JP2003224336A - Master substrate for modular substrate and method for forming edge electrode of modular substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut out a large number of modular substrates from a master substrate 5. <P>SOLUTION: A plurality of modular substrates are cut out from the master substrate 5 by cutting it along each side of a plurality of modular substrate forming regions 6 arranged on the master substrate 5. Common fringing through holes 12 are made between adjacent modular substrate forming regions 6 while fringing both of them. More specifically, no useless part dumped at the time of cutting the master substrate 5 is present between adjacent modular substrate forming regions 6. Consequently, the number of modular substrates cut out from a sheet of master substrate 5 can be increased without increasing the size thereof. The cost of the modular substrate can thereby be reduced and the cost of a modular component utilizing the modular substrate can also be reduced. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parent substrate for cutting and forming a plurality of module substrates and a method for forming end face electrodes on the module substrate.

[0002]

BACKGROUND ART FIG. 11 (a) shows a configuration example of a module component in a simplified plan view, and FIG. 11 (b) shows a cross-sectional view of a portion AA in FIG. 11 (a). ing. The module component has a module substrate 1, on which a circuit pattern (not shown) is formed and electronic components (not shown) are mounted.

Further, a plurality of end face electrodes 2 are formed in an array on the end faces of the respective sides of the module substrate 1. The end surface electrode 2 is made of solder, and a part of the end surface electrode 2 projects below the bottom surface position of the module substrate 1.
At least one of the plurality of end face electrodes 2 is connected to the circuit pattern formed on the module substrate 1 and electrically connected to the circuit pattern formed on the module substrate 1 and a circuit including electronic components. is doing. Reference numeral 3 in FIG. 11 indicates a base electrode which is a base of solder.

Such a module component has an end face electrode 2
Is mounted on a motherboard, for example. That is, after the module component is placed at the set position on the mother board with the end face electrode 2 as a foot, the end face electrode (solder) 2 is heated and melted, and the protruding tip portion of the end face electrode 2 is connected to, for example, a land (electrode pad) of the mother board. ) To join.
Then, after that, by cooling and solidifying the molten solder, the module component is mounted on the mother board by the end face electrode 2. The circuit of the module component is connected to the circuit of the mother board through the end face electrode 2.

Such a module component can be manufactured as follows. For example, first, the parent substrate 5 of the module substrate as shown in FIG. 12 is prepared. The parent board 5 is formed by cutting out a plurality of module boards 1, and a plurality of module board forming regions 6 are arranged in an array on the parent board 5 with an interval therebetween. Further, the parent substrate 5 is formed with through holes 7 extending along the respective sides of the module substrate forming region 6 so as to border the module substrate forming regions 6. Further, the base electrode 3 is formed on the parent substrate 5 at the position where the end face electrode 2 is formed at the edge of each module substrate formation region 6. The base electrode 3 is formed from the front surface side of the parent substrate 5 to the bottom surface side of the parent substrate 5 through the inner wall surface of the through hole 7.

After preparing the parent board 5 as described above, electronic components are placed on each module board forming area 6 of the parent board 5, for example. Further, as shown in FIG. 13, a jig 8 for solder placement is placed on the surface of the parent substrate 5. A through hole 9 is formed in the solder placement jig 8 in a portion corresponding to the formation position of the base electrode 3 (that is, a location where the end face electrode 2 is formed). When the solder arranging jig 8 is arranged on the parent board 5, the through hole 9 of the solder arranging jig 8 is aligned with the forming position of the base electrode 3 of the parent board 5. To be done.

Then, the solder 10 is inserted into the through hole 9 of the solder placement jig 8. After that, the solder 10 is heated in that state. As a result, the solder 10 is melted and droops downward due to gravity to enter the through hole 7 of the parent board 5. Then, the molten solder is bonded to the base electrode 3, and a part of the molten solder further hangs down and flows out from the through hole 7 and projects downward from the bottom surface position of the parent substrate 5. By cooling and solidifying this molten solder, FIG.
As shown in FIG. 5, the end face electrode 2 having a shape in which a part thereof projects downward is formed.

After that, the jig 8 for arranging the solder is removed from the parent board 5, and after that, the cutting line L for setting the parent board 5 is set.
A plurality of module components (module board 1) can be cut out from the parent board 5 by cutting along the line.

[0009]

By the way, in the parent substrate 5, the module substrate forming regions 6 are arranged with a space between each other, and the parent substrate portion between the adjacent module substrate forming regions 6 is the module. This is a portion which is wasted when the substrate 1 for use is cut out and is wasted.

An object of the present invention is to reduce the waste of such a parent board and reduce the cost of the module board (module component). An object is to provide a method for forming an end face electrode.

[0011]

In order to achieve the above object, the present invention has the following constitution as means for solving the above problems. That is, the first aspect of the present invention is a parent board for cutting out and forming a plurality of module boards on which end electrodes made of solder are formed on the end surfaces, for adjacent modules in a plurality of arrayed module board forming regions. The board forming regions are arranged through a common edging through hole edging the both, and the end face electrode forming portions of the adjacent module board forming regions are respectively arranged on the surfaces of the edging through holes facing each other. The end face electrode forming portion of the module substrate forming region on the side is different from the end face electrode forming portion of the module substrate forming region on the other side,
It is characterized in that they are arranged so as to be offset from each other in the side direction of the module substrate formation region and not face each other.

In a second aspect of the present invention, a plurality of module modules are arranged in a parent board for cutting out a plurality of module boards in which a plurality of end surface electrodes made of solder are arrayed on the end surface at a set pitch. Adjacent module substrate forming regions of the module substrate forming region are arranged through a common edging through hole that borders both of them, and the end face electrode forming portions of the adjacent module substrate forming regions are respectively defined by the edging through holes. The module substrate forming regions arranged adjacent to each other are arranged so as to be displaced from each other in the side direction of the module substrate forming region, and the end face electrode forming portion of the module substrate forming region on one side is It is characterized in that it is not opposed to the end face electrode forming portion of the module substrate forming region on the other side.

A third aspect of the invention has the structure of the first or second aspect of the invention, and is characterized in that the edge of the parent board is the edge of the module board forming area.

A fourth aspect of the invention is provided with the structure of the first, second or third aspect of the invention, and is characterized in that a base electrode serving as a base of solder is formed at the end face electrode forming portion. .

A fifth aspect of the invention has the structure of any one of the first to fourth aspects of the invention, wherein the end face electrode forming portion of the inner wall surface of the edging through hole has solder arranged at the end face electrode forming portion. It is characterized in that it has a concave shape for positioning the solder when it is melted to form the end face electrode.

A sixth aspect of the present invention is a method for forming an end face electrode made of solder on an end face of a module substrate. A parent substrate of the module substrate of the third aspect is prepared, and the parent substrate is provided with a small gap. Prepare a jig in which the parent board placement hole to be fitted is formed, and fit the parent board into the parent board placement hole of this jig through a minute gap, and then trim the through hole and the parent board. Using the minute gap between the jig and the jig, place solder by pushing it into the end face electrode forming area of each module substrate forming region, and then melt the solder to form the end face electrode of each module substrate forming region. It is characterized in that an end face electrode is formed at the use site.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1A is a schematic plan view showing a first embodiment of a parent board of a module board according to the present invention, and FIG. 1B shows an A of FIG. 1A. The schematic perspective view seen from the -A portion is shown. In the description of the first embodiment, the same components as those of the module substrate and the parent substrate thereof will be designated by the same reference numerals, and duplicate description of the common portions will be omitted.

In the first embodiment, a plurality of module substrate forming regions 6 are arranged in an array on the parent substrate 5, and a edging through hole common to both is formed between adjacent module substrate forming regions 6. 12 are formed. In other words, the edging through hole 12 is formed so as to extend in the side direction of the module substrate forming area 6, and both sides of the adjacent module substrate forming area 6 are edged.

On the inner wall surface of the edging through hole 12, a plurality of end surface electrode forming portions 13 are formed in an array on the surface which becomes the end surface of the module substrate forming area 6 at a set pitch. Each of the end face electrode forming portions 13 has a concave shape, and the base electrode 3 is formed on the concave wall surface. In addition, in the first embodiment, the concave portion of the end face electrode forming portion 13 is formed by using a drill,
The shape of the recess is an arc.

In this first embodiment, the module substrate forming regions 6 adjacent to each other are arranged so as to be offset from each other in the side direction of the module substrate forming region 6. This allows
The end surface electrode forming portion 13 of the module substrate forming area 6 on one side does not face the end surface electrode forming portion 13 of the module substrate forming area 6 on the other side via the edging through hole 12.

The parent board 5 of the first embodiment is constructed as described above. The end face electrodes 2 can be formed on the end face electrode forming portions 13 of the respective module substrate forming regions 6 of the parent substrate 5 as follows. For example, first, a plate-shaped jig 15 for solder positioning as shown in FIG. 2A is prepared. The solder positioning jig 15 has a hole for solder insertion formed in a portion corresponding to the position of the end surface electrode forming portion 13.

Such a solder positioning jig 15 is placed on the surface of the parent substrate 5. At this time, the solder insertion holes of the solder positioning jig 15 are aligned with the end surface electrode forming portions 13 of the parent substrate 5.

Then, the solder (solder ball in the illustrated example) 10 is inserted into the solder insertion hole of the solder positioning jig 15. At this time, the solder 10 is applied to a portion of the edging through hole 12 where the end face electrode forming portion 13 is formed.
The size of the edging through hole 12 and the size of the concave portion of the end face electrode forming portion 13 and the size of the solder 10 so that a part of the bottom of the
The size is designed. In the first embodiment, the end face electrode forming portion 1 on the inner wall surface of the edging through hole 12 is formed.
Since 3 has a concave shape, the solder 10 can be easily positioned on the end face electrode forming portion 13.

There are many kinds of materials forming the solder 10, and any kind of solder may be used here. For example, examples of the constituent material of the solder 10 include SnPb, SnAg, SnCu, SnSb, SnB.
i, SnZn, SnAgCu, and the like.

After that, as shown in FIG. 2 (b), the solder placement jig 15 is removed, and the solder 10 is pushed into the edging through hole 12 (press fit). As a result, the solder 10 is fixed to the parent board 5. Then, the parent substrate 5 is placed on the plate-shaped reflow jig 16. The reflow jig 16 has a hole 17 formed in a portion corresponding to the end surface electrode forming portion 13, and the hole portion 17 and the end surface electrode forming portion 13 of the parent substrate 5 are aligned with each other. .

After that, the mother substrate 5 placed on the reflow jig 16 is passed through a reflow furnace to heat the solder 10 to a melting temperature. As a result, the solder 10 melts and the solder 1
As shown in FIG. 2C, the melted solder 10 droops due to gravity and a part of the melted solder flows out downward from the edging through hole 12 as shown in FIG. 2C. As a result, a part of the solder 10 projects downward from the bottom surface of the parent board 5. In this state, the end surface electrode 2 is formed on the end surface electrode forming portion 13 by cooling and solidifying the solder 10.

The parent board 5 is attached to the plate-shaped reflow jig 16.
It is possible to prevent the parent substrate 5 from being warped by mounting and passing it through the reflow furnace. Further, in order to improve the wettability of the solder 10 and the underlying electrode 3, it is preferable to apply a flux to the parent substrate 5 before passing the parent substrate 5 through the reflow furnace.

As described above, the end face electrode forming portion 13 is formed.
After the end face electrode 2 is formed on the substrate 2, the parent substrate 5 is cut along the sides of the module substrate formation regions 6. This allows
A plurality of module substrates 1 (module components) are cut out from the parent substrate 5 and formed.

According to the first embodiment, each of the module substrate forming regions 6 arranged in the parent substrate 5 has only the edging through hole 12 between the adjacent module substrate forming regions 6. The structure is formed.
That is, there is no parent board portion between adjacent module board forming regions 6 that is discarded when cutting the parent board 5 and cutting out the plurality of module boards 1. Therefore, it is possible to significantly reduce the useless portion of the parent board 5 that is not used as the module board 1.

This makes it possible to increase the number of module substrates 1 produced from one parent substrate 5 without increasing the size of the parent substrate 5.
The cost can be reduced. This also allows
It is also possible to reduce the cost of module parts.

Furthermore, in the configuration of the first embodiment,
The end face electrode forming portions 13 of the adjacent module substrate forming regions 6 are arranged on the surfaces of the edging through holes 12 which face each other. End electrode forming part 1
If the electrodes 3 face each other via the edging through hole 12, a problem occurs when the solder 10 is melted to form the end face electrode 2. On the other hand, in the first embodiment, the adjacent module substrate forming regions 6 are arranged so as to be displaced from each other in the side direction, and the end face electrode forming portions 13 of the module substrate forming region 6 on one side are arranged. Module substrate forming area 6 on the other side
The end face electrode forming portion 13 is not opposed to. Therefore, the end surface electrode 2 can be formed by properly joining the solder 10 to each of the end surface electrode forming portions 13 of both of the adjacent module substrate forming regions 6.

The second embodiment will be described below. In the description of the second embodiment, the same components as those of the first embodiment will be designated by the same reference numerals, and duplicate description of the common parts will be omitted.

In this second embodiment, instead of arranging the adjacent module substrate forming regions 6 in the lateral direction, as shown in FIG. 3, the end face electrode formation of the adjacent module substrate forming regions 6 is performed. By arranging the use portions 13 so as to be displaced from each other in the lateral direction, the end surface electrode forming portions 13 on one side of the adjacent module substrate forming regions 6 and the end surface electrode forming portions of the other side module substrate forming region 6 13 and 13 are not facing each other. The configuration other than this is almost the same as that of the first embodiment.

According to the second embodiment, the plurality of module substrate forming regions 6 are aligned and arranged, so that the operation of cutting out the module substrate 1 from the parent substrate 5 can be facilitated.

The third embodiment will be described below. In the description of the third embodiment, the same components as those of the first and second embodiments will be designated by the same reference numerals, and duplicate description of the common parts will be omitted.

In this third embodiment, as shown in FIG. 4A, the edge of the parent board 5 is the edge of the module substrate forming area 6, and the edge of the parent board 5 is Is also used effectively. Other configurations are the same as those of the first and second embodiments.

In the third embodiment, since the edge of the parent substrate 5 is the edge of the module substrate forming area 6, the end surface electrode forming portion 13 is also formed on the edge of the parent substrate 5. ing.

The end face electrodes 2 can be formed on the parent substrate 5 shown in the third embodiment as follows. For example, a jig 20 as shown in FIG. 4B is prepared. The jig 20 is provided with a parent board arranging hole 21 into which the parent board 5 is fitted via a minute gap S.

First, the parent board locating hole 2 of the jig 20
The parent board 5 is fitted into the substrate 1 via the minute gap S. This third
In the embodiment, the jig 20 is provided with positioning means 22 in order to determine the placement position of the parent board 5 inside the parent board placement hole 21. In the example shown in FIG. 4B, the positioning means 22 is composed of a plurality of protrusions for determining the arrangement positions of two corners of the four corners of the parent board 5. By locking the sides of the parent board 5 corresponding to the tops of the respective protrusions, the parent board 5 can be arranged at the setting positions of the parent board arranging holes 21. As a result, all four sides of the parent board 5 can be reliably arranged via the inner wall surface of the parent board placement hole 21 and the minute gap S.

Of course, the structure of the positioning means 22 is not limited to the example shown in FIG. 4 (b), and other structures can be adopted. When it is necessary to pay attention to the direction of fitting the parent board 5 into the jig 20,
A means for indicating the orientation of the parent board 5 may be provided. For example, as shown in FIG. 4B, a hole 23 for determining the orientation of the arrangement is provided in the corner area of the parent substrate 5.

The parent board 5 is replaced with the parent board placement hole 2 of the jig 20.
After being fitted in 1, the solder 10 is pushed and arranged in all the end face electrode forming portions 13 by utilizing the edging through hole 12 and the minute gap S between the parent substrate 5 and the jig 20.
Then, for example, it is passed through a reflow furnace to heat the solder 10 to a melting temperature. As a result, the solder 10 is melted, and the solder 10 is bonded to the base electrode 3 of the end face electrode forming portion 13 in the same manner as described above, and the solder 10 hangs down due to gravity and part of the solder 10 penetrates the edging through hole 12 or the parent substrate 5. The shape flows out from the minute gap S between the jigs 20 and projects downward from the bottom surface of the parent substrate 5. Then, the end face electrode 2 is formed on the end face electrode forming portion 13 by cooling and solidifying the molten solder in this state.

After that, the parent board 5 is removed from the jig 20, and the parent board 5 is cut along each side of the module board forming area 6 to form a plurality of module boards 1 by cutting. .

According to the third embodiment, since the edge of the parent substrate 5 is the edge of the module substrate forming area 6,
The edge portion of the parent board 5 can also be effectively used as the module board 1 and wasteful parts can be eliminated.

Further, the end surface electrode forming portion 13 of the parent substrate 5 is formed.
By using the jig 20 when forming the end face electrode 2 on the end face electrode 2, the end face electrode 2 is formed on the end face electrode forming portion 13 at the end edge of the parent substrate 5 similarly to the other end face electrode forming portions 13.
Can be formed.

In the illustrated examples of FIGS. 4 (a) and 4 (b), the parent substrate 5 has a form in which the adjacent module substrate forming regions 6 are displaced from each other as shown in the first embodiment. However, as a matter of course, as shown in the second embodiment, the end surface electrode forming portions 13 of the adjacent module substrate forming regions 6 may be displaced from each other.

The present invention is not limited to the forms of the first to third embodiments, and various embodiments can be adopted. For example, in each embodiment, when forming the end face electrode 2, almost all of the solder 10 is trimmed through the through hole 12.
However, it is also possible to dispose a part of the solder 10 into the edging through hole 12 as shown in FIG. 5, for example. Also, as shown in FIG.
The solder 10 is filled in the inner portion of the edging through hole 12 where the end surface electrode forming portion 13 is formed.
You may arrange by pushing. Further, in each of the embodiments, an example in which the flux is applied before the reflow of the parent board 5 is shown, but, for example, without applying the flux, as shown in FIG. The solder paste 24 may be formed by printing, for example.

Further, in each of the embodiments, the end face electrode forming portion 13 on the inner wall surface of the edging through hole 12 is an arcuate concave portion, but for example, as shown in FIG. 8, the end face electrode forming portion 13 is formed. The concave shape of 13 may be a square shape, or may be a triangular shape as shown in FIG.
The shape of the recess is not particularly limited as long as the shape of the solder 10 can be easily determined.

Further, in each of the embodiments, the end face electrode forming portion 13 on the inner wall surface of the edging through hole 12 has a concave shape, but as shown in FIG. 10, it may not have a concave shape. In the case of FIG. 10, the end face electrode forming portion 13
Is flat. In this case, the solder 10 that is heated and melted is difficult to bond to a portion where the base electrode 3 is not formed by placing the solder 10 in contact with the base electrode 3 of the end face electrode forming portion 13 and arranging the solder 10 by pushing. Since it is selectively bonded to the base electrode 3, the end surface electrode 2 can be formed at the set position.

Further, in each of the embodiments, the spherical solder 1 is used.
Although the example in which the end face electrode 2 is formed on the end face electrode forming portion 13 of the parent substrate 5 using 0 is shown, instead of the spherical solder 10, a columnar solder such as a cylinder or a square pole is used. Alternatively, cone-shaped solder such as cone, triangular pyramid, or quadrangular pyramid may be used, or T-shaped or hemispherical solder may be used, and the shape of the solder is not particularly limited.

Further, in each of the embodiments, a plurality of end face electrode forming portions 1 are provided on each side of the module substrate forming region 6.
Although the 3 are arranged at regular intervals, the intervals between the end face electrode forming portions 13 do not have to be uniform. Further, in each of the embodiments, the module substrate forming area 6 of the parent substrate 5 has a rectangular shape, and a plurality of rectangular module substrates 1 can be cut out from the parent substrate 5. The substrate forming area 6 may have a shape other than a rectangle, such as a rectangular shape in which one corner is cut out, and a plurality of module substrates 1 having a shape other than a rectangle are cut out from the parent board 5. It may be configured to be able to.

[0052]

According to the present invention, only the edging through hole common to both of the adjacent module substrate forming regions is formed. That is, there is no wasteful substrate portion that is not used as a module substrate between adjacent module substrate formation regions.
Therefore, it is possible to significantly reduce the useless portion to be discarded when the parent substrate is cut and a plurality of module substrates are cut out and formed.

This makes it possible to increase the number of module substrates that can be cut out from one parent substrate without changing the size of the parent substrate. Therefore, the cost of the module substrate can be reduced. Further, this also makes it possible to reduce the cost of the module component using the module substrate.

Further, according to the present invention, the end face electrode forming portions of the adjacent module substrate forming regions are arranged on the surfaces of the edging through holes which face each other. If the end face electrode forming portions of the adjacent module substrate forming regions face each other through the edging through hole, there may be a problem in forming the end face electrode by joining the molten solder to the end face electrode forming portion. Become. On the other hand, in the present invention, the adjacent module substrate forming regions are arranged so as to be offset from each other in the side direction of the module substrate forming region, or the end face electrode formation on one side of the adjacent module substrate forming regions is performed. By disposing the use portion so as to be shifted from the end surface electrode forming portion of the module substrate forming area on the other side, the end surface electrode forming portions of the adjacent module substrate forming areas are not opposed to each other.

Therefore, it is possible to prevent the occurrence of a problem caused by the end face electrode forming portions of the adjacent module substrate forming regions being opposed to each other, and the end face electrode forming portions can be favorably disposed at each end face electrode forming portion. Can be formed.

Further, in the case where the end face electrode forming portions of the adjacent module substrate forming regions are arranged so as to be offset from each other instead of arranging the adjacent module substrate forming regions with each other, a plurality of modules are provided. Since the substrate forming regions can be aligned, the cutting operation can be facilitated when the parent substrate is cut and a plurality of module substrates are cut and formed.

In the case where the base electrode is formed in the end face electrode forming portion, the molten solder is difficult to bond to the portion where the base electrode is not formed, and the molten solder is selectively applied to the base electrode. Since they are joined, the end face electrode can be easily formed on the end face electrode forming portion as designed.

By forming the end surface electrode forming portion of the inner wall surface of the edging through hole into a concave shape for positioning the solder, the solder can be easily arranged at the set position, and the step of forming the end surface electrode is complicated. Can be prevented.

In the structure in which the edge of the parent board is used as the edge of the module substrate forming area, the edge of the parent board is also effectively used. When cutting out and forming the substrate, there is no part to be discarded,
Waste can be eliminated. This makes it possible to further reduce the cost of the module substrate, and
It is also possible to reduce the cost of module parts.

In such a parent substrate, the end face electrode forming portion is formed on the end face of the parent substrate. In the end face electrode forming method of the present invention, a jig is used in which the parent substrate is formed with the parent substrate locating holes into which the parent substrate is fitted with a minute gap. By using this jig, just as solder is pushed into the end face electrode forming part of the edging through-hole, the small gap between the parent board and the jig is also formed in the end face electrode forming part of the end face of the parent board. It is possible to press and place the solder by using. As a result, it is possible to easily form the end face electrode on the end face electrode forming portion on the end face of the parent substrate, similarly to the end face electrode forming portion on the inner wall surface of the edging through hole. Further, since it is not necessary to separately provide a step for forming the end face electrode on the end face electrode forming portion on the end face of the parent substrate, it is possible to avoid complication of the manufacturing process.

[Brief description of drawings]

FIG. 1 is a first parent board of a module board according to the present invention.
It is a model figure which shows an example of embodiment.

FIG. 2 is a diagram for explaining an example of a step of forming an end face electrode on a portion for forming an end face electrode on the parent substrate of the first embodiment example.

FIG. 3 is a model diagram showing a mother board of a second embodiment example.

FIG. 4 is a view showing a mother board of a third embodiment and explaining a jig used when forming an end face electrode at an end face electrode forming portion of the mother substrate.

FIG. 5 is a diagram for explaining another embodiment example.

FIG. 6 is a diagram for explaining another embodiment example.

FIG. 7 is a diagram for explaining another embodiment example.

FIG. 8 is an explanatory view schematically showing another concave shape of the end face electrode forming portion.

FIG. 9 is an explanatory view schematically showing another concave shape of the end face electrode forming portion.

FIG. 10 is an explanatory view schematically showing a case where the end face electrode forming portion is formed in a planar shape.

FIG. 11 is a diagram for explaining module components.

FIG. 12 is a plan view schematically showing a conventional example of a parent board.

13 is a diagram for explaining an example of a method of forming an end face electrode on the end face electrode forming portion of the parent substrate of FIG.

[Explanation of symbols]

1 module board 2 End surface electrode 3 Base electrode 5 parent board 6 Module board formation area 12 Through hole 13 End face electrode forming part 20 jigs 21 Parent board placement hole

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E317 AA22 GG16                 5E319 AA03 AB03 AC11 BB04 CC33                       CD25 GG03 GG15                 5E338 AA02 BB04 BB13 BB16 BB25                       BB28 BB46 BB65 BB75 CC01                       EE23 EE51

Claims (6)

[Claims] 1. A parent board for cutting out and forming a plurality of module boards on which end electrodes made of solder are formed on the end surfaces, and adjacent module board forming areas of a plurality of arrayed module board forming areas. Are arranged through a common edging through hole edging the both, and the end face electrode forming portions of the adjacent module substrate forming regions are respectively arranged on the surfaces of the edging through hole facing each other, and the module on one side is The end surface electrode forming portion of the substrate forming area is not aligned with the end surface electrode forming portion of the module substrate forming area on the other side in the lateral direction of the module substrate forming area. A parent substrate for a module substrate. 2. A mother board for cutting out a plurality of module boards in which a plurality of end surface electrodes made of solder are arrayed and formed on an end surface at a set pitch, and a plurality of arrayed module board formation regions are arranged. Adjacent module substrate forming regions are arranged via a common edging through hole that borders both of them, and the end face electrode forming portions of the adjacent module substrate forming regions respectively face the edging through holes facing each other. And the adjacent module substrate forming regions are arranged so as to be offset from each other in the side direction of the module substrate forming region, and the end surface electrode forming portion of the module substrate forming region on one side is the module on the other side. A parent substrate of a module substrate, which is not opposed to the end face electrode forming portion of the substrate forming region. 3. The parent board for a module substrate according to claim 1, wherein an edge of the parent board is an edge of a module board forming region. 4. The parent board of the module board according to claim 1, wherein a base electrode which is a base of solder is formed in the end face electrode forming portion. . 5. The end surface electrode forming portion of the inner wall surface of the edging through hole has a recessed shape for positioning the solder when the solder is arranged on the end surface electrode forming portion and is melted to form the end surface electrode. The parent board of the module board according to claim 1, wherein the parent board is a module board. 6. A method of forming an end face electrode made of solder on an end face of a module substrate, wherein a parent substrate of the module substrate according to claim 3 is prepared, and the parent substrate is fitted through a minute gap. Prepare a jig with board placement holes, insert the parent board into the parent board placement hole of this jig with a small gap, and then trim the edging through hole and the space between the parent board and the jig. The solder is pressed into the end-face electrode forming portion of each module substrate forming region by using the minute gap of, and after that, the solder is melted to form the end face at the end-face electrode forming portion of each module substrate forming region. A method for forming an end surface electrode of a module substrate, which comprises forming an electrode.