TWI677393B - Jig assembly for laser processing apparatus,and method and apparatus comprising the same - Google Patents

Abstract

The invention discloses a clamp assembly and a laser processing device including the clamp assembly. Provided is a jig assembly including a jig equipped with a mounting portion capable of mounting an object, and a close-contact portion that is combined with the jig and keeps the object fixed to the mounting portion. The contact force including the first contact portion and the second contact portion that generate the bonding force is achieved by the bonding force. The contact between the first contact portion and the second contact portion is achieved by the guide portion including the first guide portion and the second guide portion. Guide to achieve.

Description

Jig assembly, laser processing method and laser processing device including the same

Embodiments of the present invention relate to a clamp assembly and a laser processing device including the clamp assembly.

Generally, laser processing methods and apparatuses perform processing for drilling, marking, soldering, and the like using lasers with various electronic components as targets. Among them, soldering performed by a laser processing method and device as a step of electrically connecting electronic components by using a conductive material (for example, a solder ball) can be applied to the manufacture of various electronic products.

[Xizhi technical literature]

[Patent Literature]

(Patent Document 1) Korean Granted Patent Gazette No. 10-0332378 (2002.03.30)

Embodiments of the present invention relate to a jig assembly, and to a shape of a mounting portion in a structure of an object fixedly placed in the jig, a pressing force for fixing the object, and a component laser processing device. A laser processing apparatus and method that performs welding by laser and includes a visual inspection module or step for determining a welding position and a laser welding module or step, thereby being fast and efficient.

The present invention provides a jig assembly including: a jig equipped with a placement part capable of placing an object; and an abutting part combined with the jig and keeping the object fixed to the placement part, wherein the combination of the jig and the abutment part is by The contact force including the first contact portion and the second contact portion that generate the bonding force is achieved by the bonding force. The contact between the first contact portion and the second contact portion is achieved by the guide portion including the first guide portion and the second guide portion. Guide to achieve.

Preferably, the first contact portion and the second contact portion may be respectively located in the close contact portion and the clamp.

Preferably, one or more of the first contact portion and the second contact portion may be magnets.

Preferably, the first guide portion and the second guide portion may be respectively located in the close contact portion and the clamp.

Preferably, one of the first guide portion and the second guide portion may be a pin shape, and the other may be a hole shape corresponding to the pin shape.

Preferably, the hole form may be a non-through hole.

Preferably, the hole state can be a through hole, and a part of the pin state is penetrated and the exposed portion is combined with the fixing pin, so as to maintain the combined state of the abutting portion and the clamp.

Preferably, the placement portion may include a placement portion that is open in more than one direction to prevent a part of the object.

Preferably, the placement portion may include a storage portion capable of accommodating a portion protruding from the placement surface side of the object.

Preferably, the placement portion may include a fixing portion that locks the object from two or more directions when the object is placed.

Preferably, the gripping portion of the placement target body may include a gripping hole formed to prevent interference with the placement portion.

The invention provides a laser processing method, comprising the steps of: loading an object into a jig, sensing the alignment state of the object loaded in the jig (Detect) and first inspection (Pre-Inspection), and moving the jig to Welding position, unloading the object by laser welding, and in order to check the quality of the welding, the object is moved to the inspection section and a second inspection (Post-Inspection) performed by the inspection section is selectively performed.

Preferably, the second inspection (Post-Inspection) performed by the inspection unit may be performed simultaneously with the execution of the welding step.

Preferably, the step of inspecting the quality may be an inspection to sense whether internal cracks and pores in the welding area have occurred.

Preferably, the second inspection (Post-Inspection) performed by the inspection unit may be performed simultaneously with the execution of the welding step.

The present invention provides a laser processing device, which includes a first inspection unit that senses (Detect) and first inspects (Pre-Inspection) a moving state of an alignment state of an object mounted on a jig, and loads the object. To the jig or unload the object, the second inspection section, and selectively perform a second inspection (Post-Inspection) and a jig assembly for the object, wherein the jig assembly includes a jig equipped with an object capable of being placed therein A mounting portion of the body; and a close contact portion that is combined with the clamp and keeps the object fixed to the mounting portion, wherein the combination of the clamp and the close portion includes a first contact portion and a second contact portion that generate a bonding force. The bonding force generated by the contact portion is achieved, and the contact between the first contact portion and the second contact portion is achieved by being guided by the guide portion.

Preferably, the object can be welded by laser, and the welding step uses the slope of the output of the laser, the laser irradiation time, the number of laser irradiations, and the correlation between the laser output and the irradiation time. The combination determines the laser's specification implementation.

Preferably, the object can be welded by a solder ball sprayed from the nozzle, and if the abnormal state of the nozzle is detected, it is replaced, and the laser processing device further includes: a sensing section for detecting whether the Pollution and deformation.

Preferably, the laser processing apparatus may further include: a pre-welding section, which performs pre-soldering before performing post-soldering on the object.

Embodiments of the present invention include a visual inspection module or step and a laser welding module or step, thereby enabling a fast and efficient laser processing device and method.

1‧‧‧ cover

2‧‧‧solder ball entrance

3‧‧‧Storage Chamber

4.11‧‧‧Nitrogen inlet

5‧‧‧ solder ball outlet

6‧‧‧rotation axis

7‧‧‧ adapter

8‧‧‧ missed

9‧‧‧Transport port

10‧‧‧ receiving port

12‧‧‧Solder Ball Exit Channel

13‧‧‧ clear glass

14‧‧‧laser transmission channel

15‧‧‧Locking screw

16‧‧‧ nozzle

17‧‧‧ Upper base

18‧‧‧ lower base

20‧‧‧ Camera Module

21‧‧‧ lens module

22‧‧‧Image Sensor Module

30, 210, 210a ‧ ‧ ‧ fixture

50‧‧‧ Object

211‧‧‧First contact

212, 212a‧‧‧First guide

220, 220a‧‧‧adherent department

221‧‧‧Second contact section

222, 222a‧‧‧Second Guide

223‧‧‧Fixed pin

230‧‧‧Relocation Department

231‧‧‧ Containment Department

232‧‧‧holding hole

233‧‧‧Fixed section

234‧‧‧First placement department

235‧‧‧Second placement section

CD‧‧‧ Cool

PH1‧‧‧Pre-heating

PH1‧‧‧ after heating

S‧‧‧Solder Ball

FIG. 1 is a diagram illustrating a camera module according to an embodiment of the present invention.

2 and 3 are diagrams showing a laser processing method according to an embodiment of the present invention.

FIG. 4 is a diagram showing a camera module as a welding target body according to an embodiment of the present invention.

FIG. 5 is a diagram illustrating a heating step according to an embodiment of the present invention.

FIG. 6 is a diagram illustrating a state in which a solder ball is moved by a nozzle according to an embodiment of the present invention.

FIG. 7 is a diagram showing a cone angle and a wavelength of a laser according to an embodiment of the present invention.

FIG. 8 is a diagram showing a laser energy output according to an embodiment of the present invention.

FIG. 9 is a diagram showing a voice coil motor (VCM: Voice Coil Motor) soldering device used in a camera manufacturing step according to an embodiment of the present invention.

FIG. 10 is a diagram showing the use of welding in connection of terminals according to an embodiment of the present invention.

FIG. 11 is a diagram showing a welding joint by an embodiment of the present invention.

Fig. 12 is a diagram showing a laser processing apparatus including a nozzle according to an embodiment of the present invention.

Fig. 13 is an enlarged view showing a cross section of a nozzle according to an embodiment of the present invention.

14 and 15 are diagrams showing a welding method according to an embodiment of the present invention.

Fig. 16 is a diagram showing a jig according to an embodiment of the present invention.

Fig. 17 is an exploded view showing a jig assembly according to an embodiment of the present invention.

FIG. 18 is a diagram illustrating an arrangement of a contact portion and a guide portion formed in a close contact portion according to an embodiment of the present invention.

FIG. 19 is a diagram showing that a jig and an abutting portion are combined by a fixing pin according to another embodiment of the present invention.

FIG. 20 is a diagram illustrating a mounting portion in which an object according to an embodiment of the present invention is mounted.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, these are merely examples, and the present invention is not limited thereto.

In the course of describing the present invention, if it is determined that the specific description of the conventional technology related to the present invention will cause unnecessary confusion to the gist of the present invention, the detailed description thereof will be omitted. Moreover, the terms hereinafter are terms defined in consideration of their functions in the present invention, and may be different according to the user, the intention or habits of the user, and the like. Therefore, these terms should be defined according to the contents throughout the specification.

The technical idea of the present invention is determined by the scope of the patent application. The following embodiments are merely a means for effectively explaining the technical idea of the present invention to persons having ordinary knowledge in the technical field to which the present invention belongs.

With the laser processing apparatus and method according to the embodiments of the present invention, marking, drilling, welding, soldering, and the like can be performed on a laser processing object. Hereinafter, the laser processing apparatus and method of this invention are demonstrated as an example which performs welding. That is, the laser processing apparatus may be used as a welding apparatus, and only steps for welding may be performed. Hereinafter, the laser processing apparatus may be described as a welding apparatus in the above-mentioned cases.

Of course, this laser processing object can be applied to the manufacture of various electronic components including various electronic components of the camera module 20. Hereinafter, the object to be welded will be described using a camera module (reference numeral 20 in FIG. 1) as an example.

The camera module 20 described below can of course be used in various portable devices such as smart phones and tablet computers, and can be placed and used in: home appliances including smart TVs, home appliances, vehicles, or security cameras ( (CCTV), various medical devices, and other devices that require optical elements. For example, when the camera module 20 is used in a car, it can be applied to various electronic components, and when it is used in a home appliance, it can be applied to a turning case, a flat screen monitor, and a printed circuit board (PCB). ), Photosensors, etc. And in a portable device, it can be applied to a charge coupled device (CCD: Charged Coupled Device) camera module 20, a USB connection terminal, a battery terminal, and the like.

In addition, in the welding process described below, the movement of the object toward or from the jig may be achieved by a moving part (not shown). The moving part can hold the object by pick and place. Alternatively, the object can be attached by magnetism, or can be produced by Suction attracts the object. It can be formed as a robotic arm that moves by one or more of the methods of holding, adhering, and adsorbing.

Furthermore, the laser processing device included in the laser processing device according to the embodiment of the present invention can be applied not only to a variety of steps such as welding, soldering, bonding, etc., in addition, the material for performing each step can also be applied. Polymer, metal, dielectric, semiconductor and many other materials.

First, FIG. 1 is a diagram illustrating a configuration of a target body. The camera module 20 may include a lens module (Lens Actuator) 21 and an image sensor module 22.

The lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover (Lens Cover), a voice coil motor (VCM: Voice Coil Motor) driving unit, a holder (Holder), and an infrared filter (IR Filter) )Wait. And, the image sensor module 22 may include a semiconductor sensor chip, an anisotropic conductive film (ACF), a flexible printed circuit board (FPCB), and the like.

Specifically, the camera module 20 or the compact camera module 20 may include a lens module 21 (Module Lens), an autofocus actuator (AF Actuator), and an image stabilization device (Optical Image Stabilizer), Image Sensor, AF Driver, PCB, FPCB, Socket, etc. The lens module 21 may include a plurality of lenses, such as imaging lenses (Imaging Lens) for imaging, and may include a support body for supporting the plurality of lenses, and an infrared filter (IR Filter) may be included in the plurality of lenses. On one side, the IR filter may be supported by a support. Moreover, the image sensor may be included in the image sensor module 22, and the image sensor module 22 may include a sensitivity enhanced micro lens array (Sensitivity Improving MLA), a CCD, or a CMOS.

Here, the image sensor is a sensor that converts a captured image into an electrical signal, and a plurality of lenses play a role in gathering the image. In addition, the PCB plays a role of supporting and bonding the image sensor wire and a path capable of outputting the electrical signals of the sensor to the outside. The FPCB includes a direct connection to an external backend chip. The role of the connecting line.

Next, FIG. 2 is a diagram schematically illustrating manufacturing steps of the camera module 20 according to the embodiment of the present invention.

The manufacturing steps of the camera module 20 according to the embodiment of the present invention include the steps of manufacturing the lens module 21; the steps of manufacturing the packaging module by the lens module 21 manufactured by packaging; and further completing the packaging Module to manufacture the camera module 20.

Specifically, the manufacturing steps of the camera module 20 include processing, assembly, and inspection steps of the camera module 20, and more specifically, single lens injection, single lens cut, single lens coating (Coat), and single lens defects Inspection, lens assembly, lens performance inspection, lens holder assembly. The manufacturing steps of the package module may include wafer singulation (Wafer Saw), die attach (Die Attach), wire bonding (Wire Bond), cleaning (Clean) and lens holder mounting (Lens Holder Mount). Furthermore, the packaging module further completes the steps including Lens Pre-Ass'y, Focus UV Lock, Sensor Test, FPCB Attach, and Protective Case ( Case) assembly and discharge inspection.

In addition, with reference to FIG. 3, the manufacturing steps of the camera module 20 of a mobile device for a smart phone and a mobile phone will be specifically described as follows.

)，切割所提供的晶圓而準備感測器芯片(

)，將準備的感測器芯片貼附到印刷電路板(PCB)(

)，在用金線(Gold Wire)連接感測器芯片與印刷電路板(

)之後，將透鏡機構安裝在上部(

)。接下來分離為單獨的相機模組20(

)之 後，接合FPCB(

)，旋轉模組並設置焦點(Focus Setting)(

)。接下來，在藉由環氧樹脂(Epoxy)固化固定模組的焦點之後，將經由相機模組20(CM模組)的光照射到測試圖(Test Chart)上而檢查畫像及色相(

)並進行設置(

)。 First, a wafer (Wafer) for manufacturing a sensor chip is provided (

), Dicing the wafer provided to prepare the sensor chip (

), Attach the prepared sensor chip to the printed circuit board (PCB) (

), Using a gold wire (Gold Wire) to connect the sensor chip and the printed circuit board (

), Install the lens mechanism on the top (

). Then separate into separate camera modules 20 (

), Then join the FPCB (

), Rotate the module and set the focus (Focus Setting) (

). Next, after the focus of the fixed module is cured by Epoxy, the light passing through the camera module 20 (CM module) is irradiated onto the Test Chart to check the image and hue (

) And set (

).

In the above steps, a laser processing device (Laser Soldering Apparatus) can be used in the steps such as FPCB Attach, Case assembly, and the like. In the FPCB mounting and protective shell assembly steps, in order to connect the terminals, soldering is required, that is, a soldering step, and the laser processing device included in the embodiments of the present invention can be used in these processes.

As shown in FIG. 4, such a laser processing device can be used in the camera module 20 for two-side soldering or three-side soldering. In the case of double-sided welding, 6 to 8 points soldering can be performed on the upper surface of the camera module 20, and 6 to 8 point welding can be performed on the lower surface opposite to the upper surface ( 6 ~ 8 points soldering). In addition, in the case of three-sided welding, welding can be performed by covering 16 points on three surfaces as a whole. In this case, the camera module 20 may be an optical image stabilizer (OIS: Optical Image Stabilizer) camera module 20.

Referring to FIG. 5, the laser welding process performed by the laser processing apparatus as described above will be described below.

First, a laser can be irradiated to a solder joint to perform a Pre-Heat PH1 step. The area irradiated by the laser emits heat, for example, emits planar heat such as circles, quadrangles, and rings. Next, heat is transferred to the surrounding area, which can increase the temperature. Then, a solder ball S (solder ball) can be supplied and a Post-Heat PH2 process can be performed by means of laser. Next, the welding process is performed after cooling down the CD. Here, if necessary, the Pre-Heat PH1 step may not be performed. After the solder ball S (solder ball) supply, Post-Heat PH2 step and Cool Down CD process, the welding process is completed.

When a laser welding device uses a welding wire, the configuration of the device and the laser irradiation method may be different depending on whether the solder ball S is used or the solder paste is used.

In particular, in the case of using the solder ball S, as shown in FIG. 6, a pick and place welding method can be adopted: pick the solder ball S and move it, place the solder ball S at a desired position, and The laser beam is irradiated on the solder ball S, and the solder ball S is melted and dripped, and then joined.

Further, a solder jetting method can be adopted: the solder ball S is moved by the nozzle to melt it inside the nozzle, and then jetting is performed.

Furthermore, the nozzle can be replaced if an abnormal state is detected. The nozzle may further include a sensing portion for detecting whether or not the abnormal state including contamination and deformation is present. The sensing portion may include a first sensing portion and a second sensing portion.

The first sensing unit is a sensor for confirming the state of the nozzle, and may be a charged-coupled device (CCD) camera. The first sensing unit can check the state of the nozzle, and then perform a normal solder ball application operation when the nozzle state is not abnormal. However, if the abnormal state of the nozzle is detected by the first sensing unit, the nozzle in the abnormal state can be detached by the unloading unit, and a new nozzle stored in the nozzle cartridge can be taken out and attached. At the junction. If the new nozzle is attached to the joint portion, the new nozzle can be aligned by the Alignment portion.

In addition, the second sensing portion may be a charge-coupled device (CCD) camera, an area sensor, a hall sensor, or a capacitance sensor. The second sensing unit can confirm the abnormal state of the disk, especially the abnormal state of the solder ball transfer port, and send it to the control unit. That is, confirm the contamination status of the solder ball transfer port. The degree of supply of the solder ball (for example, when the diameter in the solder ball transfer port is less than a preset value), a signal indicating the abnormal state of the solder ball transfer port can be sent to the control unit. If the control section confirms that the disk that moves and provides the solder ball S is in an abnormal state, the result can be displayed to the user to provide a message that enables the user to replace the disk.

As an example, the pick-and-place welding method will be described in more detail with reference to FIG. 6. As shown in FIG. 6 (a), one or more prepared solder balls S (step 1) are picked up by a nozzle (step 2) Place it on the upper part of the position to be welded (step 3). The solder ball S located on the upper part is melted by laser irradiation and dripped to a position where the solder ball S is required (step 4). In addition, as shown in FIG. 6 (b), when two or more solder balls S are picked up by the nozzle, a laser can be sequentially irradiated to each solder ball S. Of course, FIG. 6 illustrates a case where the nozzle picks up two or more solder balls S, but it is not limited to this, and may also include a case where one solder ball S is sucked and dropped to a position where welding is required.

The following technical content and Fig. 7 are different from Fig. 6 (Pick and Place) and can be considered in the case of irradiating welding wire, solder paste, and preset solder.

In such a laser processing apparatus, it is necessary to perform a laser operation in accordance with the factors to be considered. It is necessary to consider the following: regarding the size of heated area by laser; error prevention; and ensuring the focus distance that enables laser welding to be performed smoothly even if an error occurs; The cone angle of the laser that is blocked by the surrounding components or causes defects to the surrounding components during the irradiation of the laser.

Therefore, as shown in FIG. 7, the size and focal length of the area heated by the laser can be adjusted by adjusting the cone angle and wavelength of the laser having a conical shape. In addition, by reducing the cone angle of the laser, it is possible to prevent defects caused by the contact of surrounding components. To adjust the circle of this laser The cone angle and the wavelength, the laser processing apparatus according to the embodiment of the present invention includes a laser wavelength adjustment section and a laser cone angle adjustment section on the upper laser supply section that supplies the laser through the nozzle 16.

Not only this, but also comprehensively consider the cycle time, working temperature of the laser processing device, the temperature sensitivity of the material being welded, the contact sensitivity, the allowable temperature required for the successful execution of the next step, and so on.

In a laser processing apparatus, considerations regarding reflow timing are specifically as follows.

First, the thermal load of the object to be welded can be considered. The larger the object, the slower the heat conduction, and the object with a higher thermal conductivity can play a role similar to a heat sink.

Second, the quality of the solder paste (solder ball S) can be considered. This is because the laser must add enough energy to evaporate the flux and liquefy the alloy. Also, because the flux vapor affects the heating rate and may also spontaneously ignite.

Third, the distance from the wetted place can be considered. The longer the distance, the longer the laser exposure time may be. This is because the alloy needs to be in a liquid state capable of flowing laterally across the surface and wetting it.

Fourth, consider the joint geometry. This is because in a case where the shape of the weld seam is a complicated shape such as a stranded wire, it may take longer to completely wet the alloy. Because the alloy needs to be in a liquid state that can flow across the surface and wet it.

Fifth, thermal sensitivity can be considered. Parts and solder must be heated quickly to limit the total heat absorbed. This is because excessive heat may be conducted to surrounding structures and damage the surrounding structures.

As shown in FIG. 8, the laser power of the laser can be controlled according to time, so heating can be standardized to be able to apply the required heating effect to the maximum extent. In the case of point-to-point heating without consideration, the profile may be a single power level at a time. In the case where the cycle time is important and the minimum time is required until the component is completely wet, in order to maintain the heated area to the extent that overheating does not occur, it can be applied sufficiently high enough to be able to start reflow before lowering to lower power Power level. The laser output level can also be changed linearly according to the passage of time, thereby ramping from one output level to another.

Such a laser welding step can be automated. For example, the laser processing device can realize visual recognition for identifying an object, and can be controlled so that the visual recognition and laser welding can be performed on the same line. In addition, the use of a linear motor can improve control efficiency and workability. Also, the welding head of the nozzle 16 that performs laser welding may include two (dual laser bonding heads) or more, so that the operability can naturally be improved. In addition, a welding table that includes two or more welding heads and realizes each laser welding includes two or more corresponding to the welding heads, so that operations can be performed in parallel. Furthermore, although not shown in detail using the drawings, such a laser processing device may of course include a mobile station including a motor capable of moving in two or more directions, and may include a laser for supplying a laser A supply unit and a solder ball S supply unit capable of supplying solder. In addition, a rotary motor capable of rotating the nozzle 16 of the laser processing apparatus may be included. The nozzle 16 is rotated by the rotation of the rotary motor, so that the target body can be irradiated with the laser obliquely at a portion requiring laser welding.

The laser processing apparatus may be manufactured in a table type or a robot automation type capable of moving the laser welding nozzle 16 by means of a robot. Furthermore, naturally, it can be provided as an automatic device as a configuration of a system automated on a manufacturing line, or it can be provided as a stand-alone system. Furthermore, as shown in FIG. 9, the voice coil motor (VCM: Voice Coil (Motor) welding equipment, and laser-coated VCM Terminal / Yoke terminals and ceramic multilayer substrates (HTCC substrates, High Temperature Coried Ceramics) can also be used as welding equipment.

And, the laser processing apparatus according to the embodiment of the present invention may include a control unit to further perform control required for laser welding. The control part can realize the start-up, the built-in system and program upgrade by external signals, and can also control or even adjust the welding parameter input / output. The laser processing apparatus according to the embodiment of the present invention may include a display section for easily grasping an operation state and a control state of the apparatus.

Further, the laser processing apparatus according to the embodiment of the present invention may include a non-contact temperature sensor capable of measuring the temperature of at least one of the object and the solder. And, a feeder for performing accurate solder feeding may be included. In addition, the control unit may include two or more optional welding profiles (profiles), so that laser welding can be performed without inputting additional control factors. For example, a laser processing apparatus according to an embodiment of the present invention may have three welding specifications, and each laser welding specification may be divided into three steps and eight steps in order to enable flexible and accurate parameter control. In addition, the control part of the laser processing apparatus according to the embodiment of the present invention may provide two or more laser welding head options capable of selecting a focal length, IR temperature detection, and realizing welding quality monitoring.

In addition, the laser welding specification may also include the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the correlation between the output of the laser and the irradiation time.

Through various combinations of the above four conditions, the laser specifications corresponding to the size of the solder ball and the welding environment can be determined. For example, it may not be possible to completely melt the solder ball when the solder ball is large. Therefore, in order to melt the solder ball, laser irradiation for heating can be performed multiple times. Can be based on solder ball Perform reflow soldering of the size. In addition, when heating is completed, slow cooling can be performed, and if rapid cooling is performed, a cold welding phenomenon may occur and cracks may occur in the welded portion. Therefore, slow cooling can be performed during cooling.

In addition, the slow cooling may include slow cooling performed by continuously reducing the laser output and slow cooling performed by gradually reducing the output. Even in the case of slow cooling by continuously reducing the output of the laser, the larger the slope of the correlation between the output of the laser and the irradiation time, the slow cooling effect will still be similar to the rapid cooling effect, so it can be selectively adjusted.

That is, in order to form more than one output interval in the welding process by a combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the relationship between the laser output and the irradiation time, you can choose Multiple laser specifications.

With the laser processing apparatus described above, as shown in FIG. 10, soldering can be applied to the electrical connection of various terminals. For example, soldering can be performed smoothly even when the terminals are located on the same plane or are arranged at an angle. Therefore, as shown in FIGS. 11 (a) to 11 (d), the laser processing apparatus according to the embodiment of the present invention can realize a corner connection, a cavity connection, and a full connection. Various connections such as azimuth joints.

First, the apparatus including the nozzle 16 of the laser processing apparatus according to the embodiment of the present invention can be described with reference to FIG. 12.

A part of the device according to an embodiment of the present invention includes an upper base 17 and a lower base 18, and a hole disk located between the upper base 17 and the lower base 18. The leak disk can be rotated by the rotation shaft 6 and includes a plurality of holes, so that the solder ball can be transferred to the laser transmission path 14 by rotation around the rotation shaft 6. That is, the solder ball S flowing in through the solder ball inlet 2 is placed in one of a plurality of holes provided in the leak disk, and the solder ball S located in one hole of the leak disk can be moved to the laser by rotation of the rotation shaft 6 Transmission channel 14 side.

Here, the solder ball S supplied to the solder ball inlet 2 can be temporarily stored in the storage chamber 3, and can be moved to the solder ball outlet end 5 by the nitrogen supplied through the nitrogen inlets 11, 4 and then to the solder ball outlet. The solder ball S at the end 5 is located in one of a plurality of holes arranged in the leak disk.

The upper base 17 may be provided with a structure capable of rotatably supporting the rotation shaft 6, and may include an adapter 7 on the upper side. And, it may include a receiving port 10 and a transmitting port 9 penetrating the upper base 17 and the lower base 18. The solder ball S moving to the laser transmission path 14 side can be moved to the nozzle 16 side through the solder ball outlet path 12.

A transparent glass 13 may be disposed on the upper side of the laser transmission channel 14, and a laser irradiated by the transparent glass 13 may be irradiated to the nozzle 16 side by the laser transmission channel 14.

The nozzle 16 can be connected by a nozzle anti-loosening locking screw 15 arranged on the lower base 18. Therefore, the nozzle 16 can be combined with the lower base 18 via the nozzle anti-loosening locking screw 15, so that the nozzle 16 can be easily replaced. In the embodiment of the present invention, the nozzle anti-loosening locking screw 15 is used as an example for description. However, obviously, the coupling structure between the nozzle 16 capable of replacing the nozzle 16 and the lower base 18 may adopt a variety of structures. form. In addition, nitrogen inlets 11 and 4 for supplying nitrogen gas may be disposed on the upper side of the laser transmission path 14 so that the solder balls S inside the nozzle 16 melted by the laser can be discharged to a portion where the laser welding is required.

As an example, the nozzle 16 included in the laser processing apparatus according to the embodiment of the present invention is enlarged and observed, as shown in FIG. 13.

A through hole may be formed in the nozzle 16 as shown in FIG. 13. The through hole includes a cylindrical shape portion and a truncated cone shape portion coupled to a lower portion of the cylindrical shape portion. After the solder ball S flows into the inside of the nozzle 16 through the solder ball outlet passage 12, the solder ball S is dropped by the cylindrical shape portion by gravity. Falling solder ball S It is stuck in the frustum-shaped portion and cannot flow outside the nozzle 16. The solder ball stuck in the truncated cone-shaped portion is irradiated with laser light through the transparent glass 13, and the molten solder ball S is discharged to the outside by nitrogen.

In addition, a lid 1 may be disposed on the solder ball inlet 2 side, and the lid 1 may be opened only when the solder ball S is moved from the solder ball S supply chamber storing the solder ball S to the solder ball inlet 2 side. Not only that, the cover 1 disposed at the solder ball inlet 2 may be opened only when a laser processing apparatus according to an embodiment of the present invention is used, so that the solder ball S can be supplied.

Furthermore, in the above-mentioned laser processing apparatus, only nitrogen has been described. However, in addition to nitrogen, any gas that can be used as an inert gas such as helium and argon can be used.

Hereinafter, A to F and A 'to F' will be described below by sequentially showing Figs. 14 and 15 as part of the steps of an example of the laser processing apparatus. The sequence diagrams (A to F) shown in FIG. 14 are briefly described.

First, after loading the object, the object is moved to the visual inspection position (A), and then the alignment state, rotation, and arrangement of the object are detected (B). Then, it moves to the welding position (C), and welding is performed by the laser processing apparatus (D). Then move to the unloading position (E) to unload. When the next object (F) is loaded, it moves to the visual inspection position (A) again. In addition, in order to check the quality of the welding after laser welding, it is obviously possible to add the option of moving to the visual inspection position.

The sequence (A 'to F') shown in FIG. 15 is briefly described. First, when the welded object is placed in the unloading position (A '), the welded object is taken out and the object to be welded is placed in the unloading position (B'), and then it is moved to the visual inspection position ( C '). Next, the alignment state, rotation, and arrangement (D ') of the object are detected. Then, it moves to a welding position (E '), and performs welding (F') by a laser processing apparatus. Here, as an additional option, in order to check the quality of the welding after laser welding, you can Added the step of moving the object to the visual inspection position, and after detecting the alignment state, rotation, and arrangement of the object, when the alignment state, rotation, and arrangement are abnormal, you can add the movement to the unloading position and unload again. Loading options.

The processing sequence described with reference to Figs. 14 and 15 is controlled by the control unit, and can be described in more detail with reference to Fig. 17 of the conceptual diagram. Welding is performed by a machining section, and the machining section includes a welding head. The welding head may include one or more of a laser beam focusing optical welding head and a solder ball supply device. The processing section may further include a nozzle for discharging the solder balls. In addition, the control unit may determine a predetermined state of the nozzle 16, that is, a state of contamination or damage, and thereby determine a cleaning or replacement time. Further, the control unit may record the laser output and correct the laser output. In addition, the control of the control unit can perform quality inspection on the solder portion that is the portion to be soldered, and can be controlled to discard or collect the solder balls used in the bonding test and defective solder balls having defects in manufacturing.

In the above-mentioned quality inspection process, a solder part that does not meet a predetermined quality standard may be irradiated with laser light again to melt the solder part, thereby improving the wettability of the solder, or removing and performing re-soldering by re-dissolution . As another example, classification may be performed by a classification device. The control section may perform control for correcting the laser beam position, the nozzle position, and the visual inspection position. In addition, the control unit can determine the specifications of the laser by a combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope in the correlation between the laser output and the irradiation time ( Profile: profile) to control the execution of welding.

According to the laser processing device and the laser processing method described above, the device and even the method according to the embodiment of the present invention may include the following configurations. The inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by the inspection unit. For the first inspection (pre-inspection), it may be to check the placement status of the object before performing welding, that is, including The rotation and the alignment state of the arrangement state are sensed. For the second inspection (post-inspection), it may be one or more inspections in which cracks and porosity of the solder portion are sensed after soldering is performed. As described below, according to the second inspection result, an object that does not meet the quality standard can be classified with an object that meets the quality standard, and re-soldering can be performed on the object that does not meet the quality standard. .

First, the laser supplied from the laser supply device may be a laser having a wavelength having a high laser absorptance according to the solder material. In addition, it may be a solid-state laser such as an optical fiber laser or a diode laser (Fiber Laser or Diode Laser). The laser beam generated from the laser generating device can be transmitted to the laser welding head through the optical fiber without a separate optical mirror. Therefore, stable laser supply and precise operation during welding by laser irradiation can be achieved.

Second, the laser processing apparatus may include a pick and place soldering head or a jet soldering head including a laser welding nozzle 16. The laser welding head may include a laser beam focusing optical head, a solder ball S supply device, and a nozzle 16. Here, when the laser welding head represents a head, it may be configured not only as a single head but also as a dual head including two welding heads. Not only this, but also a welding head body including three or more welding heads. When two or more laser welding heads are included, the productivity of the device can be improved.

Third, it may include a Vision Inspection Module / unit or a visual inspection step. Since such a visual inspection module or visual inspection step is included, it is possible to perform a position inspection, an alignment state inspection, and the like (first inspection (Pre-Inspection)) of the camera module 20 to be welded, and to perform welding after welding as required Quality inspection (Post-Inspection).

Therefore, 1) a visual inspection module composed of low magnification and high magnification lenses can be installed, or 2) a motorized variable zoom lens (1X ~ x18: highest magnification) can be installed It can be higher according to the design of the Zoom Lens), which can automatically check the low to high magnification and the wide area to narrow area.

Although a visual inspection module can also be used for pre-inspection and post-inspection, in order to improve productivity, it can be configured as a separate visual inspection module (for example, a pre-inspection (Pre -Inspection) function uses a visual inspection module, and a post-inspection function uses a visual inspection module).

In the case of using a visual inspection module for pre-inspection and post-inspection, after the pre-inspection object is moved to a position for welding, You can go back to the previous position and perform post-inpsection. In the case where the visual inspection module is composed of two, namely, a visual inspection module for a pre-inspection function and a visual inspection module for a post-inpsection function, the object is The positions of the inspection (Pre-Inspection) module, the laser welding module and the post-inpsection module are sequentially moved and inspected and welded.

Furthermore, in order to monitor the welding quality in real time, controlling parameters or performing post-inspections such as internal cracks and porosity inspections after welding (Post-Inpsection), an infrared (Infra-red) inspection device may be included.

Fourth, it may further include a sorting device capable of classifying objects that do not meet the welding quality standards required after the post-inspection.

Fifth, it may further include a repair device capable of repairing an object that does not meet the welding quality standards required after the post-inspection. Such a repairing device can irradiate a laser to melt a solder portion again, thereby improving solder wettability, or removing solder and performing resoldering. When removing solder that has been soldered, machinery such as pins can be used The tool can be removed automatically, or the laser can be used to remelting and inhale to remove it automatically.

Sixth, in order to manage the quality after soldering, a cleaning device including a dust collecting device for removing dust and foreign materials may be further included. In addition, one or more of a dry air blowing device, a CO ₂ Snow Cleaning device, and an inert gas blowing device may be included.

Seventh, it may further include a pre-welding section that performs welding in advance according to the type of equipment to be welded. In addition, a laser welding head (Soldering Head) can be additionally included to maximize welding quality and improve productivity.

Although not described in the above-mentioned embodiment, it can also be used for bonding that does not require a welding material (Solder Ball). That is, the supply of the solder ball S as a welding material may be optional, and in a laser processing apparatus that does not supply the solder ball S, it may also be applied to bonding between metals and bonding between metal and resin. (bonding) and plastic welding. Depending on the nature of the object to be irradiated with the laser, it is possible to perform bonding of the two base materials by varying conditions such as irradiation intensity, irradiation time, and irradiation period of the laser.

Furthermore, as an example, if the 16th figure showing the fixture state and the additional laser processing method and device are described, the laser processing device may further include a plurality of nozzles 16 described above. That is, when the solder ball S is supplied to the nozzle 16 side through the drain disk 8, the solder ball S can be supplied through the drain disk 8 corresponding to a plurality of nozzles 16. That is, instead of being selectively provided to one nozzle 16 among the plurality of nozzles 16, an action of simultaneous supply can be performed. For example, according to the operation described above, after the solder ball S is supplied to the dual laser bonding head side and melted by means of a laser, the solder ball S can be discharged from the solder head by discharging nitrogen gas. Since such a process can be performed simultaneously on two welding heads, the welding time can be shortened. As one For example, a device equipped with a dual laser bonding head is naturally equipped with a larger number of soldering heads, which can naturally improve work efficiency.

The laser processing apparatus may further include a jig. The jig may be a rotating fixture jig. A fixture jig channel including a plurality of fixtures adopting the rotary movement method may be arranged. For example, a fixture jig channel may be provided in which three or more fixtures that move in a rotary movement manner are combined. In such a fixture jig channel, a plurality of objects to be welded may be included or placed. Here, when one or more operations of welding and bonding are performed on two or more points of an object, if one of the two points existing in an object is welded or bonded, Work, the jig can be moved, so that laser processing can be performed on the remaining points of the two points existing in the object. Here, the movement of the jig may be a rotation, a movement by a linear motion, or a movement by a combination of the rotation and the linear motion. When the movement is completed, welding or bonding may be performed on the remaining points.

As a specific example, the first welding head (laser bonding head 1) can be bonded on the first jig channel 1 and the second welding head (laser bonding head 2) can be on the third jig channel. (fixture jig channel 3).

If the welding heads (the first welding head and the second welding head) are bonded at various positions, the first welding head can perform the bonding operation on the second jig portion.

In addition, if the first jig portion is located at the unloading position away from the laser irradiation position, the object that has completed the joining operation can be taken out. A new object can be placed on the first jig portion from which the object is taken out, and waiting for the joining operation.

If the joining operation with respect to the object located in the third jig portion is completed, the object can be taken out, and a new object can be arranged on the third jig portion from which the object is taken out to prepare for the joining operation.

If the joining operation of the first welding head to the object on the second jig portion is completed, the first welding head may perform the joining operation on the object on the first jig portion.

In addition, if the second jig portion is located at the unloading position, the objects that have completed the joining operation can be taken out, and a new object is placed on the second jig portion to wait for the joining operation.

If the joining operation of the second welding head with respect to the object on the third jig portion is completed, the second welding head may perform the joining operation with respect to the second jig portion. This joining operation can be repeatedly performed and laser processing can be performed.

More specifically, in the loading or unloading position, each jig 30 in which a plurality of object bodies are arranged may be mounted on the first jig portion. In addition, at the loading or unloading position, each jig in which a plurality of target bodies are arranged can be attached to the second jig portion. In addition, at the loading or unloading position, each jig in which a plurality of target bodies are arranged can be attached to the third jig portion.

If the first jig portion is located at the position of the joint operation, a vision inspection unit can check whether the alignment state, rotation, arrangement, etc. of the object to be operated are normal.

The first laser head may be bonded to a bonding surface of each target body arranged on the first jig portion. While the first jig unit is performing the joining operation, a vision inspection unit may check the normal operation, such as the alignment state, rotation, and arrangement of the respective objects arranged in the third jig unit.

The second laser head can be joined to a joining surface of each target body arranged on the second jig portion. When the joining operation on one side of each object arranged on the first jig portion is completed, each jig included in the first jig portion can be moved to the joining operation position on the other side. This movement may be a rotational movement.

During the joining operation of the objects arranged in the third jig section, a vision inspection unit can check the alignment state, arrangement, and the like of each object positioned on the first jig section.

In addition, the other surface of the object on the first jig portion that is moved by the first welding head can be joined. When the joining operation is completed, the first jig portion can be moved to the unloading position. After the joining operation is completed, the object on the first jig portion can be taken out, so that a new object can be placed on the first jig portion.

When the joining operation is completed on one of the two surfaces of the joints of the respective objects arranged in the third clamp section, each clamp included in the third clamp section can be moved to the joint operation position on the other surface.

Thereafter, a vision inspection unit can check the alignment state, arrangement, and the like of each object rotated by the third jig portion. In addition, the second welding head can join the other surface of each object arranged on the third jig portion.

While the second jig unit is performing the joining operation on the objects located on the third jig unit, a vision inspection unit can check the alignment state and rotation of each object arranged on the second jig unit. , Configuration, etc.

The first welding head can join one surface of each object arranged on the second jig portion, and the first jig portion arranged with a new object to be joined can wait until the operation of the second jig portion is completed. Therefore, the subsequent operations can be repeated as described above.

Each object of the fixture jig channel at the end of the operation can perform the joint quality inspection (post-inspection) by one or two vision inspection modules / units ).

In addition, when the nozzle 16 is pressurized by a gas such as nitrogen to discharge the welding material (Solder Ball) located on the inner side, the inner side of the nozzle 16 that is in contact with the molten welding material The inside surface of the nozzle 16 may be contaminated. The contamination may include a welding material that remains and remains unsettled, a foreign material generated during thermal damage due to a temperature at which the welding material melts, and a foreign material generated on the surface due to repeated exhaust of gas (nitrogen, etc.). If such foreign matter accumulates, there is a possibility that the laser processing efficiency will be affected and a negative result may occur. Therefore, by checking the state and quality of the nozzle 16, the pollution needs to be cleaned at a preset period or intermittently. When measuring the pollution degree and reaching a preset pollution level, or at a preset The unit time is a standard and fixed period, and it moves to a cleaning area for cleaning, or removes foreign matter and dust, etc. by a nozzle cleaning unit when the object is not arranged. Cleaning may be performed by a method such as physical or chemical, and a configuration for performing the cleaning may include a vision unit and a nozzle monitor.

Furthermore, when the laser is irradiated with a preset laser irradiation intensity corresponding to the degree of laser processing, the actual laser irradiation can be checked by a laser power (energy) detection unit. Intensity (laser power; energy), and if there is a difference with the preset laser irradiation intensity, the laser intensity is adjusted to correct the difference. Therefore, the control unit (not shown) and the laser intensity Degree (energy, output) detection unit (laser power (energy) detection unit) is connected to each other based on the information received from the laser intensity (energy, output) detection unit (laser power (energy) detection unit) and the preset laser intensity The comparison is performed to increase / decrease the intensity of the irradiated laser.

In addition, the laser processing apparatus may further include a waste ball collecting unit that discards or collects the solder balls S used in bonding tests and defective solder balls S that are defective during manufacturing. For example, a waste ball collecting unit may be used to collect waste balls after they are supplied to the laser processing apparatus and then move to a discharge position, and then discard them.

In addition, it also includes a calibration plate for correcting the laser beam position, nozzle 16 position, and vision inspection position. The calibration plate is connected to the control unit (not shown). The calibration plate can immediately sense more than one of the absolute coordinates and relative coordinates of the laser beam, nozzle 16 and vision inspection. Compare the setting value of the control unit, and then correct the difference from the preset setting value to set the position of the laser beam, the position of the nozzle 16 and the vision inspection. The position is moved to converge to the preset setting value. Furthermore, if the laser irradiation step is not performed without being located at a preset value, it is possible to prevent a wrong operation related to laser irradiation.

Fig. 17 is an exploded view showing components of the jig 210 according to an embodiment of the present invention.

Referring to FIG. 17, the jig 210 component included in the laser processing apparatus may include a jig 210 and an abutting portion 220. The jig 210 is provided with a mounting portion 230 capable of mounting the object 50. The object 50 placed on the placement portion 230 may be fixed to the placement portion 230 by the contact portion 220. This fixing can be achieved by the first contact portion 211 and the second contact portion 221 respectively provided in the clamp 210 and the close contact portion 220. Be close to The portion 220 may be provided with a second contact portion 221, and the second contact portion 221 may be in contact with the first contact portion 211 included in the jig 210 to maintain a coupling force.

For example, at least one of the first contact portion 211 and the second contact portion 221 is made of a magnet, and when one is a magnet, the remaining one is made of a metal, and a bonding force can be generated between them. In addition, the first contact portion 211 and the second contact portion 221 may be located at both ends of the clamp 210 and the close contact portion 220, respectively, so that the clamp 210 and the close contact portion 220 are coupled by the bonding force.

In addition, the abutting portion 220 and the clamp 210 may include a first guide portion 212 and a second guide portion 222 so as to be coupled to each other. For example, a guide portion provided on the side of the abutting portion 220 or the jig 210 may guide a coupling direction by inserting a guide portion provided on the other side. Of course, the first contact portion 211 and the second contact portion 221 may contact each other if they are coupled along the coupling direction.

The first guide portion 212 provided in the jig 210 and the second guide portion 222 provided in the clinging portion 220. In this embodiment, the first guide portion 212 provided in the jig 210 may be formed in a pin shape and provided in the clinging portion. The second guide part 222 of 220 may be formed in a hole shape so as to be combined with each other.

In addition, the object 50 placed on the jig 210 may be sandwiched and fixed between the jig 210 and the clinging portion 220 by the clinging portion 220, and the position where the welding is performed may be exposed to the outside. That is, it is assumed that when the close contact portion 220 is located above and the jig 210 is located below, the object 50 can be held in a fixed state by contact with each other. At this time, the position where the welding is performed on the object 50 may be exposed to the outside, for example, the outside may represent a side or a part above. In order to ensure such an exposure range, the width of the close contact portion 220 may be formed to be smaller than the width of the jig 210, and the object 50 may be exposed upward corresponding to the difference in width.

In addition, the jig 210 is provided with a plurality of placement portions 230 capable of placing the object 50, so that the plurality of objects 50 can be held in a fixed state by the connection between the abutting portion 220 and the jig 210 state. Here, the plurality of object bodies 50 may be arranged in a line between the contact portions located at both ends of the jig 210 and the close contact portion 220.

FIG. 18 is a diagram showing an arrangement of a contact portion and a guide portion formed in the close contact portion 220 according to an embodiment of the present invention. In the following description, the contact portion is the first contact portion 211 and the guide portion is the first guide portion 212 as an example, and naturally, the same applies to the second contact portion 221 or the second guide portion 222.

Referring to FIGS. 18 (a) to 18 (d), the first contact portion 211 and the first guide portion 212 can be variously arranged. In order to explain the illustrated example, it is assumed that the target body 50 is placed in a plurality of jigs 210. In the case where a plurality of object bodies 50 are placed on the jig 210, contrary to the above description, an array formed by a plurality of object bodies 50, that is, one column may be formed. The first contact portion 211 may be located on an extension line of the one row. Therefore, an example of four configurations is illustrated in FIG. 18, however, the position of the first contact portion 211 may not be located on the extension line of the one row. Of course, the fact that the first contact portion 211 is located on the extension line is an example of a configuration for increasing the fixing force for fixing the object 50 to the mounting portion 230, and therefore the configuration is not limited to this.

FIG. 19 is a diagram illustrating that the jig 210 a and the abutting portion 220 a are combined by a fixing pin 223 according to another embodiment of the present invention.

Referring to FIG. 19, the abutting portion 220a and the jig 210a are fixed by the contact portion, and the first guide portion 212a of the hole form provided on the side of the jig 210a can be inserted through the second guide portion 222a provided on the abutting portion 220a And, the fixing pin 223 may be inserted from a side into a part of the second guide portion 222a exposed to the opposite side of the jig 210a. The coupling state of the jig 210a and the close contact portion 220a can be maintained by various methods such as the mechanical coupling method of this embodiment.

FIG. 20 is a diagram showing a mounting portion 230 on which the object 50 according to an embodiment of the present invention is mounted.

Referring to FIG. 20, the mounting portion 230 may include a receiving portion 231, a holding hole 232, a fixing portion 233, a first placing portion 234, and a second placing portion 235. When the object 50 is placed on the placement portion 230, a receiving portion 231 capable of receiving the protruding structure may be provided according to whether a protruding structure is formed on the lower portion of the placement surface side of the object 50. In addition, in order to electrically connect with the wiring, for example, the object 50 may be soldered, and in order to place a connection structure such as the wiring, a first placement portion 234 and a second placement portion 235 may be provided. The first placement portion 234 and the second placement portion 235 may be provided by opening the remaining portions of two or more faces of the restraint object 50. Therefore, the first placement portion 234 and the second placement portion 235 may be in different directions from each other, and may be in an open state to place the electrical connection portion for the welding object 50.

If the object 50 is moved to the jig 210 by the moving part and placed on the jig 210, it can be moved by the moving part including the grasping part with a multi-joint aspect. For example, when a part of the joint of the grasping object 50 approaches the jig 210 in order to place the object 50, in order to avoid interference with the fixing portion 233 of the locking object 50, the fixing portion 233 may be close to the grasping portion. A gripping hole 232 is provided on one side. That is, the grasping hole 232 may be a hole provided to avoid interference between the grasping portion of the grasping object 50 and the jig 210.

In the above, the present invention has been described in detail by means of representative embodiments. However, those having ordinary knowledge in the technical field to which the present invention pertains can understand that the above embodiments do not exceed the scope of the present invention. Inside can realize various deformations. Therefore, the scope of rights of the present invention cannot be limited to the illustrated embodiments, and should be determined according to the scope of patent application and the scope equivalent to the scope described in the patent application scope.

Claims (18)

A clamp assembly includes: a clamp, which is provided with a mounting portion capable of accommodating an object; and a close-contact portion, which is combined with the clamp and keeps the object fixed to the mounting portion, wherein the clamp and the close-contact portion The bonding is achieved by the bonding force generated by the contact portion, and the contact portion includes a first contact portion and a second contact portion that generate a bonding force due to contact, and the contact between the first contact portion and the second contact portion is guided by To achieve the guidance of the Ministry. The fixture assembly according to item 1 of the scope of the patent application, wherein the first contact portion and the second contact portion are located at the abutting portion and the fixture, respectively. The fixture assembly according to item 1 of the scope of patent application, wherein one or more of the first contact portion and the second contact portion are magnets. The fixture assembly according to item 1 of the scope of the patent application, wherein the guide portion includes a first guide portion and a second guide portion, and the first guide portion and the second guide portion are located at the abutting portion and the clamp, respectively. The fixture assembly according to item 1 of the scope of patent application, wherein the guide portion includes a first guide portion and a second guide portion, one of the first guide portion and the second guide portion is a pin shape, and the other is Hole pattern corresponding to this pin pattern. The fixture assembly according to item 5 of the scope of application for a patent, wherein the hole is a non-through hole. The fixture assembly according to item 5 of the scope of the patent application, wherein the hole form is a through hole, and a part of the pin form penetrates and the exposed part is combined with the fixing pin, thereby maintaining the combined state of the abutment part and the fixture . The fixture assembly according to item 1 of the scope of the patent application, wherein the placement portion includes a placement portion that is open in more than one direction to be able to place a part of the object. The fixture assembly according to item 1 of the scope of patent application, wherein the placement portion includes a receiving portion capable of receiving the protruding structure. The fixture assembly according to item 1 of the scope of the patent application, wherein the placement portion includes a fixing portion, and when the object is placed, the object is restrained from more than two directions. The fixture assembly according to item 1 of the scope of the patent application, wherein the gripping portion on which the object is placed includes a gripping hole formed to avoid interference with the placement portion. A laser processing method includes the steps of: loading an object into a jig; sensing and first inspecting an alignment state of the object loaded in the jig; moving the jig to a welding position; The object to be welded is unloaded; wherein the jig is combined with a close-fitting portion that holds the object body fixed to the mounting portion of the fixture, and the binding of the jig and the close-contact portion is caused by the bonding force generated by the contact portion. Realized, the contact portion includes a first contact portion and a second contact portion that generate a binding force due to the contact, and the contact between the first contact portion and the second contact portion is achieved by the guide; in order to check the welding Quality, the object is moved to the inspection unit to selectively perform a second inspection by the inspection unit. The laser processing method according to item 12 of the scope of patent application, wherein the second inspection performed by the inspection section is performed simultaneously with the execution of the welding. The laser processing method as described in item 12 of the scope of the patent application, wherein the inspection of the quality is an inspection that senses whether internal cracks and pores in the welding area occur. A laser processing device includes: a first inspection unit that senses and aligns an alignment state of an object loaded in a jig; and a moving unit that loads and unloads the object into the jig A second inspection section that selectively performs the second inspection with the object as an object; and a jig assembly, wherein the jig assembly includes: the jig, equipped with a placement section capable of placing the object; and a clinging section, It is combined with the clamp and keeps the object fixed to the arranging part, wherein the coupling between the clamp and the abutment part is realized by the bonding force generated by the contact part, and the contact part includes the first A contact portion and a second contact portion. The contact between the first contact portion and the second contact portion is achieved by the guide portion. The laser processing device according to item 15 of the scope of patent application, wherein the object is welded by laser, the welding is output by laser, the laser irradiation time, the number of laser irradiation times and the The combination of the slope in the correlation between the output of the laser and the irradiation time is determined by the specification of the laser. The laser processing device according to item 15 of the patent application scope, wherein the object is welded by a solder ball sprayed from a nozzle, and if an abnormal state is detected, the nozzle will be replaced, and further includes: sensing Unit for detecting whether the abnormal state including pollution and deformation is present. The laser processing device according to item 15 of the scope of the patent application, further comprising a pre-welding section, which performs pre-welding before performing subsequent welding on the object.