JP4572935B2 - Detection method for detection object of bonding apparatus, bonding apparatus, and bonding method - Google Patents

Description

  The present invention relates to a joining apparatus for injecting a detection object between joining target members after joining an injection target such as a conductive member made of solder or the like at a predetermined position of a nozzle and joining these joining target members. It is. In particular, the present invention relates to a detection object detection method for detecting that an injection object is arranged at a predetermined position of a nozzle, and a bonding apparatus and a bonding method capable of detecting the position of the detection object by the method.

  For example, in the manufacture of a magnetic head, there is a step of connecting an electrode provided on a so-called magnetic head core and a wiring end portion on a so-called gimbal that supports the core. For this process, for example, as disclosed in Patent Document 1 (FIG. 13), a solder ball 515 is supplied to a portion in the vicinity of the electrode 525 and the wiring end portion 529, and these electrical connections are made via the solder ball 515. There are known methods for achieving this.

  In this method, solder balls 515 that are conductive materials are used, and a plurality of through-holes 517 are spaced apart from each other by a predetermined distance from the center of rotation so that the solder balls 515 are separated one by one from a portion where a plurality of solder balls 515 are held. Disk-like members 513 arranged at angular intervals are used. As the disk-like member 513 rotates, the solder balls 515 that have entered the through holes 517 are individually separated and transferred. At a position where the through hole 517 communicates with the conveying path 511 of the solder ball 515, the solder ball 515 falls in the conveying path 511 due to its own weight, and the solder ball 515 moves to a predetermined supply position. Further, the solder ball 515 is irradiated with the laser beam 503 at the supply position and melts to make an electrical connection between the electrode 525 and the wiring end 529. In this method, the conveyance path is also used as a supply path for nitrogen gas, nitrogen mixed gas, or the like supplied to prevent the solder ball from being oxidized, and assists movement of the solder ball to the supply position by the nitrogen gas. Is going.

  Here, with the miniaturization and high performance of a magnetic recording device (so-called HDD: Hard Disk Drive device) on which the magnetic head is mounted, the miniaturization and the complexity of the structure have been increasingly promoted in recent years. As with the magnetic head, the diameter of the solder ball is remarkably reduced, and in the case of the method disclosed in Patent Document 1, it is difficult to securely hold the solder ball at a predetermined position between the electrode and the wiring end. .

  A method for dealing with such a situation is disclosed in Patent Document 2. In this method, the diameter of the solder ball supply opening is reduced in the nozzle that holds the solder ball in the space provided therein, and the solder ball is held so as to be clogged inside the opening. The held nozzle is positioned with respect to the electrodes without contacting them, and then the solder balls are melted with laser light and the pressure inside the nozzles is increased to eject the melted solder balls from the openings. The molten solder is attached to a predetermined position above.

JP 2002-170351 A Special table 2004-534409 gazette

Also in the configuration disclosed in Patent Document 2, the solder balls are individually conveyed using a rotating disk having a through hole similar to the configuration disclosed in Patent Document 1, and the laser is assisted by free fall and nitrogen gas assist. The solder ball is transferred to the light irradiation position. In this configuration, the internal space of the nozzle is substantially sealed by the solder ball, and in this state, the pressure in the internal space required for injection of the molten solder ball is increased by sending nitrogen gas to the internal space.

  Here, with the miniaturization of the electrode size or the electrode pitch due to the miniaturization of the magnetic head or the like, the diameter of the solder balls used has been reduced to about 60 μm. In a solder ball of this size, adhesion to the rotating disk due to static electricity or the like, and an increase in resistance due to nitrogen in the nozzle against the gravity acting on the solder ball, etc. occur, so it is necessary for the solder ball to reach a predetermined position of the nozzle The time becomes longer compared to a solder ball with a large diameter.

For this reason, it has become difficult to manage whether or not the nozzle opening of the nozzle through which the solder ball is ejected has been reached. Conventionally, in order to determine the arrival of such a solder ball at a predetermined position, the pressure in the internal space of the nozzle is measured, and this is sensed as the pressure increases. In this method, for example, the solder ball is transferred to a nozzle opening that is assisted by a nitrogen gas flow, and the nitrogen gas is supplied even after the nozzle opening is closed by the solder ball so that the internal space of the nozzle is reduced to a predetermined pressure. The determination is based on the increase in pressure.
However, a certain amount of time is required for the pressure increase accompanying the closing of the nozzle opening. Further, depending on the closed state or the like, there is a possibility that the time until the pressure rises to a predetermined value also varies. For this reason, in actual processing, the standby time varies, for example, 1 to 2 seconds, and the standby time itself is long.

  Further, when the end of the transfer of the solder ball to the predetermined position in the nozzle is detected by time or pressure as in the prior art, the flow rate, flow rate, etc. of a gas such as nitrogen gas that assists the transfer of the solder ball are taken into consideration as control parameters. There was a need.

  The present invention has been made in view of the above-described situation. A detection target object such as a conductive member made of solder or the like is held in an object holding unit, and this is injected between the bonding target members to be bonded. An object of the present invention is to provide a detection method of a detection target that reliably and quickly detects that the detection target is held in the target holding unit in a bonding apparatus for bonding the target members.

  In addition, the present invention provides a joining apparatus that uses a detection target whose position is detected by the method to supply the detection target to the joining target member and melt the detection target to join the joining target members. The purpose is to provide.

A first aspect of a detection target object detection method of the present invention for solving the above-described problem is used with an irradiation unit that irradiates a detection target with heat rays, holds the detection target, and has an opening. In the holding unit, a detection method for detecting the presence or absence of the detection target object, wherein an image signal of a predetermined region having the opening is captured by an image sensor,
The irradiation optical path of the irradiation unit and the imaging optical path of the imaging element are substantially matched in the opening by optical means.
According to the second aspect of the detection object detection method of the present invention, the detection object is a conductive member, and the object holding part is a nozzle.

  According to a third aspect of the detection object detection method of the present invention, the imaging device is a CMOS.

  According to the fourth aspect of the detection object detection method of the present invention, the integration value is calculated by integrating the image signal picked up using the CMOS, and the integration value does not exceed a predetermined value. In this case, it is determined that there is no detection target, and when the integral value exceeds a predetermined value, it is determined that there is the detection target.

  According to the fifth aspect of the detection target object detection method of the present invention, an arbitrary area is selectively extracted from the screen range among the image signals for one screen imaged using the CMOS, and the area within the area is selected. The integral value of the image signal is calculated.

  According to a sixth aspect of the detection object detection method of the present invention, the CMOS is 1/6 inch.

In addition, a first aspect of the joining method of the present invention for solving the above-described problem is a joining method in which a substantially spherical conductive member is injected from a nozzle onto a joining object and the joining object is electrically joined. The conductive member having an outer diameter larger than the diameter of the opening of the nozzle is prepared, and the conductive member is pressure-bonded to the opening of the nozzle from the outside of the nozzle. The presence or absence of the detection target is detected by the detection target detection method according to any of the above aspects, and when it is determined in the detection step that the detection target is present, compressed gas is injected into the internal space of the nozzle. When the inside space is at a predetermined pressure value, the conductive member crimped to the opening is irradiated with heat rays through the inside space, and remains in a solid state by the compressed gas. The conductive member is Emitted to the object.

Moreover, according to the 2nd aspect of the joining method of this invention, the crimping | compression-bonding with respect to the said opening part of the said electroconductive member is performed by pressing the said nozzle with respect to the said electroconductive member.
According to the 3rd aspect of the joining method of this invention, in order to assist the crimping | compression-bonding with respect to the said opening part of the said electroconductive member, a suction force is provided to the said opening part through the said internal space.
According to the 4th aspect of the joining method of this invention, after the said electroconductive member is inject | emitted, the irradiation of a heat ray is further continued to the said electroconductive member.

  Furthermore, a first aspect of the joining device of the present invention for solving the above-described problems is a nozzle assembly including a nozzle having a nozzle opening that communicates with an external space and through which an injection is injected, and the nozzle opening. A supply unit that supplies the projectile, an imaging unit that captures an image signal of a predetermined area having a nozzle opening in the nozzle, an identification unit that determines the presence or absence of the projectile based on the captured image signal, On the irradiation optical axis so that the irradiation optical path of the irradiation unit, the irradiation optical path of the irradiation unit, and the imaging optical path of the imaging unit coincide at least in the nozzle Alternatively, an optical member disposed on the imaging optical axis, an injection gas supply unit that introduces compressed gas into the internal space to inject the injection product, and the injection product to be injected from the nozzle assembly, When the projectile is supplied by the supply unit and the detection unit determines that the projectile is present in the nozzle opening, the compressed gas is supplied to the internal space, and the projectile is irradiated with heat rays. A control unit for controlling a series of operations.

  According to the 2nd aspect of the joining apparatus of this invention, the said imaging part is comprised with the optical lens and the image pick-up element, and the said image pick-up element is CMOS.

  According to the third aspect of the bonding apparatus of the present invention, an integral value is calculated by integrating the image signal captured using the CMOS, and the obtained integral value does not exceed a predetermined value. The apparatus further includes an identification unit that determines that the injection target does not exist and determines that the injection target exists if a predetermined value is exceeded.

  According to a fourth aspect of the bonding apparatus of the present invention, the bonding apparatus further includes an area selection extraction unit that selectively extracts an arbitrary area from the screen range among the image signals for one screen imaged by the CMOS, and the identification The unit makes a determination based on the image signal of the arbitrary area.

  According to a fifth aspect of the bonding apparatus of the present invention, the CMOS is 1/6 inch.

  According to the 6th aspect of the joining apparatus of this invention, the said injection material is inject | emitted from the said nozzle assembly in a solid-phase state.

  According to the seventh aspect of the joining apparatus of the present invention, the supply unit causes the nozzle to contact and separate relative to the storage unit storing the projectile, and press-bonds the projectile to the opening. Pressure bonding means for causing

  According to the 8th aspect of the joining apparatus of this invention, it has a means to press-fit an injection material to the said nozzle opening from the exterior side of the said nozzle auxiliary.

  According to the ninth aspect of the joining apparatus of the present invention, the projectile is a substantially spherical conductive member, and the diameter of the nozzle opening is smaller than the diameter of the conductive member.

Furthermore, in this specification, a conductive member means a member that can electrically connect members to be joined, such as a metal material or an alloy such as solder or gold. The shape of the conductive member is not limited to a spherical shape, but includes a cubic shape, a cone shape, and the like.
Further, the detection target without translucency includes not only a member that does not transmit light at all, but also includes a member that does not transmit light substantially.

According to the detection target object detection method and the joining apparatus of the present invention, it is possible to quickly and surely detect that a very small diameter detection target object has reached the target object holding unit. Accordingly, it is possible to accurately manage the time to be supplied to the detection target in the joining apparatus in a short time, and the joining time can be shortened.
Further, since the irradiation optical path and the imaging optical path substantially coincide with each other in the opening, it is not necessary to perform the imaging process and the irradiation process in different places, and the joining operation can be performed quickly.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a detection object joining apparatus of the present invention will be described with reference to the drawings. In the drawings, the same parts are denoted by the same reference numerals.

(Embodiment)
FIG. 1 is a side view showing a bonding apparatus according to an embodiment of the present invention. The joining apparatus 1 is a nozzle assembly that is a target holding unit that has a nozzle 3 that holds a detection target that is conductive and does not transmit light, and injects the detection target (or injection) from the nozzle opening 3a at the tip. 5, a supply unit 7 for supplying a conductive member into the nozzle assembly 5, a detection unit 13 for determining whether or not the conductive member is in a predetermined position, and a hot wire for melting the conductive member And a control unit 17 that drives the detection unit 13 after supplying the detection object into the nozzle assembly 5 by the supply unit 7 in the nozzle assembly 5. Further, the detection unit 13 includes an imaging unit 9 that captures an image signal of a predetermined region having the nozzle opening 3a in the nozzle 3 of the nozzle assembly 5, and an integrated value obtained by integrating the image signal exceeds a predetermined value. If not, the image processing unit 11 determines that there is no detection target. Each element mentioned above is demonstrated below.

The nozzle assembly 5 includes a nozzle body 19, a tapered nozzle 3 having a nozzle opening 3 a concentrically connected to the lower portion of the nozzle body 19, and a stopper 21 for opening and closing the nozzle opening 3 a.
The stopper 21 is a thin plate member having a substantially L-shaped side surface, and the thickness of the stopper 21 supports a detection target located in the nozzle opening 3a in cooperation with the peripheral wall of the nozzle 3 that defines the nozzle opening 3a. It only needs to be dimensioned so that it can. Therefore, it is not necessary for the stopper 21 to completely close the nozzle opening 3a. In FIG. 1, the stopper 21 shows a state in which the nozzle opening 3a is closed. The nozzle opening 3a is opened and closed by moving or swinging (in the direction of the arrow in the figure) the stopper 21 by a stopper driving unit (not shown). In addition, the internal space of the nozzle body 19 communicates with the solder housing space of the nozzle 3, and the conductive member transferred from the supply unit 7 (described later) into the internal space of the nozzle body 19 moves to the nozzle opening 3 a.

Further, the upper surface of the nozzle body 19 is formed of a translucent shielding member 20 so that light can be guided from an optical unit 32 described later. Thus, the internal space of the nozzle assembly 5 is formed as a sealed space except for the nozzle openings 3a.
A detection unit 13 and an irradiation unit 15 are disposed above the nozzle assembly 5. The detection unit 13 includes a housing 27, an image sensor 23 such as a CCD or a CMOS disposed in the housing 27, and an imaging lens 25 of an optical system disposed on the imaging optical path from the nozzle opening 3 a to the image sensor 23. And an image processing unit 11 that performs image processing using an image signal from the image sensor 23 and identifies whether or not the conductive member is present at a predetermined position. In addition, the imaging optical axis 31 of the imaging element 23 is disposed so as to pass through substantially the center of the nozzle opening 3a.

  The irradiation unit 15 includes a light source 29 that irradiates heat rays downward in the drawing in order to melt the detection target. In the present embodiment, the irradiation optical axis 33 of the light source 29 is in a relationship that is substantially parallel to the imaging optical axis 31 of the imaging unit 13. Further, the heat rays from the light source 29 are guided into the nozzle assembly 5 by an optical unit 32 to be described later, and pass through substantially the center of the nozzle opening 3a. Thus, the heat beam irradiation optical path and the imaging optical path substantially coincide at least in the nozzle opening 3a. Accordingly, the internal space of the nozzle assembly 5 functions as an imaging optical path and an irradiation optical path.

  The optical unit 32 is interposed between the irradiation unit 15 and the detection unit 13 and the nozzle assembly 5. A reflection mirror 35 disposed on the heat beam irradiation optical axis 33 and a half mirror 37 disposed on the imaging optical axis 31 of the imaging unit 9 are provided in the housing of the optical unit 32. Therefore, the irradiation light path of the heat ray traveling vertically downward from the light source 29 is changed 90 degrees to the right by the reflection mirror 35. Further, the irradiation path of the heat rays is changed downward in the vertical direction by the half mirror 37, and the heat rays are guided into the nozzle assembly 5 and the nozzle opening 3a.

  The supply unit 7 is a member that supplies the detection object into the nozzle assembly 5. For example, the detection object is supplied from the storage part into the nozzle assembly 5 by the air from the air source in a configuration including an air source that can supply compressed gas and a storage part that stores the detection object.

Further, the control unit 17 is connected to the heat ray light source 29 of the irradiation unit 15, the image processing unit 11 of the detection unit 13, the supply unit 7, and the stopper 21 of the object holding unit 5, and the operation of each member is performed at a predetermined timing. Control to drive.
The joining apparatus 1 having the above configuration operates as follows. First, the stopper 21 closes the nozzle opening 3a according to a command from the control unit 17 (state shown in FIG. 1). Next, according to a command from the control unit 17, a single detection object is supplied into the nozzle assembly 5 by compressed gas or the like in the supply unit 7.

  Next, the detection unit 13 determines whether or not a detection target exists in the nozzle opening 3 a of the nozzle 3. As the imaging unit 9 of the detection unit 13, an imaging device using an imaging element such as a CCD or a CMOS can be used. After obtaining an image signal of a predetermined area having the nozzle opening 3a by the imaging device, the image signal is integrated by the image processing unit 11 to obtain an integral value. Furthermore, when the integral value exceeds a predetermined value, it is determined that the detection target is positioned in the opening 3a. On the contrary, if the integral value does not exceed the predetermined value, it is determined that the detection target does not exist in the nozzle opening 3a.

  In addition, the predetermined value for identifying the presence or absence of the detection target object is obtained by conducting a test in advance when the detection target object is present in the nozzle opening and when there is no detection target object in the nozzle opening. deep. Note that, in the step of supplying the detection object to the nozzle opening 3a, the stopper 21 is in a state of closing the nozzle opening. Therefore, the above predetermined value takes into account that the nozzle opening 3a is partially blocked by the stopper. Is preferably set.

Next, when the image processing unit 11 determines that the conductive member has reached the nozzle opening 3a, the image processing unit 11 controls an arrival signal indicating that the detection target has arrived at the control unit 17. Depart to part 17.
Upon receiving this arrival signal, the control unit 17 issues a drive signal to the drive unit of the stopper 21, opens the stopper 21, and issues a drive signal to the light source 29 of the irradiation unit 15, and the light source 29 of the irradiation unit 15. The object to be detected is irradiated with heat rays. Here, the stopper 21 and the irradiation unit 15 are synchronized, and the heat ray is irradiated to the conductive member simultaneously with the opening of the stopper 21 or with a time difference of a certain time. That is, when there is a time difference of a certain time, the conductive member is irradiated after passing through the nozzle opening 3a.

  As a means for injecting the conductive member, free fall due to gravity, a compressed gas used when injecting the detection object from the supply unit 7, or a compressed gas (non-nitrogen or the like) inside the nozzle assembly 5 can be used. Various configurations, such as providing an injection air supply source for supplying the active gas), that is, an injection gas supply unit, can be applied.

  A first embodiment in which the joining device of the present invention is applied to a soldering device will be described below. FIG. 2 is a schematic view of a soldering apparatus, FIG. 3 is a partial cross-sectional view showing a main part of the soldering apparatus, and FIGS. 2A to 2D show steps of injecting solder balls. FIG. 4 is a principal block diagram of the soldering apparatus. In FIGS. 3B to 3D, members unnecessary for description are omitted in order to clarify the process from supplying and injecting solder balls.

  The solder ball bonding apparatus 301 includes a gantry 352, an x-axis direction moving stage 364 that is movable on the work surface 352 a of the gantry 352, a y-axis direction moving stage 360 that is movable in the y-axis direction, and an x-axis A work tray 366 for conveying a work 358 fixed on the upper surface of the direction moving stage 364, a z-axis direction moving stage 362 fixed on the y-axis direction moving stage 360 and movable in the z-axis direction, and a z-axis direction moving stage The nozzle assembly 305, which is an object holding unit mounted on the 362, an imaging unit 313, an irradiation unit 315, a control unit, and a supply unit. The control unit and the supply unit are omitted from FIG. 2 for clarity of the drawing.

The nozzle assembly 305 is fixed to the z-axis direction moving stage 362 via the nozzle arm 368, and the nozzle arm 368 moves in the vertical direction in FIG. Further, since the imaging unit 313 and the laser irradiation unit 315 are mounted on the nozzle assembly 305, the imaging unit 313 and the laser irradiation unit 315 move in the z-axis direction as the nozzle assembly 305 moves.
Furthermore, since the z-axis direction moving stage 362 is fixed to the y-axis direction moving stage 360, the z-axis direction moving stage 362 can move in the y-axis direction (the left-right direction in FIG. 2). On the other hand, the workpiece 358 is moved in the x-axis direction (the front and back direction in FIG. 2) by moving a work tray 366 fixed to the x-axis direction stage 364.

  The work placement surface 366a of the work tray 366 is inclined with respect to the vertical direction, and the work 358 is placed on the placement surface 366a and the electrodes are joined. In the present embodiment, an electronic component used for a hard disk is used as the work 358, and specifically, a flexure 372 to which a magnetic head slider 370 is attached. The electrodes of the magnetic head slider 370 and the flexure 372 are joined by soldering using solder balls. Here, both electrodes are arranged with an angle of 90 degrees, solder balls are arranged at the corners formed by these electrodes, and the balls are melted by laser light to make electrical connection between these electrodes. Is called.

  Below, the principal part of the solder ball bonding apparatus 301 will be described. The main part of the solder ball bonding apparatus 301 is held by a solder ball 304 as a conductive member, and has a nozzle assembly 305 having a nozzle 303 for injecting the solder ball 304 from an opening 303 a at the tip, and solder in the nozzle assembly 305. A supply unit 307 for supplying a ball 304; a detection unit 313 for determining whether or not the solder ball 304 is in a predetermined position; an irradiation unit 315 for irradiating a laser for melting the solder ball 304; and a nozzle set A control unit 317 that controls the solid 305, the supply unit 307, the irradiation unit 315, and the detection unit 313. Furthermore, the detection unit 313 captures a predetermined area (imaging area) having an opening 303a in the nozzle 303, and whether or not the solder ball 304 is in a predetermined position based on the imaging signal captured by the imaging unit 309. An image processing unit 311 for determining whether or not.

First, the nozzle assembly 305 includes a nozzle body 319 having an upper portion formed of a light-transmitting shielding member 320, and a tapered nozzle 303 having a nozzle opening 303a concentrically connected to the lower portion of the nozzle body 319 and having a nozzle opening 303a. The nozzle opening 303a is opened and closed, and a substantially inverted L-shaped stopper 324 is provided. The L-shaped stopper 324 opens and closes the nozzle opening 303a by moving (in the direction of the arrow 371) by a driving means such as a known piezo element.
In FIG. 3A, the L-shaped stopper 324 is shown with the nozzle opening 303a closed. Further, the internal space 319b of the nozzle body 319 and the solder accommodating space 303b of the nozzle 303 communicate with each other, and when the solder ball 304 is transferred into the internal space 319b of the nozzle body 319 from a supply unit 307 to be described later, the solder ball 304 is moved. It is the structure which moves to the nozzle opening 303a vicinity.

  The inner diameter of the internal space 319b of the nozzle body 319, the inner diameter of the solder accommodating space 303b of the nozzle 303, and the diameter of the opening 303a are at least slightly larger than the outer diameter of the solder ball 304. 304 is a structure which can move freely.

  A supply unit 307 described later is connected to the peripheral wall of the nozzle body 319. The solder balls 304 from the supply unit 307 are introduced into the internal space 319b of the nozzle body 319 through a solder ball supply port 319a that penetrates the peripheral wall of the nozzle body 319.

  Further, an injection air supply unit 335 for injecting the solder ball 304 is connected to the nozzle main body 319, and the injection air supply 335 enters the internal space 319 b through a hole penetrating the peripheral wall of the nozzle main body 319. Supply compressed gas such as nitrogen.

  A detection unit 313 and an irradiation unit 315 are disposed above the nozzle assembly 305. The detection unit 313 processes the image signal obtained from the CMOS 323 and the image pickup unit 309 having the imaging lens 325 constituting the CMOS 323 and the optical system of the image pickup device disposed in the housing 327 so that the solder ball 304 is predetermined. It has an image processing unit 311 for identifying whether or not it exists at a position. In this embodiment, a 1/6 inch CMOS 323 is used. In addition, the CMOS 323 of the imaging unit 313 is disposed so that the imaging optical axis 331 passes through substantially the center of the nozzle opening 303a.

  The irradiation unit 315 includes a laser light source 329 that irradiates laser light downward in FIG. 3 in order to melt the solder balls 304. In this embodiment, the irradiation optical axis 333 of the laser light source 329 is in a relationship that is substantially parallel to the imaging optical axis 331 of the imaging unit 315. The laser light is guided into an internal space 319b of the nozzle assembly 305 by an optical unit 332 described later, and passes through substantially the center of the nozzle opening 303a. That is, the internal space 319b and the solder accommodating space 303b inside the nozzle assembly 305 also function as a laser path. The irradiation light path from the laser light source 329 to the nozzle opening 303a is bent by an optical unit 332 disposed on the irradiation optical axis.

  The optical unit 332 is mounted between the irradiation unit 315 and the imaging unit 309 and the nozzle assembly 305. The optical unit 332 includes a mirror 335 disposed on the irradiation optical axis 333 of the irradiation unit 315 and a half mirror 337 disposed on the imaging optical axis 331 of the imaging unit 309. With this configuration, the irradiation light path of the laser light from the laser light source 329 is changed 90 degrees to the right by the mirror 335. Further, the irradiation light path of the laser light is reflected downward in the vertical direction by the half mirror 337, and the laser light is guided to the nozzle opening 303 a through the shielding part 320 of the nozzle assembly 305. That is, in the nozzle assembly 305, the imaging optical path of the imaging unit 313 and the irradiation optical path 333 of the irradiation unit 315 are substantially coincident with each other.

  Next, the supply unit 307 will be described. The supply unit 307 includes a supply unit main body 343 that is attached to a side portion of the nozzle assembly 305 and that is open at one side, and an end plate 345 that closes the opening of the supply unit main body 343. Further, the supply unit main body 343 includes a storage unit 347, an alignment unit 349, and a transfer unit 351.

  The storage part 347 of the supply part main body 343 is defined by an end plate 345 and a recess provided inside the supply part main body 343, and includes a storage space 353 in which the solder balls 304 are stored. The alignment portion 349 continuing to the storage portion 347 is provided with an alignment path 355 communicating with the storage space 353. Further, the transfer unit 351 is continuous with the alignment unit 349. A transfer path 357 communicating with the alignment path 355 is provided in the transfer unit 351. Further, the transfer unit 351 is attached to the nozzle body 319 on the side opposite to the alignment unit 349. The transfer path 357 of the transfer unit 351 communicates with the internal space of the nozzle assembly 305 through the solder ball supply port 319a. That is, the storage space 353 communicates with the inside of the nozzle assembly 305. The alignment path 355 and the transfer path 357 of this embodiment extend linearly from the storage space 353 in the longitudinal direction of the supply unit main body 343 and have a diameter slightly larger than that of the solder balls 304. Accordingly, the solder balls 304 are dimensioned in a line in the alignment path 355 and the transfer path 357.

  The storage part 347 of the supply part main body 343 is defined by an end plate 345 and a recess provided inside the supply part main body 343, and includes a storage space 353 in which the solder balls 304 are stored. The alignment portion 349 continuing to the storage portion 347 is provided with an alignment path 355 communicating with the storage space 353. Further, the transfer unit 351 is continuous with the alignment unit 349. A transfer path 357 communicating with the alignment path 355 is provided in the transfer unit 351. Further, the transfer unit 351 is attached to the nozzle body 319 on the side opposite to the alignment unit 349. The transfer path 357 of the transfer unit 351 communicates with the internal space of the nozzle assembly 305 through the solder ball supply port 319a. That is, the storage space 353 communicates with the inside of the nozzle assembly 305. The alignment path 355 and the transfer path 357 of this embodiment extend linearly from the storage space 353 in the longitudinal direction of the supply unit main body 343 and have a diameter slightly larger than that of the solder balls 304. In addition, a first air supply / suction unit 369 is connected to the first ventilation port 356. Therefore, the air and suction force supplied from the first air supply / suction unit 369 are applied to the storage space 353 via the first vent 356.

  Further, the alignment portion 347 is provided with a second ventilation hole 359 that penetrates in a direction substantially orthogonal to the direction in which the alignment path 355 extends and communicates with the alignment path 355. A second air supply / suction unit 321 is connected to the second ventilation port 359, and air and suction force from the second air supply / suction unit 321 are aligned through the second ventilation port 359. 357. Accordingly, air or suction force is applied to the alignment path 355 from a direction substantially perpendicular to the alignment path.

  Further, a first stopper accommodating path 363 that communicates with the alignment path 355 and accommodates the first stopper 361 in a removable manner is provided in a boundary region between the alignment path 355 and the transfer path 357.

  In addition, the length of the alignment path from the center of the second vent hole to the surface of the first stopper 361 on the storage portion 347 side is approximately the same as the outer diameter of the solder ball and is about 1.5 times the outer diameter. It is preferable to be within the range up to the size of. Further, the distance of the alignment path 355 from the surface on the storage portion 347 side of the first stopper 361 to the storage space 353 is at least as long as one solder ball 304. Therefore, when air is supplied from the second air supply / suction part 321 in a state where the solder balls 304 at the head of the row are in contact with the first stopper 361 in a line in the alignment path 355, the solder at the head of the row is provided. The balls and the remaining solder balls can be separated.

  Furthermore, the transfer part 349 is provided with a second stopper accommodating path 365 that communicates with the transfer path 357 and accommodates the second stopper 339 in a removable manner. It is preferable that the distance between the first stopper accommodating path 363 and the second stopper accommodating path 365 is longer than the outer diameter of at least one solder ball.

The first stopper 361 and the second stopper 339 are connected to the first stopper 361 and the second stopper 339, respectively. Accordingly, the first stopper 361 and the second stopper 339 are driven to be inserted / removed by the receiving paths 363 and 365, thereby opening / closing the alignment path 355 and the transfer path 357.
In addition, even when the first stopper 361 and the second stopper 339 close the alignment path 355 and the transfer path 357, the first stopper 361 can supply air to the alignment path and the transfer path. And a second stopper 339 is dimensioned with respect to the alignment path and the transfer path.

Needless to say, the distance (L) from the end plate 345 of the supply unit main body 307 to the center of the opening 303a of the nozzle 303 of the nozzle assembly 305 can be changed as appropriate.
Furthermore, as shown in the block diagram of FIG. 4, the control unit 317 opens and closes the L-shaped stoppers of the light source unit 329 of the irradiation unit 315, the image processing unit 311 of the detection unit 313, the supply unit 307, and the object holding unit 305. Coupled to the drive unit 322, each is commanded to be driven at a predetermined timing.

  Next, a process for determining whether or not a solder ball is present at a predetermined position will be described with reference to FIGS. 5A and 5B show the relationship between the imaging area and the pixels, where FIG. 5A shows a state where a solder ball exists, FIG. 5B shows an area selected and extracted from FIG. 5A, and FIG. 5C shows no solder ball. (D) shows an area selected and extracted from (c). FIG. 6 shows an integration circuit using CMOS.

  The number of pixels in the imaging region shown in FIG. 5 is 640 × 480 pixels. The diameter of the nozzle opening 303a used is about 70 to 200 μm. Further, in the CMOS type image sensor, the integration of the image signal is performed using the integration circuit shown in FIG. The integration circuit performs integration by adding the image signal of the pixel in the predetermined area extracted from the image signal from the CMOS to the capacitor.

  Under such conditions, the area of the nozzle opening in the imaging region is relatively small compared to the area of the other region (the peripheral wall portion in the nozzle). For example, when a CCD type imaging unit is used to integrate an image signal of the entire imaging region and obtain an integral value, if the nozzle opening is not blocked by a solder ball, the area of the nozzle opening is the other area. Is relatively small, the difference in brightness is small, and it is difficult to identify the absence of solder balls. Furthermore, since there are areas where the nozzle openings are blocked by the L-shaped stoppers, it is more difficult to identify the presence or absence of solder balls from the integrated value of the entire imaging area.

  In the case of a CCD, a method of adding and integrating only the image data of each pixel in a predetermined area after converting the image signal of the entire imaging area into image data by an A / D converter is also conceivable. Since it is necessary to digitize all image signals, there is a limit to shortening the processing time.

  Therefore, in this embodiment, a CMOS is used as the image sensor 323. Of the image signals picked up by the image pickup unit 309, the image signal of only a predetermined area of 32 × 32 pixels having a nozzle opening is extracted by the image extraction unit 312 and integrated to obtain an integrated value. When the integrated value exceeds the predetermined value in the identification unit 314, it is identified that the solder ball exists, and when it does not exceed the predetermined value, it is identified that the solder ball does not exist in the nozzle opening. In the predetermined area, the area corresponding to the nozzle opening (the portion that becomes a bright portion when no solder ball is present) can be made larger than the area of the other portion (dark portion) (FIG. 5B). (D)), the brightness difference becomes clear, and the presence / absence of the solder ball is easily identified.

  Furthermore, it takes about 33 msec to transfer an image signal of 640 × 480 pixels. However, transfer of an image signal only in a predetermined area of 32 × 32 pixels is possible in about 2 msec. Therefore, although depending on the processing speed of the identification unit and the like, the identification result of the presence or absence of the solder ball can be transferred in about 5.5 msec after the solder ball 304 blocks the nozzle opening 303a. Therefore, CMOS is preferable in order to perform the process of soldering the presence or absence of solder balls accurately at high speed.

  Next, the soldering process in the soldering apparatus having the above-described configuration will be described with reference to FIGS. FIG. 7A is a process diagram showing a process of supplying a solder ball from the reservoir to the second stopper, and FIG. 7B shows a process of supplying the solder ball from the second stopper to the nozzle assembly. FIG. 7C is a process diagram illustrating a process of detecting the presence / absence of a solder ball and performing soldering.

  First, before the soldering process, the workpiece 358 that is an object to be soldered is fixed to the workpiece placement surface 366a. Then, relative positioning between the nozzle assembly 305 and the workpiece 358 is performed. This is performed by moving the workpiece 358 by the x-axis direction moving stage 364 and moving the nozzle assembly 357 by the y-axis direction moving stage 360 and the z-axis direction moving stage 362.

  Then, as shown in FIG. 3A, the first solder ball 304 a reaches the second stopper 339. That is, the first solder ball 304a has reached the second stopper 339 through the steps S1 to S8 in FIG. The first and second stoppers 361 and 339 are in a closed state.

  Next, as shown in FIG. 3B, the solder balls 304 are aligned in a line in the alignment path 355 by compressed air from the first air supply / suction unit 369 (S2 in FIG. 7A). (S3 in FIG. 7A). On the other hand, the compressed air from the first air supply / suction unit 369 also acts on the first solder ball 304a (S11 in FIG. 7B). Then, with the first stopper 361 closed, the second stopper 339 is opened (S12 in FIG. 7B) and the transfer path 357 is opened in accordance with a request from the control unit 317 of the solder ball bonding apparatus 301. . The first solder ball 304a passes through the internal space 319b of the nozzle body 319 and is introduced into the solder accommodating space 303b of the nozzle 303 (S13 in FIG. 7B), and then the second stopper 339 is closed and the first stopper 339 is closed. The air supply / suction unit 369 is stopped (S14 in FIG. 7B).

  After the solder balls 304 are aligned in a line in the alignment path 355, the second air supply / suction unit 321 is operated to supply compressed air into the alignment path 355 via the second vent 359 (FIG. 7 (a) S4). As a result, the second solder ball 304b and the other solder balls 304 are separated.

  Next, the air supply by the first air supply / suction unit 369 is stopped, and the suction force by the first air supply / suction unit 369 is applied (S5 in FIG. 7A). As a result, the other solder balls 304 except for the second solder ball 304b are pulled back into the storage space 353 (FIG. 3C).

  As described above, the compressed air supplied from the first air supply / suction unit 369 transports the first solder ball 304a locked to the second stopper 339 and the solder ball in the storage unit. Used for. Accordingly, the air supply by the first air supply / suction unit 369 is started so that the step of aligning the solder balls in the storage unit and the timing of transferring the solder balls locked to the second stopper 339 into the nozzle assembly coincide. And the stop is appropriately controlled by the control unit.

  Next, the suction by the first air supply / suction unit 369 is stopped (S6 in FIG. 7A), the first stopper 361 is opened (S7 in FIG. 7A), and the alignment path 355 is opened. . The second solder ball 304b reaches the second stopper 339 and is locked by the compressed air from the second air supply / suction unit 321 (S8 in FIG. 7A, FIG. 3D). Then, the first stopper 361 is closed, and the second air supply / suction unit 321 is stopped (S9 in FIG. 7A).

  On the other hand, in S13 of FIG. 7B, the first solder ball 304a passing through the transfer path 357 and located in the nozzle 303 defines a predetermined position, that is, the upper surface of the L-shaped stopper 324 and the opening 303a. A determination is made as to whether or not the state is supported by the peripheral wall.

  In the step of determining the presence / absence of a solder ball, in response to a command from the image extraction unit 312 of the image processing unit 311, only an image signal of a predetermined area is extracted from the imaging signals captured by the imaging unit 309, and the image signal is extracted. Integration is performed to obtain an integral value (S21 in FIG. 7C). Next, when the integrated value exceeds a predetermined value, the identification unit 314 determines that the first solder ball 304a is positioned at the nozzle opening 303a. If the integrated value does not exceed the predetermined value, it is determined that the first solder ball 304a has not reached the opening 303a, and the process is repeated until the integrated value exceeds the predetermined value (S22 in FIG. 7C). ).

  When it is determined that the first solder ball 304a is in the opening 303a, a drive signal is issued from the control unit 317 to the opening / closing drive unit 322 and the injection air supply unit 335, and the L-shaped stopper 324 is opened. Injection air is supplied (S23 in FIG. 7C). Then, the first solder ball 304a is discharged to the outside of the nozzle 303 (FIG. 3D). In a state where the second solder ball 303b is locked to the second stopper 339, the first solder ball 304a is discharged. The drive timing of the opening / closing drive unit 322 and the injection air supply unit 335 can be synchronized by the control unit.

  Further, after the first solder ball 304a is ejected through the nozzle opening 303a (S23 in FIG. 7C), the laser light source 329 is driven by the drive signal from the control unit 317, and the first solder in flight The ball 304a is irradiated with laser light (S24 in FIG. 7C). That is, the solder ball 304a passes through the opening 303a in a solid state. The solder ball 304a melted by the laser beam adheres to a predetermined position and electrical joining is performed (S25 in FIG. 7C), the second stopper 339 is closed, and one step of the joining process is completed (FIG. 7C). ) S26).

  Needless to say, the solder supply and joining steps described above are merely examples, and can be changed as appropriate. For example, the imaging process (S21 in FIG. 7C) is performed after the second stopper is closed (S14 in FIG. 7B), but may be before the closing. Further, the laser irradiation step (S24 in FIG. 7C) is performed after the L-shaped stopper 324 is opened, but the laser beam is irradiated to such an extent that the solder balls 304a are not melted even before the L-shaped stopper 324 is opened. Irradiation is also possible.

Finally, by applying a drive signal from the control unit 317 to the opening / closing drive unit 322, the opening 303a is closed by the L-shaped stopper 324, and the state shown in FIG. As described above, when the first solder ball of a plurality of continuous solder balls is discharged, the second solder ball 304b is locked to the second stopper 339. The delay with respect to the solder ball supply request from the control unit 317 is small, and as a result, the injection interval can be shortened.

  A second embodiment in which the joining device of the present invention is applied to a soldering device will be described below. The soldering apparatus according to the first embodiment employs a configuration in which the solder ball is supplied into the nozzle, the solder ball is held in the vicinity of the opening by the stopper, the solder ball is injected, and the heat ray is irradiated. The soldering apparatus 2 discharges solder balls by supplying compressed air into the internal space of the nozzles and supplying heat rays to the solder balls in a state where the solder balls are crimped to the nozzle openings from the outside of the nozzle assembly. It is the structure to make.

  FIG. 8 is a schematic diagram of the soldering apparatus according to the second embodiment. FIG. 9A is a front view showing the main part of the soldering apparatus of Example 2, and FIG. 9B is an enlarged cross-sectional view of the nozzle assembly along a plane passing through the optical axis of the IXB part. FIG. 9C is an enlarged cross-sectional view along a plane passing through the optical axis of the IXB portion of FIG. 9A, and shows a state where the solder balls are discharged. FIG. 10 is a principal block diagram of the soldering apparatus. FIG. 11 is a flowchart of the soldering process.

  Hereinafter, the configuration of the solder ball bonding apparatus 1301 will be described. Note that, in the configuration of the solder ball bonding apparatus 1301, a description will be given centering on parts different from the solder ball bonding apparatus of the first embodiment.

  As shown in FIG. 8, the solder ball bonding apparatus 1301 mainly includes a nozzle assembly (object holding unit) 1305, an imaging unit 1313, a laser irradiation unit 1315, a control unit 1301, a pedestal 1352, and a pedestal 1352. The x-axis direction moving stage 1364 that can move in the x direction and the y-axis direction moving stage 1360 that can move in the y-axis direction, and the first x-axis direction moving stage 1364 are fixed to the upper surface of the first x-axis direction moving stage 1364. A work tray 1366 for conveying the work 1358 and a storage part 1121 for storing solder balls fixed to the upper surface of the second x-axis direction moving stage 1121 are provided. The storage unit 1121 is disposed on the upper surface 1352a of the base 1352 between the work tray 1366 and the y-axis drive unit 1131.

  The nozzle assembly 1305 is fixed to the z-axis direction moving stage 1362 via the nozzle arm 1368, and the nozzle assembly 1305 is moved in the z-direction (in FIG. 8) by the z-axis direction driving unit 1137 for driving the z-axis direction moving stage. In the vertical direction). In addition, since the imaging unit 1313 and the laser irradiation unit 1315 are mounted on the nozzle assembly 1305, the imaging unit 1313 and the laser irradiation unit 1315 move in the z-axis direction integrally with the nozzle assembly 1305.

  Further, since the z-axis direction moving stage 1362 is fixed to the y-axis direction moving stage 1360, the z-axis direction moving stage 1362 is driven in the y-axis direction (the left-right direction in FIG. 8) by driving the y-axis driving unit 1131. ) On the other hand, the movement of the workpiece 1358 in the x-axis direction (the front and back direction in FIG. 8) causes the work tray 1366 fixed to the x-axis direction stage 1364 to move by driving the first x-axis driving unit 1145. It is done by moving. Similarly, the movement in the x-axis direction of the storage unit 1121 for storing the solder balls is performed by driving the second x-axis drive unit 1151 on the x-axis direction stage 1123 to which the work tray 1366 is fixed. .

  Here, the y-axis drive unit 1131, the z-axis drive unit 1137, and the first and second x-axis drive units 1145 and 1151 are of a known configuration. For example, the y-axis drive unit 1131 can be composed of a motor (not shown), a y ball screw, and a y nut. A y-nut provided with a female screw is fixed to a y-slider (for example, a member 1131). The y ball screw having a male screw provided on the outer periphery thereof is supported by a housing of the y-axis drive unit so that both ends thereof can be rotated by ball bearings, and a motor is connected to one end of the y ball screw. When the motor is driven to rotate the y-ball screw, the y-direction nut screwed to the y-ball screw reciprocates along the y-ball screw. As the y-direction nut reciprocates, the y-direction slider moves in the y direction. Other drive units can be configured similarly.

  The main part of the solder ball bonding apparatus will be described below. As shown in FIG. 9A, the soldering apparatus 1301 includes a nozzle 1303 for injecting a solder ball 1117, a laser irradiation unit 1315, a gas supply unit 1305, a detection unit 1313, and a control unit 1317. Prepare. Furthermore, the detection unit 1313 captures a predetermined region (imaging region) having an opening 1113a in the nozzle 1303, and whether or not the solder ball 1117 is in a predetermined position based on the image signal captured by the image capturing unit 1309. An image processing unit 1311 for determining whether or not.

  Further, in FIG. 9A, a storage portion 1121 on which the solder ball 1117 is placed is shown in the vicinity of the solder ball bonding apparatus 1301. Furthermore, in FIG. 9A, the state in which the nozzle has moved to the reservoir 1121 is indicated by a broken line. Note that driving means for moving the nozzle assembly 1305 and moving the solder ball 1117 to press-fit the opening 1113 (that is, means for supplying the solder ball to the opening of the nozzle assembly) and the like are shown in FIG. Has been omitted.

  As shown in FIGS. 9B and 9C, the nozzle assembly 1305 includes a nozzle 1303, a pressurized air supply unit 1307, and an upper plate 1320. The nozzle 1303 is a cylindrical member that includes an internal space 1303b in which a laser beam, which will be described later, passes, and is supplied with compressed gas. One end of the nozzle 1303 in the longitudinal direction is closed by an upper plate 1320 formed of glass or the like that can transmit only laser light, and the other end constitutes an opening 1113 to which the solder ball 1117 is pressed.

  The opening 1113 has a predetermined length in the longitudinal direction of the nozzle 1303. The opening of the opening 1113 has an inner peripheral surface 1113a that is continuous with the internal space 1303b and has a uniform inner diameter D1 (or a radius of curvature). The inner diameter is at least smaller than the outer diameter D2 (or radius of curvature) of the solder ball 1117.

  Further, a pressurized air supply unit 1307 for injecting the solder ball 1117 is connected to the peripheral wall 1303d of the nozzle 1303, and the pressurized air supply unit 1335 has an internal space through a hole penetrating the peripheral wall 1303d of the nozzle 1303. A compressed gas such as nitrogen is supplied to 1303b.

  Further, the nozzle assembly 1305 includes supply means for supplying the solder ball 1117 to a predetermined position of the nozzle 1303. The supply unit is a unit for bringing the relative distance between the nozzle 1303 and the storage unit 1121 into contact with each other, and includes the first x-axis drive unit 1145, the y-axis drive unit 1131, and the z-axis drive unit 1137 described above. The

  A detection unit 1313 and an irradiation unit 1315 are disposed above the nozzle assembly 1305. The detection unit 1313 processes an image signal obtained from the CMOS 1323 and an imaging unit 1309 having an imaging lens 1325 that constitutes the CMOS 1323 and an optical system of the imaging device disposed in the housing 1327, and the solder ball 1117 has a predetermined value. It has an image processing unit 1311 for identifying whether or not it exists at a position. In this embodiment, a 1/6 inch CMOS 1323 is used. In addition, the CMOS 1323 of the imaging unit 1313 is disposed so that the imaging optical axis 1331 passes through substantially the center of the nozzle opening 1113a.

  The irradiation unit 1315 includes a laser light source 1329 that emits laser light downward in FIG. 9 in order to melt the solder balls 1117. In this embodiment, the irradiation optical axis 1333 of the laser light source 1329 is in a relationship that is substantially parallel to the imaging optical axis 1331 of the imaging unit 1315. The laser light is guided into the internal space 1319b of the nozzle 1303 by an optical unit 1332 described later, and passes through substantially the center of the nozzle opening 1113a. That is, the internal space 1303b inside the nozzle 1303 also functions as a laser path. The optical path from the laser light source 1329 to the nozzle opening 1113a is bent by the optical unit 1332 disposed on the irradiation optical axis.

  The optical unit 1332 is mounted between the irradiation unit 1315 and the imaging unit 1309 and the nozzle assembly 1305. The optical unit 1332 includes a mirror 1335 disposed on the irradiation optical axis 1333 of the irradiation unit 1315 and a half mirror 1337 disposed on the imaging optical axis 1331 of the imaging unit 1309. With this configuration, the irradiation light path of the laser light from the laser light source 1329 is changed 90 degrees to the right by the mirror 1335. Further, the irradiation light path of the laser light is reflected downward in the vertical direction by the half mirror 1337, and the laser light is guided to the nozzle opening 13 a through the shielding portion 1320 of the nozzle assembly 1305. That is, in the nozzle assembly 1305, the imaging optical path of the imaging unit 1313 and the irradiation optical path 1333 of the irradiation unit 1315 are substantially matched.

  As shown in FIG. 8, the work 1358 is a flexure 1372 that uses electronic components used in a hard disk, and specifically has a magnetic head slider 1370 mounted thereon. Here, both electrodes are arranged with an angle of 90 degrees, solder balls are arranged at the corners formed by these electrodes, and the balls are melted by laser light to make electrical connection between these electrodes. Is called.

  As shown in FIG. 10, the control unit 1317 includes a supply unit including a y-axis drive unit 1131, a z-axis drive unit 1137, first and second x-axis drive units 1145 and 1151, and an object. The nozzle assembly 1305, which is a holding unit, a laser irradiation unit 1315, and a detection unit 1313 are electrically connected to each other, and each element is configured to operate according to a command from the control unit 1317. Although not shown, a positioning camera such as a CCD camera is used for positioning between the nozzle 1303, the workpiece 1358, and the solder ball 1117 of the storage unit 1121, and based on the image from the positioning camera. Needless to say, control for positioning can be performed.

  Next, the process of determining whether or not a solder ball is present at a predetermined position will be described only with respect to differences from the first embodiment (FIGS. 5 and 6). In Example 2, the presence / absence of the solder ball is determined after the solder ball is pressed to close the nozzle opening 1113a (see FIG. 9B). Of the image signals picked up by the image pickup unit 1309 that is a CMOS, an image signal of only a predetermined area of 32 × 32 pixels having a nozzle opening is extracted and integrated by the image extraction unit 1312 to obtain an integrated value.

When the integrated value exceeds a predetermined value in the identification unit 1314, it is identified that a solder ball exists, and when it does not exceed the predetermined value, it is identified that the solder ball does not exist in the nozzle opening. In the predetermined area, the area corresponding to the nozzle opening (the portion that becomes a bright portion when no solder ball is present) can be made larger than the area of the other portion (dark portion) (FIG. 5B). (See (d).), The difference in brightness becomes clear, and the presence or absence of solder balls is easily identified. Further, unlike the case of the first embodiment, since the stopper is not arranged immediately below the nozzle opening, the light like the stopper is emitted when the solder ball is arranged at a predetermined position and when the solder ball is not arranged. Since there is no blocking member, the difference in brightness appears remarkably. Therefore, the solder ball can be identified more reliably.

  As in the first embodiment, in this embodiment, the image signal can be transferred only in a predetermined area of 32 × 32 pixels in about 2 msec. Therefore, although depending on the processing speed of the identification unit or the like, after the solder ball 1117 blocks the nozzle opening 1113a, the identification result of the presence or absence of the solder ball can be transferred in about 5.5 msec.

Next, a soldering process in the soldering apparatus having the above configuration will be described with reference to FIG.
Prior to the soldering process, a workpiece 1358 that is an object to be soldered is fixed to the workpiece mounting surface 1366a. And it transfers to the process of crimping | bonding a joining member to the nozzle assembly 1305 (step S101). First, in accordance with a command from the control unit 1317, the storage unit 1121 is moved by the x-axis direction moving stage 1123, the nozzle assembly 1305 is moved by the y-axis direction moving stage 1360 and the z-axis direction moving stage 1362, and the storage unit 1121 The nozzle assembly 1305 is positioned so as to be separated from the solder ball 1117 by a predetermined distance in the vertical direction.

  Further, after the nozzle 1303 is lowered and comes into contact with the spherical solder ball 1117 placed on the storage portion 1121, the opening 1113 of the nozzle 1303 is further pressed against the solder ball 1117 with a predetermined force. 1117 is press-fitted into the peripheral edge of the opening 1113. At this time, the solder ball 1117 is distorted to generate an internal stress and is held by a frictional force resulting from the internal stress. Accordingly, the solder ball 1117 has a diameter portion 1117a which is the maximum dimension portion of the cross section along the horizontal plane extending in the horizontal (left and right) direction of the solder ball 1117, and the solder ball 1117 is in contact with the tip portion 1113b. It is located closer to the reservoir 1121 in the injection direction x than the contact portion 1117b. That is, the diameter portion 1117 a is pressure-bonded to the nozzle 1303 in a state where the diameter portion 1117 a is positioned outside the contact portion between the opening 1113 of the nozzle 1303 and the solder ball 1117. Furthermore, in other words, the solder ball 1117 is located outside the nozzle 1303 (opening or external space), and the solder ball 1117 does not exist inside the nozzle 1303.

  The maximum dimension portion is a line segment connecting any two points on the outer periphery that defines a cross section of the solder ball by a plane extending perpendicular to the injection direction (vertical direction in the present embodiment). Means the maximum length.

  The next step is to determine the presence or absence of solder balls. In this step, in response to a command from the image extraction unit 1312 of the image processing unit 1311, only an image signal of a predetermined area is extracted from the imaging signals captured by the imaging unit 1309, and the image signal is integrated to obtain an integrated value. (Corresponding to step S102 in FIG. 11 and FIG. 5). Next, the identification unit 1314 determines that the first solder ball 1117 is positioned in the nozzle opening 1113a when the integrated value exceeds a predetermined value. If the integrated value does not exceed the predetermined value, it is determined that the solder ball 1117 is not crimped to the opening 1113a, and the process is repeated until the integrated value exceeds the predetermined value (S103 in FIG. 11). The predetermined value is not only the case where the solder ball 1117 is detached from the opening 1113, but is crimped to the opening 1113, but the inner space is sealed because the nozzle opening 1113a is not completely covered. Even when it is difficult to set the internal space 1303b to a predetermined pressure, it is set so that the solder ball 1117 can be identified as not being in a predetermined position.

  When it is determined that the first solder ball 1117 covers the nozzle opening 1113a and is at a predetermined position of the nozzle opening 1113 (step S103 in FIG. 11), a nozzle positioning process described later is started.

  In the positioning step, as shown in FIG. 8, the nozzle 1303 is positioned vertically upward from a predetermined position of the work 1358 arranged on the work placement surface 366a of the work tray 1366 (step S104). Of course, it is also possible to adopt a configuration in which the work tray 1366 is moved and the relative positioning of both is determined with the nozzle 1303 fixed.

  After the positioning step, compressed gas is supplied from the gas supply unit 1307 into the internal space 1303b (step S105). The control unit 1317 determines whether or not the pressure in the internal space 1303b has reached a predetermined value (step S106). When the controller 1317 determines that the pressure in the internal space 1303b has reached a predetermined value, the solder ball 1117 is irradiated with the laser light 1333 from the laser irradiation unit 1329 via the internal space 1303b (step S107). ). Whether or not the internal space 1303b has reached a predetermined pressure is determined, for example, by measuring a predetermined time from when the gas is supplied until the predetermined pressure is reached in advance, and then by the control unit after the gas is supplied. This can be done by determining whether or not it has elapsed.

  When the laser beam 1333 irradiates and heats the portion of the solder ball 1117 facing the internal space 1303b, the elastic coefficient of the solder ball 1117 decreases, and as a result, the internal stress is relaxed. At that time, when the urging force of the compressed gas filled in the internal space 1303b exceeds the frictional force (holding force) generated by the internal stress of the solder ball, the solder ball 1117 and the tip 1113b of the opening 1113 are pressed. The substantially spherical solder ball 1117 is released (FIG. 9C, step S108).

  The injected solder ball 1117 lands on the corner formed by the electrode of the slider 1370 and the electrode of the flexure 1372 on the work tray 1366 (FIG. 8, step S109). The laser beam 1333 from the laser irradiation unit 1329 is continued until the solder ball 1117 is melted.

  Then, after the solder ball is completely melted at the landing position (the corner between the slider 1370 and the flexure 1372), a signal is sent from the control unit 1317 to stop the operation of the laser irradiation unit 1329 and the gas supply unit 1307. (Step S110). Then, the solder ball 1117 is solidified and the joining is completed.

As described above, in the bonding apparatus 1301 of this embodiment, the solid solder ball 1117 is pressure-bonded to the opening 1113 of the nozzle 1303, and then compressed gas is supplied into the internal space and the laser from the laser irradiation unit 1329 is supplied. By irradiating light 1333, the internal stress of the solder ball 1117 is relaxed (the elastic coefficient of the solder ball is lowered), and the pressure bonding of the solder ball 1117 is released by the compressed gas. Due to such a configuration, the configuration of the soldering device is simplified as compared with the first embodiment, and the control of the soldering device is facilitated.
Furthermore, since the conductive member is injected in the solid state, the residue of the conductive member does not occur in the nozzle opening and the vicinity thereof.

In addition, since the opening of the nozzle is not configured to be opened and closed by the stopper as in the first embodiment, the conductive member is not dragged by the stopper and the injection direction of the conductive member is not shifted. Further, it is necessary to synchronize the operation of the stopper and the operation of the laser device with high accuracy. However, in the second embodiment, if the inside of the nozzle is set to a predetermined pressure, only the timing of starting the heat irradiation is obtained. Since the injection timing can be controlled, the operation can be easily controlled and the structure can be simplified.
(Modification of Example 2)

  FIG. 12 is a cross-sectional view of a modified example of the nozzle assembly according to the second embodiment. The nozzle assembly 2301 according to the second embodiment is a soldering apparatus that includes a suction unit 2325 that applies a suction force to maintain the pressure-bonded state of the solder ball after the solder ball 2117 is pressure-bonded to the opening 2113. Since the configuration of the other parts is the same as that of the nozzle assembly of the second embodiment, the details are omitted.

  The suction portion 2325 is connected to the nozzle 2303 by a tube 2329 and has a configuration that can apply a suction force to the internal space 2303b. The suction portion 2325 is provided on the peripheral wall 2303d of the opening 2113 by a tube 1329, and is connected to a suction hole 2327 that communicates the internal space 1311 and the outside and extends in the horizontal direction.

  When the suction part 2325 is used supplementarily as in the above configuration, the suction force from the suction part 2325 can be supplied to the internal space 2303b, and the internal space 2303b can be set to a negative pressure. Thus, by making the inside of the internal space 2303b a negative pressure, the pressure-bonded state of the solder ball 2117 with respect to the opening 2113 can be reliably maintained.

  Note that the position where the suction hole 2327 is provided can be changed as appropriate, and the internal space 2303b and the outside may directly communicate with each other. In addition, a suction hole 2327 that is a through hole that connects the outside of the nozzle and the internal space 2303b is provided in the nozzle 2303, and a single through hole is shared as a suction hole and a gas introduction path, and gas is supplied to the single through hole. The portion 2307 and the suction portion 2325 may be connected. That is, any configuration can be used as long as the suction force can be applied to the outside of the nozzle 2303 through the opening 2113.

  The suction unit 2325 is connected to a control unit (corresponding to 1317 in FIG. 8) similarly to the laser irradiation unit (see reference numeral 1329 in FIG. 9A) and the gas supply unit 2307, and receives a signal from the control unit. It is the structure which operates. In the soldering process by the soldering apparatus of the present modification, the second embodiment is different from the second embodiment in that the suction portion 2325 is operated after the solder ball 2117 is crimped, before or when the solder ball 2117 is crimped. This is a point of applying a suction force in the internal space 2303b. In the case where a suction force is applied before or during pressure bonding, the suction force can be supplementarily applied in the step of pressure bonding the solder ball 2117 to the opening 2113.

  It is also conceivable to use a transmissive or reflective optical sensor instead of using a CMOS for the image sensor. However, for example, in the case of using a transmission type sensor, the arrangement of the sensor needs to be different from the position where the bonding operation is actually performed, and the nozzle is reciprocated between the sensor fixing position and the position where the bonding operation is performed. In short, there is a limit to shortening the operation time.

  In addition, when a reflective sensor is used, the sensor receives light reflected from the inner surface of the nozzle because the inner diameter of the nozzle becomes smaller as it approaches a predetermined position where the solder ball is placed. . As a result, it is difficult to accurately detect the presence or absence of solder balls. However, when a CMOS is used as the image sensor, the influence of the nozzle inner surface can be eliminated by selectively extracting an arbitrary area from the captured image signal.

  As described above, there is an advantage of using a CMOS as an image sensor even compared with a transmissive or reflective optical sensor.

  In the embodiments, examples, and modifications of the present invention, the optical system unit is configured to change the optical path of the irradiation unit to match the optical path of the imaging unit. However, the present invention is not limited to this configuration. Needless to say, the arrangement of the irradiation unit and the imaging unit may be exchanged so that the optical path of the imaging unit is changed to match the optical path of the irradiation unit. That is, any configuration may be used as long as the optical paths of the imaging unit and the irradiation unit can be made coincident with each other in the nozzle opening and the vicinity thereof.

  Moreover, although the nozzle assembly of the embodiment and Example 1 is configured to be formed from two components of the nozzle body and the nozzle, it is needless to say that it can be a single member as in Example 2. .

  Furthermore, although the nozzle assembly of the embodiment and Example 1 has a configuration in which the diameter of the nozzle opening is made larger than the diameter of the detection object and the stopper is provided, the diameter of the nozzle opening is smaller than the diameter of the detection object. In addition, the nozzle assembly can be configured to inject the detection target after being melted.

  Although the injection material of this embodiment, an Example, and a modification was made into the solder member, it is also possible to use an adhesive etc. as an injection material and to use UV laser for an irradiation part.

As the air supply / suction unit in the present embodiment and examples, a known pressure source that can be switched between positive pressure and negative pressure can be used. It is good also as a structure which provides separately the pressure source which provides pressurized gas, and the vacuum source which can attract | suck air.
The shape, position, and the like of the stopper are not limited to the shapes of the above embodiment and Example 1.
Further, although the present embodiment, examples, and modifications thereof are configured to melt the solder balls discharged from the nozzles or to inject the solid-state solder balls from the nozzles, the present invention has these configurations. It is not limited to. For example, it goes without saying that the detection method and the joining apparatus according to the present invention can be applied even when the solder ball is melted before discharge (that is, in a state where the solder ball is in contact with the nozzle).

  The present invention can be embodied in many forms without departing from its essential characteristics. Therefore, it is needless to say that the above-described embodiment is exclusively for description and does not limit the present invention.

It is a front view of the principal part of embodiment of the joining apparatus of the detection target object of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a side view of the solder ball joining apparatus which is Example 1 of the joining apparatus of the detection target object of this invention. It is a fragmentary sectional view of the principal part (III) of the soldering apparatus of FIG. 2, and shows the process of injecting a solder ball. It is a fragmentary sectional view of the principal part (III) of the soldering apparatus of FIG. 2, and shows the process of injecting a solder ball. It is a fragmentary sectional view of the principal part (III) of the soldering apparatus of FIG. 2, and shows the process of injecting a solder ball. It is a fragmentary sectional view of the principal part (III) of the soldering apparatus of FIG. 2, and shows the process of injecting a solder ball. It is a block diagram of the soldering apparatus of FIG. The relationship between the imaging region and the pixel is shown, (a) shows the state where the solder ball exists, (b) shows the area selected and extracted from (a), (c) shows the state where the solder ball does not exist, (D) shows the area selected and extracted from (c). An integration circuit using CMOS is shown. It is a flowchart of a solder supply-joining process, (a) is process drawing which shows the process of supplying a solder ball from a storage part to a 2nd stopper, (b) is a solder ball from a 2nd stopper to a nozzle assembly. FIG. 6C is a process diagram illustrating a process of detecting the presence / absence of a solder ball and performing soldering. 6 is a schematic diagram of a solder ball bonding apparatus according to Embodiment 2. FIG. It is a side view which shows the principal part of the solder ball joining apparatus of FIG. FIG. 10A is a cross-sectional view of the nozzle assembly of FIG. 9A, showing a step of injecting solder balls. It is sectional drawing of the nozzle assembly of Fig.9 (a), and shows the state which the solder ball is crimping | bonding. It is a block diagram of the soldering apparatus of FIG. It is process drawing which shows the process of soldering. FIG. 10 is a cross-sectional view of a nozzle assembly that is a modification of the second embodiment. It is a fragmentary sectional view of the conventional soldering apparatus.

Explanation of symbols

1 Joining device 3, 303, 1303, 2303 Nozzle 5, 305, 1305 Object holding unit 7, 307, 1307 Supply unit 13, 313, 1313 Detection unit 15, 315, 1315 Laser irradiation unit 17, 317, 1317 Control unit 21 L-shaped stopper 29 Light source 32 Optical unit

Claims (15)

A detection method for detecting the presence or absence of the conductive member in the conductive member holding part, which is used together with an irradiation unit for irradiating the conductive member with heat rays, holds the conductive member, and has an opening,
An image signal of a predetermined area having the opening is captured by a CMOS element,
Select and extract an arbitrary area from the screen range among the captured image signals for one screen,
A method for detecting a conductive member, wherein an irradiation optical path of the heat ray of the irradiation unit and an imaging optical path of the CMOS element are matched in the opening by optical means.
  The method for detecting a conductive member according to claim 1, wherein the conductive member holding portion is a nozzle. An integral value is calculated by integrating the image signal picked up and selected and extracted using the CMOS,
The integral value is determined that there is no the conductive member in the case does not exceed the predetermined value, according to claim 1 or 2, wherein the integrated value when the difference exceeds the predetermined value for determining that the conductive member is present The detection method of the electroconductive member of description. The method for detecting a conductive member according to any one of claims 1 to 3 , wherein the CMOS is 1/6 inch. A joining method of injecting a substantially spherical conductive member from a nozzle onto a joining object and electrically joining the joining object,
Preparing the conductive member having an outer diameter larger than the diameter of the opening of the nozzle;
The conductive member is crimped to the opening of the nozzle from the outside of the nozzle,
The presence or absence of the conductive member is detected by the method for detecting a conductive member according to any one of claims 2 to 4 .
When it is determined that the conductive member is present in the detection step, compressed gas is supplied into the internal space of the nozzle,
When the inside space has a predetermined pressure value, the conductive member crimped to the opening is irradiated with heat rays through the inside space,
A joining method of injecting the conductive member onto the joining object in a solid state by the compressed gas. The bonding method according to claim 5 , wherein the pressure bonding of the conductive member to the opening is performed by pressing the nozzle against the conductive member. The bonding method according to claim 5 or 6 , wherein a suction force is applied to the opening through the internal space in order to assist pressure bonding of the conductive member to the opening. After said conductive member has been injected, the bonding method according to any one of claims 5 to 7 continues further irradiation of heat rays to the conductive member. A nozzle assembly including a nozzle that communicates with an external space and has a nozzle opening through which a conductive member is injected;
A supply unit for supplying the conductive member to the nozzle opening;
An optical lens that captures an image signal of a predetermined area having a nozzle opening in the nozzle and an imaging unit configured by a CMOS element, and an image signal for one screen captured by the CMOS element, from an arbitrary screen range A detection unit having an area selection extraction unit that selectively extracts an area , and an identification unit that determines the presence or absence of a conductive member based on an image signal of the arbitrary area ;
An irradiation unit for irradiating the conductive member with heat rays;
An optical member disposed on the irradiation optical axis or on the imaging optical axis so that the irradiation optical path of the heat ray of the irradiation unit and the imaging optical path of the imaging unit coincide at least in the nozzle;
An injection gas supply unit for introducing compressed gas into the internal space to inject the conductive member;
In order to inject the conductive member from the nozzle assembly, the conductive member is supplied by the supply unit, and the internal space is determined when the detection unit determines that the conductive member is present in the nozzle opening. A control unit that controls a series of operations of supplying the compressed gas to the conductive member and irradiating the conductive member with the heat ray. An integral value is calculated by integrating the image signal of the arbitrary area imaged using the CMOS element ,
The resulting integral value, determines that the conductive member does not exceed the predetermined value does not exist, to claim 9, further comprising an identification unit for determining that said electrically conductive member to exceed the predetermined value is present The joining apparatus as described. The bonding apparatus according to claim 9 , wherein the CMOS is 1/6 inch. Joining apparatus according to any one of claims 9 to 11 emitted from the nozzle assembly of the conductive member in a solid state. The supply unit, the conductive member relatively the nozzle causes or away with respect to reservoir that stores the claim 9 or 12 wherein the conductive member is a crimping means for crimping the opening The joining apparatus as described in any one of these. The joining apparatus according to claim 13 , further comprising a means for auxiliaryly crimping a conductive member to the nozzle opening from the outside of the nozzle. Wherein the conductive member is a substantially spherical, the diameter of the nozzle opening joining device according to any one of diameter smaller claims 9 to 14 of the conductive member.

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