JP3146932B2 - Manufacturing method of electronic component with bump - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a bumped electronic component in which a solder ball is mounted on an electrode of a work to form a bump.

[0002]

2. Description of the Related Art As a method of manufacturing a bumped electronic component by forming a bump (protruding electrode) on an electrode of a work, a method using a solder ball is known. According to this method, solder balls are vacuum-sucked in suction holes formed in a large number on the lower surface of the head, transferred and mounted on the electrodes of the work, and then the work is heated in a heating furnace to melt and solidify the solder balls to generate bumps. I do. This method is extremely advantageous in terms of work efficiency because an electronic component with bumps can be manufactured by simultaneously forming a large number of bumps on the electrodes of the work.

[0003]

By the way, works are generally very small, so that a plurality of works are often mounted on a carrier one by one and conveyed on a production line. However, in the conventional head, only the solder ball for one work can be vacuum-sucked.
As described with reference to, the solder ball must be repeatedly reciprocated between the supply portion of the solder ball and the carrier to mount the solder ball for each work, so that the overall tact time becomes longer and the work efficiency becomes longer. There was a problem that it did not bounce.

Accordingly, the present invention provides a bumped electronic component which can efficiently mount a solder ball on a plurality of works.
An object of the present invention is to provide a manufacturing method of.

[0005]

[0006]

SUMMARY OF THE INVENTION The present invention provides a plurality of words.
Divided into a plurality of blocks corresponding to
A step in which a head provided with independent vacuum suction means in each block vacuum-suctions and picks up a solder ball provided in a supply section of the solder ball, and a step of picking up a plurality of works in which the head is positioned in a positioning section; Moving the head relatively horizontally with respect to each work so that the plurality of blocks are located directly above each work, and soldering each block corresponding to each work. The method of manufacturing the electronic component with bumps was constituted by the steps of releasing the vacuum suction state of the balls and mounting the solder balls on each work.

[0007]

According to the above arrangement, the head collectively picks up solder balls for a plurality of works at the solder ball supply section, moves upward of the carrier, and moves horizontally relative to each work. However, since the solder balls are sequentially mounted on each work, the overall tact time can be greatly reduced.

[0008]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a manufacturing process diagram of an electronic component with bumps according to one embodiment of the present invention, FIG. 2 is a plan view of a manufacturing apparatus of the electronic component with bumps, FIG. 3 is a side view thereof, and FIG. FIG. 5 is a sectional view of the head, and FIG. 6 is a block diagram of the control system. FIG. 7 is a cross-sectional view of a main part of the lower surface of the solder ball while a flux is being applied. FIG. FIG. 10 is a front view of the head, the light emitting unit and the light receiving unit.

First, with reference to FIG. 1, a brief description will be given of the entire manufacturing process of an electronic component with bumps. In FIG. 1A, 3
Is a substrate as a work, and has electrodes 20 formed on its upper and lower surfaces as shown in FIG.
Through holes 3a are formed to electrically connect the 0s.

Next, the chip C is mounted on the upper surface of the substrate 3 (FIG. 1C), and the electrodes on the upper surface of the chip C and the electrodes 20 on the upper surface of the substrate 3 are connected by wires W (FIG. 1D). . Next, a mold body M for protecting the chip C and the wire W is formed of a synthetic resin (FIG. 1E). Next, the substrate 3 is turned upside down, and the solder balls 5 are mounted on the upper surfaces of the electrodes 20 (FIG. 1).
(F)). Next, the substrate 3 is sent to a heating furnace where it is heated, and the solder balls 5 are melted and solidified to form bumps 5 '(FIG. 1 (g)).

Thus, the electronic component with bumps is completed.
Next, the steps of FIGS. 1F and 1G, that is, the steps of mounting the solder balls 5 on the bump electrodes 20 and forming the bumps 5 'will be described in detail with reference to the drawings.

In FIG. 2, reference numeral 3 denotes a substrate shown in FIG. 1 (e), and a mold body M for molding a chip C is formed on a lower surface thereof. Four substrates 3 are mounted on the carrier 10.

In FIG. 2, reference numeral 1 denotes a table, and two guide rails 2 are provided at the center of the upper surface thereof. The carrier 10 is transported along the guide rail 2 and is clamped by the guide rail 2 to be positioned at a predetermined position. In this embodiment, the carrier 1 by the guide rail 2 is used.
A transport direction of 0 is defined as an X direction, and a direction orthogonal thereto is defined as a Y direction. A solder ball supply unit 4 is provided at a corner of the table 1. As shown in FIG. 3, the supply portion 4 for solder balls is formed of a box, and a large amount of solder balls 5 are stored inside the box. Also, on the side of the guide rail 2,
A collecting section 19 for the solder balls 5 is provided. The collecting section 19 is made up of a box.

In FIGS. 2 and 3, a flux application section 6 is provided at the other corner of the table 1. FIG.
The flux application section 6 includes a dish-shaped container 7 and a smooth head 8.
It has. Flux 9 is stored shallowly in container 7. The smoothing head 8 is mounted on the table 1 so as to be slidable in the X direction, and includes a base plate 15 provided above the container 7. Two cylinders 16 are installed on the base plate 15, and squeegees 18a,
8b are coupled. The squeegees 18a and 18b move up and down by the rod 17 of the cylinder 16 protruding and retracting.

In FIG. 2, a feed screw 13 is driven by a motor 14 to rotate. A nut (not shown) screwed to the feed screw 13 is provided on the lower surface of the side of the base plate 15, and when the motor 14 is driven to rotate the feed screw 13, the smooth head 8 is horizontally moved in the X direction. Moving. In this case, the squeegee 18a or 18b shown in FIG. 3 selectively lands on the flux 9 and slides to smooth the upper surface of the flux 9.

Next, a description will be given of a head as a means for transferring solder balls and a moving means therefor. 2 and 4,
In FIG. 5, the head 50 comprises a box-shaped head main body 51 and a head portion 52. The head section 52 is divided into a plurality of blocks A, B, C, and D by a partition wall 53, and suction holes 54 for vacuum suction of the solder balls 5 are formed on the lower surface of each of the blocks A to D in a matrix. Many holes are opened. In the present embodiment, the partition wall 53 is partitioned into four square blocks A to D by a cross-shaped partition wall 53 in plan view.

Each of the blocks A to D has a suction space T independent of each other.
Through a piping system such as a vacuum pump 62 and a blower 63 (described later with reference to FIG. 6). An optical sensor 56 for detecting the presence or absence of the solder ball 5 vacuum-sucked in the suction hole 54 is provided above each suction space T. By operating the vacuum pump 62,
The suction space T is evacuated, and the solder balls 5
Is vacuum-adsorbed. By operating the blower 63 and blowing air into the suction space T, the holding state by vacuum suction is released, and the solder balls 5 fall from the suction holes 54. A camera 11 for board recognition is integrally provided on a side surface of the head 50 (FIG. 2).

In FIG. 2, a long frame 24 is provided above the table 1. A feed screw 25 and a guide rail 26 are arranged on the frame 24 in parallel. 27 is a motor for rotating the feed screw 25. A nut 28 screwed to the feed screw 25 is connected to the head 50. Therefore, when the motor 27 is driven to rotate the feed screw 25, the nut 28 moves horizontally in the X direction along the feed screw 25, and the head 50 also moves to the guide rail 26.
Move horizontally in the X direction along.

Both ends of the frame 24 are slidably mounted on guide rails 29 and 30. The guide rails 29 and 30 are orthogonal to the guide rail 26. A feed screw 31 is provided in parallel with the guide rail 29. A nut (not shown) with which the feed screw 31 is screwed is provided on the lower surface of the frame 24.
Therefore, when the motor 32 is driven and the feed screw 31 is rotated, the frame 24 and the head 50 connected thereto are rotated.
Moves horizontally in the Y direction along the guide rails 29 and 30.

As described above, the feed screws 25, 31, the guide rails 26, 29, 30, the motors 27, 32, etc.
The moving means for horizontally moving the head 50 in the X direction or the Y direction is constituted, whereby the head 50 can freely move between the solder ball supply unit 4, the recovery unit 19, and the carrier 10 positioned on the guide rail 2. Moving.

Next, the inspection means will be described. In FIG. 2, reference numeral 40 denotes a long first light source. The first light source 40 is provided between the solder ball supply unit 4 and the flux application unit 6, and irradiates light from below to the lower surface of the head 50 (see FIG. 9). An optical sensor 56 is built in the head 50. Therefore, when the solder balls 5 are vacuum-sucked in all the suction holes 54,
The suction holes 54 are completely shielded from light by the solder balls 5 and no light enters the optical sensor 56. However, when the solder balls 5 are not vacuum-sucked in any of the suction holes 54, the light is emitted from the first light source 40. The emitted light passes through the suction hole 54 and enters the optical sensor 56. As a result, it is found that the pick-up of the solder ball 5 has occurred. That is, the first
The light source 40 and the optical sensor 56 are inspection means for inspecting whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 54, that is, whether or not there is a pickup error.

In FIG. 2, a second light source 42 is provided between the flux application section 6 and the guide rail 2. Similarly to the first light source 40, the second light source 42 emits light toward the lower surface of the head 50, and whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 54, that is, whether the solder balls 5 A check is made to see if there is a drop (see FIG. 9).

The reason for installing the second light source 42 is as follows. That is, the head 50 is moved up and down above the container 7 so that the solder balls 5 that have been vacuum-adsorbed on the lower surface of the head 50 are brought into contact with the flux 9 and the flux 9 is attached to the lower surface (FIGS. 7A and 7B). )), Flux 9
Is so viscous that when the solder ball 5 is immersed in the flux 9, the viscosity of the solder ball 5 causes the suction hole 5
4 may fall. When the head 50 from which the solder balls 5 have fallen is moved above the substrate 3 and the solder balls 5 are mounted on the substrate 3, the substrate 3
Will be defective. Therefore, during the movement of the head 50 to the substrate 3, the second light source 42 and the optical sensor 56 inspect whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 54. That is, the second light source 42 and the optical sensor 56
This is an inspection means for inspecting the presence or absence of a fall.

In FIG. 2, a light emitting section 43 and a light receiving section 44 are provided between the guide rail 2 and the solder ball supply section 4. As shown in FIG. 10, light is emitted horizontally from the light emitting unit 43 to the light receiving unit 44. After the solder balls 5 are mounted on the substrate 3, the head 50 moves between the light emitting section 43 and the light receiving section 44 in a direction orthogonal to the optical path and returns to the solder ball supply section 4. Head 50
When the solder ball 5 remains on the lower surface of the device, the light is blocked and the light receiving section 44 does not receive the light. Also, all the solder balls 5 are mounted on the substrate 3, and the solder balls 5
Is not attached at all, the light emitted from the light emitting unit 43 is received by the light receiving unit 44. Thereby, whether or not the solder balls 5 remain and adhere to the lower surface of the head 50, that is, whether the head 50
A check is made to determine whether or not a mounting error has occurred on the substrate 3.

Next, the control system will be described with reference to FIG. A tube 55 connected to each suction space T of each of the blocks A to D is connected to a vacuum pump 62 via valves 60 and 61.
And the blower 63. Each valve 60, 61 is controlled by a valve drive circuit 64. The optical sensor 56
And the light receiving section 44 are connected to a detection circuit 65. Reference numeral 66 denotes a control unit for controlling the whole, and a valve driving circuit 64
The motor drive circuit 67 and a position detection unit 68 connected to the camera 11 are connected. The motor drive circuit 67 controls the motors 14, 27, 32. As is clear from FIG. 6, each suction space T of each of the blocks A to D is provided with a piping system such as the tube 55 and the valves 60 and 61 which are independent of each other, so that the suction and suction release can be controlled independently of each other. Done.

The manufacturing apparatus for an electronic component with bumps is constructed as described above. Next, the operation for mounting the solder balls shown in FIG. 1 (f) will be described. In FIG. 2, the head 50 moves above the solder ball supply unit 4 (arrow A). Then, the head 50 moves up and down, and
The plurality of solder balls 5 are collectively vacuum-sucked into the suction holes 54 on all lower surfaces of the blocks A to D and picked up. A description of a mechanism for causing the head 50 to perform the up-down operation is omitted.

In FIG. 2, the head 50 is then moved leftward (above the first light source 40) (arrow B), and as described with reference to FIG. To inspect. If there is a pick-up error, the head 50 returns above the solder ball supply unit 4 (arrow C), performs vertical movement again, picks up the solder ball 5, and moves leftward again (arrow d). Then, the light passes above the first light source 40 and is inspected again for the presence or absence of a pickup error.

When there is no pick-up error and the solder balls 5 are correctly held by vacuum suction in all the suction holes 54, the head 50 moves above the container 7, where the head 50 moves up and down. Then, the flux 9 is adhered to the lower surface of the solder ball 5 vacuum-adsorbed to the lower surface.
FIGS. 7A and 7B show the operation.

Next, in FIG. 2, the head 50 moves from above the container 7 to above the second light source 42 (arrow E), and as described with reference to FIG. To inspect. If it is found that one or more solder balls 5 are dropping from the lower surface of the head 50, the head 50 moves above the collecting unit 19,
All the solder balls 5 that are vacuum-adsorbed on the lower surface thereof are dropped into the collecting section 19. The head 50 having dropped all the solder balls 5 moves above the solder ball supply unit 4 and repeats the above operation.

In FIG. 2, if it is detected by the second light source 42 and the optical sensor 56 that the solder ball 5 has not fallen, the head 50 moves above the substrate 3 (arrow F), The solder balls 5 are mounted on the substrate 3.
Next, with reference to FIG.
The mounting operation of the solder ball 5 for the above will be described. 4, a, b, c, and d show the position of the head 52 with respect to the carrier 10 when the solder balls 5 are mounted by the four blocks A to D. That is, the head 52
At the position a, the solder balls 5 of the block A
Is mounted on the electrode 20 of the substrate 3. Similarly, the head part 5
The solder balls 5 of the blocks B, C, and D are placed on the substrate 3 by setting the positions 2 to the positions b, c, and d.
To be mounted on. In this case, the head section 52 moves horizontally on the carrier 10 in the X direction and the Y direction as indicated by arrows. Of course, this movement is performed by driving the motors 27 and 32 (FIG. 2).

For example, when the solder ball 5 of the block A is mounted on the substrate 3 at the position a, the valve 60 on the vacuum pump 62 side connected to the block A is closed and the valve on the blower 63 side in FIG. By opening 61 and blowing air into the suction space T of the block A, the vacuum suction state of the solder ball 5 that has been vacuum suctioned to the suction hole 54 of the block A is released. At this time, the states of the valves 60 and 61 of the other blocks BD are unchanged (the valve 60 on the vacuum pump 62 side is open, and the valve 61 on the blower 63 side is closed). The vacuum suction state is maintained. Similarly, when the solder balls 5 of the other blocks B to D are mounted on the substrate 3, the valves 60 and 61 are opened and closed as in the case of the block A. As described above, the present apparatus is provided with the solder ball supply unit 4.
, The solder balls 5 are collectively vacuum-adsorbed simultaneously on the four blocks A to D, and then the solder balls 5 are mounted on the four substrates 3 one after another. FIG. 8 shows a state where the solder balls 5 are mounted on the electrodes 20 of the substrate 3.

FIG. 11 is a time chart of a solder ball mounting operation, FIG. 11 (a) is a time chart of a conventional solder ball mounting operation, and FIG. 11 (b) is a time chart of the solder ball of the present embodiment described above. It is a time chart of a mounting operation.
In the conventional method shown in FIG. 11A, a series of operations of “substrate recognition”, “pickup of solder balls”, “adhesion of flux”, and “mounting of solder balls on a substrate” are performed on four substrates 3 on a carrier 10. Since the repetition was performed individually one by one, the total tact time became longer, and the work efficiency was not improved.

On the other hand, in the present embodiment, as shown in FIG.
After picking up the solder balls and attaching the flux to the first substrate 3 at a time, and mounting the solder balls 5 on the first substrate 3, the second to fourth substrates 3 FIG. 11 shows that only the board recognition and the mounting of the solder balls 5 are performed and the solder balls 5 are mounted one after another.
Tact time can be greatly reduced as compared with the conventional method shown in FIG.

After the solder balls are mounted on the four substrates 3 as described above, the head 50 moves to a position short of the light emitting section 43 and the light receiving section 44 (arrow G in FIG. 2). To the supply unit 4 (arrow a). At this time,
As described with reference to FIG. 10, it is inspected whether the solder balls 5 remain on the lower surface of the head 50 and are not held. Here, if it is detected that the solder ball 5 is remaining attached, the solder ball 5 has failed to be mounted on the board 3, that is, due to a mounting error, and the head 50 This solder ball 5 moves upward.
Is dropped into the collection unit 19 and collected. Note that solder balls 5
Is dropped from the head 50 to the collection unit 19, the valve 60 shown in FIG. 6 is closed and the valve 61 is opened to release the suction state of the solder ball 5. The substrate 3 is defective because the solder balls 5 are missing, and is removed outside the line. Next, the head 50 moves above the solder ball supply unit 4 (arrow A), and the above-described operation is repeated. The board 3 on which the solder balls 5 are correctly mounted is
It is transported along the guide rail 2 toward the next step.

FIG. 12 is a perspective view of a carrier according to another embodiment of the present invention. The carrier 70 is a multiple-panel substrate. After forming bumps on the electrodes 20, the carrier 70 is cut along a chain line to obtain four substrates 3 '. By positioning the carrier 70 on the guide rail 2 instead of the carrier 10, the solder balls 5 are mounted on the electrodes 20 as in the above-described embodiment.

As described above, according to the apparatus for manufacturing an electronic component with bumps, the head picks up the solder balls in the supply section, attaches the flux to the solder balls, and mounts the solder balls on a plurality of substrates. Can be automatically and continuously performed. In addition, the presence / absence of a solder ball pick-up error, a drop in the middle, or a mounting error on a substrate is quickly detected during each process, and if such a mistake is detected, a recovery operation is quickly performed. be able to.

[0037]

According to the present invention, the whole process from picking up the solder ball of the supply portion of the solder ball by the head to mounting it on a plurality of works can be performed with good workability, and the tact time can be increased. Can be shortened to width.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram of an electronic component with bumps according to an embodiment of the present invention.

FIG. 2 is a plan view of an apparatus for manufacturing a bumped electronic component according to an embodiment of the present invention.

FIG. 3 is a side view of an apparatus for manufacturing a bumped electronic component according to an embodiment of the present invention.

FIG. 4 is a perspective view of a head and a carrier of the apparatus for manufacturing an electronic component with bumps according to one embodiment of the present invention.

FIG. 5 is a cross-sectional view of a head of an apparatus for manufacturing an electronic component with bumps according to an embodiment of the present invention.

FIG. 6 is a block diagram of a control system of the apparatus for manufacturing an electronic component with bumps according to one embodiment of the present invention.

FIG. 7 is a cross-sectional view of a main part of a device for manufacturing an electronic component with bumps according to an embodiment of the present invention, in which flux is applied to the lower surface of a solder ball;

FIG. 8 is a cross-sectional view of a main part of a manufacturing apparatus for an electronic component with bumps according to one embodiment of the present invention, in which a solder ball is being mounted on an electrode of a substrate.

FIG. 9 is a front view of a head and a first light source of the apparatus for manufacturing an electronic component with bumps according to one embodiment of the present invention.

FIG. 10 is a front view of a head, a light emitting unit, and a light receiving unit of a manufacturing apparatus of an electronic component with bumps according to an embodiment of the present invention.

11A is a time chart of a conventional solder ball mounting operation. FIG. 11B is a time chart of a solder ball mounting operation according to one embodiment of the present invention.

FIG. 12 is a perspective view of a carrier according to another embodiment of the present invention.

[Explanation of symbols]

 2 Guide rail (work positioning part) 3, 3 'substrate (work) 4 Solder ball supply part 5 Solder ball 6 Flux application part 7 Container 8 Smooth head 9 Flux 10, 70 Carrier 11 Guide rail 13 Feed screw 14 Motor 18a, 18b Squeegee 19 Collection unit 25 Feed screw 27 Motor 28 Nut 31 Feed screw 32 Motor 40 First light source 42 Second light source 43 Light emitting unit 44 Light receiving unit 50 Head 54 Suction hole 55 Tube 60, 61 Valve 62 Vacuum pump 63 Blower A, B, C, D Block T Suction space

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/34 505 B23K 3/06 H01L 21/60

Claims (2)

(57) [Claims] 1. A head which is divided into a plurality of blocks respectively corresponding to a plurality of workpieces and has vacuum suction means independent of each other in each block vacuum-adsorbs a solder ball provided in a solder ball supply section. Picking up, moving the head over a plurality of works positioned at the positioning unit, and positioning the heads so that the plurality of blocks are positioned directly above each work. A step of horizontally moving relative to the work, releasing the vacuum suction state of the solder ball for each block corresponding to each work, and mounting the solder ball on each work. Of manufacturing electronic components A step of forming an electrode for forming a bump on a workpiece; and a step of dividing a head into a plurality of blocks each corresponding to a plurality of workpieces, each of which being provided with vacuum suction means independent of each other. A step of vacuum-sucking and picking up a solder ball provided in a ball supply unit; a step of moving the head over a plurality of works positioned at a positioning unit; The head is moved horizontally relative to each work so as to be located directly above the work, the vacuum suction state of the solder balls is released for each block corresponding to each work, and the solder balls are applied to each work. Mounting process,
A method of manufacturing an electronic component with bumps, comprising: