irradiated with laser light. As a result, the substrate 410 is heated, the solder is melted by heat conduction, and the component 420 is sucked.

At this time, since heat is transferred from the substrate 410 to the solder, melting of the solder starts at the interface between the bonding pad of the substrate 410 and the solder. For this reason, when the solder and the pad are separated by inhalation of the component 420, the solder and the pad are separated at the interface, and most of the solder adheres to the component 420 side, and a small amount of solder remains on the pad side. It will be. When a new part 420 is soldered for repair, it causes a soldering failure such as a solder bridge, and therefore a process of removing the solder remaining on the pad side is usually required. However, in the fourth embodiment of the present technology, the amount of solder remaining on the pad side is reduced, so that this solder removal step can be omitted.

On the other hand, in the above-described embodiment in which the component 420 is irradiated with the laser light, the component 420 is heated first, so that the melting of the solder starts at the interface between the package portion of the component 420 and the solder. For this reason, a lot of solder remains on the pad side of the substrate 410 after the component 420 is sucked, and the process of removing the solder cannot be omitted.

Thus, according to the fourth embodiment of the present technology, since most of the melted solder is sucked together with the component 420, the solder remaining on the pads of the substrate 410 can be reduced, and the solder removal step is omitted. can do. Thereby, the repair which replaces | exchanges the components 420 can be simplified. *

<5. Fifth embodiment>
In the above-described fourth embodiment, a method of irradiating the surface of the substrate 410 opposite to the surface where the component 420 is bonded is employed. On the other hand, in the fifth embodiment of the present technology, a configuration of the substrate 410 suitable for the method is proposed.

[Substrate structure]
9 and 10 are diagrams illustrating a configuration example of the substrate 410 according to the fifth embodiment of the present technology. The substrate 410 shown in the figure includes a bonding pad 412 and a base material 411. In the figure, the laser beam is irradiated onto the substrate 410 from above the paper surface. Further, in the same figure, description of a substrate protective layer, a wiring pattern and the like disposed on the substrate surface is omitted.

The bonding pad 412 is a member to which the solder 421 is bonded. The bonding pad 412 can be a conductive thin film, for example, a thin film made of Cu. The base material 411 is a member on which the bonding pad 412 is disposed. For this base material 411, for example, a base material made of glass-containing epoxy resin, glass, ceramic and Si can be used. However, in the fifth embodiment of the present technology, since the laser beam is irradiated from the surface opposite to the surface where the component 420 of the substrate 410 is bonded, it is preferable to use a member having a high transmittance with respect to the laser beam. is there. For example, the use of glass, ceramic and Si is preferred. Thereby, since the absorption of the laser beam by the base material 411 is reduced, the loss of the irradiated laser beam can be reduced and the solder 421 can be efficiently heated.

However, when the bonding pad 412 is made of a member having a low absorption rate of laser light such as Cu, the heating efficiency by the laser light is lowered. Therefore, a heat generating member 413 which is a member having a high laser light absorption rate is disposed in the vicinity of the bonding pad 412. Here, the heat generating member is a member that easily absorbs laser light and generates heat. FIG. 9A illustrates an example in which the heat generating member 413 is disposed between the base material 411 and the bonding pad 412. Further, b in FIG. 9 represents an example in which the heat generating member 414 is disposed in the vicinity of the bonding pad 412 inside the base material 411. As these

heat generating members

413 and 414, for example, any of Si, Ti, Cr, Ni, Pt, Sn, W, Fe, Al, or an alloy thereof can be used. These

heat generating members

413 and 414 generate heat by laser light irradiation, and this heat is transmitted to the bonding pad 412 and heated, so that the solder 421 can be efficiently dissolved. In FIG. 9A, when a member that is compatible with the solder 421, for example, Sn is used as the heat generating member 413, the heat generating member 413 can be used in combination with the bonding pad 412.

On the other hand, when a member having a high laser light transmittance is used as the base material 411, the laser light passes through the base material 411 and reaches the component 420. When the laser light absorption rate of the component 420 is high, the component 420 becomes hotter than the bonding pad 412, and the solder 421 may start to melt from the package interface of the component 420. Therefore, a reflecting member 415 that reflects the laser light is disposed between the component 420 and the laser light emitting portion. Here, the reflecting member is a member having a high reflectance with respect to laser light. In FIG. 10, a indicates that the reflecting member 415 is disposed on the surface opposite to the surface to which the component 420 of the base material 411 is bonded. In addition, b in FIG. 10 represents an example in which the reflecting member 415 is disposed in the base material 411 and in the vicinity of the component 420. As the reflecting member 415, for example, any of Al, Cu, Au, Ag, or an alloy thereof can be used. The laser beam traveling toward the component 420 is reflected by the reflecting member 415. For this reason, the heat generation of the component 420 due to the irradiation of the laser light is reduced, the melting of the solder 421 can be started from the interface between the bonding pad 412 and the solder 421, and the solder remaining on the substrate 410 can be reduced. .

In addition, it is necessary to arrange the reflecting member 415 while avoiding the bonding pad 412 and the

heat generating members

413 and 414 so as not to prevent the heating of the bonding pad 412 by laser light. Further, Al is a member that can be used for both the heat generating member and the reflecting member as described above. When this Al is used as a heat generating member, a member having a higher reflectance with respect to laser light than Al, for example, Cu, Au, or Ag can be used as the reflecting member.

It is also possible to use both these heat generating members and reflecting members. C in FIG. 10 represents an example in which the heat generating member 414 and the reflecting member 415 are arranged inside the base material 411. In this example, the reflecting member 415 is disposed at a position closer to the component 420. The heat generating member 414 absorbs the laser light and generates heat, and this heat is transmitted to the bonding pad 412. At the same time, laser light that has not been absorbed by the heat generating member 414 and has passed through the heat generating member 414 is reflected by the reflecting member 415 and cannot reach the component 420. As a result, the solder 421 can be dissolved from the interface between the bonding pad 412 and the solder 421, and the amount of solder remaining on the substrate 410 can be reduced.

As described above, according to the fifth embodiment of the present technology, by using the substrate 410 on which either one or both of the heat generating member and the reflecting member is used, the laser beam is irradiated on the substrate 410 side. In this case, the efficiency of heating by laser light can be improved. Further, according to the fifth embodiment, it is possible to reduce the solder remaining on the substrate 410.

<6. Sixth Embodiment>
In the above-described embodiment, a component removal apparatus has been proposed. On the other hand, in the sixth embodiment of the present technology, a component repair device that employs the component removal device is proposed.

[Configuration of parts removal equipment]
FIG. 11 is a diagram illustrating a configuration example of the component repair device according to the sixth embodiment of the present technology. The component repair device shown in FIG. 1 includes a component removal device 610, a flux application device 620, a substrate transport device 630, a component mounting device 640, a loader / unloader 650, and a reflow device 660.

As the component removal device 610, the component removal device described in the first to fourth embodiments can be used. In addition, in the component removal apparatus 610 of the same figure, description of the laser beam emission part 130 grade | etc., Is abbreviate | omitted.

The flux applying device 620 is a device that applies flux to the substrate 410 from which the component 420 has been removed by the component removing device 610. The component mounting device 640 is a device that mounts a new component 420 on the substrate 410 coated with flux. The loader / unloader 650 is a device that serves as both a loader for loading the substrate 410 before repair and an unloader for collecting the substrate 410 after repair. The substrate transfer device 630 is a device that transfers the substrate 410 to these devices. The reflow device 660 is a device that melts the solder and then solidifies it to join the component 420 to the substrate 410, that is, a device that performs soldering. Note that the component repair apparatus in FIG. 10 can perform soldering to the substrate 410 after the components are mounted in the component removal apparatus 610. That is, soldering can be performed in the component removing device 610 by irradiating the component 420 with laser light and melting the solder without operating the vacuum pump 330. In that case, the reflow device 660 can be omitted.

[Configuration of parts removal equipment]
As the component removing device 610 according to the sixth embodiment of the present technology, the component removing device described in FIGS. 1, 3 to 5, 7, and 8 can be used. However, it is necessary that the substrate 410 can be exchanged with the substrate transfer device 630. Since the configuration of the component removal apparatus other than this is the same as that of the component removal apparatus described in the above-described drawings, description thereof is omitted. It is also necessary to change the part removal procedure. Specifically, in the flow described in FIG. 6, it is necessary to add a procedure for carrying in the substrate 410 after step S901 and add a procedure for carrying out the substrate 410 before step S909. Since other procedures are the same as those described in FIG.

Thus, according to the sixth embodiment of the present technology, it is possible to remove components in the component repair apparatus at high speed.

<7. Seventh Embodiment>
In the above-described embodiment, a component removal apparatus has been proposed. On the other hand, in the seventh embodiment of the present technology, a component mounting board manufactured by repairing the component 420 by the component removing apparatus is proposed.

[Configuration of component mounting board]
FIG. 12 is a diagram illustrating a configuration example of a component mounting board according to the seventh embodiment of the present technology. In the figure, “a” represents the configuration of the sensor array device 450 as an example of a component mounting board. The sensor array device 450 of FIG. 14A is configured by arranging a large number of light receiving sensors 470 on a substrate 460 in a two-dimensional lattice shape. The sensor array device 450 is an imaging device and is required to be defect-free. That is, all the light receiving sensors 470 arranged need to operate normally. However, due to defects in the manufacturing process, for example, the occurrence of soldering defects or defects in the light receiving sensor 470 itself, it is difficult to eliminate defects, and repair of the light receiving sensor 470 is essential.

On the other hand, the light receiving sensor 470 has a size of about 0.2 mm × 0.2 mm, and since the interval between the adjacent light receiving sensors 470 is narrow, it is difficult to remove only the light receiving sensor 470 at the defective portion for repair. It is. Therefore, the component removal apparatus of the present embodiment is applied. B in the same figure is a figure explaining the removal of the light reception sensor 470 of a malfunction location. There is a defect in the light receiving sensor 470 described in the center, and the laser light 502 is irradiated to remove the light receiving sensor 470. At this time, in this embodiment, since the laser beam 502 is not irradiated to the other light receiving sensors 470, thermal damage to other normal light receiving sensors 470 can be reduced. In addition, since the light receiving sensor 407 in which the solder is dissolved by the irradiation with the laser beam 502 is quickly sucked and removed, the time required for repair can be shortened. As a result, a practical turnaround time can be obtained. These enable mass production of sensor array devices that are defect-free.

Note that the sensor mounted on the sensor array device 450 is not limited to the light receiving sensor, and various sensors can be used. Other examples of the component mounting substrate include a component mounting substrate on which a component such as a chip component, a semiconductor chip (bare chip component), a MEMS, or a wafer level package is mounted.

As described above, according to the embodiment of the present technology, a part is heated by a laser beam and sucked and removed by a suction part having an opening larger than the part, thereby shortening the time required for part removal. can do.

The above-described embodiment shows an example for embodying the present technology, and the matters in the embodiment and the invention-specific matters in the claims have a corresponding relationship. Similarly, the invention specific matter in the claims and the matter in the embodiment of the present technology having the same name as this have a corresponding relationship. However, the present technology is not limited to the embodiment, and can be embodied by making various modifications to the embodiment without departing from the gist thereof.

Further, the processing procedure described in the above embodiment may be regarded as a method having a series of these procedures, and a program for causing a computer to execute these series of procedures or a recording medium storing the program. You may catch it. As this recording medium, for example, a CD (Compact Disc), an MD (MiniDisc), a DVD (Digital Versatile Disc), a memory card, a Blu-ray disc (Blu-ray (registered trademark) Disc), or the like can be used.

It should be noted that the effects described in this specification are merely examples, and are not limited, and other effects may be obtained.

In addition, this technique can also take the following structures.
(1) a laser beam irradiation unit for irradiating a laser beam for dissolving a thermoplastic bonding agent for bonding a component to a substrate;
A component removing apparatus comprising: a suction portion that removes the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by the laser light irradiation.
(2) The component removing device according to (1), further including a measuring unit that measures a state of inflow of air into the suction unit accompanying the suction.
(3) The measurement unit may measure the flow rate of the air inflow by measuring a pressure sensor that measures the state of the air inflow by measuring a pressure difference between the outside and the inside of the suction unit. The component removal apparatus according to (2), further including at least one of flow rate sensors for measuring the state of.
(4) The component removal apparatus according to (2) to (3), further including a control unit that controls the inflow of air based on the measurement result of the measurement unit.
(5) further comprising a distance adjusting unit for adjusting a distance between the substrate and the opening;
The said control part is a component removal apparatus as described in said (4) which makes the said distance adjustment part adjust the said distance and controls the inflow of the said air.
(6) The control unit controls the inflow of air and causes the laser beam irradiation unit to start irradiating the laser beam when the inflow of air reaches a predetermined state, and starts irradiating the laser beam. The component removal apparatus according to (4) or (5), wherein when the state of the inflow of air changes later, the laser light irradiation unit stops the irradiation of the laser light.
(7) The component removing device according to (1) to (6), further including a capturing unit that captures the inhaled component.
(8) The component removing apparatus according to any one of (1) to (7), further including an exhaust unit that performs the suction by exhausting air in the suction unit.
(9) The suction portion includes a transmission portion that transmits the laser light on a surface facing the opening,
The said laser beam irradiation part is a component removal apparatus as described in said (1) to (8) which irradiates the said laser beam to the said component through the said permeation | transmission part and the said opening part.
(10) The component removing apparatus according to (1) to (8), wherein the laser beam irradiation unit irradiates the laser beam on a surface of the substrate opposite to a surface to which the component is bonded.
(11) a bonding pad to which the component is bonded by a thermoplastic bonding agent;
When the component is removed by being sucked through an opening larger than the component after the component is irradiated with a laser beam that dissolves the thermoplastic bonding agent and the thermoplastic bonding agent is dissolved. A heating member that is disposed near the pad and absorbs the laser light to generate heat;
A substrate comprising the bonding pad and a base material on which the heat generating member is disposed.
(12) The substrate according to (11), wherein the heat generating member is any one of Si, Ti, Cr, Ni, Pt, Sn, W, Fe, Al, or an alloy thereof.
(13) a bonding pad to which the component is bonded by a thermoplastic bonding agent;
When the component is removed by being sucked through an opening larger than the component after the component is irradiated with a laser beam that dissolves the thermoplastic bonding agent and the thermoplastic bonding agent is dissolved. A reflective member that reflects light;
A substrate comprising the bonding pad and a base material on which the reflecting member is disposed.
(14) The substrate according to (13), wherein the reflecting member is any one of Al, Cu, Au, Ag, or an alloy thereof.
(15) a laser beam irradiation procedure for irradiating a laser beam for dissolving a thermoplastic bonding agent for bonding the component to the substrate;
A component removing method comprising: a suction procedure for removing the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by the laser light irradiation.
(16) a laser beam irradiation unit that irradiates a laser beam that dissolves a thermoplastic bonding agent for bonding the component to the substrate;
A component removing device comprising: a suction portion that removes the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by irradiation of the laser beam;
A substrate transfer device for transferring the substrate;
A flux application device for applying flux to the substrate from which the component has been removed, a component mounting device for mounting a new component on the substrate from which the component has been removed, and a solidification after dissolving the thermoplastic bonding agent A component repair device comprising: at least one of reflow devices for bonding a component to the substrate.
(17) a laser beam irradiation step of irradiating a laser beam that dissolves a thermoplastic bonding agent for bonding the component to the substrate;
The substrate used in a component removal method comprising: a suction step of removing the component from the substrate by suction through an opening larger than the component after the thermoplastic bonding agent has been dissolved by the laser light irradiation A component mounting board comprising:
(18) The component mounting board according to (17), wherein the component is a chip component, a semiconductor chip, a MEMS, or a wafer level package.
(19) The component is a sensor,
The component mounting board according to (17), wherein the component mounting board is a sensor array device.
(20) The component mounting board according to (19), wherein the sensor is a light receiving sensor.

DESCRIPTION OF SYMBOLS 110 Laser light generation part 120 Optical waveguide 130 Laser light emission part 140,160 Camera 150 Optical unit 210 Distance adjustment part 220 Suction part holding | maintenance part 230,270 Suction part 231 Suction nozzle 232 Transparent member 233,234,235,261 Opening part 240

Exhaust tube

250, 260 Substrate holding part 310 Filter 320 Pressure sensor 330

Vacuum pump

340, 360, 370 Control part 350

Flow sensor

410, 460 Substrate 411 Base material 412

Bonding pad

413, 414 Heating member 415 Reflective member 420 Parts 421 Solder 450 Sensor Array device 470

Light receiving sensor

501, 502 Laser beam 610 Component removal device 620 Flux coating device 630 Substrate transport device 640 Component mounting device 650 Loader / Unloader 660 Reflowー Device

Claims

A laser beam irradiation unit that irradiates a laser beam that dissolves a thermoplastic bonding agent that bonds the component to the substrate;
A component removing apparatus comprising: a suction portion that removes the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by the laser light irradiation.
2. The component removing apparatus according to claim 1, further comprising a measuring unit that measures a state of inflow of air into the suction unit accompanying the suction.
The measuring unit measures a state of the air inflow by measuring a flow rate of the air inflow or a pressure sensor that measures the air inflow state by measuring a differential pressure outside and inside the suction unit. The component removal apparatus according to claim 2, further comprising at least one of flow rate sensors to be measured.
The component removing apparatus according to claim 2, further comprising a control unit that controls the inflow of the air based on the measurement result of the measurement unit.
Further comprising a distance adjuster for adjusting the distance between the substrate and the opening;
The component removing apparatus according to claim 4, wherein the control unit controls the inflow of the air by causing the distance adjusting unit to adjust the distance.
The control unit controls the inflow of the air to cause the laser beam irradiation unit to start irradiating the laser beam when the inflow of the air reaches a predetermined state, and after starting the irradiation of the laser beam, the air The component removal apparatus according to claim 4, wherein when the state of the inflow of the laser beam changes, the laser beam irradiation unit stops the laser beam irradiation.
The component removing apparatus according to claim 1, further comprising a capturing unit that captures the inhaled component.
The component removing apparatus according to claim 1, further comprising an exhaust unit that performs the suction by exhausting air in the suction unit.
The suction portion includes a transmission portion that transmits the laser light on a surface facing the opening,
The component removing apparatus according to claim 1, wherein the laser beam irradiation unit irradiates the component with the laser beam through the transmission unit and the opening.
2. The component removing apparatus according to claim 1, wherein the laser beam irradiation unit irradiates a surface of the substrate opposite to a surface where the components are bonded.
A bonding pad to which the parts are bonded by a thermoplastic bonding agent;
In the vicinity of the bonding pad when the component is removed by being sucked through an opening larger than the component after being irradiated with a laser beam that dissolves the thermoplastic bonding agent and the thermoplastic bonding agent is dissolved. A heating member that is arranged to absorb the laser light and generate heat;
A substrate comprising the bonding pad and a base material on which the heat generating member is disposed.
The substrate according to claim 11, wherein the endothermic member is any one of Si, Ti, Cr, Ni, Pt, Sn, W, Fe, Al, or an alloy thereof.
A bonding pad to which the parts are bonded by a thermoplastic bonding agent;
The laser beam is reflected when the component is removed by being sucked through an opening larger than the component after being irradiated with a laser beam that dissolves the thermoplastic adhesive and the thermoplastic adhesive is dissolved. A reflective member to be
A substrate comprising the bonding pad and a base material on which the reflecting member is disposed.
14. The substrate according to claim 13, wherein the reflecting member is any one of Al, Cu, Au, Ag, or an alloy thereof.
A laser beam irradiation procedure for irradiating a laser beam that dissolves a thermoplastic bonding agent for bonding the component to the substrate;
A component removing method comprising: a suction procedure for removing the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by the laser light irradiation.
A laser beam irradiation unit that irradiates a laser beam that dissolves a thermoplastic bonding agent that bonds the component to the substrate;
A component removing device comprising: a suction portion that removes the component from the substrate by sucking through the opening larger than the component after the thermoplastic bonding agent is dissolved by irradiation of the laser beam;
A substrate transfer device for transferring the substrate;
A flux application device for applying flux to the substrate from which the component has been removed, a component mounting device for mounting a new component on the substrate from which the component has been removed, and a solidification after dissolving the thermoplastic bonding agent A component repair device comprising: at least one of reflow devices for bonding a component to the substrate.
A laser beam irradiation step of irradiating a laser beam that dissolves a thermoplastic bonding agent for bonding the component to the substrate;
The substrate used in a component removal method comprising: a suction step of removing the component from the substrate by suction through an opening larger than the component after the thermoplastic bonding agent has been dissolved by the laser light irradiation A component mounting board comprising:
The component mounting board according to claim 17, wherein the component is a chip component, a semiconductor chip, a MEMS, or a wafer level package.
The component is a sensor;
The component mounting board according to claim 17, wherein the component mounting board is a sensor array device.
20. The component mounting board according to claim 19, wherein the sensor is a light receiving sensor.