KR20180123988A - Appratus and method for laser processing - Google Patents

Abstract

Provided is a fast and highly efficient laser processing method, which comprises: loading an object on a jig; performing detection and primary pre-inspection on an alignment state including rotation and placement of the object loaded on the jig; moving the jig to a soldering position; soldering the object by laser; unloading the soldered object; and moving the object to an inspection part for inspecting the quality of soldering to selectively perform a secondary post-inspection by the inspection part.

Description

[0001] APPARATUS AND METHOD FOR LASER PROCESSING [0002]

An embodiment of the present invention relates to a laser processing method and apparatus.

Processing by a general laser processing method and apparatus is performed in the form of drilling, masking, soldering, etc., for various electronic parts using a laser. Among them, soldering performed by the laser processing apparatus and method is an apparatus for electrically connecting electrical components using a conductive material (e.g., solder ball), and can be used for manufacturing various electronic products.

Korean Patent Registration No. 10-0332378 (March 30, 2002)

An embodiment of the present invention relates to a laser machining apparatus comprising a vision inspection module or step for performing soldering using a laser to determine a soldering position and a laser machining apparatus and method for rapid and high efficiency including a laser soldering module or step And the like.

The object is loaded on the jig, the alignment state including the rotation and arrangement of the object loaded on the jig is detected and the first inspection is performed, the jig is moved to the soldering position, There is provided a laser processing method capable of selectively performing a second inspection (post-inspection) by an inspection unit by moving an object to an inspection unit for soldering, unloading a soldered object, and checking the quality of soldering .

And quality inspection can be performed by vision inspection.

The quality inspection may also be an inspection to detect whether internal cracks and pores in the soldering area have occurred.

The laser may also be a solid laser comprising at least one of a fiber laser or a diode laser.

Soldering can also be performed by a soldering head that includes a laser beam focusing optical head, a solder ball feeder, and a nozzle.

Soldering may also be performed by a pick and place soldering head or a jet soldering head that includes one or more heads.

Further, the soldering may further include the step of cleaning or replacing the solder ball by inspecting the predetermined state and quality of the nozzle for discharging the solder ball.

Further, the soldering may further include the step of recording the output of the laser and correcting the laser output.

Further, the inspection by the inspection unit can be performed at the same time as the soldering is performed.

The quality inspection can also include discarding or collecting the solder balls used in the bonding test and defective solder balls defective at the time of manufacture.

In addition, the method may further include sorting the object by a predetermined quality criterion after the second inspection (Post-Inspection).

In addition, for some or all of the solder balls that do not meet the predetermined quality criteria determined by the second inspection (post-inspection), the laser is re-examined and melted to improve the solder wettability, or to remove the solder ball by remelting And then re-soldering.

The method may further include a cleaning step for removing dust and foreign matter after the second inspection step. The cleaning step may include a dry air blowing process, a CO2 snow cleaning process, ), And inert gas blowing.

Also, the soldering performed on the object may include post-soldering and pre-soldering.

The method may further include correcting at least one of a laser beam position during soldering, a nozzle position at which the solder ball is ejected, and a vision inspection position.

A control unit; A jig to which an object is loaded; A first inspection unit for detecting and performing an inspection of an alignment state including rotation and disposition of a target object loaded on the jig; A moving unit for loading and unloading the object to the jig; A processing unit for soldering the object by a laser; And a second inspection unit for selectively performing a second inspection (Post-Inspection) on the object under the control of the control unit.

And, the second inspection can be performed by the vision inspection.

In addition, the second inspection may be an inspection for detecting whether internal cracks and pores of the soldering region are generated.

The laser may also be a solid laser comprising at least one of a fiber laser or a diode laser.

Further, soldering is performed by the machining portion, and the machining portion may include a soldering head including a laser beam focusing optical head, a solder ball supply device, and a nozzle for discharging the solder ball.

Soldering may also be performed by a laser soldering nozzle that includes a Pick and Place Soldering Head or a Jet Soldering Head that includes one or more heads.

In addition, the control unit can control the cleaning or replacement by checking the predetermined state and quality of the nozzle for discharging the solder ball.

Further, the control section can record the output of the laser and correct the laser output.

Further, the inspection by the inspection unit can be performed at the same time as the soldering is performed.

Further, under the control of the control unit, quality inspection can be controlled to discard or collect solder balls used in the bonding test and defective solder balls defective at the time of manufacture.

In addition, the apparatus may further include a sorting device for sorting the objects by a predetermined quality criterion after the second inspection (post-inspection).

Further, it is also possible to improve the solder wettability by re-examining and melting the solder balls, which are not in conformity with the quality criteria determined by the second inspection (post-inspection) under control of the control unit, , Remelting, and re-soldering can be performed.

The cleaning device may further include a drying air blowing device for providing dry air, a device for removing carbon dioxide from the surface of the substrate, A snow cleaning device and an inert gas blowing device.

Also, the soldering performed on the object may further include pre-soldering performed before or after post-soldering.

In addition, the control unit may perform a control to correct the position of the laser beam, the position of the nozzle, and the position of the vision inspection.

Further, the control section can be performed by a laser profile determined by a combination of the output of the laser, the laser irradiation time, the number of laser irradiation times, and the slope in the relationship between the output of the laser and the irradiation time.

Embodiments of the present invention can implement a fast and highly efficient laser processing apparatus and method, including a vision inspection module or step, and a laser soldering module or step.

1 illustrates a camera module according to an embodiment of the present invention,
2 and 3 are diagrams illustrating a laser processing method according to an embodiment of the present invention,
4 is a view illustrating a camera module to be soldered according to an embodiment of the present invention,
5 illustrates a heating process according to an embodiment of the present invention,
FIG. 6 illustrates movement of a solder ball by a nozzle according to an embodiment of the present invention;
FIG. 7 is a view showing cone angles and wavelengths of a laser according to an embodiment of the present invention,
8 is a graph illustrating laser energy output according to an embodiment of the present invention.
9 is a view showing a VCM (Voice Coil Motor) soldering apparatus employed in a camera manufacturing process according to an embodiment of the present invention,
10 is a view showing soldering according to an embodiment of the present invention used for connection of terminals,
FIG. 11 is a view illustrating an example of bonding through soldering according to an embodiment of the present invention;
12 illustrates a laser processing apparatus including a nozzle according to an embodiment of the present invention,
13 is an enlarged view of a cross section of a nozzle according to an embodiment of the present invention,
14 and 15 are flowcharts showing a soldering method according to an embodiment of the present invention,
16 is a perspective view of a jig according to an embodiment of the present invention,

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

The laser processing apparatus and method according to the embodiments of the present invention can perform marking, drilling, welding, soldering, and the like on a laser processing object. Hereinafter, the laser processing apparatus and method of the present invention will be described as an example of performing soldering. That is, the laser processing apparatus may be employed as a soldering apparatus to perform only a process for soldering. Hereinafter, in this case, the laser processing apparatus can be described as a soldering apparatus.

It goes without saying that the laser processing object can be applied to the manufacture of various electronic components such as various electronic components including the camera module 20. [ Hereinafter, the target object to be soldered will be described by exemplifying the camera module (20 in FIG. 1).

The camera module 20 described below can be used not only in various portable devices such as a smart phone and a tablet PC, but also in a home appliance including a smart television, a home appliance, a car or a security camera (CCTV) It goes without saying that the optical element can be mounted and used in various devices requiring the optical element. For example, when it is used in a car, it can be applied to various electric parts, an ABS sensor, a battery for a vehicle, and the like in a home appliance, and can be applied to a turning case, a flat screen monitor PCB, a photo sensor and the like. When applied to a portable device, it can be applied to a CMOS sensor, a smart watch, and the like included in various ICs, and can be applied to a CCD camera module 20, a USB connection terminal, a battery terminal, and the like in a portable device.

Further, the laser processing apparatus included in the laser processing apparatus according to the embodiment of the present invention can be included in various processes such as welding, soldering, bonding, etc., and the material on which each process is performed can be a polymer, a metal, a dielectric ), Semiconductors, and the like.

First, Fig. 1 is a diagram showing a configuration of a target object. The camera module 20 may include a lens module 21 (Lens Actuator) and an image sensor module 22 (Image Sensor Module).

The lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover (Lens Cover), a VCM driving part, a holder, an IR filter and the like. The image sensor module 22 may include a semiconductor sensor chip, ACF, FPCB, and the like.

Specifically, the camera module 20 or the compact camera module 20 includes a lens module 21, an AF actuator, an optical image stabilizer, An image sensor, an AF driver, a PCB, an FPCB, a socket, and the like. The lens module 21 may include a plurality of lenses, for example imaging lenses for imaging, and may include a support for supporting a plurality of lenses. A plurality of IR filters (IR Filters) And the IR filter may be supported by the support. Also, the image sensor may be included in the image sensor module 22, and the image sensor module 22 may include sensitivity enhancement MLA (MLA), CCD, or CMOS.

Here, the image sensor is a sensor for converting a photographed image into an electrical signal, and a plurality of lenses collect images. In addition, the PCB serves as a support for wire bonding and supporting the image sensor and a path for inputting and outputting electrical signals of the sensor to the outside, and the FPCB includes a connection line directly connected to an external backend chip .

Next, FIG. 2 is a view schematically showing a manufacturing process of the camera module 20 according to the embodiment of the present invention.

The camera module 20 according to the embodiment of the present invention can be manufactured by manufacturing the lens module 21, manufacturing the packaging module through packaging of the manufactured lens module 21, ). ≪ / RTI >

More specifically, the manufacture of the camera module 20 includes a process of assembling and inspecting the camera module 20, and more specifically, a process of assembling and inspecting the camera module 20 by using a single lens injection, a single lens cut, a single lens coat, Defect inspection, lens assembly, lens performance inspection, lens holder assembly. Packaging module fabrication may include wafer sawing, die attach, wire bond, clean, and lens holder mounts. The packaging module is further complimented by lens pre-assembly, focus UV lock, sensor test, FPCB attach, case assembly, Includes shipment inspection.

A manufacturing process of the camera module 20 used in a portable device such as a smart phone and a mobile phone will be described in detail with reference to FIG.

First, a wafer for manufacturing a sensor chip is supplied (1), the supplied wafer is cut to prepare a sensor chip (2), the provided sensor chip is attached to a printed circuit board (PCB) (3) , Connect the sensor chip and the printed circuit board with gold wire (④), and then attach the lens mechanism to the top (⑤). Next, separate the camera module 20 (⑥), connect the FPCB (⑦), rotate the module, and set the focus (⑧; Focus Setting). Next, the focus of the module is fixed through epoxy curing (⑨), and the light passed through the camera module 20 (CM module) is inspected on a test chart, (⑨).

In the above-described process, a laser soldering apparatus can be used for FPCB attaching (FPCB Attach), case assembly and the like. In order to connect the terminals in the FPCB attaching and case assembling process, a soldering process or soldering process is required. In this process, the laser processing apparatus included in the embodiment of the present invention can be used.

As shown in FIG. 4, such a laser processing apparatus can be used for two-side soldering or three-side soldering in the camera module 20. In the case of two-sided soldering, the camera module 20 can be soldered at 6 to 8 points on the upper surface (6 to 8 points soldering) and 6 to 8 points soldering can be made on the lower surface opposite to the upper surface . On the other hand, in the case of three-sided soldering, a total of 16 points can be made across three soldering surfaces. In this case, the camera module 20 may be an OIS (Optical Image Stabilizer) camera module 20.

The laser soldering process performed by the laser processing apparatus will now be described with reference to FIG.

First, a step of pre-heating (PH1) by irradiating a laser to a soldering point can be performed. The area irradiated with the laser emits heat, for example, a circular heat, a square heat, a ring heat, or the like. Next, the heat is transferred to the surrounding area and can raise the temperature. Next, a solder ball (S) is supplied and a post-heat (PH2) process can be performed by a laser. Next, the soldering process is performed through a cool down (CD). Soldering process (S), post-heat (PH2) process and cool down (CD) process are completed without pre-heat (PH1) You may.

The laser soldering apparatus may have different device configurations and laser irradiation methods depending on whether the solder wire is used, when the solder ball S is used, or when the solder paste is used.

6, the solder ball S is picked up and moved so that the solder ball S is positioned at a required position and the solder ball S is irradiated with a laser to melt the solder ball S, There may be a pick and place soldering method in which the solder is bonded in such a manner as to be bonded.

There may be a solder jetting method in which the solder ball S is transferred through a nozzle to be melted in the nozzle and jetted.

Furthermore, the nozzle can be replaced if an abnormal condition is detected. The nozzle may further include a sensing unit for sensing whether the abnormal state includes contamination and deformation. The sensing unit may include a first sensing unit and a second sensing unit.

The first sensing unit is a sensor for checking the state of the nozzle 100, and may be a charge-coupled device (CCD) camera. When the state of the nozzle is checked by checking the state of the nozzle by the first sensing unit, a normal solder ball applying operation can be performed. However, when the first sensing unit senses an abnormal state of the nozzle, the nozzle in the abnormal state can be removed by the detachment unit, and the new nozzle stored in the nozzle cartridge unit can be brought to the attachment unit. When the new nozzle is attached to the engaging portion, the alignment of the new nozzle can be performed through the alignment portion.

The second sensing unit may be a charge-coupled device (CCD) camera, an area sensor, a hole sensor, or a capacitance sensor. It is possible to check the abnormal state of the disk, particularly, the abnormal state of the solder ball delivery port by the second sensing unit, and transmit it to the control unit. That is, when the contamination state of the solder ball delivery port is checked and the degree of contamination obstructs the supply of the solder ball (for example, the diameter of the solder ball is less than the predetermined value), a signal indicating that the solder ball delivery port is abnormal To the control unit side. The control unit may display information to the user when the abnormal state of the disk for moving and providing the solder ball S is confirmed, so that the user can provide information for replacing the disk.

For example, the pick and place soldering method will be described in more detail with reference to FIG. 6. As shown in FIG. 6 (a), solder balls S (Step 1) (Step 3) at the required position. The solder ball S located on the upper side is dissolved by laser irradiation, and the solder ball S is dropped to a required position (Step 4). On the other hand, when the nozzle holds two or more solder balls S as shown in FIG. 6 (b), the laser can be sequentially irradiated onto the respective solder balls S. Of course, FIG. 6 shows a case where two or more solder balls S are picked up by the nozzle, but the present invention is not limited to this. It is also possible to include a case where the nozzle picks up one solder ball S and drops the solder ball S at a position where soldering is required Of course

The following technical details and FIG. 7 can be considered when irradiating solder wire, solder paste, and pre-solder, unlike FIG. 6 (Pick and Place).

In such a laser processing apparatus, operation of the laser is required depending on factors to be considered. The size of the heated area by the laser, the prevention of error and the securing of the focus distance for smooth laser soldering even if errors occur, It is necessary to consider the cone angle of the laser in order to prevent it from being cut off or causing flaws to the surrounding components.

Accordingly, as shown in FIG. 7, the size and focal distance of the region heated by the laser can be controlled by adjusting the cone angle and wavelength of the laser having conical shape. In addition, by reducing the cone angle of the laser, scratches due to contact with the peripheral structure can be prevented. In order to adjust the cone angle and wavelength of the laser, the laser processing apparatus according to the embodiment of the present invention may include a laser wavelength adjusting unit and a laser cone angle adjusting unit in the upper laser supplying unit for supplying the laser of the nozzle 16 have.

In addition, considerations such as the cycle period of the laser machining apparatus, the operating temperature, and the temperature sensitivity of the material to be soldered, the contact sensitivity, and the allowable temperature for smooth execution of the next process can be considered together.

Reflow timing considerations in a laser processing apparatus will be described in detail as follows.

First, the thermal load of the soldering object can be considered. The larger the object, the slower the heat transfer, and the higher the thermal conductivity, the more the object can act like a heat sink.

Second, the mass of the solder paste (solder ball S) can be considered. The laser must add enough energy to evaporate the flux and liquefy the alloy. Also, flux steam may affect the heating rate and may be auto-ignited.

Third, the distance to the wetted area can be considered. The longer the distance, the longer the laser irradiation time can be. Because the alloy must be liquid enough to flow across the surface and become wet.

Fourth, joint geometry can be considered. If the joint shape is a complex shape such as a twisted wire, it may take more time for the alloy to be completely wet. Because the alloy must be liquid enough to flow across the surface and become wet.

Fifth, thermal sensitivity can be considered. Parts and solder must be heated rapidly to limit the total calorie absorbed. Excessive heat can be conducted to the surrounding configuration and damage the configuration.

As shown in FIG. 8, since the laser can control the laser power over time, the heating can be profiled to take full advantage of the required heating effect. For point-to-point heating without consideration, the profile can be a single power level at a time. If the cycle time is important and the minimum time is required for the part to fully wet, the laser should be powered high enough to begin reflowing before falling to lower power to maintain the heated area to maintain reflow without overheating Level. ≪ / RTI > The laser may be ramped from one output level to another by changing the output level linearly over time.

This laser soldering process can be automated. E.g. Vision recognition for recognizing a target object in a laser processing apparatus can be performed, and vision recognition and laser soldering can be controlled on the same line. In addition, the control efficiency and workability can be improved by including a linear motor. Further, it is needless to say that the number of the nozzles 16 performing the laser soldering may be two (dual laser bonding head) or more than two so that workability can be improved. In addition, two or more heads including two or more heads and each laser soldering table may correspond to the heads so that work can be performed in parallel. Further, such a laser processing apparatus may include a moving stand including a motor for moving the laser soldering nozzle 16 in two or more directions, although not shown in detail in the drawing, A laser supply part and a solder ball S supply part capable of supplying solder. The nozzle 16 may be rotated by the rotation of the rotary motor so that the laser can be irradiated obliquely to a portion of the object requiring laser soldering. have.

The laser processing apparatus may be manufactured as a desktop type or a robot automation type in which the laser soldering nozzle 16 can be moved by the robot. Further, it may be provided as an automated apparatus as a configuration of an automated system in the manufacturing process line, or may be provided as a stand-alone system. 9, as a voice coil motor (VCM) soldering apparatus of the camera module 20, a voice coil motor terminal (VCM terminal) / yoke terminal and a ceramic multilayer substrate (HTCC substrate, High Temperature Cored Ceramics) using a laser.

Further, the laser processing apparatus according to the embodiment of the present invention may include a control unit to perform control necessary for laser soldering. The control unit can be initiated, embedded systems and program upgrades via external signals, and can be controlled or adjusted via soldering parameter inputs and outputs. The laser processing apparatus according to an embodiment of the present invention may include a display unit for easily grasping the operation state and the control state of the apparatus.

Furthermore, the laser processing apparatus according to the embodiment of the present invention may include a noncontact temperature sensor for measuring the temperature of at least one of the object and the solder. It can also include a feeder for feeding precise solder. Further, the control unit may include two or more selectable soldering profiles, so that laser soldering may be possible without inputting a separate control factor. For example, the laser machining apparatus according to the embodiment of the present invention may have a plurality of soldering profiles, and each laser soldering profile may be divided into three steps and eight steps in order to allow flexible and accurate parameter control. Meanwhile, the control unit of the laser processing apparatus according to the embodiment of the present invention can be provided to select two or more laser head options from among the focal distance, IR temperature detection, and real time soldering quality monitoring.

On the other hand, the laser soldering profile may include the output of the laser, the laser irradiation time, the number of laser irradiation times, and the slope in relation to the laser output and irradiation time.

The laser profile corresponding to the size of the solder ball and the soldering environment can be determined by various combinations of the above four conditions. For example, when the solder ball is large, melting of the solder ball may not be completely performed, so laser irradiation for heating may be performed plural times for melting the soldering. It may be to perform reflow soldering according to the size of the solder ball. Further, when the heating is completed, slow cooling can be carried out. However, when quenching is carried out, cold discharge phenomenon occurs and a crack may occur in the soldering portion. Therefore, slow cooling can be performed during cooling.

Meanwhile, the slow cooling may be performed by continuously reducing the laser output and decreasing the output stepwise. Even if the laser power is continuously reduced by slowing down the laser power, the larger the slope of the laser output and the irradiation time relationship, the more rapid quenching and the similar effect become, so that it can be selectively controlled.

That is, various laser profiles can be selected to form one or more output sections in the soldering process through a combination of the output of the laser, the laser irradiation time, the number of laser irradiation times, and the slope in relation to the laser output and irradiation time.

According to the above-described laser machining apparatus, as shown in Fig. 10, soldering can be applied to electrical connection of various terminals. For example, soldering can be performed smoothly even when the terminals are located on the same plane or at an angle. 11 (a) to 11 (d), the laser machining apparatus according to the embodiment of the present invention can be used for a corner connection, a cavity connection, an all connection ), And the like.

First, a description of an apparatus including the laser processing apparatus nozzle 16 according to the embodiment of the present invention will be described with reference to FIG.

A portion of the apparatus according to the embodiment of the present invention includes an upper base 17 and a lower base 18 and includes a hole disc located between the upper base 17 and the lower base 18. [ The hole disc can be rotated by the rotation axis 6 and includes a plurality of holes so that the solder balls located in each hole can be transferred to the laser transmission channel 14 by rotation about the rotation axis 6. That is, the solder ball S introduced through the solder ball inlet 2 is located in one of the plurality of holes provided in the hole disk, and the solder ball S positioned in one hole of the hole by the rotation of the rotation shaft 6, Can be moved toward the laser transmission channel 14 side.

Here, the solder ball S supplied to the solder ball inlet 2 can be temporarily stored in the reservoir chamber 3 and can be supplied to the solder ball S via the nitrogen gas inlet 11, The solder ball S can be moved to the port 5 and the solder ball S moved to the solder ball S outlet port 5 can be positioned in one of the plurality of holes provided in the hole disk.

The upper base 17 is provided with a structure for rotatably supporting the rotary shaft 6, and the adapter 7 may be included on the upper side. Also, a receiving port 10 and a transmission port 9, which penetrate the upper base 17 and the lower base 18, may be included. The solder ball S moved to the laser transmission channel 14 side can be moved toward the nozzle 16 through the solder ball S outlet channel 12. [

A transparent glass 13 may be provided on the upper side of the laser transmission channel 14 and a laser irradiated via the transparent glass 13 may be irradiated toward the nozzle 16 via the laser transmission channel 14 .

The nozzle 16 may be coupled with a nozzle 16 locking screw provided in the lower base 18. In this manner, the nozzle 16 can be coupled via the lower base 18 and the nozzle 16 lock screw, so that the nozzle 16 can be easily replaced. Although the nozzle 16 lock screw has been described as an example in the embodiment of the present invention, the nozzle 16 and the lower base 18, which allow the nozzle 16 to be replaced, to be. A nitrogen gas inlet 11 (4) for supplying a nitrogen gas to the upper side of the laser transmission channel 14 so that the solder ball S in the nozzle 16 melted by the laser can be discharged to a portion required for laser soldering May be provided.

The nozzle 16 included in the laser processing apparatus according to the embodiment of the present invention may be enlarged and described as an example in FIG.

 In the nozzle 16 shown in Fig. 13, a through hole including a cylindrical portion and a truncated conical portion coupled to the lower portion of the cylindrical portion may be provided. The solder ball S flows into the nozzle 16 via the solder ball S outlet channel 12 and then falls through the cylindrical portion due to gravity. The dropped solder ball S is caught by the truncated conical portion and does not go out of the nozzle 16. The laser is irradiated via the transparent glass 13 to the solder fire in the frustum-shaped portion, and the molten solder ball S is discharged to the outside by the nitrogen gas

A cap may be provided on one side of the solder ball inlet 2 and the cap may be opened only when the solder ball S is moved toward the solder ball inlet 2 in the solder ball S supply chamber where the solder ball S is stored . In addition, the cap provided at the solder ball inlet 2 can be opened so that the solder ball S can be supplied only when the laser processing apparatus according to the embodiment is used.

In addition, although the above-described laser machining apparatus mainly describes only nitrogen gas, it is needless to say that any gas that can be used as an inert gas such as helium gas, argon gas, etc., in addition to nitrogen gas can be used.

Hereinafter, A to F and A 'to F' will be described later with reference to Figs. 14 and 15, in which some processes, which are examples of the laser processing apparatus, are shown in order. The flowcharts (A to F) described in Fig. 14 will be briefly described.

First, after the object is loaded, the object moves to the vision inspection position (A), and then the alignment state, rotation, and placement of the object are detected (B). Then, it is moved to the soldering position (C) and soldered (D) by the laser processing apparatus. Then it is moved to the unloading position (E) and unloaded. When the next object is loaded (F), it moves to the vision inspection position (A) again. It goes without saying that an option to move to the vision inspection position may be added to check the quality of soldering after laser soldering.

The flowcharts (A 'to F') described in Fig. 15 will be briefly described. First, when the soldered object is positioned at the unloading position (A), the soldered object is taken out, the object to be soldered is loaded at the unloading position (B), and then moved to the vision inspection position (C). Next, the alignment state, rotation and placement of the object are detected (D). Then, it is moved to the soldering position (E) and soldered (F) by the laser machining apparatus. As an option that may be added here, the object is moved to a vision inspection position (position) to inspect the quality of soldering after being laser soldered, and after the alignment state, rotation, and placement are detected on the object, And / or if the placement is not normal, the option to be moved to the unloading position and unloaded and loaded again may be added.

14 and 15 is controlled by the control unit and can be more specifically described with reference to Fig. 17 showing a conceptual diagram. Soldering is performed by the machining portion, which includes the head 110. The head 110 may include at least one of a laser beam focusing optical head and a solder ball holder. The machining portion may further include a nozzle for discharging the solder ball. In addition, the controller 200 may determine a predetermined state of the nozzle 16, that is, a state such as contamination or damage, and determine a cleaning or replacement point. Furthermore, the control unit 200 can record the laser output and correct the laser output. Also, the quality inspection of the solder portion, which is the soldered portion under the control of the control portion, can be performed, which can be controlled to discard or collect the solder ball used in the bonding test and defective solder ball defective at the time of manufacture .

It is possible to improve solder wettability by re-melting the solder part by re-examining the solder part which does not meet predetermined quality standards in the quality inspection process, or to remove the solder part by re-dissolution and re-soldering. As another example, it may be classified by the classification device 150. [ The control unit 200 may perform control to correct the laser beam position, the nozzle position, and the vision inspection position. The control unit 200 can control the soldering to be performed by the profile of the laser determined by the combination of the output of the laser, the laser irradiation time, the number of times of laser irradiation, and the slope in the relationship between the output of the laser and the irradiation time.

According to the above-described laser machining apparatus and laser machining apparatus and method, the apparatus or method according to the embodiment of the present invention can include the following configuration. Meanwhile, the inspection described below may include a pre-inspection and a post-inspection performed by the inspection units 120 and 130. In the case of pre-inspection, it is necessary to detect the alignment state including the seating state of the object, that is, the rotation and the placement state, before the soldering is performed, and after the soldering is performed in the case of the second inspection Cracks and pores of the solder portion. As described below, a target object that does not satisfy the second test result quality criterion can be classified as a target object (CM) that satisfies the quality criterion, and resolding is performed for a target object (CM) that does not satisfy the quality criterion .

 First, the laser supplied from the laser supply device may be a laser having a high laser absorption rate depending on the solder material. It may also be a solid state laser, such as a fiber laser or a diode laser (Fiber Laser or Diode Laser). The laser beam generated from the laser generator can be transmitted to the laser soldering head through the optical fiber without a separate optical mirror. This makes it possible to stably supply the laser and perform precise operation during soldering by laser irradiation.

 Second, the laser processing apparatus may include a pick and place soldering head or a jet soldering head including a laser soldering nozzle 16. [ The laser soldering head may include a laser beam focusing optical head, a solder ball (S) supply, and a nozzle 16. In this case, the laser soldering head may be configured as a single head, or a dual head including two heads. But it is needless to say that it can be constituted by a head body including three or more heads. When two or more laser soldering heads are included in this manner, the productivity of the apparatus can be increased.

Third, it may include a Vision Inspection Module (Vision Inspection Module) or a vision inspection stage. By including such a vision inspection module or step, it is possible to perform position inspection, alignment inspection (Pre-Inspection) of the camera module 20 to be soldered, and post-inspection of soldering quality after soldering, can do.

Therefore, 1) a vision inspection module composed of a low magnification and a high magnification lens is mounted 2) Motorized Variable Zoom Lens (1X ~ x18: Max magnification can be increased according to Zoom Lens design), so it can automatically scan small areas in low magnification and high magnification.

Pre-Inpsection and Post-Inclusion can be a single vision inspection module, but they can be configured as separate vision inspection modules to increase productivity (for example, pre-inspection One for the Pre-Inpsection function, and one for the Post-Inclusion function).

In the case where the pre-inspection and the post-inspection are provided by one vision inspection module, the object subjected to the pre-inspection is moved to the position for soldering and is soldered , It can be returned to its previous position and post-inspected. In the case where vision inspection modules are provided for two, that is, one for the pre-inspection function and one for the post-inspection function, there are a pre-inspection module, a laser soldering Modules, and post-inspection modules can be moved, inspected, and soldered in the sequence in which they are placed.

 In addition, the soldering quality can be monitored in real time to control the parameters, or to further include an infra-red inspection device for post-inspection such as internal cracking and pore inspection of the soldered area .

Fourth, it may further include a sorting device capable of sorting objects that do not meet the soldering quality criteria required after the post-inspection.

 Fifth, the post-inspection may further include a repair device capable of repairing an object that does not meet the soldering quality criteria required after the post-inspection. Such a repair device can re-melt the solder to re-melt the laser to improve solder wettability or remove solder and resold. When soldering solder is removed, it can be automatically removed by using a mechanical tool such as a pin, or can be remelted using a laser to inhale automatically.

 Sixth, a cleaning device including a dust collecting device for removing dust and foreign substances may be further included for quality control after soldering. The cleaning device may further include at least one of a dry air blowing device, a CO2 snow cleaning device, and an inert gas blowing device.

Seventh, depending on the kind of substrate to be soldered, it may further include pre-pre-soldering. In addition, a laser soldering head is additionally included to improve soldering quality and maximize productivity.

Although not described in the above-described embodiment, it can also be used for joining in which a soldering material (solder ball S) is not required. That is, the supply of the solder ball S as a solder ball may be optional, and in a laser processing apparatus in which the supply of the solder ball S is not performed, the bonding between the metals, the bonding between the metal and the resin, Can be applied. Depending on the nature of the object to which the laser is to be irradiated, the base material can be bonded with different conditions such as the irradiation intensity of the laser, the irradiation time, and the irradiation period.

16, which illustrates the shape of the jig as an embodiment, an additional laser processing method and apparatus will be described. The laser processing apparatus may include a plurality of nozzles 16 described above. That is, the solder ball S may be provided by the hole disc 8 so as to correspond to the plurality of nozzles 16 when the solder ball S is supplied to the nozzle 16 side by the hole disc 8. That is, not only the nozzles 16 of one of the plurality of nozzles 16 but also the motions provided at the same time can be provided. For example, according to the above-described movement, the solder ball S may be provided to the dual laser bonding head side and may be ejected from the head by the ejection of the nitrogen gas after being dissolved by the laser. This process can be done simultaneously on the two heads, so the soldering time can be shortened. As an example, a dual laser bonding head may be provided, and a greater number of heads may be provided to increase the work efficiency.

And, the laser processing apparatus may further include a jig. The jig may be a rotating fixture jig. A fixture jig channel including a plurality of jigs employing the rotary movement system may be provided. For example, a three fixture jig channel may be provided in which three or more jigs are moved in a rotational movement manner. The fixture jig channel may include a plurality of objects to be subjected to the soldering operation or may be seated. Here, when performing at least one of soldering and bonding at two or more points of a target object, if soldering or bonding is performed at one of the two points existing in one target object, The jig can be moved so that laser processing can be performed at the remaining points of the two points. Here, the movement of the jig may be a rotation, a movement by a linear movement, or a movement by a combination of the rotation and the linear movement. When the movement is completed, soldering or bonding may be performed on the remaining points.

As a specific example, a laser bonding head 1 performs bonding on a fixture jig channel 1 and a laser bonding head 2 is bonded on a fixture jig channel 1, 3). ≪ / RTI >

When the heads (laser bonding head 1 and laser bonding head 2) complete bonding at each position, the first head can perform a bonding operation on the second jig.

When the first jig is positioned at the unloading position deviated from the laser irradiation position, the object to be bonded can be taken out. A new object is positioned on the first jig portion from which the object has been taken out, and can wait for the joining operation.

When the joining operation is completed with respect to the object placed in the third jig, the object is taken out and a new object is placed on the third jig from which the object has been taken out, so that the joining operation can be waited.

The first head can perform the bonding operation to the object positioned on the first jig when the bonding operation to the object positioned on the second jig is completed.

When the second jig is located at the unloading position, the object to be bonded is taken out, and a new object is placed on the second jig, so that the joining operation can be waited for.

When the object of the second head is joined to the object on the third jig, the second head can perform the joining operation to the second jig. The above joining operation is repeatedly performed, and laser processing can be performed.

More specifically, each jig 30 in which a plurality of objects are disposed at a position where the object is loaded or unloaded can be mounted on the first jig. Each jig in which a plurality of objects are arranged at a position where the object is loaded or unloaded can be mounted on the second jig. Further, each jig in which a plurality of objects are arranged at a position where the object is loaded or unloaded can be mounted on the third jig.

When the first jig is positioned at the joining operation position, the vision inspection unit can check whether the target object to be worked on is properly operated, such as alignment, rotation, and placement.

The first head can bond the joint surfaces formed on the respective objects disposed on the first jig. While the first jig is performing the joining operation, the vision inspection unit can check whether or not the respective objects arranged in the third jig are in an aligned state, rotated, arranged, and so on.

The joining surfaces formed on the respective objects disposed on the second jig portion of the second head can be joined. When the joining operation of one surface of each object disposed on the first jig is completed, each jig included in the first jig can move to the joining operation position of the other surface. The movement may be rotation.

The vision inspection unit may check the alignment state, arrangement, etc. of each object positioned on the first jig while the bonding operation is performed on the object disposed on the third jig.

The object on the first jig portion moved by the first head may be bonded to the other surface. When the joining operation is completed, the first jig can be moved to the unloading position. When the joining is completed, the object is taken out on the first jig and a new object can be placed on the first jig.

When one of the two surfaces to be joined of the respective objects disposed on the third jig is completed, the respective jigs included in the third jig can be moved to the joining operation position on the other surface.

After that, the vision inspection unit can check the alignment, arrangement, etc. of each object rotated in the third jig. Then, the second head can be joined to the other surface of each object disposed on the third jig.

During the bonding operation of the object placed on the third jig, the vision inspection unit inspects the alignment state, rotation, arrangement, etc. of each object disposed on the second jig, Can be inspected.

The first head joins one surface of each object disposed on the second jig and the first jig where the object to be newly joined is disposed can wait until the operation of the second jig is completed. Therefore, the following process can be repeated.

Each object in the fixture jig channel can perform a post-inspection with one or two vision inspection modules / units.

On the other hand, the nozzle 16 presses the inner surface of the nozzle 16, that is, the nozzle 16 (not shown), which is in contact with the molten steel during the process of discharging the molten material (solder ball S) May be contaminated. The contamination includes foreign matter generated during the process of heat damage due to the temperature at the time of dissolving the foreign materials and gas (nitrogen, etc.) which is not discharged and remains and fixed, foreign matter generated on the surface by repetitive discharge of gas can do. If the foreign matter is accumulated, there is a possibility that the laser processing efficiency is affected, resulting in an unfixed result. Accordingly, as a process of checking the condition and quality of the nozzle 16, it is necessary to clean it at a predetermined period or intermittently. It is necessary to measure the degree of contamination and to measure the degree of contamination In the cycle, foreign matter, dust, and the like may be removed by a nozzle cleaning unit in a state where the cleaning area is moved to be washed or the object is not positioned. And may be cleaned by a physical or chemical method. A configuration for performing the cleaning may include a vision unit, a nozzle monitor 16, and the like.

Further, when the laser is irradiated at a predetermined laser irradiation intensity corresponding to the degree of laser processing, the laser power (energy) irradiated by a laser power (energy) detection unit ), And when a difference from the predetermined laser irradiation intensity is generated, the laser intensity can be adjusted to be compensated for by the difference. Therefore, a control unit (not shown) and a laser intensity (energy output) detection unit are connected to each other to receive laser power (energy) from a laser power detection unit The intensity of the irradiated laser can be increased or decreased in comparison with the predetermined laser intensity based on the information obtained.

The laser machining apparatus further includes a waster ball collecting unit for discarding or collecting the solder ball S used in the bonding test and the defective solder ball S defective at the time of manufacturing can do. For example, the solder ball S may be collected and discarded in the process of being moved by the waster ball collecting unit before being discharged from the nozzle 16 immediately after the solder ball S is provided to the laser machining apparatus.

The apparatus further includes a calibration plate for correcting a position of a laser beam, a position of a nozzle 16, and a position of a vision inspection. The controller (not shown) The calibration plate connected to the control unit immediately detects one or more of the absolute coordinates and the relative coordinates of the laser beam, the nozzle 16 and the vision inspection, A position of a nozzle 16, a position of a nozzle 16, and a position of a vision inspection are corrected by comparing the actual beam position, the nozzle 16 position, and the vision inspection position with each other, It can be moved to converge to the set value. Furthermore, if the laser irradiation step is not located at the preset value, the laser irradiation step is not performed, thereby preventing malfunction related to the laser irradiation.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.

1: cap
2: Solderball entrance
3: Storage chamber
4: Nitrogen gas inlet
5: Solder ball outlet port
6:
7: Adapter
8: Hall disc
9: Transmission port
10: Receiving port
11: Nitrogen gas inlet
12: Solderball outlet channel
13: Clear glass
14: Laser transmission channel
15: Nodular Screw
16: Nozzle
17: Upper base
18: Lower base
20: Camera module
21: Lens module
22: Sensor module
100: laser processing device
110: head portion
111: Yes payment
120: First inspection section
130:
140:
150: Classifier
200:
300: jig
400: Cleaning device
CM: object

Claims (31)

Loading the object into the jig,
The method includes detecting and performing a first inspection of an alignment state including rotation and disposition of a target object loaded on the jig,
The jig is moved to a soldering position,
The object is soldered by a laser,
Unloading the soldered object,
Wherein the second inspection by the inspection unit is selectively performed by moving the object to the inspection unit to check the quality of the soldering.
The method according to claim 1,
Wherein inspection of the quality is performed by vision inspection.
The method according to claim 1,
Wherein the quality inspection is an inspection for detecting whether internal cracks and pores of the soldering area are generated.
The method according to claim 1,
Wherein the laser is a solid laser comprising at least one of a fiber laser or a diode laser.
The method according to claim 1,
Wherein the soldering is performed by a soldering head comprising a laser beam focusing optical head, a solder ball feeder, and a nozzle,
The method according to claim 1,
Wherein the soldering is performed by a pick and place soldering head or a jet soldering head including at least one head.
The method according to claim 1,
Wherein the soldering further comprises cleaning or replacing the solder ball by inspecting the predetermined state and quality of the nozzle for discharging the solder ball,
The method according to claim 1,
Wherein the soldering further comprises recording an output of the laser and correcting the laser output.
The method according to claim 1,
Wherein the inspection by the inspection unit can be performed at the same time as the soldering is performed.
The method according to claim 1,
Wherein the inspection of the quality comprises discarding or collecting solder balls used in the bonding test and defective solder balls defective at the time of manufacture.
The method according to claim 1,
Further comprising sorting the object by a predetermined quality criterion after the second inspection (Post-Inspection).
The method according to claim 1,
For solder parts that do not meet the quality criteria predetermined by the post-inspection,
Reclamating and melting the laser to improve solder wettability, or removing and re-soldering through remelting.
The method according to claim 1,
Further comprising a cleaning step for removing dust and foreign matter after the second inspection step,
Wherein the cleaning step performs at least one of dry air blowing, CO2 snow cleaning, and inert gas blowing to provide dry air.
The method according to claim 1,
Wherein the soldering performed on the object includes post-soldering and pre-soldering.
The method according to claim 1,
And correcting at least one of a laser beam position, a nozzle position at which the solder ball is ejected, and a vision inspection position during the soldering process.
A control unit;
A jig to which an object is loaded;
A first inspection unit for detecting and performing an inspection for an alignment state including rotation and disposition of a target object loaded on the jig;
A moving unit for loading and unloading the object to the jig;
A processing unit for soldering the object by a laser;
And a second inspection unit that selectively performs a second inspection (Post-Inspection) on the object under the control of the control unit.
18. The method of claim 16,
And said second inspection is performed by vision inspection.
18. The method of claim 16,
Wherein the second inspection is a test for detecting whether internal cracks and pores are generated in the soldering region.
18. The method of claim 16,
Wherein the laser is a solid laser comprising at least one of a fiber laser or a diode laser.
18. The method of claim 16,
Soldering is performed by the machining portion,
Wherein the machining portion includes a soldering head including a laser beam focusing optical head, a solder ball supply device, and a nozzle for discharging the solder ball.
18. The method of claim 16,
Wherein the soldering comprises a laser soldering nozzle comprising a Pick and Place Soldering Head or a Jet Soldering Head including at least one head.
18. The method of claim 16,
Wherein the controller controls the cleaning or replacement by checking the predetermined state and quality of the nozzle for discharging the solder ball.
18. The method of claim 16,
Wherein the control section records the output of the laser and corrects the laser output.
18. The method of claim 16,
And inspection by the inspection unit is performed at the same time as the soldering is performed.
18. The method of claim 16,
By the control of the control unit, the quality inspection is controlled to discard or collect the solder balls used in the bonding test and defective solder balls defective at the time of manufacture.
18. The method of claim 16,
Further comprising a sorting device for sorting the object by a predetermined quality criterion after the second inspection (Post-Inspection).
18. The method of claim 16,
A solder portion which does not meet the quality criterion predetermined by the second inspection (Post-inspection) under the control of the control portion,
The laser is resampled and melted to improve the wettability of the solder, or remelting is performed to remove the solder and resoldering is performed.
18. The method of claim 16,
Further comprising a cleaning device for removing dust and foreign matter after the post-inspection step,
Wherein the cleaning apparatus comprises at least one of a Dry Air Blowing apparatus, a CO2 Snow Cleaning apparatus, and an inert gas blowing apparatus that provide dry air.
18. The method of claim 16,
Wherein the soldering performed on the object further includes a pre-soldering step for performing pre-soldering before post-soldering.
18. The method of claim 16,
Wherein,
And performs control to correct the position of the laser beam, the position of the nozzle, and the position of the vision inspection.
18. The method of claim 16,
Wherein,
And the profile of the laser is determined by a combination of the output of the laser, the laser irradiation time, the number of times of laser irradiation, and the slope in the irradiation time relationship with the output of the laser.

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