TWI678251B - Apparatus and method for laser processing - Google Patents

Abstract

The invention discloses a laser processing device and a processing method. Provided is a laser processing device, including: a head portion that irradiates an inspection light to an object; and a control unit that matches the input surface information of the welding object region and the surface information obtained by the irradiation inspection light, wherein According to the determination of more than one position, welding is performed at a first position that is a preset position or a second position that is compensated for distance from a preset position.

Description

Laser processing device and processing method

Embodiments of the present invention relate to a laser processing apparatus and processing method.

Generally, laser processing methods and apparatuses perform processing for drilling, marking, soldering, and the like using lasers with various electronic components as targets. Among them, soldering performed by a laser processing method and device as a step of electrically connecting electronic components by using a conductive substance (for example, a solder ball) can be applied to the manufacture of various electronic products.

[Xizhi technical literature]

[Patent Literature]

(Patent Document 1) Korean Granted Patent Gazette No. 10-0332378 (2002.03.30)

Embodiments of the present invention relate to a laser processing apparatus, and the object thereof is to provide a laser processing apparatus and method that performs welding using a laser and includes a visual inspection module or step for determining a welding position and a laser welding module. Or steps, which are fast and efficient.

The present invention provides a laser processing device, which includes a head portion that irradiates inspection light to an object, and a control unit that matches input surface information of a welding object region and surface information obtained by irradiating the inspection light. For the matching of surface information, welding is performed at a first position as a preset position or a second position after distance compensation is obtained from the preset position according to more than one position determination factor.

Preferably, the position determining factors may include the distance between the terminals to be soldered, the size difference of the terminals to be soldered, the angle formed between the terminals to be soldered, and the size of the solder balls to be soldered.

Preferably, the separation distance between the terminals may be a distance separated in a horizontal direction or a vertical direction, and a position determination factor capable of obtaining distance compensation in the separated direction.

Preferably, the difference in the size of the terminal may be a difference in a cross-sectional direction of the terminal to be soldered, and a position determination factor capable of obtaining distance compensation in the cross-sectional direction.

Preferably, the angle formed by the terminals may be the angle formed between the terminals to be soldered, and the smaller the angle, the smaller the degree of distance compensation obtained from the first position; the larger the angle, the distance obtained from the first position The greater the degree of compensation.

Preferably, the larger the size of the solder ball, the smaller the degree of distance compensation obtained from the first position; the smaller the size of the solder ball, the greater the degree of distance compensation obtained from the first position.

Preferably, in the case where the position determination factor is detected, the second position may be determined by reflecting one or more factors of the position determination factor.

Preferably, the head can perform pre-heating of the object area to be welded by laser before performing the welding.

Preferably, the region to which the inspection light reaches may include the welding target body region.

Preferably, the object body is rotated by the rotation of a jig holding the object body, so that welding can be performed on two or more faces of the object body.

Preferably, the jig for fixing the object can be rotated by multiple axes, and the position of the welding object can be changed to the head side.

The present invention provides a laser processing method including the steps of: irradiating an inspection light from a head to an object; matching the surface information of the object obtained by irradiating the inspection light with the input surface information of the object; As a result, is the difference in the position determination factor detected, and the welding position is determined as the first position or the second position, wherein the position determination factor includes the distance between the terminals to be welded, the size of the terminals to be welded, and the terminals to be welded The angle formed between them and the size of the solder ball to be welded, and the second position is determined by one or more conditions detected in the position determination factor, and the second position is obtained from the difference of the position determination factor The first position is a welding position determined by distance compensation.

Preferably, the laser processing method may further include the steps of: performing a first inspection (Pre-Inspection) of sensing the alignment state of the object by the inspection unit; and detecting whether or not welding to the welding portion of the object occurs. More than one of the post-inspection of internal cracks and pores.

Preferably, the second inspection (Post-inspection) and the execution of the welding can be performed simultaneously.

Preferably, the laser processing method may further include the step of: after the second inspection (Post-inspection), classifying the object according to a predetermined quality standard (Sorting).

The present invention provides a laser processing device, including: a jig, an object to be loaded; a first inspection unit that senses (Detect) and first inspects (Pre-Inspection) an alignment state of the object loaded in the jig; and a moving unit For loading and unloading the object into and from the jig, and selectively performing a second inspection (Post-Inspection) on the object; and a processing section including a head and a control section, wherein the head is The control unit controls and irradiates the target with a laser, and the control unit matches the input surface information of the welding target area with the surface information obtained by the irradiation inspection light, and, by In the matching of the surface information, welding is performed at a first position that is a preset position or a second position that is distance-compensated from the preset position according to more than one position determination factor.

Preferably, the second inspection (Post-Inspection) can sense whether cracks and pores inside the welded portion occur.

Preferably, the laser processing device may further include: a classification device that sorts the object according to a predetermined quality standard after the second inspection (Post-Inspection).

Preferably, the laser processing device may further include a cleaning device for removing dust and foreign matter after the second inspection step, wherein the cleaning device includes a blower that provides dry air ( One or more of a Dry Air Blowing device, a CO ₂ Snow Cleaning device, and an inert gas blowing device.

Preferably, the laser processing device may further include: a pre-welding part, which performs pre-soldering before performing post-soldering on the object.

Embodiments of the present invention include a visual inspection module or step and a laser welding module or step, thereby enabling a fast and efficient laser processing device and method.

1‧‧‧ cover

2‧‧‧solder ball entrance

3‧‧‧Storage Chamber

4.11‧‧‧Nitrogen inlet

5‧‧‧ solder ball outlet

6‧‧‧rotation axis

7‧‧‧ adapter

8‧‧‧ missed

9‧‧‧Transport port

10‧‧‧ receiving port

12‧‧‧Solder Ball Exit Channel

13‧‧‧ clear glass

14‧‧‧laser transmission channel

15‧‧‧Locking screw

16‧‧‧ nozzle

17‧‧‧ Upper base

18‧‧‧ lower base

20‧‧‧ Camera Module

21‧‧‧ lens module

22‧‧‧Image Sensor Module

30‧‧‧ Fixture

50‧‧‧terminal

100‧‧‧laser processing device

110‧‧‧Head

CD‧‧‧ Cool

H1, H2‧‧‧‧ Water level

L‧‧‧ Examination light

P1‧‧‧Check the light irradiation area

P2‧‧‧welding target area

PH1‧‧‧Pre-heating

PH2‧‧‧ after heating

S‧‧‧Solder Ball

SP1‧‧‧First position

SP2‧‧‧Second Position

FIG. 1 is a diagram illustrating a camera module according to an embodiment of the present invention.

2 and 3 are diagrams showing a laser processing method according to an embodiment of the present invention.

FIG. 4 is a diagram showing a camera module as a welding target body according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a heating step according to an embodiment of the present invention.

FIG. 6 is a diagram illustrating a state in which a solder ball is moved by a nozzle according to an embodiment of the present invention.

FIG. 7 is a diagram showing a cone angle and a wavelength of a laser according to an embodiment of the present invention.

FIG. 8 is a diagram showing a laser energy output according to an embodiment of the present invention.

FIG. 9 is a diagram showing a voice coil motor (VCM: Voice Coil Motor) soldering device used in a camera manufacturing step according to an embodiment of the present invention.

FIG. 10 is a diagram showing the use of welding in connection of terminals according to an embodiment of the present invention.

FIG. 11 is a diagram showing a welding joint by an embodiment of the present invention.

Fig. 12 is a diagram showing a laser processing apparatus including a nozzle according to an embodiment of the present invention.

Fig. 13 is an enlarged view showing a cross section of a nozzle according to an embodiment of the present invention.

14 and 15 are diagrams showing a welding method according to an embodiment of the present invention.

Fig. 16 is a diagram showing a jig according to an embodiment of the present invention.

Fig. 17 is a diagram showing the determination of a welding position according to an embodiment of the present invention.

FIG. 18 is a diagram showing a welding device according to an embodiment of the present invention, which determines a welding position based on a distance between terminals.

FIG. 19 is a diagram showing a welding device according to an embodiment of the present invention, which determines a welding position according to a size of a terminal.

FIG. 20 is a diagram illustrating a welding device that determines a welding position according to an angle of a joint surface according to an embodiment of the present invention.

FIG. 21 is a diagram illustrating a welding device that determines a welding position according to a size of a solder ball according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, these are merely examples, and the present invention is not limited thereto.

In the course of describing the present invention, if it is determined that the specific description of the conventional technology related to the present invention will cause unnecessary confusion to the gist of the present invention, the detailed description thereof will be omitted. In addition, the terms hereinafter are terms defined in consideration of their functions in the present invention, and may be different according to the user, the intention or habits of the user, and the like. Therefore, these terms should be defined according to the contents throughout the specification.

The technical idea of the present invention is determined by the scope of the patent application. The following embodiments are merely a means for effectively explaining the technical idea of the present invention to those who have ordinary knowledge in the technical field to which the present invention belongs.

With the laser processing apparatus and method according to the embodiments of the present invention, marking, drilling, welding, soldering, and the like can be performed on a laser processing object. Hereinafter, the laser processing apparatus and method of this invention are demonstrated as an example which performs welding. That is, the laser processing apparatus may be used as a welding apparatus, and only steps for welding may be performed. Hereinafter, the laser processing apparatus may be described as a welding apparatus in the above-mentioned cases.

Of course, the laser processing object can be applied to the manufacture of various electronic components including various electronic components of the camera module 20. Hereinafter, the object to be welded will be described using a camera module (20 in FIG. 1) as an example.

The camera module 20 described below can of course be used in various portable devices such as smart phones and tablets, and can be installed and used in: Home appliances including smart TVs, home appliances; vehicles; or security cameras (CCTV) ), Various medical equipment, etc. require optical requirements Vegetarian various devices. For example, when the camera module 20 is used in a car, it can be applied to various electronic components, and when it is used in a home appliance, it can be applied to a turning case, a flat screen monitor, and a printed circuit board (PCB). ), Photosensors, etc. In addition, the portable device can be applied to a charge coupled device (CCD: Charged Coupled Device) camera module 20, a USB connection terminal, a battery terminal, and the like.

In addition, in the welding process described below, the movement of the object toward or from the jig may be achieved by a moving part (not shown). The moving part can hold the object by pick and place. Alternatively, the object may be adhered by magnetism, or the object may be adsorbed by generating suction. It can be formed in the form of a robot arm that achieves positional movement by one or more of these methods of holding, adhering, and adsorbing. Furthermore, the laser processing device included in the laser processing device according to the embodiment of the present invention can be applied not only to a variety of steps such as welding, soldering, bonding, etc. In addition, the material for performing each step can also be applied Polymer, metal, dielectric, semiconductor and many other materials.

First, FIG. 1 is a diagram illustrating a configuration of a target body. The camera module 20 may include a lens module (Lens Actuator) 21 and an image sensor module 22.

The lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover (Lens Cover), a voice coil motor (VCM: Voice Coil Motor) driving unit, a holder (Holder), and an infrared filter (IR Filter) )Wait. In addition, the image sensor module 22 may include a semiconductor sensor chip, an anisotropic conductive film (ACF), a flexible printed circuit board (FPCB), and the like.

Specifically, the camera module 20 or the compact camera module 20 may include a lens module 21 (Module Lens) and an autofocus actuation. (AF Actuator), anti-shake device (Optical Image Stabilizer), image sensor (Image Sensor), AF driver (AF Driver), PCB, FPCB, socket (Socket) and so on. The lens module 21 may include a plurality of lenses, such as imaging lenses (Imaging Lens) for imaging, and may include a support for supporting the plurality of lenses, and an infrared filter (IR Filter) may be included in a plurality of On the lens side, the IR filter can be supported by a support. In addition, the image sensor may be included in the image sensor module 22, and the image sensor module 22 may include a sensitivity enhanced micro lens array (Sensitivity Improving MLA), a CCD, or a CMOS.

Here, the image sensor is a sensor that converts a captured image into an electrical signal, and a plurality of lenses play a role in gathering the image. In addition, the PCB plays a role of supporting and bonding the image sensor wire and a path capable of outputting the electrical signals of the sensor to the outside. The FPCB includes a direct connection to an external backend chip. The role of the connecting line.

Next, FIG. 2 is a diagram schematically illustrating manufacturing steps of the camera module 20 according to the embodiment of the present invention.

The manufacturing steps of the camera module 20 according to the embodiment of the present invention include the steps of manufacturing the lens module 21; the steps of manufacturing the packaging module by packaging the lens module 21 manufactured; and further completing the packaging module Steps to manufacture the camera module 20.

Specifically, the manufacturing steps of the camera module 20 include processing, assembly, and inspection steps of the camera module 20, and more specifically, single lens injection, single lens cut, single lens coating (Coat), and single lens defects Inspection, lens assembly, lens performance inspection, lens holder assembly. The manufacturing steps of the package module may include wafer dicing (Wafer Saw), die attach (Die Attach), wire bonding (Wire Bond), cleaning (Clean), and lens holder mounting (Lens Holder Mount). And, the package module further completes the steps The steps include Lens Pre-Ass'y, Focus UV Lock, Sensor Test, FPCB Attach, Case Assembly, and Load Check.

In addition, with reference to FIG. 3, the manufacturing steps of the camera module 20 of a mobile device for a smart phone and a mobile phone will be specifically described as follows.

)，切割所提供的晶圓而準備感測器芯片(

)，將準備的感測器芯片貼附到印刷電路板(PCB)(

)，在用金線(Gold Wire)連接感測器芯片與印刷電路板(

)之後，將透鏡機構安裝在上部(

)。接下來分離為單獨的相機模組20(

)之後，接合FPCB(

)，旋轉模塊並設置焦點(Focus Setting)(

)。接下來，在藉由環氧樹脂(Epoxy)固化固定模組的焦點之後，將經由相機模組20(CM模組)的光照射到測試圖(Test Chart)上而檢查畫像及色相(

)並進行設置(

)。 First, a wafer (Wafer) for manufacturing a sensor chip is provided (

), Dicing the wafer provided to prepare the sensor chip (

), Attach the prepared sensor chip to the printed circuit board (PCB) (

), Using a gold wire (Gold Wire) to connect the sensor chip and the printed circuit board (

), Install the lens mechanism on the top (

). Then separate into separate camera modules 20 (

), Then join the FPCB (

), Rotate the module and set the focus (Focus Setting) (

). Next, after the focus of the fixed module is cured by Epoxy, the light passing through the camera module 20 (CM module) is irradiated onto the Test Chart to check the image and hue (

) And set (

).

In the above steps, a laser processing device (Laser Soldering Apparatus) can be used in the steps such as FPCB Attach, Case assembly, and the like. In the FPCB mounting and protective shell assembly steps, soldering is required in order to connect the terminals, that is, a soldering step, and the laser processing device included in the embodiments of the present invention can be used in these processes.

As shown in FIG. 4, such a laser processing device can be used in the camera module 20 for two-side soldering or three-side soldering. In the case of double-sided welding, 6 to 8 points soldering can be performed on the upper surface of the camera module 20, and 6 to 8 point welding can be performed on the lower surface opposite to the upper surface ( 6 ~ 8 points soldering). In addition, in the case of three-sided welding, welding can be performed by covering 16 points on three surfaces as a whole. In this case, the camera module 20 may be an optical image stabilizer (OIS: Optical Image Stabilizer) camera module 20.

Referring to FIG. 5, the laser welding process performed by the laser processing apparatus as described above is described as follows.

First, a laser can be irradiated to a solder joint to perform a Pre-Heat PH1 step. The area irradiated by the laser emits heat, for example, emits planar heat such as circles, quadrangles, and rings. Next, heat is transferred to the surrounding area, which can increase the temperature. Then, a solder ball S (solder ball) can be supplied and a Post-Heat PH2 process can be performed by means of laser. Next, the welding process is performed after cooling down the CD. Here, as required, the pre-heat (PH1) step may not be performed, and it may be completed after the supply of solder ball S (solder ball), post-heat (PH2) step, and the cooling (CD) process. Welding process.

When a laser welding device uses a welding wire, the configuration of the device and the laser irradiation method may be different depending on whether the solder ball S is used or the solder paste is used.

In particular, in the case of using the solder ball S, as shown in FIG. 6, a pick and place welding method can be adopted: pick the solder ball S and move it, place the solder ball S at a desired position, and The laser beam is irradiated on the solder ball S, and the solder ball S is melted and dripped, and then joined.

Further, a solder jetting method can be adopted: the solder ball S is moved by the nozzle to melt it inside the nozzle, and then jetting is performed.

Furthermore, the nozzle can be replaced if an abnormal state is detected. The nozzle may further include a sensing portion for detecting whether or not the abnormal state including contamination and deformation is present. The sensing portion may include a first sensing portion and a second sensing portion.

The first sensing unit is a sensor for confirming the state of the nozzle, and may be a charged-coupled device (CCD) camera. The first sensing unit can check the state of the nozzle, and then perform a normal solder ball application operation when the nozzle state is not abnormal. However, if the first sensing The abnormal state of the nozzle is detected by the part, and the abnormal state of the nozzle can be detached by the unloading part, and the new nozzle stored in the nozzle cartridge can be taken out and attached to the joint part. If the new nozzle is attached to the joint portion, the new nozzle can be aligned by the Alignment portion.

In addition, the second sensing unit may be a charge-coupled device (CCD) camera, an area sensor, a hall sensor, or a capacitance sensor. The second sensor can confirm the abnormal state of the disk, especially the abnormal state of the solder ball transfer port, and send it to the control unit. That is, confirm the contamination status of the solder ball transfer port. If the degree of pollution is sufficient to interfere with the supply of the solder ball (for example, when the diameter in the solder ball transfer port is less than a preset value), the solder ball transfer The signal of abnormal port status is sent to the control department. If the control section confirms that the disk that moves and provides the solder ball S is in an abnormal state, the result can be displayed to the user to provide a message that enables the user to replace the disk.

As an example, the pick-and-place welding method will be described in more detail with reference to FIG. 6. As shown in FIG. 6 (a), one or more prepared solder balls S (step 1) are picked by a nozzle (step 2). ) And place it in the upper part of the position to be welded (step 3). The solder ball S located on the upper part is melted by laser irradiation and dripped to a position where the solder ball S is required (step 4). In addition, as shown in (b) of FIG. 6, when two or more solder balls S are picked up by a nozzle, a laser can be sequentially irradiated to each solder ball S.

However, FIG. 6 illustrates a case where the nozzle picks up two or more solder balls S, but it is not limited to this, and may include a case where one solder ball S is sucked and dropped to a position where welding is required.

The following technical content and Fig. 7 are different from Fig. 6 (Pick and Place) and can be considered in the case of irradiating welding wire, solder paste, and preset solder. In such a laser processing apparatus, it is necessary to perform a laser operation in accordance with the factors to be considered. The following needs to be considered: regarding the size of heated area by laser; prevention of errors; and ensuring that even Even if an error occurs, the focus distance of the laser welding can be ensured smoothly; the cone angle of the laser can be prevented from being blocked by the surrounding components or causing defects to the surrounding components during the irradiation of the laser.

Therefore, as shown in FIG. 7, the size and focal length of the area heated by the laser can be adjusted by adjusting the cone angle and wavelength of the laser having a conical shape. In addition, by reducing the cone angle of the laser light, it is possible to prevent defects caused by contact of surrounding constituent elements. In order to adjust the cone angle and wavelength of such a laser, the laser processing apparatus according to the embodiment of the present invention includes a laser wavelength adjustment section and a laser cone angle adjustment section on the upper laser supply section that supplies the laser through the nozzle 16. .

Not only this, but also comprehensively consider the cycle time, working temperature of the laser processing device, the temperature sensitivity of the material being welded, the contact sensitivity, the allowable temperature required for the successful execution of the next step, and so on.

In a laser processing apparatus, considerations regarding reflow timing are specifically as follows.

First, the thermal load of the object to be welded can be considered. The larger the object, the slower the heat conduction, and the object with a higher thermal conductivity can play a role similar to a heat sink.

Second, the quality of the solder paste (solder ball S) can be considered. This is because the laser must add enough energy to evaporate the flux and liquefy the alloy. Also, because the flux vapor affects the heating rate and may also spontaneously ignite.

Third, the distance from the wetted place can be considered. The longer the distance, the longer the laser exposure time may be. This is because the alloy needs to be in a liquid state capable of flowing laterally across the surface and wetting it.

Fourth, consider the joint geometry. This is because in a case where the shape of the weld seam is a complicated shape such as a stranded wire, it may take longer to completely wet the alloy. Because the alloy needs to be in a liquid state that can flow across the surface and wet it.

Fifth, thermal sensitivity can be considered. Parts and solder must be heated quickly to limit the total heat absorbed. This is because excessive heat may be conducted to surrounding structures and damage the surrounding structures.

As shown in FIG. 8, the laser power of the laser can be controlled according to time, so heating can be standardized to be able to apply the required heating effect to the maximum extent. In the case of point-to-point heating without consideration, the profile may be a single power level at a time. In the case where the cycle time is important and the minimum time is required until the component is completely wet, in order to maintain the heated area to the extent that overheating does not occur, it can be applied sufficiently high enough to be able to start reflow before lowering to lower power Power level. The laser output level can also be changed linearly according to the passage of time, thereby ramping from one output level to another.

Such a laser welding step can be automated. For example, in a laser processing device, visual recognition for identifying an object can be realized, and it can be controlled that visual recognition and laser welding can be performed on the same line. In addition, the use of a linear motor can improve control efficiency and workability. Also, the welding head of the nozzle 16 that performs laser welding may include two (dual laser bonding heads) or more than two, thereby naturally improving workability. In addition, a welding table that includes two or more welding heads and realizes laser welding includes two or more corresponding to the welding heads, so that operations can be performed in parallel. Furthermore, although not shown in detail using the drawings, such a laser processing device may of course include a mobile station including a motor capable of moving in two or more directions, and may include a laser for supplying a laser Supply department and those capable of supplying solder Solder Ball S Supply Department. In addition, a rotary motor capable of rotating the nozzle 16 of the laser processing apparatus may be included. The nozzle 16 is rotated by the rotation of the rotary motor, so that the target body can be irradiated with the laser obliquely at a portion requiring laser welding.

The laser processing apparatus may be manufactured in a table type or a robot automation type capable of moving the laser welding nozzle 16 by means of a robot. Furthermore, naturally, it can be provided as an automatic device as a configuration of a system automated on a manufacturing line, or it can be provided as a stand-alone system. Furthermore, as shown in FIG. 9, as a voice coil motor (VCM: Voice Coil Motor) welding equipment of the camera module 20 steps, the laser can also be used to connect the voice coil motor terminal (VCM Terminal) / Yoke terminal to Ceramic multilayer substrates (HTCC substrates, High Temperature Coried Ceramics) are used as equipment for soldering.

And, the laser processing apparatus according to the embodiment of the present invention may include a control section to further perform control required for laser welding. The control unit can realize the start-up, the built-in system and program upgrade by external signals, and can also control or even adjust the welding parameter input / output. The laser processing apparatus according to the embodiment of the present invention may include a display section for easily grasping an operation state and a control state of the apparatus.

Further, the laser processing apparatus according to the embodiment of the present invention may include a non-contact temperature sensor capable of measuring the temperature of at least one of the object and the solder. And, a feeder for accurate solder supply may be included. In addition, the control section may include two or more optional welding specifications, so that laser welding can be performed without inputting additional control factors. For example, a laser processing apparatus according to an embodiment of the present invention may have three welding specifications, and each laser welding specification may be divided into three steps and eight steps in order to enable flexible and accurate parameter control. another In addition, the control part of the laser processing apparatus according to the embodiment of the present invention may provide two or more laser welding head options capable of selecting a focal length, IR temperature detection, and real-time welding quality monitoring.

In addition, the laser welding specification may also include the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the correlation between the output of the laser and the irradiation time.

Through various combinations of the above four conditions, the laser specifications corresponding to the size of the solder ball and the welding environment can be determined. For example, it may not be possible to completely melt the solder ball when the solder ball is large. Therefore, in order to melt the solder ball, laser irradiation for heating can be performed multiple times. Reflow soldering can be performed according to the size of the solder balls. In addition, when heating is completed, slow cooling can be performed, and if rapid cooling is performed, a cold welding phenomenon may occur and cracks may occur in the welded portion. Therefore, slow cooling can be performed during cooling.

In addition, the slow cooling may include slow cooling performed by continuously reducing the laser output and slow cooling performed by gradually reducing the output. Even in the case of slow cooling by continuously reducing the output of the laser, the larger the slope of the correlation between the output of the laser and the irradiation time, the slow cooling effect will still be similar to the rapid cooling effect, so it can be selectively adjusted.

That is, in order to form more than one output interval in the welding process by a combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the relationship between the laser output and the irradiation time, you can choose Multiple laser specifications.

With the laser processing apparatus described above, as shown in FIG. 10, soldering can be applied to the electrical connection of various terminals. For example, soldering can be performed smoothly even when the terminals are located on the same plane or are arranged at an angle. Therefore, as shown in FIGS. 11 (a) to 11 (d), the laser processing apparatus according to the embodiment of the present invention can realize a corner connection, a cavity connection, and a full connection. Various connections such as azimuth joints.

First, the apparatus including the nozzle 16 of the laser processing apparatus according to the embodiment of the present invention can be described with reference to FIG. 12.

A part of the device according to an embodiment of the present invention includes an upper base 17 and a lower base 18, and a hole disk between the upper base 17 and the lower base 18. The leak disk can be rotated by the rotation shaft 6 and includes a plurality of holes, so that the solder ball can be transferred to the laser transmission path 14 by rotation around the rotation shaft 6. That is, the solder ball S flowing in through the solder ball inlet 2 is placed in one of a plurality of holes provided in the leak disk, and the solder ball S located in one hole of the leak disk can be moved to the laser by rotation of the rotation shaft 6 Transmission channel 14 side.

Here, the solder ball S supplied to the solder ball inlet 2 can be temporarily stored in the storage chamber 3, and can be moved to the solder ball outlet end 5 by the nitrogen supplied through the nitrogen inlets 11, 4 and then to the solder ball outlet. The solder ball S at the end 5 is located in one of a plurality of holes arranged in the leak disk.

A structure capable of rotatably supporting the rotation shaft 6 may be arranged on the upper base 17, and an adapter 7 may be included on the upper side. In addition, the receiving port 10 and the transmitting port 9 may pass through the upper base 17 and the lower base 18. The solder ball S moving to the laser transmission path 14 side can be moved to the nozzle 16 side through the solder ball outlet path 12.

A transparent glass 13 may be arranged on the upper side of the laser transmission channel 14, and a laser irradiated through the transparent glass 13 may be irradiated to the nozzle 16 side via the laser transmission channel 14.

The nozzle 16 may be coupled by a nozzle anti-loosening locking screw 15 arranged on the lower base 18. Therefore, the nozzle 16 can be combined with the lower base 18 via the nozzle anti-loosening locking screw 15, so that the nozzle 16 can be easily replaced. In the embodiment of the present invention, the nozzle anti-loosening locking screw 15 is used as an example for description. However, obviously, the coupling structure between the nozzle 16 capable of replacing the nozzle 16 and the lower base 18 may adopt a variety of structures. form. Also, an upper side of the laser transmission channel 14 may be arranged for supplying nitrogen gas. The nitrogen inlets 11 and 4 allow the solder balls S inside the nozzle 16 fused by the laser to be discharged to the portion where the laser welding is required.

As an example, the nozzle 16 included in the laser processing apparatus according to the embodiment of the present invention is enlarged and observed, as shown in FIG. 13.

A through hole may be formed in the nozzle 16 as shown in FIG. 13. The through hole includes a cylindrical shape portion and a truncated cone shape portion coupled to a lower portion of the cylindrical shape portion. After the solder ball S flows into the inside of the nozzle 16 through the solder ball outlet passage 12, it passes through the cylindrical shape portion and drops by gravity. The dropped solder ball S is caught in the frustum-shaped portion and cannot flow outside the nozzle 16. The solder ball stuck in the truncated cone-shaped portion is irradiated with laser light through the transparent glass 13, and the molten solder ball S is discharged to the outside by nitrogen.

In addition, a cover 1 may be disposed on the solder ball inlet 2 side, and the cover 1 may be opened only when the solder ball S is moved from the solder ball S supply chamber storing the solder ball S to the solder ball inlet 2 side. Not only that, the cover 1 arranged at the solder ball inlet 2 may be opened only by using the laser processing apparatus according to the embodiment of the present invention to be able to supply the solder ball S.

Furthermore, in the above-mentioned laser processing apparatus, only nitrogen has been described. However, in addition to nitrogen, any gas that can be used as an inert gas such as helium and argon can be used.

Hereinafter, A to F and A 'to F' will be described below by sequentially showing Figs. 14 and 15 as a part of the steps of an example of the laser processing apparatus. The sequence diagrams (A to F) shown in FIG. 14 are briefly described.

First, after loading the object, the object is moved to the visual inspection position (A), and then the alignment state, rotation, and arrangement of the object are detected (B). Then, it moves to the welding position (C), and welding is performed by the laser processing apparatus (D). Then move to the unloading position (E) to unload. When loading At the next object (F), move to the visual inspection position (A) again. In addition, in order to check the quality of the welding after laser welding, it is obviously possible to add the option of moving to the visual inspection position.

The sequence (A 'to F') shown in FIG. 15 is briefly described. First, when the welded object is placed in the unloading position (A '), the welded object is taken out and the object to be welded is placed in the unloading position (B'), and then it is moved to the visual inspection position ( C '). Next, the alignment state, rotation, and arrangement (D ') of the object are detected. Then, it moves to a welding position (E '), and performs welding (F') by a laser processing apparatus. Here, as an additional option, in order to check the quality of the welding after laser welding, a step of moving the object to a visual inspection position can be added, and after detecting the alignment state, rotation and arrangement of the object, When the alignment status, rotation, and layout are abnormal, you can add the option to move to the unloading position and unload and load again.

The processing sequence described with reference to FIGS. 14 and 15 is controlled by the control unit, and can be described in more detail with reference to FIG. 17 of the conceptual diagram. Welding is performed by the processing section, and the processing section includes a welding head. The welding head may include one or more of a laser beam focusing optical welding head and a solder ball supply device. The processing section may further include a nozzle for discharging the solder balls. In addition, the control unit may determine a predetermined state of the nozzle 16, that is, a state of contamination or damage, thereby determining a cleaning or replacement time. Further, the control unit may record the laser output and correct the laser output. In addition, the control of the control unit can perform quality inspection on the solder portion that is the portion to be soldered, and can be controlled to discard or collect the solder balls used in the bonding test and defective solder balls having defects in manufacturing.

In the above-mentioned quality inspection process, a solder part that is not compounded with a predetermined quality standard may be irradiated with laser light again to melt the solder part, thereby improving the wettability of the solder, or removing and performing re-soldering by re-dissolution . As another example, classification may be performed by a classification device. The control section may perform control for correcting the laser beam position, the nozzle position, and the visual inspection position. and, The control unit may determine the specification of the laser by a combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the middle slope of the correlation between the laser output and the irradiation time. To control the execution of welding.

According to the laser processing device and the laser processing method described above, the device and even the method according to the embodiment of the present invention may include the following configurations. The inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by the inspection unit. For the first inspection (pre-inspection), it may be to inspect the installation state of the object before performing welding, that is, the alignment state including the rotation and arrangement states. For the second inspection (post-inspection), It may be one or more inspections in which cracks and pores (Pore) of the solder portion are sensed after the soldering is performed. As described below, according to the second inspection result, an object that does not meet the quality standard can be classified with an object that meets the quality standard, and re-soldering can be performed on the object that does not meet the quality standard. .

First, the laser supplied from the laser supply device may be a laser having a wavelength having a high laser absorptance according to the solder material. In addition, it may be a solid-state laser such as an optical fiber laser or a diode laser (Fiber Laser or Diode Laser). The laser beam generated from the laser generating device can be transmitted to the laser welding head through an optical fiber without a separate optical mirror. Therefore, stable laser supply and precise operation during welding by laser irradiation can be achieved.

Second, the laser processing apparatus may include a pick and place soldering head or a jet soldering head including a laser welding nozzle 16. The laser welding head may include a laser beam focusing optical head, a solder ball S supply device, and a nozzle 16. Here, when the laser welding head represents a head, it can be configured not only as a single head, but also as a structure including two welding heads. Dual head. Not only this, but also a welding head body including three or more welding heads. When two or more laser welding heads are included, the productivity of the device can be improved.

Third, it may include a Vision Inspection Module / unit or a visual inspection step. Since such a visual inspection module or visual inspection step is included, it is possible to perform a position inspection, an alignment state inspection, and the like (first inspection (Pre-Inspection)) of the camera module 20 to be welded, and to perform welding after welding as required Quality inspection (Post-Inspection).

Therefore, 1) a visual inspection module composed of low magnification and high magnification lenses can be installed, or 2) a motorized variable zoom lens (1X ~ x18) can be installed: the highest magnification can be based on the design of the zoom lens (Zoom Lens) And higher), which can automatically check low to high magnifications and wide to narrow areas.

Although a visual inspection module can also be used for pre-inspection and post-inspection, in order to improve productivity, it can be configured as a separate visual inspection module (for example, a pre-inspection (Pre -Inspection) function uses a visual inspection module, and a post-inspection function uses a visual inspection module).

In the case of using a visual inspection module for pre-inspection and post-inspection, after the pre-inspection object is moved to a position for welding, You can go back to the previous position and perform post-inpsection. In the case where the visual inspection module is composed of two, namely, a visual inspection module for a pre-inspection function and a visual inspection module for a post-inpsection function, the object is The positions of the inspection (Pre-Inspection) module, the laser welding module and the post-inpsection module are sequentially moved and inspected and welded.

Furthermore, in order to monitor the welding quality in real time, controlling parameters or performing post-inspections such as internal cracks and porosity inspections after welding (Post-Inpsection), an infrared (Infra-red) inspection device may be included.

Fourth, it may further include a sorting device capable of classifying an object that does not meet the welding quality standard required after the post-inspection.

Fifth, it may further include a repair device capable of repairing an object that does not meet the welding quality standards required after the post-inspection. Such a repairing device can irradiate a laser to melt a solder portion again, thereby improving solder wettability, or removing solder and performing resoldering. When removing the solder that has been soldered, it can be removed automatically using a mechanical tool such as a pin, or it can be automatically removed by remelting and inhaling it with a laser.

Sixth, in order to manage the quality after soldering, a cleaning device including a dust collecting device for removing dust and foreign materials may be further included. In addition, one or more of a dry air blowing device, a CO ₂ Snow Cleaning device, and an inert gas blowing device may be included.

Seventh, it may further include a pre-welding section that performs welding in advance according to the type of equipment to be welded. In addition, a laser welding head (Soldering Head) can be additionally included to maximize welding quality and improve productivity.

Although not described in the above-mentioned embodiment, it can also be used for bonding that does not require a welding material (Solder Ball). That is, the supply of the solder ball S as a welding material may be optional, and in a laser processing apparatus that does not supply the solder ball S, it may also be applied to bonding between metals and bonding between metal and resin. (bonding) and plastic welding. According to the pair of irradiated lasers Due to the nature of the object, the conditions of the laser irradiation intensity, irradiation time, and irradiation period can be changed to perform bonding of the two base materials.

Furthermore, as an example, if FIG. 16 showing the shape of the jig and the additional laser processing method and device are described, the laser processing device may further include a plurality of nozzles 16 described above. That is, when the solder ball S is supplied to the nozzle 16 side through the drain disk 8, the solder ball S can be supplied through the drain disk 8 corresponding to a plurality of nozzles 16. That is, instead of being selectively provided to one nozzle 16 among the plurality of nozzles 16, an action of simultaneous supply can be performed. For example, according to the operation described above, after the solder ball S is supplied to the dual laser bonding head side and melted by means of a laser, the solder ball S can be discharged from the welding head by discharging nitrogen gas. Since such a process can be performed simultaneously on two welding heads, the welding time can be shortened. As an example, since a device for arranging a dual laser bonding head is provided with a larger number of soldering heads, it is naturally possible to improve work efficiency.

The laser processing apparatus may further include a jig. The jig may be a rotating fixture jig. A fixture jig channel including a plurality of fixtures adopting the rotary movement method may be arranged. For example, a fixture jig channel that is arranged in combination with three or more fixtures that move in a rotational movement manner may be provided. Such a fixture jig channel may include or mount a plurality of objects to be welded. Here, when one or more operations of welding and bonding are performed on two or more points of an object, if one of the two points existing in an object is welded or bonded, ) Work, the jig can be moved, so that laser processing can be performed on the remaining points of the two points existing in the object. Here, the movement of the jig may be a rotation, a movement by a linear motion, or a movement by a combination of the rotation and the linear motion. If the movement ends, welding or bonding may be performed on the remaining points.

As a specific example, the first welding head (laser bonding head 1) can be bonded on the first jig channel 1 and the second welding head (laser bonding head 2) can be on the third jig channel. (fixture jig channel 3).

If the welding heads (the first welding head and the second welding head) are bonded at various positions, the first welding head can perform the bonding operation on the second jig portion.

In addition, if the first jig portion is located at the unloading position away from the laser irradiation position, the object that has completed the joining operation can be taken out. A new object can be placed on the first jig portion from which the object is taken out, and waiting for the joining operation.

If the joining operation with respect to the object located in the third jig portion is completed, the object may be taken out, and a new object may be arranged on the third jig portion from which the object is taken out to prepare for the joining operation.

If the joining operation of the first welding head to the object on the second jig portion is completed, the first welding head may perform the joining operation on the object on the first jig portion.

In addition, if the second jig portion is located at the unloading position, the objects that have completed the joining operation can be taken out, and a new object is placed on the second jig portion to wait for the joining operation.

If the joining operation of the second welding head with respect to the object on the third jig portion is completed, the second welding head may perform the joining operation with respect to the second jig portion. The joining operation may be repeatedly performed and laser processing may be performed.

More specifically, in the loading or unloading position, each jig 30 in which a plurality of object bodies are arranged may be mounted on the first jig portion. In addition, at the loading or unloading position, each jig in which a plurality of object bodies are arranged may be mounted on the second jig portion. In addition, at the loading or unloading position, each jig in which a plurality of object bodies are arranged may be mounted on the third jig portion.

If the first jig portion is located at the position of the joining operation, a vision inspection unit can check whether the alignment state, rotation, arrangement, etc. of the object to be operated are normal operations.

The first laser head may be bonded to a bonding surface of each object formed on the first jig portion. During the period during which the first jig section performs the joining operation, the vision inspection unit may check the normal operation, alignment, rotation, arrangement, and the like of each object arranged on the third jig section.

The second laser head may be bonded to a bonding surface of each object formed on the second jig portion. When the joining operation on one side of each object arranged on the first jig portion is completed, each jig included in the first jig portion can be moved to the joining operation position on the other side. The movement may be a rotational movement.

During the joining operation of the objects arranged in the third jig portion, a vision inspection unit (vision inspection unit) can check the alignment state, arrangement, etc. of the respective objects located on the first jig portion.

Further, the other surface of the object on the first jig portion that is moved by the first welding head can be joined. When the joining operation is completed, the first jig portion can be moved to the unloading position. When the joining operation is completed, the object on the first jig portion can be taken out, so that a new object can be arranged on the first jig portion.

When the joining operation is completed on one of the two surfaces of the joints of the respective objects arranged in the third clamp section, each clamp included in the third clamp section can be moved to the joint operation position of the other surface.

After that, a vision inspection unit can check the alignment state, arrangement, and the like of each object rotated by the third jig portion. In addition, the second welding head may be joined to the other surface of each target body arranged on the third jig portion.

While the second jig unit is performing the joining operation on the objects on the third jig unit, a vision inspection unit can check the alignment state and rotation of each object arranged on the second jig unit. , Layout, etc.

The first welding head may join one side of each object arranged on the second jig portion, and the first jig portion arranged with a new object to be joined may wait until the operation of the second jig portion is completed. Therefore, the subsequent operations can be repeated as described above.

Each object of the fixture jig channel at the end of the operation can perform the joint quality inspection (post-inspection) by one or two vision inspection modules / units ).

In addition, while the nozzle 16 is being pressurized by a gas such as nitrogen to discharge the welding material (Solder Ball) located on the inside, the inner side of the nozzle 16, that is, the tube that is in contact with the molten welding material. The inside of the mouth 16 may be contaminated. The contamination may include welding materials that are left and fixed without being discharged, foreign materials generated during thermal damage due to the temperature when the welding materials are fused, and foreign materials generated on the surface due to repeated exhaust of gas (nitrogen, etc.). . If the foreign matter accumulates, there is a possibility that the laser processing efficiency will be affected and a negative result may be caused. Therefore, by checking the state and quality of the nozzle 16, the pollution needs to be cleaned at a preset period or intermittently. When measuring the pollution degree and reaching a preset pollution level, or at a preset The unit time is a standard and fixed cycle, and it moves to a cleaning area for cleaning, or removes foreign matter and dust by a nozzle cleaning unit when the object is not arranged. Can be cleaned by physical or chemical methods (cleaning), and a configuration for performing the cleaning may include a vision unit and a nozzle monitor.

Furthermore, when the laser is irradiated with a predetermined laser irradiation intensity corresponding to the degree of laser processing, the actual laser intensity (energy) detection unit (laser power (energy) detection unit) can be used to check laser power; energy), and in the case of a difference from the preset laser irradiation intensity, adjusting the laser intensity to compensate for the difference. Therefore, the control unit (not shown) and laser power (energy, output) detection unit (laser power (energy) detection unit) are connected to each other, and based on the laser power (energy, output) detection unit (laser power (energy)) detection unit) compares the received information with a preset laser intensity, thereby increasing / decreasing the intensity of the irradiated laser.

In addition, the laser processing apparatus may further include a waste ball collecting unit that discards or collects the solder balls S used in bonding tests and defective solder balls S that are defective during manufacturing. For example, a waste ball collecting unit may be used to collect waste balls after they are supplied to the laser processing apparatus and then move to a discharge position, and then discard them.

In addition, it also includes a calibration plate for correcting the laser beam position, nozzle 16 position, and vision inspection position, and is connected to the control unit (not shown). The calibration plate can immediately sense more than one of the absolute and relative coordinates of the laser beam, nozzle 16 and vision inspection. The setting values set in the control section are compared, and then the difference from the preset setting value is compensated to position the laser beam, the nozzle 16 and the vision inspection. ) To move to converge to the preset setting value. Further, where is not located In the case of a preset value, the laser irradiation step is not performed, so that an erroneous operation related to laser irradiation can be prevented.

The following drawings are diagrams schematically illustrating the process of determining the welding position. The object to be soldered may be the camera module 20 or other electronic components. Therefore, naturally, it is not limited to the shape of the example of illustration.

Fig. 17 is a diagram showing the determination of a welding position according to an embodiment of the present invention.

First, to determine the welding position, the inspection light L may be irradiated from the head 110 to the welding target region P2. Here, the head 110 has a structure including a nozzle, and can perform a function of ejecting the solder ball S. By irradiating the inspection light L, the surface information of the welding object region P2 can be input, and the surface information can be matched with the input welding information. Therefore, the welding target region P2 may be included in a region to which the inspection light L is irradiated.

In addition, in the case where the input welding information is matched with the surface information by matching, the welding can be performed at the first position SP1 as a reference value, and for some unmatched messages, the welding can be determined at the compensated position. Position while performing welding. In the following, the mismatched information is recorded as the position determination factor, and the determination of the welding position will be specifically described below.

Referring to (a) of FIG. 17, the inspection light L can be released from the head 110. The irradiation area of the inspection light L may include an area occupied by the plurality of terminal portions 50 as welding targets in order to electrically connect the plurality of terminal portions 50 to each other by welding.

In addition, the laser processing device can sense the position of the terminal portions 50, the distance between the terminal portions 50, the angle between the terminal portions 50, and the like by the inspection light L. The position of the ejected solder ball S, that is, the welding position can be determined by the sensed information. And by determining the welding position, the welding can be adjusted The resulting bonding force can further adjust the distribution of the solder balls S. Adjusting the bonding force means that the area where the solder ball S is in contact with the terminal can be adjusted.

Once the welding position is determined, the head 110 may perform welding. There may be multiple position determination factors when determining the welding position. The position determining factors include the distance between the terminals, the difference in the size of the terminals (the difference in width or exposed area), the angle at the time of joining, and the size of the solder ball S.

In order to explain the position determination factor, a preset value (Default) will be described below with reference to (b) of FIG. 17. As shown in the figure, the welding position can be set to the first position SP1 to perform welding when the following conditions are met: the distance and size of the two terminals 50 are the same, and for the angle at the time of joining, the entered data The angle coincides with the inspection by the inspection light L, and the size of the solder ball S is a predetermined size.

Based on this, a case where the welding position is changed from the first position SP1 due to the influence of the position determination factor will be described.

FIG. 18 is a diagram illustrating a situation where a welding device determines a welding position according to an interval distance between terminals according to an embodiment of the present invention.

Referring to FIG. 18, the distance between the terminals and the input data (the preset value) may be different in the process of checking the position by the inspection light L. In this case, welding can be performed at the second position SP2, which is a position compensated from the first position SP1 to reflect the distance reflecting the separation distance.

Here, when the separation distance is an interval in the X direction of the drawing, the second position SP2 as the welding position after compensation is also determined as the position after compensation in the X direction. For example, when the center positions of the two terminals 50 are 0.3 mm apart from each other, the welding position as the second position SP may be compensated from the center position by 0.15 mm and determined as the center positions of the two terminals 50 separated from each other. Relative to the interval The distance of the distance compensation is only an example. Of course, it can also be changed by other position determination factors, and it is not limited to the above values except for other position determination factors.

In addition, the welding is performed at the determined second position SP2 by compensating the separation distance, so that the joint area of each terminal 50 and the solder ball S is formed more uniformly, so that the current can be improved compared to the case of welding at the first position SP1 Sex. For example, in the case of performing welding at the first position SP1, one of the two terminals 50 matches the input data, and the remaining one does not match. Therefore, if the matched terminal position is used as a reference, the first position is determined. SP1 and soldering is performed, the remaining one terminal is more spaced apart from the first position SP1 than the one terminal is separated from the first position SP1. Therefore, the bonding area between the two terminals 50 and the solder ball S may be unevenly formed, and the electrical conductivity may be reduced. That is, determining the second position SP2 and performing welding can improve the electrical conductivity and increase the bonding force.

FIG. 19 is a diagram showing a welding device according to an embodiment of the present invention, which determines a welding position according to a size of a terminal.

Referring to FIG. 19, the sizes of the two terminals 50 may be different from the preset value to be different from each other. The different sizes of the respective terminals 50 as described above can be sensed by irradiation inspection light, and the positions of soldering can be determined to be different from each other according to the sizes of the terminals. That is, the size of the terminal may be included in the position determination factor. And, according to the size of the terminal, welding can be performed on the second position SP2 which is a position compensated from the first position SP1. According to FIG. 18, the second position SP2 as the position after compensation may be a position after moving in the X direction from the first position SP1. Conversely, in a state where the sizes of the two terminals 50 are different, when the welding position is determined, it may be a position moved in the Y direction from the first position SP1.

Specifically, when the sizes of the two terminals 50 are different from each other, the solder ball S can be ejected toward the terminal side having a larger size. That is, the welding position can be determined to change from the first position SP1 along the size. The second position SP2 which moves in the direction in which the large terminal is located, that is, the Y direction. The above-mentioned position determination has the effect of increasing the contact area with the terminal and improving the electrical conductivity.

Of course, when the distances and sizes of the terminals are all different, these conditions can also be reflected, and the second position SP2 can be determined by moving from the first position SP1 in the X and Y directions.

FIG. 20 is a diagram illustrating a welding device that determines a welding position according to an angle of a joint surface according to an embodiment of the present invention.

Referring to FIG. 20, the welding position can be determined by an angle formed by the arrangement of the joint surfaces of the two terminals 50 by welding. Since when the welding is performed between the two terminals 50, the two components each including the two terminals 50 are arranged so as to form a determined angle, the solder ball S may be formed facing the two components Cracks.

Therefore, the water levels H1 and H2 of the solder ball S in the molten state may be different according to the angle of the gap, and therefore the position determination factor may include the angle of the joint surface.

Specifically, the larger the joint surface angle, the lower the water level H2 of the solder ball S in the molten state, and the smaller the joint surface angle, the higher the water level H1 of the solder ball S in the molten state. Therefore, the degree of reflection of the second position SP2 determined according to the sizes of the two terminals 50 different from each other can be set low. That is, when the water level of the solder ball S fused in the gap is high, although the second position SP2 is determined according to different sizes from each other, the effect of determining the welding position of the determined second position SP2 may be small. This is because the solder ball S can sufficiently contact the two terminals 50 due to the small gap.

FIG. 21 is a diagram illustrating a situation where a welding device determines a welding position according to a size of a solder ball according to an embodiment of the present invention.

Referring to FIG. 21, since the larger the solder ball S is, the higher the height H1 is formed, the possibility of joining the two terminals 50 by welding can be increased. That is, when the solder ball S is large, When the ball S is small, the contact area with the two terminals 50 can be increased. Due to this effect, when the solder ball S is large, the effect of the determination based on the welding position is small, so the degree of intervention in the position determination process may also be reduced.

Conversely, when the solder ball S is small, the possibility of contact with the two terminals 50 is low. Even if the solder ball S is in contact with the two terminals 50, the contact between the terminal 50 and the solder ball S may occur depending on the welding position. The difference in contact area. When such a difference occurs, the electrical conductivity and bonding force may decrease. Therefore, when the solder ball S is small, the degree of intervention in the position determination process may increase, which may increase the number of welding times more than two times and increase the contact area of the welding portion.

In the foregoing, the present invention has been described in detail through representative embodiments. However, those having ordinary knowledge in the technical field to which the present invention pertains can understand that the embodiments described above are within the limits of the scope of the present invention. A variety of deformations can be achieved. Therefore, the scope of rights of the present invention cannot be limited to the illustrated embodiments, and should be determined according to the scope of patent application and the scope equivalent to the scope described in the patent application scope.

Claims (19)

A laser processing device includes: a head portion that irradiates inspection light to a target body; and a control unit that matches input surface information of a welding object area that has been input with surface information obtained by irradiating the inspection light. According to the matching of the surface information, welding is performed at a first position that is a preset position or a second position that is compensated for distance from the preset position according to more than one position determination factor, where the position determination factor includes a The separation distance between the terminals to be soldered, the dimensional difference of the terminal to be soldered, the angle formed between the terminals to be soldered, and the size of the solder ball to be soldered. The laser processing device according to item 1 of the scope of patent application, wherein the distance between the terminals is a distance spaced in the horizontal direction or the vertical direction, and the horizontal distance or the vertical direction is capable of being spaced apart. This position-determining factor for distance compensation is obtained. The laser processing device according to item 1 of the scope of patent application, wherein the difference in size of the terminal is a difference in a cross-sectional direction of the terminal to be soldered, and the distance compensation can be obtained in the cross-sectional direction. Location determination factors. The laser processing device according to item 1 of the scope of patent application, wherein the angle formed by the terminal is an angle formed between the terminals to be soldered, and the smaller the angle is, the degree of distance compensation is obtained from the first position. The smaller it is; the larger the angle, the greater the degree of distance compensation obtained from the first position. The laser processing device according to item 1 of the patent application scope, wherein the larger the size of the solder ball, the smaller the degree of distance compensation obtained from the first position; the smaller the size of the solder ball from the first The greater the position is distance compensated. The laser processing device according to item 1 of the scope of patent application, wherein, when the position determination factor is detected, the second position is determined by reflecting one or more factors of the position determination factor. The laser processing device according to item 1 of the patent application scope, wherein the head performs pre-heating on the welding target area by laser before performing the welding. The laser processing device according to item 1 of the scope of patent application, wherein the region to which the inspection light reaches includes the welding target region. The laser processing device according to item 1 of the scope of patent application, wherein the object is rotated by rotation of a jig holding the object, so that welding is performed on two or more faces of the object. According to the laser processing device described in the first item of the patent application scope, the jig holding the object can be rotated by multiple axes to further change the position of the welding object to the head side. A laser processing method includes the steps of: irradiating an inspection light from a head to an object; matching surface information of the object obtained by irradiating the inspection light with input surface information of the object; Whether the result of the match detects a difference in position determination factors, and determines the welding position as the first position or the second position, where the position determination factors include the distance between the terminals to be soldered, the size of the terminals to be soldered, The angle formed between the terminals to be soldered and the size of the solder balls to be soldered, and the second position is determined by one or more conditions detected in the position determination factor, and the second position is determined by the position determination factor The welding position determined by obtaining the distance compensation from the first position. The laser processing method according to item 11 of the scope of patent application, further comprising the steps of: performing a first inspection of sensing an alignment state of the object by an inspection unit, and detecting whether welding to the object occurs. Internal cracks and pores in the part were examined in more than one. The laser processing method as described in claim 12, wherein the second inspection is performed simultaneously with the execution of the welding. The laser processing method according to item 12 of the patent application scope, further comprising the step of: after the second inspection, classifying the object according to a predetermined quality standard. A laser processing device includes: a jig for loading an object; a first inspection unit for sensing and first inspecting an alignment state of the object loaded in the jig; and a moving unit for loading the object To the jig and unloading from the jig; a second inspection section to selectively perform a second inspection on the object body; and a processing section including a head and a control section, wherein the head is controlled by the control section, And irradiating the object with laser, the control unit matches the input surface information of the welding object area with the surface information obtained by the irradiation inspection light, and matches the surface information to determine factors based on more than one position, Welding is performed at a first position that is a preset position or a second position after distance compensation is obtained from the preset position, and the position determining factors include the distance between the terminals to be welded, and the terminal to be welded Dimensional difference, the angle formed between the terminals to be soldered, and the size of the solder ball being soldered. The laser processing device according to item 15 of the scope of patent application, wherein the second inspection senses whether cracks and pores inside the welded portion occur. The laser processing device according to item 15 of the scope of the patent application, further comprising: a classification device that, after the second inspection, classifies the object according to a predetermined quality standard. The laser processing device according to item 15 of the patent application scope, further comprising: a cleaning device for removing dust and foreign matter after the second inspection step, wherein the cleaning device includes a blowing device that provides dry air, dry ice One or more of a cleaning device and an inert gas blowing device. The laser processing device according to item 15 of the scope of the patent application, further comprising: a pre-welding part, which performs pre-welding before performing subsequent welding on the object.