WO1998009323A1

WO1998009323A1 - Method and device for forming very small ball bump

Info

Publication number: WO1998009323A1
Application number: PCT/JP1997/002996
Authority: WO
Inventors: Kenji Shimokawa; Kohei Tatsumi; Eiji Hashino; Toshio Yamamoto; Toshiharu Kikuchi
Original assignee: Nippon Steel Corporation
Priority date: 1996-08-29
Filing date: 1997-08-28
Publication date: 1998-03-05

Abstract

A method and device for forming bumps composed of very small metallic balls on electrodes of semiconductor chips, printed board, etc. A first invention is such that a vacuum chamber for vacuum clamping is divided into a plurality of divisions and the clamping/releasing are controlled for each division so as to prevent balls from being clamped to an array board in aggregates. Partition walls are provided in the vacuum chamber. A second invention is such that cut-off sections are provided in an edge portion of the array board so as to prevent bumps already formed from being pressed against the board again. A third invention is such that a bump forming device which hold only one ball is disclosed. A forth invention is such that bumps are formed at once on two or more diced semiconductor chips. A fifth invention is such that an optimum amount range of very small metallic balls are accurately supplied to a container. A sixth invention is such that two or more balls excessively arranged on one suction hole of the array board are reliably detected.

Description

Specification

Method and apparatus for forming minute pole bumps

The present invention relates to a method and an apparatus for forming a bump made of minute metal balls on an electrode such as a semiconductor chip or a printed circuit board. Background art

2. Description of the Related Art Conventionally, wafer bumps, stud bumps, transfer bumps, and the like have been known as bumps serving as bonding media between electrodes of a semiconductor chip and external circuits. In recent years, as the density of semiconductor devices has increased, the pitch of electrodes has been reduced or the size of bumps has been reduced. A bump forming method in which minute metal balls on which bumps are to be formed are arranged in advance at the same coordinates as the electrodes of a semiconductor chip, and the bumps are collectively bonded on the electrodes has been put into practical use.

For example, as disclosed in Japanese Patent Application Laid-Open No. 7-15373675, the present applicant has already arranged micro metal balls so as to be flush with electrode pads of a semiconductor chip. We proposed a bump formation method that collectively picks up a metal ball group for one semiconductor chip from the arrayed substrate, transports it to the bonding stage, and bonds it to the part to be bonded.

In the bump forming method proposed in the above publication, at least one metal ball group of a semiconductor chip is sucked and held. In order to hold a plurality of metal ball groups by suction, a ball array substrate having suction holes formed at all positions corresponding to bump forming positions on the semiconductor chip is used. After sucking and holding the ball array substrate, the ball array substrate is transported to a joining stage to be joined to a portion to be joined.

Therefore, in this case, the uniformly formed fine metal balls can be collectively joined to the bump formation position, so that ball bumps with high reliability can be easily and efficiently formed.

In FIG. 8, 61 is an array substrate, 62 is a ball suction hole, 63 is a metal ball, 6 Two

Reference numeral 4 denotes an array head to which the array substrate 61 is attached. Further, 65 is a vacuum chamber provided between the array substrate 61 and the array head 64, 66 is a vent hole communicating with the vacuum chamber 65, and 67 indicated by an arrow is a vacuum chamber 65. This is a ventilation pipe provided between the decompression and Z pressure devices.

In the conventional arrangement apparatus for fine balls configured as described above, ball suction holes 62 are formed at all positions corresponding to the bump formation positions in order to collectively hold a plurality of metal balls 63 by suction. After the plurality of metal balls 63 are collectively held on the array substrate 61, the array substrate 63 is conveyed to a bonding stage (not shown) and bonded to a portion to be bonded of an electronic component. Like that.

Therefore, in this case, the uniformly formed minute metal balls 63 can be bonded together at the bump formation positions of the electronic component, so that ball bumps with high resilience and reliability can be obtained easily and It can be formed efficiently.

By the way, in recent years, the miniaturization of semiconductor devices has been increasingly advanced, and the wiring pitch of the electrodes has become extremely small. For this reason, metal balls used for forming ball bumps on the electrodes have become extremely fine as the wiring pitch of the electrodes becomes finer.

The first problem of the prior art will be described below.

In order to improve the reliability of narrow pitch and multi-pin connections, it is effective to change from conventional side-placed pins to surface-placed pins. However, when a plurality of metal balls 63 are collectively sucked and held on the array substrate 61 for the pins arranged in a plane, the following problems occur.

That is, when ball bumps are formed using the array substrate 61, as shown in FIG. 9, first, the array head 64 is moved onto the container 14 in which the metal balls 63 are accommodated. . A vacuum chamber 65 formed inside the array head 64 is connected to a decompression and pressurization device (not shown) through a ventilation pipe 67, and the vacuum chamber 65 is formed by the decompression and Z pressurization device.减 Pressure is applied inside.

Further, the container 14 is fixed on a vibration generator 15 such as a parts feeder, and the metal ball 63 is viewed by the vibration of the vibration generator 15. The frequency of the vibration generated by the vibration generator 15 is the size of the metal ball 63. CT / JP97 / 02996

According to 3 etc., it is made variable from 0 to 1 kHz, for example. Further, the container 14 can be detached from the vibration generator 15.

Next, in order to adsorb the metal balls 63 on the adsorbing surface of the array substrate 61, the array heads 64 are lowered to the vicinity of the container 14 and are swung, and the jumping metal balls 63 are arranged. Vacuum suction is performed on the ball suction holes 62 of the substrate 61. Here, the descending distance and the amplitude distance of the array head 64 can be controlled, for example, in units of 0.1 mm, and the number of amplitudes can be controlled.

As described above, when the metal balls 6 are vacuum-sucked into the pole suction holes of the array substrate 61, as shown in FIG. 9, the metal balls 63 are sucked onto the dumplings at the center of the array substrate 61. It may be done. This is because when the arrangement substrate 61 approaches the container 14 and attracts the metal balls 63, the air flowing from the peripheral portion of the arrangement substrate 6 、 flows into the arrangement substrate 61 and the container. This is because it is easy to approach the center of the space facing 14.

If a plurality of metal balls 63 are vacuum-adsorbed in the central part of the array substrate 61 in a ball-like manner, the ball suction process must be restarted from the beginning, and the production efficiency of the ball bump decreases. Not so good.

In addition, even when the metal balls 63 are re-adsorbed, conventionally, all of the metal balls 63 have to be adsorbed, so that there is a problem that the malfunction of the adsorbed state is likely to occur again. Further, since all of the metal balls 63 are re-adsorbed, there is a problem that the desorption / adsorption process of the metal balls 63 takes much time. The second problem of the prior art will be described below.

FIG. 19 shows a schematic configuration of an apparatus used for a bump forming method for a semiconductor chip using micro balls. The main components of this device are a ball pickup stage] 0, a joining stage 120, an array head 130, and a drive mechanism 140 for moving the array head 130 in the X direction. It has. In FIG. 19, the direction perpendicular to the plane of the drawing is the Y direction, and the up and down direction is the Z direction, and it is possible to move in these Y and Z directions. In this apparatus, the array head 130 moves between a ball-bickup stage 100 (dotted line) and a joining stage 120 (solid line) as shown in FIG. In the ball pickup stage 100, a large number of minute balls 4 are accommodated in a container 14 as shown in FIG. 20 (A). When the container 14 is vibrated by the vibrator 15, the minute balls 4 in the container 14 are viewed. The microballs 4 that have jumped in this manner are adsorbed and arranged by the array substrate 1 attached to the tip of the array head 10, as shown in FIG. 20 (B). The array substrate 1 has suction holes 3 corresponding to the electrodes of the semiconductor chip on which bumps are to be formed, and each of the suction holes 3 holds one fine / j and a ball 4 by suction. I'm sorry.

Next, the array head 10 (in FIG. 19, 30) is moved to the joining stage 120 by the driving mechanism 140 (FIG. 20 (C)). In this bonding stage 12 (), the array head 10 is aligned with the semiconductor chip 1, which is positioned at a predetermined position, and lowered, and the micro-balls 4 held on the array substrate 1 are moved downward. It is brought into contact with the electrodes 12 of the semiconductor chip 11. In this case, the micro-balls 4 can be bonded to the electrodes 12 as shown in FIG. Although the above example is a case where bumps are formed on the electrodes 12 of the semiconductor chip 11, the bumps are formed in substantially the same manner in the case of a printed circuit board including TAB (Tape Automated Bonding). In a conventional bump forming method using such a metal ball, as shown in FIG. 21, for example, a plurality of semiconductor chips (semiconductor chips on a wafer) are placed on a substrate 104 side on which a bump is to be formed. May be included), a specific one of the already formed bumps _{25a, the} force _25ai ; and the formation of a new bump 25b to be formed again by the array substrate 1 There was a problem that it could be pressed.

That is, as in the example of the array substrate 1 shown in FIG. 21, the peripheral portion 1 a has a certain degree as shown in the drawing to secure a certain mechanical strength, particularly in relation to the formation of the suction holes 3. The length must be overhanged. In the conventional array substrate 1, the bumps 25a! As in the case of (2), it is pushed twice, and as a result, the bump height varies on the substrate 104. Such a variation in bump height leads to problems such as impairing the reliability of bump bonding.

The third problem of the prior art will be described below. CT / JP97 / 029 6

5 In the conventionally known method of forming minute ball bumps, the suction holes formed in the array substrate are uniquely determined according to the bump formation positions of the semiconductors forming the ball bumps. There was a problem that an array board corresponding to it had to be prepared and prepared every time.

Therefore, the method of collectively forming a plurality of ball bumps using the array substrate having a plurality of suction holes as described above is suitable for mass production of multi-pin semiconductor products. However, it was not suitable for the small-scale production of low-pin-count semiconductor devices.

As a method for forming a pole bump suitable for producing a small number of semiconductor devices with a small number of pins, for example, a "solder ball forming method" proposed in Japanese Patent Application Laid-Open No. 62-166658 / 1988. Can be considered.

The “solder ball forming method” is a method of forming a solder ball by using a solder bump tool provided with a suction hole penetrating from a tip of a heat generating portion at a tool end to a connection portion with a suction means, and a suction means. In this way, it is possible to form a good solder bump having a large thickness and a small variation.

In recent years, semiconductor devices have been increasingly miniaturized, and the wiring pitch of the electrodes has become extremely small. For this reason, the metal balls used for forming the ball bumps on the electrodes are very fine in accordance with the finer wiring pitch of the electrodes. Such fine metal balls are very difficult to handle, but in the “solder ball forming method”, no special measures have been taken when handling fine metal balls. For this reason, when trying to form a fine ball bump using the above-mentioned “solder ball forming method”, a plurality of metal balls may be attracted when one fine metal ball is attracted to the tool end. There was sex.

If an extra metal ball is adsorbed, not only the metal ball is wasted, but also the extra metal ball may fall on the semiconductor chip and cause a defective product, which is not preferable.

Further, in the case of the “solder ball forming method”, the solder balls are welded to the bump forming positions. Therefore, the tip of the soldering tool must be at a high temperature corresponding to the melting point of the solder ball. Therefore, since a high melting point noble metal ball such as AuPt has a high melting point, it is desirable to perform thermocompression bonding at a temperature as low as possible so as not to cause thermal damage to a chip or the like.

The fourth problem of the prior art will be described below.

In a conventionally known bump forming method, dicing semiconductor chips are arranged one by one on a bonding stage, and bumps are formed on each semiconductor chip. Therefore, the conventional method has room for improvement in terms of manufacturing efficiency or productivity.

Further, there is a known device in which bumps are formed on at least one semiconductor chip at the wafer stage, that is, before dicing the wafer. However, when a defective semiconductor chip is included in the semiconductor chip, bumps are formed not only on the pulled semiconductor chip but also on the defective semiconductor chip. Even with this method, it was difficult to achieve productivity.

The fifth problem of the prior art will be described below.

In the conventionally known method of forming bumps using minute metal balls, for example, as shown in FIG. 36, an array having an array substrate 1 having a number of ball array holes 3 corresponding to the electrodes of a semiconductor chip is formed. Head 10 is used. The array head 10 is adapted to be evacuated by the suction chamber 5. A vacuum pump 16 as a vacuum source is connected to the suction chamber 5. The array head 10 is supported by the actuator 140.

Below the arrangement bed 10, a container 14 for accommodating micro gold balls 4 for forming bumps is arranged. The arrayed substrate 1 is lowered into the container 14 at a predetermined timing as shown by a dashed line in FIG. 36, so that the minute metal balls 4 are attracted to the ball array holes 3, and the attracted minute metal balls 4 are not shown. Transfer to the joining stage. When the small metal balls 4 are adsorbed to the ball array holes 3, the container 14 can be vibrated so that the small metal balls 4 can be viewed in the container 14 內 to facilitate adsorption. Be taken.

In the method or the apparatus for forming the bumps, a small amount of fine metal balls 4 should be formed in an appropriate amount by appropriate timing so that the fine metal balls 4 do not become excessive or insufficient in the container 14. Is supplied. The supply amount of the minute metal balls 4 in the container 14 is controlled by the weight. When the amount of the minute metal balls 4 in the container 14 becomes small, the device is stopped appropriately and supplied.

By the way, when the minute metal balls 4 attracted to the array substrate 1 are joined to the electrodes of the semiconductor chip in the ball joining stage, it is necessary that the minute metal balls 4 are properly attracted to the ball array holes 3. The method is extremely important. In other words, one micro metal ball 4 must be properly adsorbed in each ball arrangement hole 3.

As shown in Fig. 36, when the array substrate 1 is lowered into the container 14 and the minute metal balls 4 are sucked into the ball array holes 3, depending on the size of the minute metal balls 4 contained in the container 14, The success rate of ball suction changes. That is, as shown in FIG. 37, when the amount of the minute metal balls 4 is out of the optimum range and extremely small or large, the ball suction success rate decreases. Also, the width of the optimum range itself may vary as indicated by the dotted line depending on the ball diameter and the like.

We would like to supply the small metal balls 4 contained in the container 14 in an optimal range, but since the small metal balls 4 are extremely small (some diameters of several tens of μm have been introduced), to some extent I have to figure out the amount with the mass. As described above, since the amount of the minute metal balls 4 accommodated in the container 14 is controlled by the weight, the supply becomes rough. Therefore, it is actually difficult to perform ball suction with a high success rate.

The sixth problem of the prior art will be described below.

As described above, when the size of the fine metal balls is reduced, excess balls may be generated when a plurality of the fine metal balls are suction-held on the array substrate. Therefore, the surplus balls are detected in a state where the plurality of fine metal balls are sucked and held on the array substrate.

Although the state of generation of the surplus balls is various, they can be roughly classified as shown in FIGS. 48 (a) and (b).

In FIG. 48, 1 is an array substrate, 3 is a through hole formed on the array substrate 1, 4 is a fine metal ball adsorbed in the through hole 3, 4a is an excess ball, and 304 is an excess ball. Detecting device 305 indicates the direction in which surplus ball detecting device 304 detects surplus ball 4a.

As shown in FIG. 48, the surplus ball detecting device 304 was arranged so as to face the array substrate 1, and detected the surplus ball 4a from the front of the array substrate 1. The positions of the fine metal balls 4 held at predetermined positions on the array substrate 1 are all known.

Therefore, even if the number of the fine metal balls 4 is very large, it is determined whether the fine metal balls 4 are held at a predetermined position, or whether the surplus balls 4a are attached to positions other than the predetermined position. Therefore, as shown in FIG. 48 (a), for example, as shown in FIG. 48 (a), it is possible to reliably detect the surplus ball 4a adhering to a position other than the location of the f f.

However, in the case shown in FIG. 48 (b), two or more fine gold balls are arranged in the direction along the detection direction of the surplus ball detecting device 304, that is, in the vertical direction in FIG. Therefore, the method of detecting whether the fine metal ball 4 is at a predetermined position or whether the surplus ball 4a is attached to a position other than the predetermined position as in the conventional detection method is detected. I couldn't.

The purpose of the present invention will be described below.

The present invention is to prevent the fine balls from being intensively sucked into the central portion of the array substrate, so that the micro balls can be uniformly vacuum-sucked on the entire surface of the array substrate, and The first object is to reduce the probability of occurrence of a problem when re-adsorbing a fine ball and to shorten the time required for the re-adsorption process.

The present invention provides a micro-ball array substrate and bump formation that prevent over-hanging portions of the array substrate from pressing the already formed bumps again in bump formation, realize proper bump bonding, and ensure high reliability. The secondary purpose is to provide a method.

The present invention is intended to ensure that only one fine ball can be sucked and held when a fine ball is sucked and transferred to a bump formation position, and that a fine ball bump can be formed at a low temperature and reliably. Is the third purpose. A fourth object of the present invention is to provide a bump forming method and a bonding apparatus capable of forming bumps on a semiconductor chip more efficiently and properly and more reliably than before.

A fifth object of the present invention is to provide a method and an apparatus capable of accurately supplying micro-balls to a container in an amount in an optimum range.

A sixth object of the present invention is to make it possible to reliably detect two or more extra balls arranged in the vertical direction when bumps are formed using fine balls. Disclosure of the invention

An embodiment of the second invention of the present invention that achieves the first object will be described below.

The arrangement device for fine balls according to the present invention includes: an array substrate having a plurality of ball suction holes formed on a suction surface of the fine balls; and a microball array head holding the array substrate. And a pressure reducing system for reducing the pressure of the vacuum chambers and pressurizing the fine balls into and out of each of the ball suction holes. A micro-ball arrangement device that collectively holds the printed circuit board and the semiconductor chip at least on the electrodes of the electronic components including at least the semiconductor chip, wherein a plurality of vacuum chambers formed inside the array head are provided. And the pressure reduction Z pressurizing system is provided for each of the plurality of areas, and the pressure reduction timing and the magnitude of the pressure reduction in each of the areas can be controlled for each of the areas. As a sign

Another feature of the present invention is that, in the arrangement device, in addition to the pressure reduction timing and the pressure reduction magnitude in each of the areas, the suction and release of the fine ball can be controlled for each of the areas. It is characterized by doing.

Further, the method for arranging fine balls of the present invention provides a vacuum chamber formed inside a fine ball array head holding an array substrate having a plurality of ball suction holes formed on a suction surface of the fine balls. The micro-balls are pressed / pressurized so that the micro-balls are sucked and released from each of the ball suction holes, and a plurality of micro-balls are collectively held on the arrayed substrate, and at least a printed substrate and a semiconductor chip are included. In a method for arranging micro balls to be collectively arranged on electrodes of an electronic component, the micro balls are formed inside the arrangement head. The vacuum chamber is divided into a plurality of areas, and an array head in which a decompression system is provided for each of the plurality of areas is used. The decompression timing and the magnitude of the decompression in each area are determined. The present invention is characterized in that a plurality of fine balls are collectively arranged by being collectively sucked on the suction surface while controlling for each of the plurality of areas.

Another feature of the present invention is that, in the method for arranging fine balls, in addition to the pressure reduction timing and the pressure reduction in each of the areas, the suction / release of the fine balls is performed for each of the plurality of areas. It is characterized in that a plurality of fine balls are collectively arranged by being collectively adsorbed on the suction surface while being controlled.

Further, in the method of arranging the fine balls, it is possible to collectively adsorb the fine balls on the suction surface only by controlling the suction / release of the fine balls for each of the plurality of areas, and to arrange the plurality of fine balls collectively. is there.

Since the present invention comprises the above technical means, it becomes possible to vary the suction timing and the suction force of the fine balls in accordance with the positions of the plurality of ball suction holes formed on the suction surface of the arrayed substrate. By controlling the system, in the ball suction holes located in the peripheral part of the array substrate, the suction of fine balls is started at an early timing and a large suction force is obtained, and the ball is formed at the center of the array substrate. By delaying the suction timing and reducing the suction force in the ball suction hole, the inconvenience of intensive suction of fine balls at the center of the array substrate can be prevented. .

Further, according to another feature of the present invention, when fine balls are sucked and held in a plurality of ball suction holes formed on an array substrate, and these fine balls are collectively arranged on electrodes of an electronic component, In the case where a problem occurs with respect to the suction of the fine balls, the fine ball can be re-adsorbed on the array substrate because only the depressurization and pressurization system corresponding to the area where the problem has occurred need be re-adsorbed. In this case, it is possible to greatly reduce the probability of occurrence of a failure again, and to shorten the time required for the re-adsorption process.

A second embodiment of the present invention that achieves the first object will be described below.

The fine ball array substrate of the present invention has a vacuum chamber formed therein and a plurality of ball suction holes formed on the suction surface thereof, the ball suction holes communicating with the vacuum chamber. In a micro-ball array head holding a cell array substrate, an air suction hole is formed around the vacuum chamber, and a partition wall is formed between the air suction hole and the center of the vacuum chamber. The flow of air sucked from each of the ball suction holes and reaching the air suction holes can be controlled by the partition wall. Further, the method of arranging fine balls of the present invention includes a method of arranging a fine ball array substrate in which a vacuum chamber is formed and a plurality of ball suction holes communicating with the vacuum chamber are formed on the suction surface. A fine ball arranging method using a held fine ball arranging head to collectively adsorb fine balls into the plurality of ball suction holes and arrange a plurality of fine balls at predetermined positions. An air suction hole is formed in a peripheral portion of the vacuum chamber, and a fine ball array head having a partition wall formed between the air suction hole and a central portion of the vacuum chamber; The flow of the air sucked from each of the ball suction holes is controlled to be a predetermined flow by the partition wall, and a plurality of fine balls are collectively sucked into the ball suction holes and arranged in a predetermined state. Features It is.

Since the present invention comprises the above technical means, the flow of air in the vacuum chamber formed inside is obstructed by the partition wall, and thereby the positions of the plurality of ball suction holes formed on the surface of the ball array substrate are reduced. This makes it possible to vary the suction timing and suction force of the fine ball, and the ball suction hole located near the air suction hole starts suctioning the fine ball at an early timing and obtains a large size. It becomes possible to be made. In addition, in the ball suction hole formed in the center of the ball array substrate, the suction timing can be delayed and the suction force can be reduced, so that the fine balls are intensively sucked in the center of the ball array substrate. Inconvenience is prevented.

Embodiments of the present invention that achieve the second object will be described below.

The micro-ball array substrate of the present invention is a micro-ball array substrate having a large number of suction holes for sucking and holding conductive micro-balls, wherein a peripheral portion of the substrate on the opening side of the suction hole is thin. It has an excision part formed in the above.

Further, in the micro ball array substrate according to the present invention, the cutout portion is provided with a suction hole near the peripheral portion of the substrate on the outside. Alternatively, the bump forming method of the present invention is a method of forming bumps by transferring conductive micro balls arranged and carried on an array substrate to a joined portion, wherein the joined portion is divided into a plurality of regions. The above-mentioned minute balls arranged and carried on the arrangement substrate are joined to each of the divided areas.

Further, in the bump forming method according to the present invention, the bonded portion is constituted by electrode portions of a plurality of semiconductor elements f.

Further, in the bump forming method of the present invention, the bonded portion is divided into one or a plurality of semiconductor elements, and the minute balls are bonded to electrode portions of the respective semiconductor elements.

Further, in the bump forming method of the present invention, the minute ball array substrate is used.

According to the present invention, at the time of forming a bump, a portion to be bonded of a microball, that is, for example, a plurality of semiconductor chips on a wafer is divided into a plurality of regions, and each divided region is arranged and carried on an array substrate. Join the small balls. When forming a bump in each of the divided areas, when a micro-ball is joined in the area adjacent to the area where the bump has already been formed, a cutout is provided on the periphery of the array substrate. There is no danger of being pressed again by the array substrate.

Further, according to the present invention, for example, a wafer to be joined, for example, a wafer is divided into a plurality of regions, and the micro balls arranged and carried on the arrangement substrate are joined for each of the divided regions. High production efficiency can be achieved by joining micro balls together in each divided area.

An embodiment of the present invention that achieves the third object will be described below.

The method of forming a fine ball bump according to the present invention includes the steps of: providing a fine ball to a container in which the fine ball is housed; One of the micro-balls is vacuum-adsorbed and held at the tip of an arrayed substrate having at least one suction hole, and the micro-ball sucking process is held at the tip of the arrayed substrate 1 An unnecessary ball removing step of removing extra fine balls other than the two fine balls by vibration with a minute amplitude; and an array substrate from which the extra fine balls have been removed in the unnecessary ball removing step, An array substrate moving step of moving the ball bump forming object including the electrode and aligning the ball bump forming object with the fine ball adsorbed on the array substrate; and A step of transferring the attracted fine ball to a predetermined position of the ball bump forming object to form a ball bump.

Another feature of the present invention is that the vibration with the minute amplitude in the unnecessary ball removing step is an ultrasonic vibration generated by an ultrasonic vibrator.

Another feature of the present invention is that, in the bump forming step according to any one of claims 1 and 2, the minute ball and the ball bump forming object are formed while applying ultrasonic energy. It is characterized in that it is joined.

In addition, the fine ball bump forming apparatus of the present invention includes: an array substrate having one end of an adsorbing hole for adsorbing one of the micro balls being viewed opened at a tip end thereof; A vacuum suction device for applying a negative pressure to the inside of the suction hole, so that one of the jumping fine balls is vacuum-sucked to the tip of the array substrate; and a vacuum is applied to the tip of the array substrate. And vibrating means for vibrating the ball array substrate with a minute amplitude in order to remove extra fine balls other than the sucked fine balls.

Another feature of the present invention is that the vibration means for removing the extra fine ball is an ultrasonic vibrator.

Another feature of the present invention is that the tip of the ball array substrate is formed to have a small diameter corresponding to the size of the fine ball to be used, so that the pitch at which the ball bumps are formed is formed. Another feature of the present invention is that the fine ball adsorbed on the tip of the array substrate is transferred to a predetermined position on the ball bump forming object. When the ball bump is formed by the method, an ultrasonic vibrator for applying ultrasonic energy to the fine ball is further provided. Also, this ultrasonic vibrator has extra P 7 02996

14

—It may also have the function of removing the rule.

Since the present invention has the above technical means, the ball bumps are formed by holding the fine balls one by one, so that a ball array substrate is produced for each type of product for forming the ball bumps. There is no need, and great versatility can be obtained.

In addition, since bumps can be formed by using fine balls formed in a desired size in advance, the height and diameter of the bumps can be made uniform, and bumps having high bonding reliability can be obtained. It can be formed.

Furthermore, by using an ultrasonic vibrator as a vibrator, extra balls often appearing when using fine balls can be removed satisfactorily. Can be prevented.

Further, according to another feature of the present invention, at the time of bump formation, the fine ball and the ball bump forming object are bonded while applying ultrasonic energy to the fine ball, so that the bonding temperature is reduced. The joining time can be shortened and the joining strength can be improved.

Embodiments of the present invention that achieve the fourth object will be described below.

In the bump forming method according to the present invention, two or more diced semiconductor chips or printed circuit boards are positioned and arranged at predetermined positions, and bumps using conductive balls are collectively formed.

Further, the bump forming method according to the present invention includes a step of arranging and holding conductive balls at positions corresponding to two or more diced semiconductor chips or printed circuit board electrodes, and a method of forming a semiconductor chip or printed circuit board. A step of aligning the conductive balls held and arranged with each other; and a step of transferring and joining the conductive balls held and arranged to an electrode portion of a semiconductor chip or a printed circuit board.

The bump forming method according to the present invention is characterized in that the method further comprises a step of inspecting an arrangement state of the conductive balls held in the arrangement.

In addition, the bump forming apparatus according to the present invention includes a ball arranging means for arranging and holding conductive balls at positions corresponding to two or more diced semiconductor chips or printed circuit board electrodes, and a semiconductor chip or printed circuit board. Positioning means for positioning the electrode portion and the conductive balls arranged and held by the ball arranging means. And transfer joining means for transferring and joining the conductive balls held in alignment to an electrode portion of a semiconductor chip or a printed circuit board.

In the bump forming apparatus according to the present invention, the positioning means includes a tray having a groove formed at a position corresponding to each semiconductor chip.

Further, in the bump forming apparatus according to the present invention, the positioning means includes a stage having a groove formed at a position corresponding to each semiconductor chip.

Further, in the bump forming apparatus according to the present invention, the positioning means includes two or more stages whose orthogonal and rotational coordinates can be independently controlled.

Further, in the bump forming apparatus according to the present invention, the positioning means includes a stage configured to position each semiconductor chip and fix the semiconductor chip by suction at the position.

According to the present invention, two or more diced semiconductor chips are positioned and arranged, and conductive balls are bonded to these semiconductor chips to form bumps. Productivity can be significantly improved by selecting and using semiconductor chips after dicing and good products. By the way, when bumps are formed on two or more semiconductor chips before dicing at the wafer stage, it is difficult to increase the production efficiency because defective semiconductor chips are included.

Further, when two or more semiconductor chips after dicing are positioned and arranged on a predetermined stage, the semiconductor chips can be accurately positioned relative to each other by the positioning means. As a result, the alignment of the ball arrangement means and the conductive balls can be performed efficiently and accurately.

As an example of the positioning means, a semiconductor chip or a printed circuit board is placed in a groove larger than the size of a semiconductor chip or a printed circuit board formed on the tray or the stage, and the tray or the stage is appropriately tilted. By doing so, it is possible to align the semiconductor chip and the like at the corners of the concave groove.

Embodiments of the present invention that achieve the fifth object are described below. The method for supplying micro-balls of the present invention is a method for supplying micro-balls to a predetermined container, wherein the number of micro-balls to be supplied from the ball supply means to the container is counted and stored in the container. This is to control the supply amount of the minute balls so that the amount of the minute balls is maintained in the optimum range.

Further, in the method for supplying micro-balls of the present invention, the number of micro-balls discharged from the container is detected, and the amount of ball supply from the ball supply means is controlled according to the amount of the discharged micro-balls. It is characterized by.

Further, in the method for supplying micro-balls of the present invention, substantially the same number of micro-balls as the micro-balls discharged from the container are supplied until the next ball is discharged.

Further, the micro ball supply device of the present invention comprises: a ball supply means for supplying a micro pole to the container; and a ball counter for counting the number of micro balls to be supplied from the ball supply means to the container. And supplying the minute balls to the container from the ball supply means while counting the minute balls by the ball counter.

Further, in the micro-ball supply device of the present invention, the drive control means for driving the ball supply means to supply an appropriate amount of micro-balls to the container based on the quantity data of the micro-balls discharged from the container. It is characterized by having.

Further, in the micro ball supply device of the present invention, the ball supply means includes a chute set to pass a single micro ball, and the micro balls passing through the chute are counted by a ball counter. It is characterized by. According to the present invention, in this type of bump formation, when supplying minute metal balls to a predetermined container, the number of discharged minute metal balls is refilled based on the number of minute metal balls discharged or used from the container. Calculate the quantity of minute metal balls to be supplied to the container. When supplying the metal balls to the container, the metal balls passing through the chute are accurately counted by the ball counter. In this way, by counting the number of minute gold balls and supplying them to the container, the number of minute metal balls in the container can always be maintained in the optimum range. The present invention can be applied irrespective of the diameter of the ball, but it is difficult to control the number by the conventional method of measuring the weight. The effect is remarkable for the small ball below.

Embodiments of the present invention that achieve the sixth object are described below.

The method for detecting excess balls according to the present invention is a method for detecting excess balls generated when holding fine balls on an array substrate, comprising irradiating the fine balls held on the array substrate with light in an oblique direction, Thereby, the surplus balls are detected based on the shadows of the fine balls formed on the surface of the array substrate. Another feature of the present invention is a method of detecting an extra ball generated when a fine ball is held on an array substrate, wherein the method includes focusing the fine ball held on the array substrate at a predetermined position. It is characterized in that an image is taken by a detection camera whose distance is adjusted, and an extra ball is detected based on an image output of the detection output lens. Another feature of the present invention is that when imaging the fine balls held on the array substrate, the imaging is performed by focusing on the fine balls normally held on the array substrate. Features.

Another feature of the present invention is that, when imaging the fine ball held on the array substrate, the focus is on a position before the focus of the fine ball normally held on the array substrate. The imaging is performed by combining the above.

According to another feature of the present invention, in a method for detecting a surplus ball generated when a fine ball is held on an array substrate, an image of the fine ball held on the array substrate is taken obliquely. The method is characterized in that a surplus ball is detected based on an image obtained by imaging from the oblique direction.

Another feature of the present invention is that imaging in the oblique direction is performed by a CCD camera.

According to another feature of the present invention, in a method for detecting an extra ball generated when a fine ball is held on an array substrate, the method further includes applying vibration to the array substrate holding the fine ball. The method is characterized in that a fine ball held on the array substrate is imaged in a state where the vibration is applied, and a surplus ball is detected based on the image obtained by the imaging.

According to another feature of the present invention, in a method for detecting an extra ball generated when a fine ball is held on an array substrate, the method further comprises: This is characterized in that the surplus balls held are defeated and detected.

According to another feature of the present invention, in the method of defeating the surplus balls, the array substrate is passed over a ball defeating jig positioned at a predetermined height, and the vertical connection is performed. The method is characterized in that the retained excess ball is brought into contact with the ball dropping jig and is dropped.

According to another feature of the present invention, the method of defeating the surplus balls includes injecting a fluid toward the array substrate, and using the surplus balls held in the vertical direction with the fluid. It is characterized by the method of defeating.

According to another feature of the present invention, in a method for detecting an excess ball generated when a fine ball is held on an array substrate, the array substrate holding the fine ball is set to a predetermined height. After passing over the ball dropping jig positioned at the position above, the surplus balls connected vertically are tilted, and then the fine balls held on the array substrate are imaged. It is characterized by detecting surplus balls based on the surplus balls.

According to another feature of the present invention, in a method for detecting an extra ball generated when a fine ball is held on an array substrate, a fluid is ejected toward the array substrate holding the fine ball. This makes it possible to image the fine balls held on the array substrate after the surplus balls that are vertically connected are turned down, and to detect the extra balls based on the image obtained by the imaging. And Another feature of the present invention is that the fluid is nitrogen gas.

In addition, the surplus ball detection device of the present invention is a detection device for detecting an extra ball generated when a fine ball is held on an array substrate, wherein light is emitted obliquely toward the fine ball held on the array substrate. A projector for irradiating, an imaging unit for capturing a shadow of a fine ball formed on the array substrate by the projector, and a surplus ball detection for detecting a surplus ball based on image data output from the imaging unit Means.

According to another feature of the present invention, in a detection device for detecting an extra ball generated when a fine ball is held on an array substrate, It is characterized by comprising: a detection camera for imaging a fine ball at a predetermined position with a focal length adjusted; and an extra ball detection means for detecting an extra ball based on an image output of the detection camera.

Another feature of the present invention is that when the detection camera captures an image of the fine ball held on the array substrate, the fine ball normally held on the array substrate is focused. It is characterized by imaging.

Another feature of the present invention is that, when the fine ball held on the array substrate is imaged by the detection camera, the fine ball is focused on the front side of the fine ball normally held on the array substrate. The imaging is performed by combining the above. According to another feature of the present invention, the surplus ball detecting means includes: an image obtained by imaging the fine balls in a state where the fine balls are normally held on the array substrate; The surplus ball is detected by comparing with an image captured by the method.

Another feature of the present invention is that, in an apparatus for detecting an extra ball generated when a fine ball is held on an array substrate, an image of the fine ball held on the array substrate is taken in an oblique direction. It is characterized by comprising imaging means, and surplus ball detecting means for detecting an extra ball based on an image obtained by the imaging means.

Another feature of the present invention is that the imaging means is a CCD camera.

Another feature of the present invention is that in an apparatus for detecting an extra ball generated when a fine ball is held on an array substrate, vibration applying means for applying a vibration having a predetermined amplitude to the array substrate, Imaging means for imaging fine balls held on the array substrate in a state where the vibration is applied by the vibration applying means, and a surplus for detecting an extra ball based on an image obtained by the imaging means. And a ball detecting means.

Another feature of the present invention is that, in a device for detecting an extra ball generated when a fine ball is held on an array substrate, the excess ball held vertically in a row on the array substrate is provided. Detection means for detecting the It is characterized by.

According to another feature of the present invention, in an apparatus for detecting an excess ball generated when a fine ball is held on an array substrate, the detection means includes a ball positioned at a predetermined height. A tilting jig is provided, and the arrayed substrate is passed over the ball tilting jig, so that a surplus ball vertically connected to the arrayed substrate is tilted.

According to another feature of the present invention, in an apparatus for detecting an excess ball generated when a fine ball is held on an array substrate, the detecting unit injects a fluid toward the array substrate. It is characterized in that it is provided with a jetting means, and the surplus balls, which are held in a vertically connected manner, are brought down by the fluid. Another feature of the present invention is that in an apparatus for detecting an extra ball generated when a fine ball is held on an array substrate, a predetermined distance from the array substrate holding the fine ball is provided. A ball dropping jig positioned at such a height that the ball is dropped, an arrayed board moving means for passing the arrayed board over the ball dropping jig to drop excess balls, and the ball dropping jig. Image pickup means for picking up an image of the fine balls held on the array substrate passed over the tool, and extra ball detection means for detecting an extra ball based on the image obtained by the image pickup means. It is characterized by.

Another feature of the present invention is that in a device for detecting an extra ball generated when a fine ball is held on an array substrate, a fluid is jetted toward the array substrate holding the fine ball. A fluid ejecting apparatus for causing the surplus balls to fall down, imaging means for taking an image of the fine balls held on the array substrate in a state where the surplus balls have fallen by the fluid ejecting device, and the imaging means And a surplus ball detecting means for detecting a surplus ball based on the obtained image.

Another feature of the present invention is that the fluid ejected from the fluid ejecting apparatus is nitrogen gas.

Since the present invention comprises the above technical means, according to the first invention, the light irradiated from the oblique direction of the array substrate has a size corresponding to the height of the fine ball on the array substrate. A shadow is formed, and based on the size of the shadow, it is possible to reliably detect the surplus balls overlapping in a vertical straight line when viewed from the detection direction.

According to another feature of the present invention, in the case of a surplus ball, since the surplus ball exists at a position away from a predetermined focal length, a fine ball held on the array substrate is detected and detected. By taking an image with a predetermined focal length, it is possible to reliably detect an extra ball overlapping in a vertical straight line when viewed from the detection direction based on the strength of the imaging output of the detection camera. .

According to another feature of the present invention, a fine ball held on the array substrate is imaged in an oblique direction, and a surplus ball is detected based on an image obtained by the imaging. As a result, it is possible to obtain images of different sizes between the portion normally held and the portion where the surplus ball is generated, and the surplus balls are overlapped in a vertical straight line when viewed from the detection direction. Even so, it can be detected reliably.

Further, according to another feature of the present invention, an image was taken in a state where vibration was applied to the array substrate holding the fine balls, so that the fine balls normally held were obtained by imaging. The size and outline of the image and the obtained image of the surplus ball can be different, and even if the surplus ball overlaps in a vertical straight line when viewed from the detection direction, it can be detected reliably. Will be able to

Further, another feature of the present invention is that the array substrate holding the fine balls is passed over a ball dropping jig positioned at a predetermined height, and the surplus balls are dropped and then imaged. As a result, even if a surplus ball in a vertically connected state occurs, the surplus ball can be easily viewed and viewed from the front direction, and the surplus ball can be reliably detected. be able to.

Another feature of the present invention is that a fluid is jetted to the array substrate holding the fine balls, and a surplus ball held vertically in a row on the array substrate is tilted. As a result, it is possible to reliably detect the occurrence of an extra ball that is vertically aligned when viewed from the front. BRIEF DESCRIPTION OF THE FIGURES FIG. 1 is a front view of an array head and a control board for explaining an example of dividing an adsorption surface into an area.

FIG. 2 is a cross-sectional view illustrating a schematic configuration of a main part of an array head and an array substrate. FIG. 3 is a view for explaining the operation of the fine ball arrangement device of the embodiment.

FIG. 4 is a diagram showing an example in which a plurality of ball suction holes provided on an array substrate are divided into a plurality of areas.

FIG. 5 is a diagram showing another example in which a plurality of ball suction holes provided on the array substrate are divided into a plurality of areas.

FIG. 6 is a diagram showing another example in which a plurality of ball suction holes provided on an array substrate are divided into a plurality of areas.

FIG. 7 is a diagram showing another example in which a plurality of ball suction holes provided on the array substrate are divided into a plurality of areas.

FIG. 8 is a cross-sectional view illustrating a configuration example of a conventional array head.

FIG. 9 is a diagram showing a state in which fine balls are sucked using a conventional fine ball arrangement device.

FIG. 10 shows one embodiment of the present invention, and is a diagram illustrating an example in which a partition wall is provided in a ball row head #.

FIG. 11 is a diagram illustrating an example of a ball array substrate.

FIG. 12 is a view showing an example of a printed circuit board.

FIG. 13 illustrates the second embodiment, and is a view illustrating another example of the partition wall provided in the ball array head.

FIG. 14 is a diagram showing a state in which fine metal balls are attracted using the ball array substrate of the present embodiment.

FIG. 15 is a cross-sectional view illustrating an embodiment of a micro-ball array substrate of the present invention. FIG. 16 is a cross-sectional view showing another embodiment of the micro ball array substrate of the present invention.

FIG. 17 is a plan view showing an example of area division of a wafer according to the bump forming method of the present invention. FIG. 18 is a plan view showing an example of an array substrate according to the bump forming method of the present invention.

FIG. 19 is a diagram illustrating a schematic configuration example of a conventional bump forming apparatus.

FIG. 20 is a view sequentially showing main steps in a conventional bump forming apparatus. FIG. 21 is a diagram showing a state when bumps are formed on a conventional array substrate.

FIG. 22 is a diagram showing a joining procedure in the embodiment of the present invention.

FIG. 23 is a diagram illustrating dimensions and a schematic configuration of a ball array substrate according to the embodiment of the present invention.

FIG. 24 is a view showing an apparatus for floating a fine metal ball.

FIG. 25 is a perspective view showing a wafer dicing step in the present invention. FIG. 26 is a perspective view showing a positioning step of the semiconductor chip after dicing in the present invention.

FIG. 27 is a diagram illustrating a configuration example of a ball array head according to the present invention. FIG. 28 is a diagram showing a state of moving and transporting the ball array head according to the present invention.

FIG. 29 is a diagram illustrating a configuration example of a tray for a semiconductor chip according to the present invention.

FIG. 30 is a diagram illustrating a configuration example of a concave groove of the tray according to the present invention. # 31 is a plan view showing an example of the arrangement of semiconductor chips on a stage in the present invention.

FIG. 32 is a perspective view showing an example of means for positioning a semiconductor chip or the like on a stage or the like in the present invention.

FIG. 33 is a diagram sequentially illustrating a ball arrangement step of the ball arrangement head according to the present invention.

ίFIG. 34 is a diagram showing a main configuration of a micro-ball supply device used in the present invention.

FIG. 35 is a block diagram illustrating a schematic configuration according to the embodiment of the present invention. [Fig. 36] Required around the ball array head used in the conventional bump formation method FIG. 3 is a diagram illustrating a configuration of a unit.

FIG. 37 is a diagram showing the relationship between the number of small metal balls and the ball suction success rate in the ball array head used in the conventional bump forming method.

FIG. 38 is a block diagram illustrating an embodiment of the present invention and illustrating a schematic configuration of a surplus ball detection device.

FIG. 39 is a diagram for describing a first embodiment of a method of detecting an extra ball, and is a diagram illustrating a state where a shadow of a fine gold ball is formed by irradiating light from an oblique direction. is there.

FIG. 40 is a diagram illustrating a state of a shadow formed by irradiating light from an oblique direction.

FIG. 41 shows the second embodiment and is a diagram for explaining that the focal length differs depending on the position of a fine ball.

FIG. 42 is a diagram showing how images obtained by different focal lengths are different.

FIG. 43 illustrates the third embodiment, and is a diagram illustrating a state in which imaging is performed from an oblique direction.

FIG. 44 is a diagram illustrating an example of an image obtained by capturing an image in an oblique direction. FIG. 45 shows the fourth embodiment, and is a diagram illustrating an example in which vibration is applied to an array substrate so that surplus balls can be easily viewed from the front.

FIG. 46 is a view showing the fifth embodiment, and showing an example in which an arrayed substrate is brought down on a ball and brought into contact with a jig to make it easy to see excess balls.

FIG. 47 is a view showing the sixth embodiment and showing an example in which a surplus ball is easily seen by injecting a fluid onto an array substrate.

FIG. 48 is a diagram illustrating an example of a conventional surplus ball detection method. BEST MODE FOR CARRYING OUT THE INVENTION

The best mode for carrying out the first embodiment of the present invention for achieving the first object will be described below.

The examples in Figures 1 and 2 assume that the vacuum chamber of array head 10 is divided into multiple areas. In addition, an example in which a decompression // pressure system is provided for each area is shown. Fig. 1 is a front view of an array substrate 1 for explaining an example of area division, and Fig. 2 is a cross-sectional view showing a schematic configuration of a main part. As shown in FIG. 1, the ball arrangement device of the present embodiment includes an arrangement head 10 and a ball arrangement substrate 1. The ball array substrate 1 is held on the array head 10 by vacuum suction using a suction system different from a system for sucking a ball. The ball array substrate 1 may be integrally formed with the array head 10 by bonding or the like.

In the present embodiment, the suction surface of the array substrate] is divided into four areas of a first area 11] to a fourth area 114 (actually, the array head 10 is divided into four areas). The inside of the vacuum chamber 5 formed inside is divided, but for convenience, the suction surface of the array substrate 1 is shown as being divided). Then, as shown in FIG. 2, a plurality of decompression Z pressurizing systems 2 provided on the back surface side of the array substrate] are provided corresponding to each area 1 11 to 11114.

In the example of FIG. 2, four ball suction holes 3 are provided as indicated by 3a to 3d, and the pressure reduction / An example is shown in which four pressurizing systems 2a to 2d are provided. That is, in this case, an example is shown in which one ball suction hole 3 is provided in each of the four areas, but in reality, each area 11 1 to 11 4 has several hundred or several thousand pieces. Ball suction holes 3 are provided.

In FIG. 2, a vacuum chamber 5 formed inside the array substrate 1 is divided by a partition plate 6 into four, a first vacuum chamber 5 a to a fourth vacuum chamber 5 d. Each of the first vacuum chamber 5a to the fourth vacuum chamber 5d is provided with a decompression and pressurization system 2a to 2d.

That is, ventilation holes 10 a to 10 communicating with the first vacuum chamber 5 a to the fourth vacuum chamber 5 d are provided in the array head 10 attached to the back side of the array substrate 1. These ventilation holes 10 a to 10 d are connected to a pressure device and a pressurizing device (both not shown) via vent pipes (not shown), respectively. The system consists of 2a to 2d. In the present embodiment, the pressure in each area 11 1 to 11 and the pressurization timing (减 pressure timing) can be independently controlled by controlling the decompression and pressurization systems 2 a to 2 d. Like that. This makes it possible to obtain an optimal suction timing (separation timing) in each of the areas 11 1 to 14 and also obtain an optimal suction force.

Further, in the arrangement apparatus for fine balls according to the present embodiment, the fine balls 4 are independently suctioned into the ball suction holes 3a to 3d for each of the pressure systems 23 to 2d. Or the fine balls 4 adsorbed in the ball suction holes 3a to 3d can be separated from the array plate.

Next, referring to FIG. 3, the fine balls 4 are attracted onto the array substrate 1 by using the fine ball arranging apparatus of the present embodiment configured as described above, and are formed on the semiconductor chip 1]. The operation of bonding to the electrode 12 will now be described.

As shown in FIG. 3, the array substrate 1 is moved onto a container 14 in which a fine ball 4 (for example, it is made of precious gold such as Au or a metal having a low melting point) is placed. Descent to a close distance. The container 14 is vibrated with a small amplitude, and the fine balls 4 housed therein are viewed by the vibration.

Therefore, when the decompression device (not shown) connected to the array substrate 1 is operated to bring all the ball suction holes 3 a to 3 d into a suction state, the fine particles jumping on the container 14 The ball 4 can be sucked into each of the ball suction holes 3a to 3d.

In the present embodiment, when the air in each of the vacuum chambers 5a to 5d is sucked through the decompression and pressurizing systems 2a to 2d, the vacuum chamber 5a located in the peripheral portion of the array substrate 1 And start decompression from 5 d. For this reason, the fine balls 4 accommodated in the container 14 are sucked from the ball suction holes 3 a and 3 d located around the array substrate 1. By adjusting the pressure reduction timing, the fine balls 4 can be simultaneously adsorbed in the vacuum chambers 5b and 5c in the central part of the array substrate 1 and the vacuum chambers 5a and 5d in the peripheral part. .

Further, in the present embodiment, the force for attracting the fine balls 4 can be balanced in the central portion and the peripheral portion of the array substrate 1. Is less likely to be inadvertently adsorbed The fine balls 4 can be satisfactorily sucked over the entire surface of the array substrate 1. As described above, after the fine balls 4 are sucked and held in each of the ball suction holes 3a to 3d, next, the array substrate 1 is moved to a predetermined position on the semiconductor chip 11 for alignment. . After aligning the array substrate 1 at a predetermined position, the array substrate 1 is then lowered to a short distance from the semiconductor chip 11, and the fine ball 4 held by suction is thermally placed on a specific portion of the electrode 12. Join by crimping or the like.

Here, the stage on which the semiconductor chip 11 is mounted may have a heating mechanism. If a flux is supplied on the electrode 12 in advance, the fine pole 4 made of a low-melting-point alloy such as solder may be temporarily bonded, and then transferred to a furnace for reflow. In this case, the stage need not be heated.

In this way, when a plurality of fine balls 4 are collectively arranged on the semiconductor chip # 1, a plurality of fine balls 4 are sucked into one ball suction hole 3 in addition to the above-described dumpling-like suction. Or the fine ball 4 may leak.

The arrangement apparatus for fine balls according to the present embodiment can perform the decompression and pressurization independently for each of the decompression / pressurization systems 2a to 2d. It can be re-adsorbed.

For example, if an extra fine ball 4 is adsorbed in the first ball suction hole 3a, the first micro-pressure pressurizing system 2a is pressurized to remove the fine ball 4 adsorbed there. Let go. At this time, the second to fourth decompression and pressurization systems 2 b to 2 d that normally adsorb the fine balls 4 are not pressurized, and thus are adsorbed to these decompression Z pressurization systems 2 b to 2 d. The fine ball 4 that has been detached.

Accordingly, in the case of the arrangement apparatus for fine balls according to the present embodiment, the fine balls 4 are used only in the decompression / pressurization system in which the suction of the ball has a problem, in this case, in the first decompression / pressurization system 2a. Since it is sufficient to perform re-adsorption, the probability that a problem will occur again during re-adsorption can be greatly reduced, and the time required for the re-adsorption process can be significantly reduced.

In the above-described embodiment, for ease of explanation, four ball suction holes 3 a to 3 d are formed on the array substrate 1, and each of the ball suction holes 3 a to 3 d has a low pressure. Although an example in which the pressurizing systems 2a to 2d are provided is shown, in practice, for example, 50 to 50 An extremely large number of fine balls 4 such as 0 are collectively held on the array substrate 1.

The manner in which the inside of the vacuum chamber 5 is divided into a plurality of areas can be arbitrarily set. For example, it may be divided into meshes as shown in FIG. 4 and FIG. 6, or divided vertically as shown in FIG. Although it may be divided as shown in FIG. 7, _c , and in the above-described embodiment, a decompression Z pressurizing device may be provided for each reduction / pressurizing system. By installing a solenoid valve in the pressure reduction Z heating pipe and controlling the opening and closing operation of each solenoid valve, the pressure reduction operation can be performed independently for each area. Yeah. Further, in the present invention, the array substrate may include means for removing an extra pole made of minute vibration (for example, ultrasonic vibration).

The best mode for carrying out the second aspect of the present invention for achieving the first object will be described below.

FIG. 10 is a view from the side where the ball array head holds the ball array substrate 1, and FIG. 11 is a front view of the ball array substrate 1. As shown in FIG. 11, the ball array substrate 1 according to the present embodiment has a plurality of ball suctions so that a plurality of fine metal balls 4 (see FIG. 12) can be suctioned at once. Hole 3 is formed. The above-mentioned ball array head is composed of a head 10 and a ball array substrate 1 as shown in a partial sectional view of FIG. The ball array substrate 1 is held on the head 10 by being sucked in a vacuum by a suction system different from a system for sucking a ball. The ball array substrate 1 may be integrally formed with the head 10 by bonding or the like.

A vacuum chamber 5 is formed between the head 10 and the ball array substrate 1. An air suction hole 7 is formed in the periphery of the head 10, and a vacuum device (not shown) is connected to the air suction hole 7 via a vacuum system. As a result, when the air in the vacuum chamber 5 is sucked by the suction force of the vacuum device, the pressure in the vacuum chamber 5 decreases, and the air is sucked from each of the ball suction holes 3 into the vacuum chamber 5. The air is sucked, and the fine metal balls 4 are sucked by vacuum into the ball suction holes 3 by the suction force. In such a ball array head 1, in order to solve the above-mentioned inconvenience, in the present embodiment, partition walls 8 a to 8 c are provided in the vacuum chamber 5, and a flow of air in the vacuum chamber 5 is provided. Can be controlled according to the position E where the ball suction hole 3 is formed.

That is, in the case of the example shown in FIG. 10, rectangular partition walls 8 a to 8 c having openings formed only in one place are provided, and the inside of the above-mentioned vacuum chamber 5 is made into the first vacuum chamber 5. _a to 4th vacant rooms 5d are divided into four.

By dividing the inside of the vacuum chamber 5 in this manner, the timing and the suction force for sucking the fine metal balls 4 are different for each of the first to fourth vacuum chambers 5a to 5d.

That is, when the air in the vacuum chamber 5 is sucked from the air suction hole 7 by operating the vacuum device, first, the air pressure in the first vacuum chamber 5a decreases. As a result, air is sucked from the ball suction hole 3 formed at a position corresponding to the first vacuum chamber 5a, and the suction of the fine metal ball 4 is started in this portion.

On the other hand, since an opening is formed in the first partition wall 8a, the first vacuum chamber 5a and the second vacuum chamber 5b communicate with each other. Therefore, as the pressure in the first vacuum chamber 5a decreases, the pressure in the second vacuum chamber 5b 5 also decreases, so that the pressure is formed at a position corresponding to the second vacuum chamber 5b. Air is also sucked from the ball suction holes 3 that are present.

Therefore, the ball suction hole formed at a position corresponding to the second vacuum chamber 5b is slightly delayed from the ball suction hole 3 formed at the position corresponding to the first vacuum chamber 5a. At 3 also, the adsorption of the fine metal balls 4 is started.

Furthermore, since air is sucked through the opening formed in the second partition wall 8b, the third vacuum chamber 5b 內 decreases in pressure as the pressure in the second vacuum chamber 5b decreases. The pressure in c decreases, and air is sucked from the ball suction holes 3 formed in the pin corresponding to the third vacuum chamber 5c.

Next, as the pressure in the third vacuum chamber 5c decreases, air is sucked through the opening formed in the third partition wall 8c. Vacuum chamber 5 d 內 As the pressure of the second vacuum chamber 5 d decreases, air is sucked from the ball suction hole 3 formed at a position corresponding to the fourth vacuum chamber 5 d.

Therefore, in the case of the ball array head 1 of the present embodiment, the ball suction holes 3 formed at positions corresponding to the first vacuum chamber 5a—the positions formed at the positions corresponding to the second vacuum chamber 5b. Ball suction hole 3 → ball suction hole 3 formed at a position corresponding to third vacuum chamber 5 c — ball suction hole 3 formed at a position corresponding to fourth vacuum chamber 5 d Then, the fine metal balls 4 are attracted.

Thus, in the case of the ball array head 1 of the present embodiment, immediately after the start of suction, the ball suction head 3 is formed at a position corresponding to the ball suction hole 3 at the center (that is, the position corresponding to the fourth vacuum chamber 5d). The inconvenience that the fine metal balls 4 are intensively attracted to the ball suction holes 3) is less likely to occur.

Also, the pressure gradient in the vacuum chamber 5 is as follows: the first vacuum chamber 5a → the second vacuum chamber 5b → the third vacuum chamber 5c → the fourth vacuum chamber 5d, so that fine metal The force for sucking the ball 4 is greatest at the periphery of the ball array head 1, then the second vacuum chamber 5b is large, then the third vacuum chamber 5c is large, and the fourth The suction power of the shochu corresponding to the vacuum chamber 5d is the smallest.

Therefore, the fine metal balls 4 can be satisfactorily suctioned even in the peripheral portion where the fine metal balls 4 have been difficult to be sucked, and the central portion where the fine metal balls 4 have been sucked too much in the past. Excessive adsorption can be prevented. As a result, in the case of the ball array head 1 of the present embodiment, the fine metal balls 4 can be evenly adsorbed on the surface of the ball array substrate 1 to form a ball bump with high reliability. The work efficiency of the process of arranging the fine metal balls 4 to be performed can be greatly improved.

As the shape of the partition wall 8 formed in the vacuum chamber 5, various shapes other than the example shown in FIG. 10 are considered. For example, as shown in FIG. 13, when the air suction holes 7 are formed on both sides in the vacuum chamber 5, even if a plurality of linear partition walls 9 are arranged in parallel, The suction of the fine metal ball 4 can be started from the portion. Also, the pressure gradient can be reduced from the periphery to the center. FIG. 14 is a diagram showing a state in which the fine metal balls 4 are sucked using the ball array head shown in FIG.

As shown in FIG. 14, in the ball array head, when air in the vacuum chamber 5 is sucked through the vacuum system 28, a ball suction hole located in the peripheral portion of the ball array substrate 1 is formed. Since the suction of air is started from 3, the fine metal balls 4 contained in the container 14 placed on the vibration generator 15 are placed in the ball suction holes located in the periphery of the ball array substrate 1. Then, the fine metal balls 4 are simultaneously attracted to the central portion and the peripheral portion of the ball array substrate 1 by attracting.

In addition, since the suction force is balanced in the central portion and the peripheral portion of the ball array substrate 1, the fine metal balls 4 are centrally attracted only to the central portion of the ball array substrate 1 as in the related art. Inconvenience hardly occurs, and the fine metal balls 4 can be satisfactorily adsorbed over the entire surface of the ball array substrate 1. Note that the array substrate 1 may include means for removing excess balls made of minute vibration (for example, ultrasonic vibration). Hereinafter, the best mode for carrying out the present invention for achieving the second object will be described below using the same reference numerals for members substantially the same as or corresponding to those of the conventional example based on the drawings.

Here, first, the basic configuration of the bump forming device used in this embodiment is substantially the same as that of the conventional device (FIG. 19). That is, the ball pickup stage 100, the joining stage 120, the array head 130, and the drive mechanism 140 for moving the array head 130 in the X direction shown in FIG. Have.

FIG. 15 shows a main configuration of this embodiment. An array substrate 1, a part of which is shown, is attached to the tip of the array head 130. Suction holes 3 corresponding to the electrodes of the semiconductor chip on which the bumps are to be formed are formed in the array substrate 1, and one micro ball 4 is sucked and held in each suction hole 3. The peripheral edge la of the array substrate 1 is overhanged to some extent as shown in the figure to secure a certain mechanical strength.

In this embodiment, a cutout portion 102 is provided in the peripheral portion 1a. The cut-out portion 102 is formed by thinning the substrate peripheral portion 1a on the substrate surface (lower side) on the opening side of the suction hole 3 and is provided outside the suction hole 3 near the peripheral edge 1a. Can be In this example A cut-out portion 102 is provided by cutting the peripheral portion 1 a of the array substrate 1 as a flat surface by inclining.

For example, it is assumed that a plurality of semiconductor chips 11 are included on a wafer on a substrate 104 side on which a bump is to be formed. When the present invention is applied to such a wafer, the electrodes of the semiconductor chips on the substrate 104, which are the portions to be bonded of the microballs 4, are preferably divided into a plurality of regions in units of a plurality of semiconductor chips. The micro-balls 4 arranged and carried on the arrangement substrate 1 are joined to each of the divided areas.

In FIG. 15, it is assumed that bumps 25 a are already formed on the substrate that constitutes one of the divided regions] 04 in correspondence with the electrodes of the semiconductor chip in that region. Next, when a bump is formed in an adjacent divided region, the array substrate 1 holding the minute balls 4 by suction in the suction holes 3 is pressed against a predetermined portion of the substrate 104, so that a new bump 25b is formed. It is formed. When a wafer is divided into regions as in this example and bumps are formed in adjacent divided regions, a cutout portion 102 is provided on the peripheral portion 1a of the array substrate as shown in the figure. There is no danger that the already formed bumps 25a will be pressed again by the peripheral part 1a of the array substrate 1 in particular. That is, the cut portion 102 constitutes a relief for the bump 25a.

Here, FIG. 16 shows another configuration example of the cutout portion 102 provided on the peripheral portion 1 a of the array substrate 1. In this example, the peripheral portion 1a of the array substrate 1 is formed in a stepped shape as shown in the figure to provide the cutout portion 102, thereby making the peripheral portion 1a thin. Further, the cutout 102 is provided outside the suction hole 3 near the peripheral edge 1a. Also in the case of the cut portion 102 in this example, a relief is formed for the already formed bump 25a, and a new portion is formed in the adjacent divided region without damaging the bump 25a. The bump 25b can be formed properly.

When bumps are formed on a plurality of semiconductor chips on a wafer, according to the method of the present invention, the wafer 20 is divided into a plurality of semiconductor chip units (depending on the chip size, for example, as shown in FIG. 17). It is divided into a plurality of regions 20 ai to 20 a 9 by several tens to several hundreds). Each of these divided areas 20 a! Joining the minute balls are arranged supported on each to 2 0 a ₉ to SEQ substrate 1.

When the wafer 20 is divided into regions as described above, the dicing process of the wafer 20 is performed. Assuming a dicing line before, it can be divided into a plurality of regions along the dicing line as described above. Further, after the dicing step of the wafer 20, the semiconductor chips diced may be in a state of being adhered on an adhesive tape or the like. Alternatively, in the case of a wafer having a relatively small size, it is possible to collectively form bumps on the entire wafer without dividing the area.

For example, as shown in FIG. 18, the array substrate 1 is formed with suction holes 3 corresponding to the electrodes of a plurality of semiconductor chips 11 on which bumps are to be formed. It is assumed that three micro balls 4 are held by suction. Further, a cut-out portion 102 substantially similar to that shown in FIG. 15 or FIG. 16 is provided in the peripheral portion 1a of the array substrate 1 used here. The micro balls 4 are sequentially bonded to each of a plurality of regions 20 ai to 20 a ₉ defined on the wafer 20 using the powerful array substrate 1, thereby forming bumps. .

Thus by dividing the wafer 2 0 to a plurality of the plurality of regions 2 0 a 1 ~ 2 0 a _9, by joining the minute balls at once for each divided region, conventionally which has been processed one chip The productivity can be significantly improved compared to the case of. Incidentally, according to the present invention, the productivity can be generally increased by several tens to several hundreds of times, depending on the chip size. Moreover this case, when forming the bumps in the divided areas adjacent to each other (e.g., 2 0 8! And 2 0 a _2), and more to have a cutout 1 0 2, damage to the already formed bumps It is possible to form bumps sequentially and appropriately for each of the divided regions without giving any problem.

In the case of bump formation on the outside of the peripheral region _{2 O b t ~ 2 0 b} 12 divided area 2 0 at~2 0 a ₉ in the central portion in the wafer 2 0 shown in FIG. 1 7, in those areas This can be performed in the same manner as described above using an array substrate of a suitable size. In this case, in the same bump forming apparatus, the arrangement substrates for the central portion and the peripheral portion of the wafer 20 may be appropriately switched and used, or alternatively, a different bump forming device may be used for each of those regions. Yeah.

In the above embodiment, when the cutout portion 102 is provided in the peripheral portion 1a of the row substrate 1, it is formed by forming it as an inclined flat surface (FIG. 15) or forming it in a step shape (FIG. 16). Examples have been described. In particular, regarding the shape and the like of the cut portion 102, The shape is not limited to the above, and other shapes may be used as long as the peripheral portion 1a is made thin. For example, the peripheral portion 1a may be formed in an arc shape, a curved shape, or the like, and the same operation and effect as in the above embodiment can be obtained.

The best mode for carrying out the present invention for achieving the third object is shown below. As shown in FIGS. 22 and 23, the fine ball bump forming apparatus of the present embodiment has a A ball array substrate 1 and an ultrasonic vibrator 3 are provided.

The ball array substrate 1 is formed to have a smaller diameter toward the tip, and the diameter L at the tip is smaller than the pitch at which the bumps are formed. Further, a ball suction hole 3 is formed at the center thereof. A vacuum suction device〗 6 (see FIG. 23) such as a vacuum pump is connected to the ball array substrate 1 via a hose 17, and the inside of the ball suction hole 3 is indicated by an arrow. As described above, the vacuum suction force is applied.

When forming ball bumps using the ball array substrate 1 configured as described above, first, the ball array substrate 1 is moved onto a container 4 in which fine metal balls 4 are stored. As shown in FIG. 24, the container 14 is fixed on a vibration generator 15 such as a parts feeder, and the fine metal ball 4 jumps when the vibration generator 15 vibrates.

The frequency of the vibration generated by the vibration generator 15 is variably set, for example, from 0 to 1 kHz according to the size of the fine metal ball 4 and the like. Desorption from 15 is possible.

Next, in order to attract the fine metal balls 4 to the ball array substrate 1, the ball array substrate 1 is lowered to the vicinity of the container 14 and is swung, and the fine metal balls 4 that are being viewed are adjusted to the ball array substrate 1. Vacuum suction is applied to the ball suction hole 3. Here, the descending distance and the amplitude distance of the ball array substrate 1 can be controlled, for example, in units of 0.1 mm, and the control of the amplitude number is also possible.

As described above, when the fine metal balls 4 are vacuum-sucked into the ball suction holes 3 of the ball array substrate 1, as shown in FIG. 22 (a), extra fine metal balls 4a are attached. May come. In this embodiment, in order to remove the extra fine metal balls 4a, the ultrasonic vibrator 13 is operated, and as shown in FIG. Vibrate. As a result, as shown in FIG. 22 (b), extra fine gold balls 4a attached to the fine metal balls 4 can be dropped downward, and one fine gold ball Only 4 can be reliably vacuum-sucked to the tip of the ball array substrate 1.

As described above, when one fine metal ball 4 is vacuum-adsorbed to the tip of the ball array substrate ¾, the ball array substrate 1 is then moved to the semiconductor chip 1 as shown in FIG. 22 (c). Move to a predetermined position on 1.

On the semiconductor chip 11, a plurality of electrodes 12 are formed at a predetermined pitch. When the ball array substrate 1 is moved onto the electrodes 12 on which bumps are to be formed, FIG. The ball array substrate 1 is lowered as shown in FIG.

Then, after positioning the fine metal ball 4 at a predetermined position on the electrode 12 of the semiconductor chip 1] on the stage 18 where the fine metal ball 4 is heated, the fine metal ball 4 is thermocompression bonded to the electrode 12. At this time, in the present embodiment, the ultrasonic vibrator # 3 is operated to apply ultrasonic energy. For example, ultrasonic vibration having a frequency of 20 to 150 KHz (preferably 30 to 120 KHz) is applied so that the fine metal ball 4 can be deformed with a very small force. To

And, since the new surface is exposed at the joint by the deformation, it is possible to carry out solid phase joining at a relatively low temperature, that is, to form an alloy by mutual diffusion of metal. Therefore, in the present embodiment, since bonding can be performed at a low temperature, the bonding time can be shortened and the bonding strength can be improved.

When the fine metal balls 4 are thermocompression bonded to the electrodes 12, they may be heated on the stage 18 side or on the ball array substrate 1 side. Alternatively, heating may be performed from both the stage 18 side and the ball array substrate 1 side.

After the fine metal balls 4 are bonded to the predetermined positions of the electrodes 12 as described above, next, the vacuum suction is released, and the ball array substrate 1 is raised to complete one bonding. By repeating such processing, the fine metal balls 4 are bonded to predetermined positions of the semiconductor chip 11 to form ball bumps one after another. You.

When operating the ultrasonic vibrator 13, the operation timing is synchronized with the suction of the fine metal ball 4, that is, when the fine metal ball 4 is suctioned to the ball array substrate. Good. In this case, the fine metal balls 4 are adsorbed to the ball suction holes 3 and at the same time, the extra fine metal balls 4a can be prevented from being attached.

In the above description, an example in which the ultrasonic vibrator 13 is fixed on the ball array substrate 1 is shown. However, in such a case, the ultrasonic transducer 13 is fixed in place on the ball array substrate 1 using screws or the like. do it. Also, a suitable adhesive such as an adhesive, rubber, or high-viscosity grease may be interposed between one ball array substrate and fixed. Further, instead of being fixed on the ball array substrate 1, it may be embedded in the ball array substrate 1 in a buried form.

Further, in the above-described embodiment, one ultrasonic vibrator 13 is provided to remove an extra fine ball or to bond the fine metal ball 4. However, an ultrasonic vibrator for removing extra fine balls and an ultrasonic vibrator for bonding the fine metal balls 4 at predetermined positions of the semiconductor chip 11 may be separately provided.

In any case, it is configured to be controlled by a control device (not shown) so as to generate ultrasonic vibrations according to conditions such as the size and type of the fine metal balls 4. In addition, as a means for removing extra fine balls, other vibration means such as a vibrator can be used in addition to the ultrasonic vibrator.

According to the present invention, as described above, the fine metal balls 4 are transferred one by one to predetermined positions of the ball bump forming object and are bonded to each other, so that the semiconductor chip on which a plurality of ball bumps are already formed is used. A ball bump can be formed well at a predetermined position. Therefore, the fine ball bump forming apparatus of the present invention can be favorably used for recovering pumping leakage.

In addition, the present apparatus may be provided with leveling means for adjusting the height of each bump after forming the bumps one by one, for example, pressing with a flat plate. The best mode for carrying out the present invention for achieving the fourth object is described below.In this embodiment, two or more diced semiconductor chips are positioned and arranged at predetermined positions, and conductive balls are collectively placed. The used bump is formed. The wafer W is diced as shown in Fig. 25. The diced semiconductor chip S is positioned and arranged at a predetermined position on the stage 201 by the transport head 200 as shown in FIG. The transport head 200 arranges only good semiconductor chips S selected from the diced wafers W on the stage 201. At this time, if two or more transport heads 200 are used, two or more semiconductor chips S can be quickly arranged. one

Further, as shown in FIG. 27, a ball array head 10 is provided as ball array means for arraying and holding the conductive balls 4 on which bumps are to be formed. The array head 10 includes an array substrate 1 having a large number of ball array holes 3 corresponding to the electrode portions of two or more semiconductor chips S, and is evacuated through a suction chamber 5. . A vacuum pump 16 as a vacuum suction source is connected to the suction chamber 5, and a ball array head 10 is arranged with conductive balls 4 in the ball array holes 3 as shown in the figure. The held ball array head 10 is supported by a moving transport mechanism (not shown) so as to be movable in the horizontal and vertical directions as shown in FIG. The ball array head 10 in which the conductive balls 4 are arranged and held in the supply section of the conductive balls 4 is transported to the stage 201 by this moving transport mechanism. While the ball array head 10 is aligned with the semiconductor chip S positioned at a predetermined position on the stage 201, the conductive ball 4 is bonded to the corresponding semiconductor chip S. It is composed of When the semiconductor chip S is placed on the stage 201 by the transport head 200, the tray 2 having the concave groove 211 formed at a position corresponding to each semiconductor chip S as shown in FIG. Use 1 ◦. The tray 210 functions as positioning means for positioning the electrode portion of the semiconductor chip S and the conductive balls 4 arrayed and held by the ball array head 10. The concave grooves 2 1 1 are formed with high dimensional accuracy between themselves and each other to accurately position the semiconductor chip S. Can be.

The concave groove 211 formed in the tray 210 preferably has a guide portion 212 formed in an appropriate tapered shape as shown in FIG. By providing such a guide portion 211, the semiconductor chip S can be smoothly set in the concave groove 211. Note that these concave grooves 211 and guide portions 212 can be formed in advance on the stage 201 itself without using a separate tray 20.

As described above, on the stage 201, two or more diced semiconductor chips S are arranged. Figure 3 1 shows an example of the arrangement of the semiconductor chips S in that case, the four semiconductor chips Si～S ₄ in a square shape (Fig. 3 1 (A)), or four semiconductors chips S! To S ₄ are arranged in a row (Fig. 3 (B)). The arrangement is not limited to the illustrated arrangement example, and two or more diced semiconductor chips s may be positioned and arranged at predetermined positions.

Alternatively, when arranging two or more semiconductor chips or printed circuit boards on the tray 210 or the stage 201, for example, as shown in FIG. 32, a concave groove larger than the size of the target semiconductor chip S or printed circuit board or the like. Form 2 1 1 First, the grooves 21 1, semiconductor chip Si～S ₄ is not like in Fig. 3 2 (A) is-out coffer a printed circuit board or the like, grooves 21 1 by appropriately tilting the trays 210 or the stage 20 1 aligning such as a semiconductor chip to S ₄ at the corners (Figure 32 (B)).

When aligning the semiconductor chip St～S ₄ like in the recessed groove 1 within 1 sucks fixed by suction holes 213 of good urchin semiconductor chip to S ₄ in FIG. 32 (B) from its rear side. Then, while maintaining this positioning state, the tray 210 or the stage 201 is returned to the original state position as shown in FIG. 32 (C).

On the other hand, the ball array head 10 is lowered at a predetermined timing into the container 14 from above the container 14 for accommodating the conductive balls 4 for forming bumps in the supply section of the conductive balls 4 (FIG. )). Further, as shown in FIG. 33 (B), the conductive balls 4 are arranged and held in the ball arrangement holes 3 of the arrangement substrate 1 by evacuating through the suction chamber 5.

When the conductive balls 4 are sucked into the ball array holes 3 of the array substrate 1, the container 1 By vibrating 4, the conductive balls 4 are made to be in a state of view in the container 14 to take measures such as facilitating adsorption.

As shown in FIG. 33 (C), one conductive ball 4 is attracted to each ball array hole 3 of the array substrate 1. Here, when the conductive balls 4 are adsorbed, an extra ball removing means for removing extra balls from the array substrate 1 and adsorbing one conductive ball 4 to each ball arrangement hole 3 is further included. The surplus ball removing means can be configured, for example, to apply a slight vibration to the array substrate 1 so that the extra conductive balls 4 are separated from the array substrate 1.

Further, the arrangement state of the conductive balls 4 arranged and held on the arrangement substrate 1 as described above is inspected. In this case, as shown in FIG. 33 (C), the arrangement state of the conductive balls 4 is photographed from below the arrangement substrate 1 by the image recognition means (TV camera) 29, and the quality of the arrangement state is confirmed. it can.

The ball array head 10 holding the conductive balls 4 in an appropriate arrangement descends while being aligned with the semiconductor chip S on the stage 201, and thereby, the conductive balls 4 correspond to the corresponding semiconductor chips S. Electrode.

The two or more diced semiconductor chips S are positioned and arranged on the stage 201, and the conductive balls 4 are bonded to these semiconductor chips S to form bumps. By using non-defective semiconductor chips S after dicing, non-defective products can be removed from the manufacturing process, and productivity can be significantly improved.

Another aspect of the positioning means in the above embodiment includes two or more stages whose orthogonal (X-y) and rotational coordinates (Θ) can be independently controlled. In this case, one semiconductor chip is positioned and arranged on one stage, and the conductive balls 4 are joined.On the other stage, the next semiconductor chip is positioned and arranged independently and simultaneously, and the conductive balls 4 are arranged. Join.

As still another embodiment of the positioning means, the positioning means includes a stage configured to position each semiconductor chip and to suction-fix the semiconductor chip to the position.

In the above embodiment, the example in which the bump is formed on the electrode of the semiconductor chip has been described. According to the present invention, the two or more semiconductor chips need not be of the same type, but may include different types of semiconductor chips. Not only for semiconductor chips, For example, the present invention can be applied to a printed circuit board or the like, and the same operational effects as those of the above embodiment can be obtained.

Based on FIGS. 34 and 35, the same reference numerals are used for members that are substantially the same as or correspond to those of the conventional example, and the best mode for carrying out the present invention for achieving the fifth object is described. It is shown below.

According to this embodiment, when forming a bump made of a fine metal ball on an electrode or the like of a semiconductor chip, the fine metal ball is housed in a predetermined container, and the fine metal ball in the container is arranged in an array head. Shall be adsorbed. By moving the array head to which the minute metal balls are adsorbed to the next joining stage in this way, the minute metal balls are discharged from the container by a fixed amount.

FIG. 34 shows a main configuration of a micro-ball supply device used in the method of the present invention. In the figure, as described above, the array head 10 includes an array substrate having a number of ball array holes corresponding to the electrodes of the semiconductor chip, and is evacuated through a suction chamber ( See Figure 36). The array head 10 is also supported so as to be able to move up and down above the container 14. By lowering the array substrate into the container 14 at a predetermined timing, the minute metal balls 4 are attracted to the ball array holes. .

This embodiment also includes a linear feeder 30 as ball supply means. A chute 31 is attached to the linear feeder 30, and minute chute balls 4 are supplied to the container 14 from the chute 31. The linear feeder 30 is driven by the drive unit 32. The drive section 32 includes a drive control circuit, and is configured to be able to freely control the output of the linear feeder 30.

The shot 31 is set to pass one micro metal ball 4. In the middle of the chute 31, a counter 40 for counting the passing minute metal balls 4 is provided. The counter 40 includes a light emitter 41 and a light receiver 42. The light emitter 41 emits, for example, a visible light laser beam, and is emitted from the light emitter 41 according to the presence or absence of the minute metal ball 4 on the optical path between the light emitter 41 and the light receiver 42. The received laser light is received by the light receiver 42.

That is, as shown in the figure, when the minute metal ball 4 passes through the optical path between the emitter 41 and the receiver 42, the output of the receiver 42 is switched ON / OFF, Ball 4 can be counted. By using laser light in the projector 41, even the extremely minute metal balls 4 can be accurately detected by the light receiver 42, and accurate count data can be obtained.

FIG. 35 is a block diagram showing a schematic configuration in the present embodiment. The drive of the linear buoyer 30 is controlled by the drive control circuit 33 of the drive unit 32. In this example, the drive control circuit 33 receives the command of the CPU 34 and adjusts the output of the linear feeder 30. From the counter 40, the count data when the minute metal balls 4 are counted is output to the CPU 34. In addition, the number of the minute metal balls 4 in which the array heads 10 are discharged from the container 14 is always input to the CPU 34. In the above configuration, the array head 10 sucks the minute metal balls 4 into the ball array holes of the array substrate and moves and conveys them to the bonding stage in a predetermined cycle time. In this manner, the minute metal balls 4 are discharged from the container 14 in a fixed amount. The discharge or use amount of the minute metal balls 4 from the container 14 can be accurately obtained from the number of times the array head 0 is sucked, and the data of the amount is input to the CPU 34.

By the way, as described above, the success rate of adsorption of the minute metal balls 4 on the array head 10 depends on the amount of the minute balls 4 accommodated in the container 14. The CPU 34 calculates the number of minute metal balls 4 to be supplied to the container 14 in order to supplement the number of minute metal balls 4 discharged. Then, the CPU 34 drives the linear feeder 30 via the drive control circuit 33 to supply the fine metal balls 4 to the container 14. In this case, the minute metal pole 4 passing through the chute 31 is accurately counted by the counter 40. By supplying the small metal balls 4 to the container 20 while counting them one by one, the number of the small metal balls 4 in the container 20 can always be maintained in an optimum range. The structure (diameter) of the chute is, for example, smaller than twice the ball diameter, and if it is larger than the ball diameter, a single ball can pass. In addition, if the chute is made of a transparent material such as a glass tube, it is possible to count a ball such as a laser beam without setting a window in the shot. Also, there may be a plurality of shorts.

By supplying the minute metal balls 4 to the container 14 while counting them one by one, the supply amount of the minute metal balls 4 can be managed by the number. Therefore, —The ability to supply a small amount of metal balls 4 in the optimal range for the success rate of metal adsorption, and to maintain a high level of adsorption success rate for the array head 10 to achieve high productivity. Can be. In the present embodiment, in the case of 35, 50, 80, 100 / im gold balls and the case of 50, 100, 150, 200 μm diameter solder balls, The productivity of the present invention was confirmed.

In the above embodiment, the example in which the linear feeder 30 is provided as the ball supply means has been described. However, a ball supply means such as a so-called circular feeder can be used. In this case, the same operation and effect as those of the above embodiment can be obtained.

Further, in addition to the case where the minute metal balls 4 are supplied to the container 14 in the bump forming step as in the above embodiment, for example, the case where a predetermined number of minute metal balls 4 are packed in a fixed bin container or the like. The present invention can also be applied effectively.

The best mode for carrying out the present invention for achieving the sixth object is shown below. FIG. 38 is a block diagram showing a first embodiment of the surplus ball detecting device of the present invention.

As shown in FIG. 38, the surplus ball detection device according to the present embodiment includes a projector 310, an image sensor 311, an AZD conversion unit 312, an image memory 313, a grayscale image preprocessing unit 3 14, binarizing means 3 15 and surplus ball detection processing means 3 16 etc.

The floodlight 310 is for irradiating the surface of the array substrate 1 with light 3107 from an oblique direction, whereby the fine metal balls 4 (see FIG. 39) are formed on the surface of the array substrate 1. ) Shadow is formed.

The imaging device 311 captures an image of the array substrate 1 from the front direction, and replaces the light amount distribution on the array substrate 1 with an electric signal, and includes a lens and peripheral circuits of the imaging device.

The AZD conversion means 3 1 2 is for converting the video signal S 1 output in an analog form from the image sensor 3 11 into a digital electric signal, and as a result, the array substrate which is the object to be detected The information on the brightness distribution of the surface 1 is transferred to the image memory 3 13 as two-dimensional array data S 2. The image memory 3 13 is for storing the two-dimensional array data S 2 input from the AZD conversion means 3 12 in a predetermined address.

The gray-scale image pre-processing means 3 14 is for pre-processing the image data fetched into the image memory 3 13, and performs, for example, processing such as image distortion correction and noise elimination.

The binarizing means 3 15 performs a process of determining each pixel fetched into the image memory 3 13 as “0” or “1”. Here, each pixel can be determined using a threshold (threshord) with a gray scale according to the mail or processing capacity.

The surplus ball detection processing means 3 16, based on the information on the brightness distribution of the surface of the array substrate 1 that has been binarized by the binarization means 3 15, etc. It is for determining whether or not there is.

Next, a specific example in which the surplus ball is detected by the surplus ball detection device of the present embodiment configured as described above will be described.

FIG. 39 shows a second method of detecting a surplus ball by the surplus ball detection device of the present invention.

FIG. 2 is a diagram for explaining one embodiment. In FIG. 39, the same parts as those in FIG. 48 are denoted by the same reference numerals, and detailed description will be omitted.

As shown in Fig. 39, when there is an extra ball 4a, the light is

When 30 7 is irradiated from an oblique direction, the shadows of the fine metal balls 4 appear on the surface of the array substrate 1 as shown in FIG. It is formed.

In Fig. 40 (a), 320a shows the shadow formed when there is one fine metal ball 4, and 320b shows the shadow when two extra balls 4a are arranged in the vertical direction. This shows the shadow that is formed.

As is clear from FIG. 40 (a), the shadow 320b formed when the surplus ball 4a is present is much more remarkable than the shadow 320a formed when the surplus ball 4a is not present. It is getting bigger. Therefore, the surplus ball detection processing means 3 16 force The reference pattern when there is no surplus ball 4a shown in FIG. 40 (b) is held, and the captured shadow pattern on the array substrate 1 and the To compare with the reference pattern Thus, the presence / absence of the extra ball 4a and the position of the extra pole 4a can be easily and reliably detected.

Next, a second embodiment of the surplus ball detection method and device of the present invention will be described with reference to FIGS. 41 and 42.

In the case of the second embodiment, the surplus balls 4a are detected by setting the focal length when imaging the fine metal balls 4 held on the array substrate 1 to a predetermined value. I have.

That is, in FIG. 41, the image is focused on the position indicated by A, and the image is focused on the position indicated by B. As described above, when the image is focused on the position indicated by A, an image as shown in FIG. 42 (a) is obtained. When the image is focused on the position indicated by B, an image as shown in FIG. 42 (b) is obtained.

Since the image of FIG. 4 2 (a) is focused on the position indicated by A, the fine metal balls 4 on both sides of the three captured fine metal balls 4 are normal images 3 2 1 a, and the image obtained by imaging the fine metal pole 4 in the middle is an out-of-focus image 3221b.

In the image of FIG. 42 (b), since the image is focused on the position indicated by B, out of the three captured fine metal balls 4, the fine metal balls 4 on both sides are out of focus. Image 3221b, and the image obtained by imaging the fine metal ball 4 in the middle is a 画像 ^ image 3221a.

On the other hand, when an image of the array substrate 1 in a normal state without the surplus balls 4a is taken, all the fine metal balls 4 are taken as a normal image 3 2 1a as shown in (c) of FIG. Can be.

Therefore, the surplus ball detection processing means 316 compares the image of FIG. 42A with the image of FIG. 42C or the comparison of the image of FIG. 42B with the image of FIG. By doing so, the presence / absence of the extra ball 4a and the position of the extra ball 4a can be easily and reliably detected.

Next, a third embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 43, in the present embodiment, the first CCD camera 3 The second CCD camera 324b is used to image the fine balls 4 adsorbed on the array substrate 1.

The second CCD camera 324a captures an image of the array substrate 1 on which the plurality of fine balls 4 are adsorbed from an oblique direction 325a of 45 °. In addition, the second CCD camera 324b captures an image from the front direction 325b of the array substrate 1.

As described above, if the imaging directions are different, two types of images can be obtained as shown in FIGS. 44 (a) and (b). Here, FIG. 44 (a) is an image obtained by capturing the image from the oblique direction 325a by the first CCD camera 324a. FIG. 44 (b) is an image obtained by capturing an image from the front direction 325b with the second CCD camera 324b.

Comparing these images, in FIG. 44 (b), which is an image taken from the front direction 3 25b, all the fine balls 4 are substantially circular images, that is, a normal image 3 26a It is imaged as. In contrast, in FIG. 44 (a), a large elliptical abnormal image 326b which is not a perfect circle is captured.

As shown in FIG. 43, the abnormal image 326b is captured due to the occurrence of the extra ball 4a. That is, even if the surplus ball 4a is generated, if the surplus ball 4a overlaps with the fine ball 4, the normal ball 326a is taken when photographed from the front direction 325b.

When the surplus ball 4a is generated, the height of that part is the sum of the height of the fine ball 4 and the height of the surplus ball 4a. Is large. That is, it can be captured as the abnormal image 326b.

Therefore, in the case of the present embodiment, the surplus ball detection processing means 316 compares the image of FIG. 44 (a) with the image of FIG. The presence / absence and the position of the surplus ball 4a can be easily and reliably detected.

In addition, an upper limit value of the area of the imaged surplus ball 4a is set, and the surplus ball is obtained by comparing the surface of the image of the surplus ball 4a actually imaged with the upper limit value. You can know the presence or absence of the 4a.

Next, a fourth embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 45, in the present embodiment, a vibration device 327 is mounted on the array substrate, and vibration is applied by the vibration device 327. When vibration of a predetermined frequency is applied to the array substrate 1, the surplus balls 4 a rotate together with the fine balls 4 as shown by the arrow R in FIG. 45 (a).

When rotated in this manner, the surplus ball 4a is rotated by the action of the centrifugal force, as shown by the dotted line in FIG. 45 (b), in a state deviated from the vertical straight line when viewed from the detection direction. Therefore, even if the array substrate 1 is imaged from the front direction 3 25 b with the CCD camera 32 4, if the surplus ball 4 a exists, it can be imaged as a large image or an image with large swing. The presence or absence and position of the surplus ball 4a can be surely known.

Next, a fifth embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 46 (a), the surplus ball detecting device of this embodiment is provided with a ball dropping jig 328 as a means for dropping excess ball, and the ball dropping jig 3288 is fixed. It is provided at the height. Then, as shown by an arrow F in FIG. 46 (a), the array substrate 1 is moved on the ball dropping jig 3 288.

Then, the fine balls 4 normally sucked into the through holes 3 of the array substrate 1 do not come into contact with the ball knocking jigs 3 28, but the surplus balls 4 overlapping the fine balls 4 “a” comes into contact with the ball falling jig 3 288 and falls down when viewed from a vertical straight line as shown in FIG. 46 (b).

In this state, the camera can be easily and reliably distinguished when viewed from the front direction 3 25 b, so that the image is captured by the CCD camera 3 24 as shown in FIG. 46 (b). Based on the obtained image, it is possible to easily know that the extra ball 4a has occurred.

Next, a sixth embodiment of the present invention will be described with reference to FIG.

In the case of this embodiment, an example is shown in which a gas ejection device 329 is used in place of the above-described surplus ball falling jig.

In other words, as shown in FIG. 47, the gas blowing device 3 It is arranged diagonally below the array substrate 1. Then, as indicated by an arrow 3229 a in FIG. 47 (a), nitrogen gas or the like is jetted toward the adsorption surface of the arrayed substrate 1. By doing so, when the surplus ball 4a is generated, as shown in the fifth embodiment described above, the surplus ball 4a overlapping the fine ball 4 is removed from the vertical straight line. The surplus ball 4a can be easily and reliably detected because the surplus ball 4a can be easily and reliably detected. It should be noted that, in addition to nitrogen gas, a gas such as air may be ejected in order to knock down the surplus ball.

Since the surplus ball detection method and apparatus of the present embodiment detects the surplus balls 4a as described above, it is difficult to detect the surplus balls 4a by the conventional detection method. 4a can be reliably detected.

Therefore, extra fine metal balls with a diameter of less than 500 / mφ, especially fine gold balls less than 3 000 μm, tend to generate extra balls in the vertical direction, but bumps are formed using these fine metal balls. The present invention can be effectively used in forming, and it is possible to detect the presence or absence of excess balls and the size of fine balls when forming fine ball bumps, and to greatly reduce the occurrence of defective products. Can be. Industrial applicability

ADVANTAGE OF THE INVENTION According to this invention, the inconvenience that a fine ball is intensively adsorbed to the center part of an arrangement substrate can be prevented, and a fine ball can be adsorbed favorably over the whole surface of a ball arrangement substrate. Further, according to the apparatus and method for arranging fine balls of the present invention, it is possible to reduce the probability of occurrence of a problem of ball suction during re-sucking to a fraction or less, and to reduce the time required for re-sucking to several minutes. It can be reduced to 1 or less.

According to the present invention, suction timing and suction force are varied according to the positions of a plurality of ball suction holes formed on the surface of the ball array substrate, and the suction timing and the suction force are changed at the peripheral portion of the ball array substrate close to the air suction hole. In the ball suction hole, the suction of fine balls is started at an early timing and at the same time, and the suction force is increased. On the contrary, the suction timing is set in the ball suction hole formed in the center of the ball array substrate. Slowly and with a small suction force, the fine holes are spread over the entire surface of the ball array substrate. This makes it possible to adsorb the tool well.

According to the present invention, proper, high-level, and reliable bump bonding can be realized without damaging a bump on which a bump is already formed in this type of bump formation. In particular, by joining micro-balls in multiple areas on the wafer at once, the uniformity of the bump height in at least the divided areas is ensured, and the bonding reliability is improved in the process after bump formation. Can be enhanced. In addition, there is an advantage that the production efficiency can be remarkably improved by joining the micro balls in each divided region.

According to the present invention, since the ball bumps are formed by holding the fine balls jumped by vibration one by one, there is no need to create a ball array substrate for each type of product for which a Bonore bump is formed. Versatility is obtained. Therefore, it is particularly effective, for example, when a small number of semiconductor devices with a small number of pins are manufactured.

In addition, since bumps can be formed by using fine balls formed in a desired size in advance, the height and diameter of the bumps can be made uniform, and bumps having high bonding reliability can be obtained. However, it can be easily formed with a simple device.

Further, by applying the ultrasonic vibration by the ultrasonic vibrator, it is possible to satisfactorily remove an extra ball that often appears when using a fine ball. It can be prevented reliably. In addition, by applying ultrasonic energy when bonding the fine balls, the bonding temperature between the fine balls and the ball bump forming object can be reduced, thereby shortening the bonding time and improving the bonding strength. Will be able to According to the present invention, when forming this kind of bump, by using two or more diced semiconductor chips, a plurality of bumps can be formed at the same time, whereby productivity can be remarkably improved. In this case, since a non-defective semiconductor chip can be selected, the non-defective semiconductor chip has an advantage that the non-defective product rate can be increased to nearly 100% and the yield can be improved.

According to the present invention, when supplying a minute metal ball to a predetermined container, the number of the minute metal balls in the container is always maintained in an optimum range by supplying the minute metal balls while controlling the number of the minute metal balls. Can be. This allows the ball to be adsorbed on the array head It has the advantages of always guaranteeing a high success rate and significantly improving productivity. As described above, according to the first aspect, the present invention irradiates light from an oblique direction to form a shadow having a size corresponding to the height of the fine ball on the array substrate, Since the surplus balls are detected based on, the surplus balls overlapping in a straight line can be reliably detected when viewed from the detection direction.

Further, according to another feature of the present invention, when the fine ball held on the array substrate is imaged by the detection camera, the fine ball is imaged at a predetermined focal length. It is possible to discriminate by the magnitude of the image signal, and based on the strength of the imaging output of the detection output mera, it is possible to reliably detect the surplus balls overlapping in a straight line when viewed from the detection direction.

Further, according to another feature of the present invention, an image of the minute ball held on the array substrate is taken in an oblique direction, and an extra ball is obtained based on the image obtained by the image taken in the oblique direction. Is detected, it is possible to obtain images of different sizes in the part where the ball is properly retained and the part where the surplus ball is generated, and they are vertically aligned when viewed from the detection direction. The surplus ball can be reliably detected.

Further, according to another feature of the present invention, the image is taken in a state where vibration is applied to the array substrate holding the fine balls, so that a surplus ball overlapping in a vertically connected state is generated. The size and outline of the image obtained by imaging the image can be different from the image obtained by imaging the normally held part. It is possible to reliably detect the surplus balls that overlap.

Another feature of the present invention is that the array substrate holding the fine balls is passed over a ball dropping jig positioned at a predetermined height, and the surplus balls are dropped and then imaged. Even if there is a surplus ball that overlaps vertically, it can be taken in a state where the surplus ball is easy to see when viewed from the front. It can be detected reliably.

Therefore, according to the present invention, fine metal balls having a diameter of less than 500 μπιφ 0 0 / Ζ 良好 It is possible to detect well even when the fine metal balls of less than φ overlap in the vertical direction to form a surplus ball, and when forming a bump using the fine metal balls, The occurrence of defective products can be greatly reduced.

Claims

Claims: An array substrate having a plurality of ball suction holes formed on the suction surface of the micro-balls, and a vacuum chamber formed inside a micro-ball array head holding the array substrate are depressurized. A pressurizing system for depressurizing the micro balls in each of the ball suction holes so as to adsorb and desorb the fine balls. And an arrangement device for fine balls arranged at a time on an electrode of an electronic component including at least a semiconductor chip, wherein a vacuum chamber formed inside the arrangement head is divided into a plurality of areas, and Decompression and pressurization systems are provided for each of the plurality of areas,

A minute ball arrangement apparatus, wherein the pressure reduction timing and the pressure reduction magnitude in each area can be controlled for each area.

The fine ball array shingle according to claim 1,

A fine ball arrangement apparatus, characterized in that the suction / release of the fine balls can be controlled for each of the areas, instead of the pressure reduction timing and the magnitude of the pressure reduction in each of the areas.

The arrangement device for fine balls according to claim 1, wherein

An arrangement apparatus for microballs, characterized in that, in addition to the decompression timing and the magnitude of decompression in each area, the adsorption and desorption of the microballs can be controlled for each of the areas.

A micro-ball array head holding a micro-ball array substrate having a vacuum chamber formed inside and a plurality of ball suction holes communicating with the vacuum chamber formed on the suction surface. ,

An air suction hole is formed in the periphery of the vacuum chamber, and a partition wall is formed between the air suction hole and the center of the vacuum chamber.

A fine ball arrangement head, wherein the flow of air sucked from each of the ball suction holes and reaching the air suction holes can be controlled by the partition wall.

. Microbore with multiple suction holes for holding and holding conductive microballs Array board,

A micro-ball array substrate, comprising: a cutout portion formed by thinning a peripheral portion of the substrate on a side of the substrate on which a micro-ball is held.

6. The microball array substrate according to claim 5, wherein the cutout portion is provided outside a suction hole near a peripheral portion of the substrate.

7. An array substrate having one end of a suction hole for sucking one of the jumping fine balls opened at the tip thereof;

A vacuum suction device for causing the inside of the suction hole formed in the array substrate to have a negative pressure so that one of the jumping fine balls is vacuum-adsorbed to the tip of the array substrate;

Vibrating means for vibrating the ball array substrate with a minute amplitude in order to remove extra fine balls other than the fine balls that are vacuum-adsorbed at the tip of the array substrate. Bump forming equipment.

8. The fine ball bump forming apparatus according to claim 7, wherein the vibrating means for removing the extra fine balls is an ultrasonic vibrator.

9. The tip of the ball array substrate is formed to have a small diameter corresponding to the size of the fine ball to be used, so that it is formed smaller than the pitch for forming the ball bumps. 9. The fine ball bump forming apparatus according to claim 7, wherein

10. A method for applying ultrasonic energy to the fine balls when transferring the fine balls adsorbed to the tip of the array substrate to predetermined positions of the ball bump forming object to form ball bumps. The fine ball bump forming apparatus according to any one of claims 7 to 9, further comprising an ultrasonic vibrator. 11. Ball arrangement means for arranging and holding conductive balls at positions corresponding to two or more diced semiconductor chips or printed circuit board electrodes,

Positioning means for aligning the electrode portion of the semiconductor chip or the printed board with the conductive balls arranged and held by the ball arranging means; and Transfer joining means for transferring and joining to the electrode portion, A bump forming apparatus comprising:

12. The bump forming apparatus according to claim 11,

The bump forming apparatus, wherein the positioning means includes a tray having a groove formed at a position corresponding to each semiconductor chip.

13. The bump forming apparatus according to claim 11,

The positioning device includes a stage in which a groove is formed in a position corresponding to each semiconductor chip.

14. The bump forming apparatus according to claim 11,

A bump forming apparatus, wherein the positioning means includes two or more stages whose orthogonal and rotational coordinates can be independently controlled.

5. The bump forming apparatus according to claim 11,

The bump forming apparatus, wherein the positioning means includes a stage configured to position each semiconductor chip and fix the semiconductor chip by suction. 6. Ball supply means for supplying minute balls to a predetermined container;

A ball counter for counting the number of micro balls to be supplied from the ball supply means to the container,

A minute ball supply device, wherein the minute ball is supplied from the ball supply means to the container while counting the minute balls by the ball counter. 7. The micro-ball supply device according to claim 16,

A micro-ball supply device comprising: a drive control means for driving the ball supply means to supply an appropriate amount of micro-balls to the container based on data on the number of small balls discharged from the container.

8. The ball supply device according to claim 17, wherein the ball supply means includes a shot set to pass a single minute ball, and the minute balls passing through the shot are counted by the ball counter. The described micro ball supply device.

9. In a detection device for detecting an extra ball generated when a fine ball is held on an array substrate,

Irradiating light from an oblique direction toward the fine balls held on the array substrate A floodlight,

Imaging means for imaging a shadow of a fine ball formed on the array substrate by the light projector;

A surplus ball detecting device, comprising: surplus ball detecting means for detecting a surplus ball based on image data output from the imaging means.

20. In a detection device that detects surplus balls generated when fine balls are held on an array substrate,

A detection camera for imaging the fine ball held on the array substrate at a predetermined position with a focal length adjusted;

A surplus ball detection device, comprising: surplus ball detection means for detecting a surplus ball based on an imaging output of the detection camera.

21. When imaging the fine balls held on the array substrate by the detection camera, the imaging is performed by focusing on the fine balls normally held on the array substrate. The surplus ball detection device described in 0.

22. When imaging the fine ball held on the array substrate with the detection camera, the image is focused on the front side of the fine ball normally held on the array substrate. 22. The surplus ball detection device according to claim 20, wherein

23. The surplus ball detection means compares an image obtained by imaging the fine ball in a state where it is normally held on the array substrate with an image obtained by the detection power mela. The surplus ball detection device according to any one of claims 19 to 22, wherein the surplus ball detection device detects the surplus ball.

24. In a device for detecting surplus balls generated when micro balls are held on an array substrate,

Imaging means for imaging the fine ball held on the array substrate from an oblique direction;

A surplus ball detection device, comprising: a surplus ball detection unit that detects a surplus ball based on an image obtained by the imaging unit.

25. The surplus ball detection device according to claim 24, wherein the imaging means is a CC camera.

6. In an apparatus for detecting an extra ball generated when a fine ball is held on an array substrate,

Vibration applying means for applying a vibration of a predetermined amplitude to the array substrate,

Imaging means for imaging the fine ball held on the array substrate in a state where the vibration is applied by the vibration applying means;

A surplus ball detection device comprising surplus ball detection means for detecting a surplus ball based on an image obtained by the imaging means.

7. In an apparatus for detecting excess balls generated when micro balls are held on an array substrate,

A surplus ball detecting device, comprising: detecting means for detecting a surplus ball, which is vertically connected to the array substrate and held, in a depressed state.

8. In a device for detecting an extra ball generated when a fine ball is held on an array substrate,

The detecting means includes a ball dropping jig positioned at a predetermined height, and passes the array board over the ball dropping jig, and holds a surplus vertically connected to the array board. 28. The surplus ball detecting device according to claim 27, wherein the surplus ball is set in a state where the ball is tilted.

9. In a device for detecting an extra ball generated when a fine ball is held on an array substrate,

28. The detection device according to claim 27, wherein the detection device includes an ejection device that ejects a fluid toward the arrayed substrate, and the surplus balls held in the vertical direction are brought down by the fluid. The surplus ball detection device according to any one of the above.

0. In an apparatus for detecting an extra ball generated when a fine ball is held on an array substrate,

A ball dropping jig positioned at a height such that it is at a fixed interval with respect to the array substrate holding the fine balls,

Array substrate moving means for passing the array substrate over the ball drop jig to drop excess balls,

Fine balls held on an array substrate passed over the ball dropping jig Imaging means for imaging

3 1. In an apparatus that detects excess balls generated when micro balls are held on an array substrate,

A fluid ejecting device for ejecting a fluid toward the array substrate holding the fine balls to bring the surplus balls down,

Imaging means for imaging the fine balls held on the array substrate in a state where the surplus balls are tilted by the fluid ejecting device;

A surplus volume detecting a surplus volume based on the image obtained by the imaging means;

A surplus ball detection device comprising a rule detection means;

32. The surplus ball detecting device according to claim 31, wherein the fluid ejected from the fluid ejecting device is a nitrogen gas. 33. A vacuum chamber formed inside a micro-ball array head holding an array substrate having a plurality of ball suction holes formed on the micro-ball suction surface is depressurized and pressurized, and the ball suction is performed. A plurality of fine balls are collectively held on the array substrate so as to adsorb / remove the fine balls in each of the holes, and the fine balls are collectively arranged on electrodes of an electronic component including at least a printed board and a semiconductor chip. In the array method of

A vacuum chamber formed inside the array head is partitioned into a plurality of areas, and an array head in which a pressure and pressure system is provided for each of the plurality of areas is used.

A fine ball, wherein a plurality of fine balls are collectively adsorbed on the suction surface while controlling the timing of the pressure and the magnitude of the pressure in each of the areas for each of the plurality of layers. Array method.

34. In the method for arranging fine balls according to claim 33,

Instead of the pressure reduction timing and the magnitude of the pressure in each of the areas, only the suction / release of the fine ball is controlled on each of the plurality of areas and collectively on the suction surface. A method for arranging fine balls, wherein a plurality of fine balls are collectively arranged by suction.

35. In the method for arranging fine balls according to claim 33,

In addition to the decompression timing and the magnitude of the decompression in each of the areas, the plurality of micro balls are collectively arranged by collectively adsorbing on the adsorption surface while controlling the adsorption and desorption of the micro balls for each of the plurality of areas. Characteristic method of arranging fine balls. 36. A micro-ball array head holding a micro-ball array substrate having a vacuum chamber formed inside and a plurality of ball suction holes communicating with the vacuum chamber formed on the suction surface. In the method for arranging fine balls, the fine balls are collectively sucked into the plurality of ball suction holes and the plurality of fine balls are arranged at predetermined positions.

Each of the balls is formed by using a fine ball array head in which an air suction hole is formed in a peripheral portion of the vacuum chamber and a partition wall is formed between the air suction hole and a central portion of the vacuum chamber. The flow of the air sucked from each of the suction holes is controlled to be a predetermined flow by the partition wall, and a plurality of fine balls are collectively sucked into the ball suction holes and arranged in a predetermined state. How to arrange the fine balls.

37. A method of forming bumps by transferring conductive micro balls arranged and carried on an arrangement substrate to a portion to be joined,

A method for forming a bump, comprising: dividing the portion to be joined into a plurality of regions; and joining the micro balls arranged and carried on the arrangement substrate for each of the divided regions. 38. The bump forming method according to claim 37, wherein the part to be joined is constituted by electrode parts of a plurality of semiconductor elements.

39. The method according to claim 38, wherein the part to be bonded is divided into one or a plurality of semiconductor elements, and the micro-ball is bonded to an electrode part of each semiconductor element.

-The bump formation method described above.

40. The method of forming a bump according to claim 37, wherein the microball array substrate according to claim 5 or 6 is used.

4 1. Micro-vibration is applied to the container containing the micro-balls to jump the micro-balls. The fine ball jumping process that makes you jump,

A fine ball suction step of holding one of the fine balls jumping by the processing of the fine ball jumping step by vacuum suction at the tip of the arrayed substrate having one suction hole;

Extra fine holes other than one fine ball adsorbed on the tip of the array substrate

An unnecessary ball removing process for removing the ball by vibration with a small amplitude;

The arrangement substrate from which the extra fine balls have been removed in the unnecessary ball removal step is moved onto a substrate or a ball bump formation target including electrodes of a semiconductor chip, and is attracted to the ball bump formation target and the arrangement substrate. An array substrate moving step for aligning with the fine ball

Forming a ball bump by transferring a micro ball adsorbed to the tip of the array substrate to a predetermined position of the ball bump forming object. Method.

42. The method for forming a fine ball bump according to claim 41, wherein the vibration due to the minute amplitude in the unnecessary ball removing step is an ultrasonic vibration generated by an ultrasonic vibrator.

43. The bump forming step according to claim 41, wherein the micro-ball and the ball bump forming object are joined while applying ultrasonic energy. Method for forming fine ball bumps.

44. A bump forming method comprising: positioning two or more diced semiconductor chips or print substrates at predetermined positions; and forming bumps using conductive balls all at once.

45. A step of arranging and holding conductive balls at positions corresponding to two or more diced semiconductor chips or printed circuit board electrode portions;

An electrode portion of a semiconductor chip or a printed circuit board;

And the process of aligning the

Transferring and bonding the conductive balls held in alignment to an electrode portion of a semiconductor chip or a printed circuit board;

A method of forming a bump, comprising:

46. The bump forming method according to claim 45, further comprising a step of inspecting an arrangement state of the conductive balls held in the arrangement.

4 7. A method of supplying micro balls to a predetermined container,

Counting the number of minute balls to be supplied from the ball supply means to the container, and controlling the supply amount of the minute balls so that the amount of the minute balls contained in the container is maintained in an optimum range. A method for supplying micro-balls, characterized in that:

48. The method according to claim 47, wherein the number of minute balls discharged from the container is detected, and the amount of ball supply from the ball supply means is controlled according to the amount of the discharged balls. Micro ball supply method.

49. The method according to claim 47 or 48, wherein the same number of micro balls as the micro balls discharged from the container are supplied until the next ball is discharged.

50. In a method for detecting an extra ball generated when a fine ball is held on an array substrate,

Irradiating the micro balls held on the array substrate with light in an oblique direction, thereby detecting an excess ball based on a shadow of the micro balls formed on the surface of the array substrate. Ball detection method.

5 1. In a method for detecting an extra ball generated when a fine ball is held on an array substrate,

An image of the fine ball held on the array substrate is captured by a detection camera having a focal length adjusted to a predetermined position, and a surplus ball is detected based on an image output of the detection camera. Detection method.

52. The imaging method according to claim 51, wherein when imaging the fine balls held on the array substrate, the imaging is performed by focusing on the fine balls normally held on the array substrate. Surplus ball detection method.

5 3. When capturing an image of the fine ball held on the array substrate, imaging is performed by focusing on a position in front of the focus of the fine ball normally held on the array substrate. The method for detecting a surplus ball according to claim 51, wherein the surplus ball is detected.

5. Detect surplus balls generated when micro balls are held on an array substrate In the method,

A method of detecting a surplus ball, comprising: taking an image of a fine ball held on the array substrate in an oblique direction; and detecting an extra ball based on an image obtained by the imaging in the oblique direction.

55. The surplus ball detection method according to claim 54, wherein the imaging from the oblique direction is performed by a CCD camera.

5 6. In a method for detecting an extra ball generated when a fine ball is held on an array substrate,

Vibration is applied to the array substrate holding the micro-balls, and the micro-balls held on the array substrate are imaged in a prone state in which the vibration is applied, based on the image obtained by the imaging. And detecting a surplus ball.

5 7. In a method for detecting an extra ball generated when a fine ball is held on an array substrate,

A surplus ball detection method, characterized in that surplus balls held vertically in a row on the array substrate are tilted and detected.

5 8. The method of knocking down the surplus balls is to pass the arrayed substrate over a ball dropping jig positioned at a predetermined height, and to drop the surplus balls held in a row in the vertical direction. The surplus ball detection method according to claim 57, wherein the surplus ball is a method of being brought down by contacting a tool.

59. The method of tilting the surplus balls is a method of injecting a fluid toward the arrayed substrate and tilting the surplus balls held in a vertical line with the fluid. 7. The surplus ball detection method according to 7.

60. In a method for detecting an extra ball generated when a fine ball is held on an array substrate,

(I) The array substrate holding the fine balls is passed over a ball dropping jig positioned at a predetermined height, and the excess balls in a vertically connected state are tilted, and then the A method for detecting a surplus ball, wherein the micro ball held on the array substrate is imaged, and the surplus ball is detected based on the image obtained by the imaging. How to get out.

1. A method for detecting a surplus ball generated when a fine ball is held on an array substrate,

By injecting a fluid toward the array substrate holding the micro-balls, an image of the micro-balls held on the array substrate is taken after the surplus balls connected vertically have been turned down, and the imaging is performed. Surplus balls are detected based on images obtained by the method.

2. The method for detecting surplus balls according to claim 61, wherein the fluid is nitrogen gas.