KR102059987B1 - A Method For Controlling Solder ball Jetting System - Google Patents

Abstract

An objective of the present invention is to reduce tact time. According to the present invention, a solder ball jetting system comprises: a solder ball jetting unit including a fixed block equipped with a drive motor, a solder ball feeder to receive and jet a solder ball, a laser oscillator to melt a solder ball, and a pressure providing fitting; a soldering position control unit to control a moving means for moving the solder ball jetting unit; a disk drive unit to drive the drive motor connected to a vertical disk accommodated in the solder ball feeder of the solder ball jetting unit; and a control unit to control the soldering position control unit and the disk drive unit. The soldering ball feeder includes: a body having an internal space formed therein to be inclined towards a lower side thereof to be penetrated by a laser beam, and a feeding pipe communicating with the internal space to feed the solder ball to the internal space; a solder ball feeding unit which is adjacent to the body, and individually feeds a plurality of solder balls one by one to the feeding pipe of the body by rotation of the vertical disk connected to a rotary shaft of the drive motor while accommodating the solder balls; and a nozzle unit which is coupled to the lower side of the body and jets solder balls melted by the laser oscillator. The control unit controls the disk drive unit and the soldering position control unit to rotate the vertical disk while moving the solder ball jetting unit.

Description

A Method For Controlling Solder Ball Jetting System

The present invention relates to a control method of a solder ball jetting system, and more particularly to a control method of a solder ball jetting system that can improve the tact time by changing the relative position of the object and the solder ball to be jetted without delay.

BACKGROUND ART In general, an electronic circuit board is formed by attaching a semiconductor chip or active and passive component parts to a circuit board. In recent years, multifunctional, miniaturization, and high integration are required.

Efforts have been made to overcome this problem with laser soldering to solder heterogeneous components or ultra-small components with different heat capacities that conventional reflow (hot air soldering) cannot solve, and mainly using Au wire solder and solder paste. Is trying to solder.

In recent years, an indirect laser method is applied in which a solder ball is melted by firstly irradiating a laser to melt the solder ball and then spraying the molten liquid. This method accurately aims the solder ball at a working target point and then joins an object by heat. The loss of peripheral components can be minimized.

However, the conventional laser jetting apparatus has a disadvantage in that the tact time increases because the movement between the plurality of objects and the supply of the solder balls are controlled separately.

In addition, the solder ball is deformed by the high energy of the laser in the process of loading the solder ball, there is also a problem that some or all of the solder ball can not be discharged from the opening of the nozzle portion may remain as a residue. Therefore, there is a technical need to maintain the object to be jetted at an appropriate temperature and to remove the residue of the nozzle portion.

Domestic Application No. 10-2017-0108742 Domestic Publication No. 10-2014-0123214 Domestic Patent No. 10-0704903 Domestic Patent No. 10-0357210

The problem to be solved by the present invention aims to reduce the tact time by proposing a structure that can simultaneously move between a plurality of objects and supply of solder balls.

Another problem to be solved by the present invention is to provide a solder ball jetting control method that can be arranged to determine whether the nozzle portion is clogged automatically by disposing the differential pressure sensor and to automatically discharge the residue at high pressure to effectively block the nozzle portion.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

Solder ball jetting system according to an embodiment of the present invention to solve the above problems, a fixed block having a drive motor, a solder ball input for supplying and jetting the solder ball, a laser oscillator for melting the solder ball, providing pressure A solder ball jetting part including a fitting; Soldering position control unit for controlling the moving means for moving the solder ball jetting unit; A disk driver for driving the driving motor connected to the vertical disk accommodated in the solder ball inserter of the solder ball jetting part; And a control unit for controlling the soldering position control unit and the disk drive unit, wherein the solder ball injector includes an internal space formed to be inclined toward the lower side so that the laser beam penetrates therein, and the solder ball may be introduced into the internal space. A body having an input pipe communicating with the internal space; A solder ball input unit adjacent to the body and individually inserting solder balls into the input pipe of the body through rotation of a vertical disk connected to a rotation shaft of the driving motor in a state where a plurality of solder balls are accommodated; And a nozzle unit coupled to the lower side of the body and jetting the molten solder ball by a laser oscillator, wherein the controller controls the disc drive unit and the soldering position control unit to move the solder ball jetting unit while simultaneously moving the vertical disc. Can be rotated.

In this case, the solder ball jetting unit further includes a differential pressure sensor for measuring the pressure of the internal space, the control unit, when the differential pressure sensor senses the pressure, the laser having the energy to melt the solder ball to the solder ball The laser driving unit may be controlled to irradiate and the solder ball may be discharged by controlling the pressure providing fitting to increase pressure in the internal space.

The control unit controls the laser beam to be irradiated to the solder ball for a predetermined time after the solder ball is discharged, and controls the disk drive unit and the soldering position control unit after the predetermined time elapses while the solder ball jetting unit is moved. Vertical discs can be rotated at the same time.

On the other hand, the solder ball input unit, the fixed jig fixed to the fixed block in a state adjacent to the body, the fixing jig formed with a supply path for receiving the solder ball on the upper side; A rotating body accommodated in the fixing jig while being coupled to the rotating shaft of the driving motor; A vertical disc disposed between the body and the fixing jig in a state of being coupled with the rotating body, and having a plurality of seating grooves formed around the solder ball; And a guide cover disposed on the fixing jig while accommodating the vertical disc and discharging the solder ball seated while seating the solder ball in at least one seating groove of the vertical disc.

In addition, the guide cover is formed with an accommodating hole for accommodating the vertical disk, an upper accommodating hole is provided with an expansion receiving portion for exposing at least one seating groove while accommodating a plurality of solder balls through a supply path, An induction path having a predetermined inclination for guiding a solder ball seated in a seating groove to the input pipe of the body may be formed.

In addition, the supply path is formed to be inclined in an upward direction, the supply pipe may be connected to the connector for receiving the solder ball from the solder ball supply box.

In addition, an O-ring for maintaining airtightness may be further provided between the guide cover, the body and the fixing jig.

In addition, the nozzle unit, a communication hole is formed in the inner side to be coupled to communicate with the inner space to the lower side of the body, the nozzle adapter with a stepped portion formed in the lower portion of the communication hole; A nozzle inserted into the stepped portion of the communication hole; And a nozzle holder helically coupled to the nozzle adapter while penetrating the nozzle to press the tapered surface of the nozzle.

In addition, a pressing hole having an inclined inner surface through which the nozzle corresponds to a tapered surface of the nozzle may be formed at a center of a lower surface of the nozzle holder, and a knurling may be formed at an outer circumference of the nozzle holder.

On the other hand, the solder ball jetting control method according to an embodiment of the present invention, a fixed block provided with a drive motor, a solder ball input to supply and jetting the solder ball, a laser oscillator to melt the solder ball, and a solder ball jetting part including a pressure providing fitting ; Soldering position control unit for controlling the moving means for moving the solder ball jetting unit; A disk driver for driving the driving motor connected to the vertical disk accommodated in the solder ball inserter of the solder ball jetting part; And a soldering jetting system including a control unit for controlling the soldering position control unit and the disk driving unit, the solder ball being loaded in the nozzle unit; Discharging the loaded solder ball and irradiating a laser to the discharged solder ball for a predetermined time; And controlling the disc drive unit and the soldering position control unit to rotate the vertical disc at the same time while moving the solder ball jetting unit, wherein the solder ball injector is formed to be inclined toward a lower side to penetrate a laser beam therein. A body having an inner space and an input pipe communicating with the inner space so that the solder ball can be introduced into the inner space; A solder ball input unit adjacent to the body and individually inserting solder balls into the input pipe of the body through rotation of a vertical disk connected to a rotation shaft of the driving motor in a state where a plurality of solder balls are accommodated; And coupled to the lower side of the body, it may include a nozzle unit for jetting the molten solder ball by a laser oscillator.

The present invention has the effect of preheating the object to be jetted until the solder ball is loaded into the opening of the nozzle portion to maintain the temperature of the object to improve the efficiency of the work and at the same time improve the reliability of the product.

The present invention has an effect that can effectively prevent the clogging of the nozzle portion by automatically evaluating whether the nozzle portion is clogged to discharge the pressure.

1 is a schematic diagram of a solder ball jetting system according to an embodiment of the present invention.
2 is a perspective view showing a solder ball jetting part provided with a solder ball inserter according to the present invention;
FIG. 3 is an exploded perspective view illustrating the decomposition of FIG. 1;
4 is a cross-sectional view of main parts of FIG.
5 is an exploded perspective view illustrating a disassembled solder ball inserter according to the present invention;
6 is a front view of a state of removing the body of the solder ball injector according to the invention,
7 is an exploded perspective view of the nozzle unit of the solder ball injector according to the present invention;
8 is a sectional view of main parts in which the nozzle unit is coupled;
9 is a flowchart illustrating a solder ball jetting method according to an embodiment of the present invention.
10A to 10C are views for explaining a solder ball jetting control method according to an embodiment of the present invention.
11A through 11B are flowcharts illustrating a solder ball jetting unit according to an exemplary embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. These embodiments are provided to explain in detail the present invention to those skilled in the art. Therefore, the shape of each element shown in the drawings may be exaggerated to emphasize a more clear description.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are only used to distinguish one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, the solder ball jetting system 1000 will be described in detail with reference to FIG. 1. 1 is a schematic diagram of a solder ball jetting system 1000 according to an embodiment of the present invention.

Referring to FIG. 1, the solder ball jetting system 1000 includes a laser driver 110, a disk driver 120, a controller 130, an air pressure controller 140, a pressure detector 150, and a soldering position controller 160. And a solder ball jetting unit 800.

The solder ball jetting system 1000 is a device capable of bonding an object 850 to a printed circuit board by jetting a solder ball B on a printed circuit board using the solder ball jetting unit 800. Alternatively, the plurality of objects 850 on the printed circuit board may be bonded. The solder ball jetting system 1000 according to the embodiment of the present invention may discharge the solder ball B by irradiating a laser.

The laser driver 110 is a component for driving the laser oscillator 500 based on a control signal of the controller 130. The laser driver 110 may heat the object 850 and the solder ball by applying a driving signal for irradiating a laser beam to the laser oscillator 500. The laser driver 110 may control the temperature of the object 850 by adjusting the power of the laser oscillator 500 by the control signal of the controller 130.

The disc driver 120 is a component for rotating the vertical disc 330 by a control signal of the controller 130. The disk driving unit 120 may load the solder ball B accommodated in the vertical disk 330 into the opening of the nozzle unit 400 by rotating the vertical disk 330. Here, a detailed description of the vertical disk 330 and the nozzle unit 400 will be described later with reference to FIGS. 2 to 8 and 10.

The controller 130 may control the laser driver 110, the disk driver 120, the air pressure controller 140, the pressure detector 150, and the soldering position controller 160. The controller 130 may operate the laser oscillator 500 by applying a laser control signal to the laser driver 110. For example, the controller 130 may adjust the intensity and irradiation time of the laser oscillator 500. In addition, the controller 130 may operate the vertical disc 330 by applying a control signal to the disc drive unit 120. For example, the controller 130 may adjust the rotation direction and rotation speed of the vertical disc 330.

The air pressure adjusting unit 140 is a component that pressurizes the solder ball B or the solder ball residue from the nozzle unit 400 when the solder ball B is loaded into the opening of the nozzle unit 400. . The air pressure controller 140 is electrically connected to the air pressure controller 211 and supplies air to the body 200 of the solder ball jetting unit 800 through an air pipe 212 connected to the air pressure controller 211. Can be injected.

The pressure detector 150 is a component for checking the position of the solder ball B by detecting a pressure through the differential pressure sensor 1213. When the pressure detector 150 determines whether the pressure is detected by the differential pressure sensor 1213, when the pressure is detected, the solder ball B is detected in the opening of the nozzle unit 400, or the residue of the solder ball B is detected. If it is detected and a pressure is not detected, it is preferable to understand that the solder ball B or the discharge residue of the solder ball B was not detected in the opening part of the nozzle part 400.

The soldering position controller 160 is a device for controlling the soldering position through the solder ball by adjusting the position of the solder ball injector 700 of the solder ball jetting unit 800 using the moving means 510. The solder ball jetting system 1000 may minimize the influence on the peripheral parts except for the soldered part by jetting the solder ball B to the correct position by the soldering position control unit 160.

The structure of the solder ball jetting unit 800 will be described in detail with reference to FIGS. 2 to 8.

2 is a perspective view illustrating a solder ball jetting unit 800 provided with a solder ball injector 700 according to the present invention, FIG. 3 is an exploded perspective view of FIG. 2, and FIG. 4 is a sectional view of the main part of FIG. 2. 6 is an exploded perspective view illustrating a disassembled solder ball injector according to the present invention, FIG. 6 is a front view of a state in which a body is removed in the configuration of the solder ball injector according to the present invention, and FIG. 7 is an exploded perspective view of the nozzle unit in the configuration of the solder ball injector according to the present invention. 8 is a sectional view showing the main parts of the nozzle unit.

2 to 8, the solder ball jetting unit 800 of the present invention includes a solder ball injector 700, and the solder ball injector 700 is formed to be inclined toward the lower side so as to penetrate a laser beam therein. A body 200 having an input pipe 213 communicating with the internal space 211 so that the solder ball B can be introduced into the internal space 211; Adjacent to the body 200, the body 200 through the rotation of the vertical disk 330 connected to the rotating shaft 111 of the drive motor 110 in a state accommodating a plurality of solder balls (B) Solder ball input unit 300 for injecting the solder ball (B) to the pipe 213 individually; And a nozzle unit 400 coupled to the lower side of the body 200 and jetting the molten solder ball B by the laser oscillator 500.

In the solder ball jetting unit 800, a laser oscillator 500 for irradiating a laser beam with a solder ball B is disposed in an upward direction on the drawing, and a solder ball B to be described below directly below the laser oscillator 500. Solder ball injector 700 of the present invention in which the injection and jetting is performed. Each structure of the solder ball jetting unit 800 is controlled by the controller of FIG. 1.

The fixed block 100 serves to support various structures such as the laser oscillator 500 and the solder ball injector 700 constituting the solder ball jetting unit 800, and the driving motor 110 having the rotating shaft 111 therein. ) Is provided.

1 and 3, the laser oscillator 500 is disposed on the fixed block 100 to be spaced apart from the upper portion of the body 200 on an axis coinciding with the center of the inner space 211 of the body 200, which will be described later. , The solder ball (B) injected into the body 200 is irradiated with a laser beam to melt the solder ball (B).

At this time, the laser oscillator 500 may be selected from any one of the laser oscillator 500 of the NdYAG laser oscillator, Fiber laser oscillator, diode laser oscillator, DPSSL laser oscillator, the laser oscillator 500 is typically in the art Detailed description will be omitted as it applies.

In addition, the laser oscillator 500 has a structure finely controlled by the moving means 510 so that the correct laser beam can be irradiated according to the size of the solder ball (B) supplied.

The movement means 510 is coupled to the horizontal movement block 511 in a state in which the horizontal movement block 511 moves to the left and right in the horizontal direction and the laser oscillator 500 is coupled to lift the laser oscillator 500 up and down. The lifting movement block 513 is configured.

That is, the horizontal moving block 511 and the lifting moving block 513 move the laser oscillator 500 fixed by a separate bracket (unsigned) to the solder ball (B) size while moving left, right, up and down on the drawing. It is to set the focus of the laser beam accordingly.

At this time, the horizontal movement block 511 and the lifting movement block 513 is moved by the adjustment of the micrometer 515 installed to one side of the horizontal movement block 511 and the lifting movement block 513.

Hereinafter, since the structure of the horizontal moving block 511 and the lifting movement block 513 is composed of a coupling between conventional rails, a detailed description thereof will be omitted and may be implemented through various structures.

The solder ball injector 700 receives the solder ball B from the outside and jets it to the substrate for welding, as shown in FIGS. 2 to 8, to the body 200, the solder ball injection unit 300, and the nozzle unit 400. It is composed.

Body 200 is a rectangular shape having a predetermined width and width, is disposed directly below the laser oscillator 500 in a state coupled with the solder ball input unit 300 is installed on the fixed block 100.

In the lower side of the body 200, the solder ball B to be introduced into the inside of the body 200 from the solder ball injection unit 300 to be described later to melt through the laser oscillator 500 to be jetted into the paste of the substrate (below) 400) are combined.

4 and 8, an inner space 211 penetrating the body 200 is inclined toward the nozzle unit 400 coupled to the lower side so that the laser beam can penetrate as shown in FIGS. 4 and 8. The inner space 211 is formed at a position coincident with the vertical center axis of the laser oscillator 500 so that the laser beam can be irradiated accurately as shown in FIG. 3.

In addition, the body 200 has an input pipe 213 communicating with the internal space 211 so that the solder ball B may be introduced into the internal space 211 by the solder ball input unit 300 described later as shown in FIG. 7. Formed.

At this time, the input pipe 213 is preferably formed to be inclined at a predetermined angle adjacent to the nozzle unit 400 disposed below the body 200, which is formed by inclining the input pipe 213 to solder ball from the solder ball input unit 300 When (B) is supplied to be able to be quickly introduced into the nozzle unit 400 through the inner space 211.

In addition, a viewing window 215 through which the laser beam radiated from the laser oscillator 500 passes is disposed above the body 200.

2 to 8, the solder ball input unit 300 is formed in the state adjacent to the body 200, the solder ball supply box through the rotation of the vertical disk 330 connected to the rotating shaft 111 of the drive motor 110 ( The solder balls B are supplied from the 360 and the solder balls B are individually input into the input pipe 213 of the body 200.

The solder ball injection unit 300 is composed of a fixing jig 310, a rotating body 320, a vertical disk 330, and a guide cover 350.

The fixing jig 310 is fixed to the left side in the drawing of the fixing block 100 through a coupling bolt (not shown), and the front surface facing the body 200 is disposed adjacent to the rear surface of the body 200. .

The supply path 315 for receiving the solder ball B is formed on the plate surface of the fixing jig 310 adjacent to the body 200 as shown in FIGS. 4 and 7.

At this time, the supply path 315 is formed to be inclined at a predetermined angle in the upward direction as shown in Figure 8, the supply path 315 is connected to the connector 317 for receiving the solder ball (B) from the solder ball supply box 360 Connected.

When the supply path 315 is formed to be inclined, as the frictional resistance of the supplied solder ball B is reduced, the supply of the solder ball B is smoothly performed without a catch phenomenon.

On the other hand, the solder ball supply box 360 is coupled to the solder ball injector 700 by a support bracket 316 coupled to the fixed block 100 is spaced apart, it is connected to the supply path by the connector 317.

And, one side of the connecting pipe 317 is coupled to the rear side of the fixing jig 310 through the fastening member 319 to be connected to the supply path 315.

The rotating body 320 is coupled to the rotating shaft 111 of the drive motor 110 to be rotated by the drive of the drive motor 110, it is accommodated in the fixing jig 310 so that the rotation is made stable.

In addition, a coupling protrusion 323 into which the vertical disk 330 is fitted is formed at the center of the rotating body 320.

5 and 6, the vertical disk 330 has a disk shape of a metal material, a coupling hole 333 into which the coupling protrusion 323 of the rotating body 320 is inserted is formed at the center thereof, and the rotating body ( 320 is disposed adjacent to each other between the body 200 and the fixing jig 310 in a state coupled to the 320, the periphery of the vertical disk 330 is formed to be recessed inward along the periphery so that the solder ball (B) is seated A plurality of seating grooves 331 are formed.

In this case, a plurality of magnets 340 are provided between the vertical disk 330 and the rotating body 320 so that the vertical disk 330 is coupled to and separated from the rotating body 320. The insertion groove 321 into which the plurality of magnets 340 are inserted is formed at 320.

In this case, the vertical disk 330, the coupling hole 333 is fitted to the engaging projection 323 of the rotating body 320, the plate surface is attached to the plurality of magnets 340 to achieve a stable coupling state. .

If the separation of the vertical disk 330 is required, the separation is performed only by releasing the contact with the magnet 340, so that the replacement and maintenance of the vertical disk 330 is easy.

In addition, disposing the vertical disk 330 adjacent to one surface of the body 200 minimizes the moving distance of the solder ball B introduced into the body 200 through the vertical disk 330 as shown in FIG. 8. By doing so, the solder ball (B) is to be introduced into the nozzle unit 400 through the inlet duct 213 quickly.

In this embodiment, the coupling and separation of the vertical disk 330 and the rotating body 320 is shown as being implemented through the magnet 340, but the structure is not necessarily limited as it can be implemented through a variety of structures.

5 and 6, the guide cover 350 is disposed on the front surface of the fixing jig 310 (left side in the drawing of the fixing jig) in a state in which the vertical disc 330 is accommodated in a plate-shaped quadrangle and is vertical. While the solder ball (B) is seated in at least one seating groove (331) of the mold disk 330 is discharged of the seated solder ball (B).

In other words, the guide cover 350 accommodates the vertical disc 330 so that the periphery of the vertical disc 330 can be covered to prevent separation of the solder ball B accommodated in the seating groove 331, and a plurality of The solder ball (B) is allowed to be seated in the state in which the mounting groove 331 is exposed.

To this end, the guide cover 350, the receiving hole 351 for receiving the vertical disk 330 is formed, the upper side of the receiving hole 351 is supplied through the supply path 315 of the fixing jig 310 An expansion accommodating portion 353 is formed to expose the plurality of mounting grooves 331 of the vertical disc 330 while accommodating the plurality of solder balls B.

In addition, an induction path 355 having a predetermined inclination for guiding the solder ball B seated in the seating groove 331 to the input pipe 213 of the body 200 is formed below the accommodation hole 351. .

At this time, the diameter of the receiving hole 351 is preferably to have a size slightly larger than the diameter of the vertical disk 330, which is when the diameter of the receiving hole 351 is too large the receiving hole 351 and the vertical disk This is because the solder ball B may be pinched by the circumferential gap of 330.

The expansion accommodating part 353 has a predetermined area to accommodate the solder ball B supplied as shown in FIG. 5, and the seating grooves 331 of the vertical disc 330 accommodated in the accommodating hole 351 may be exposed. It is made of a space in communication with the receiving hole 351 so that.

When the empty mounting grooves 331 of the vertical disk 330 are exposed to the expansion receiving portion 353, the plurality of solder balls B waiting in the state accommodated in the expansion receiving portion 353 are seated in the mounting groove 331. As a result, the solder ball B may be quickly settled, and even though the solder ball B is not seated at the same time, the solder ball B may be seated in the process of passing through the expansion receiving portion 353. It will prevent the settling in advance.

In addition, the induction path 355 is inclined to coincide with the inlet of the input pipe 213 so that the solder ball B of the seating groove 331 may directly enter the input pipe 213.

In this embodiment, the expansion receiving portion 353 is shown as being formed in a streamline having a curved surface, but the size and shape is not limited.

Meanwhile, at least one guide protrusion 311 is formed on one of the plate surfaces facing the guide cover 350 and the fixing jig 310 so that the guide cover 350 may be disposed on the front surface of the fixing jig 310. On the other plate surface, a guide hole 357 into which the guide protrusion 311 is fitted is formed.

In this case, as the coupling and separation of the guide cover 350 disposed in the fixing jig 310 becomes easier, the replacement of the guide cover 350 together with the vertical disc 330 accommodated in the receiving hole 351 is easy. Will be done.

The reason why the vertical disc 330 and the guide cover 350 should be replaced together is that the mounting groove of the vertical disc 330 is changed according to the size of the solder ball B when the size of the solder ball B is supplied. Since the width of the 331 also varies, the guide cover 350 must also be replaced according to the size of the vertical disk 330 to be changed.

In the present exemplary embodiment, two guide protrusions 311 are formed in the fixing jig 310, and two guide holes 357 corresponding to the guide cover 350 are formed, but the guide protrusions 311 and the guides are formed. The position and coupling structure of the ball 357 are not necessarily limited.

In addition, the guide cover 350 is configured to be disposed in the front of the recessed jig 310, but may be disposed directly in the front of the jig 310 does not limit the placement position.

On the other hand, between the guide cover 350, the body 200 and the fixing jig 310 is preferably provided with an O-ring (O) for maintaining airtightness.

The nozzle unit 400 jets the solder ball B melted therein by the laser oscillator 500 in a state coupled to the lower side of the body 200 so that the solder ball fusion process of the substrate is performed.

6 and 7, the nozzle unit 400 includes a nozzle adapter 410, a nozzle 420, and a nozzle holder 450.

The nozzle adapter 410 has a cylindrical shape and has a communication hole 411 formed therein so as to communicate with the inner space 211 at the lower side of the body 200, and has a nozzle at a lower portion of the drawing of the communication hole 411. A stepped portion 412 having a predetermined length is formed to allow the 420 to be inserted therein.

At this time, the nozzle adapter 410 is spirally coupled to the body 200 by applying an O-ring (O) for maintaining airtightness.

The nozzle 420 is inserted into the stepped portion 412 in communication with the communication hole 411 of the nozzle adapter 410, and the lower end of the nozzle 420 has a diameter of the solder ball B at the distal end of the nozzle 420. The taper surface is inclined so that the supplied solder ball B may be maintained while maintaining a smaller diameter.

The nozzle holder 450 is formed in a cup shape to accommodate the lower side of the nozzle adapter 410, and the nozzle 420 is helically coupled to the lower side of the nozzle adapter 410 while the nozzle 420 is penetrated to the center. Press the tapered surface of the lower outer surface.

To this end, a pressing hole 451 is formed at the center of the lower surface of the nozzle holder 450 while the nozzle 420 penetrates and the inner surface thereof has an inclination corresponding to the tapered surface of the nozzle 420.

Further, the knurling 452 is formed on the outer circumference of the nozzle holder 450 to provide easy grip.

The nozzle unit 400 is supported by the pressing force of the pressing hole 451 through the coupling of the nozzle holder 450 in a state where the nozzle 420 is inserted into the stepped portion 412 of the nozzle adapter 410, On the contrary, the nozzle 420 may be separated by releasing the pressing force by the separation of the nozzle holder 450 to facilitate the maintenance of the nozzle 420.

On the other hand, the pressure providing fitting 600 is coupled to the fixing jig 310 of the solder ball input unit 300, and gives a gas pressure when the solder ball (B) is introduced into the input pipe 213 of the body 200.

To this end, the pressure providing fitting 600 is coupled to the fixing jig 310 through the lower portion of the fixing jig 310 as shown in FIG. 7.

At this time, the fixing jig 310 is pressure so that the pressure supplied from the combined pressure providing fitting 600 can be applied to the solder ball (B) accommodated in the seating groove 331, that is, the seating groove 331 of the vertical disk (330) Supply pipe 313 is formed.

The pressure supply passage 313 is formed in the fixing jig 310 at a position corresponding to the position of the seating groove 331 of the vertical disc 330.

That is, the pressure supply passage 313 is to be formed in the rear (the opposite direction of the body) of the vertical disk 330.

Therefore, since the pressure providing fitting 600 constantly applies pressure to the pressure supply line 313, the mounting groove 331 of the vertical disc 330 is located at the front of the pressure supply line 313. The solder ball B of 331 is strongly pushed into the input pipe 213 of the body 200 to be introduced into the internal space 211.

In the present embodiment, the gas supplied (injected) through the pressure providing fitting 600 is nitrogen gas.

The pressure providing fitting 600 also introduces the solder ball B into the input pipe 213 using nitrogen gas, but also serves to continuously supply nitrogen gas to the internal space 211 of the body 200. It is.

On the other hand, the body 200 is further provided with a detection sensor 220 for sensing the correct position of the mounting disc 330, the vertical disk 330.

The detection sensor 220 is preferably installed in the body 200 in a line corresponding to the mounting groove 331 of the vertical disk 330, which is the mounting groove 331 during the initial driving of the solder ball jetting unit 800 This is to detect when the position of is not set to the correct position to receive the solder ball (B).

The detection sensor 220 is connected to a separate control device, and the control device recognizes a signal from the detection sensor 220 and controls the rotation of the driving motor 110 to position the seating groove 331 in the correct position.

At this time, the sensor 220 is not limited to the various types of sensors can be applied as a matter of course.

In addition, the body 200 is preferably provided with a gas filling fitting 230 to fill the nitrogen gas in accordance with the pressure change of the internal space 211.

This is because when the solder ball B spreading over the nozzle part 400 is jetted with a paste of a substrate (unsigned) in a molten state by the laser oscillator 500, the nozzle part 400 is opened at the same time as jetting and instantaneously. This is because the pressure of the inner space 211 drops.

When the pressure change in the internal space 211 of the body 200 occurs, since the gas filling fitting 230 is connected to the differential pressure sensor 1213, the nitrogen gas dropped to the internal space 211 by the control of the control device. Will be filled.

Hereinafter, the process of the solder ball (B) is introduced through the solder ball injector according to the present invention with the accompanying drawings as follows.

First, the exact position setting of the mounting groove 331 of the vertical disc 330 is completed using the detection sensor 220.

When the setting is completed, the solder ball jetting unit 800 is driven to supply the solder balls B from the solder ball supply box 360.

The solder balls B are supplied to the expansion receiving portion 353 through the supply path 315 of the fixing jig 310 and are loaded into the expansion receiving portion 353 as shown in FIG. 5.

At this time, the vertical disk 330 is rotated by the drive motor 110 to expose the empty seating groove 331 to the expansion receiving portion 353 sequentially.

Each of the exposed mounting grooves 331 has solder balls B loaded on the expansion receiving portion 353.

In this embodiment, the vertical disk 330 is shown to rotate in the right direction on the drawing.

Then, the solder balls (B) of the seating groove 331 is moved in a state that can not be separated to the outside by the receiving hole 351 of the guide cover 350 in accordance with the rotation of the vertical disk (330).

When the solder ball B is positioned on the induction path 355 as shown in FIG. 5, the solder ball B is introduced into the input pipe 213 of the body 200 as shown in FIG. 7 by the gas pressure applied from the pressure supply pipe.

The solder ball B introduced into the input pipe 213 flows into the nozzle 420 through the internal space 211 of the body 200 and is spread over the lower end of the nozzle 420, and then the laser of the laser oscillator 500. Melted by beam irradiation, jetted into the paste of the substrate.

Input of the solder ball (B) as described above is made continuously by the rotation of the vertical disk (330).

As described so far, the solder ball injector of the solder ball jetting part 800 of the present invention, the solder ball is not supplied through the supply path as in the prior art, but is directly supplied to the expansion receiving portion by blocking the phenomenon that the solder ball is inherently blocked. In addition, the plurality of seating grooves of the vertical disk are exposed in the expansion receiving part so that the solder balls are seated in the exposed seating grooves, thereby preventing the dropping of the solder balls jetted onto the substrate during the solder ball fusion process of the board. .

In addition, by forming a structure in which the nozzle is coupled through the nozzle holder, the wear of the body coupling portion as in the prior art is fundamentally prevented, and the replacement of the nozzle is made easily, and the structural effect of ensuring complete tightening of the nozzle is also excellent.

Hereinafter, the control of the solder ball jetting unit 800 of the solder ball jetting system 1000 according to an embodiment of the present invention will be described in detail with reference to FIGS. 9 and 10.

9 is a flowchart illustrating a control method of a solder ball jetting unit according to another embodiment of the present invention. 10A to 10C are diagrams for describing a state corresponding to the step of FIG. 9 of the present invention.

First, the solder ball B is loaded into the opening of the nozzle unit 400 from the state S100.

When the loading of the solder ball B in the opening of the nozzle unit 400 is completed (step S100, see FIG. 10A), the pressure is detected by the differential pressure sensor 1213 while the inner space 211 is sealed by the solder ball B. do. At this time, when the pressure detection signal by the differential pressure sensor 1213 is transmitted to the control unit 130, the control unit 130 applies a control signal to the laser drive unit 120 to generate a laser having energy above the melting temperature of the solder ball (B). The solder ball (B) is irradiated. In addition, a control signal is applied to the air pressure adjusting unit 140 to increase the pressure flowing into the internal space 211.

In this case, the solder ball B is partially or entirely melted by the laser to be discharged through the opening of the nozzle unit 400, and the post-heat treatment is performed for a predetermined time while the laser is continuously irradiated after the discharge. (Step S200, see FIG. 10B)

When the predetermined time elapses, the post heat treatment is stopped and the moving means and the vertical disc 300 are simultaneously controlled. (Step S200, see FIG. 10C)

In the case of the present invention, the plate-shaped guide cover 350 having the expansion receiving portion 535 and the receiving hole (B) is disposed on the front of the fixing jig 310 in a state of receiving the vertical disk 300, Since the vertical disk 300 is attached to the rotating body 320 by a plurality of magnets, it is a stable structure that can stably receive the solder balls even if the movement and rotation are simultaneously controlled as described above. Solder ball (B) is sandwiched between the structure, such as the mold disk 300 and the guide cover 350 or the fixing jig 310, the work material is significantly reduced.

Therefore, in the existing structure, it was very difficult to simultaneously control the movement and rotation, but in the case of the present invention it is possible to perform the movement and rotation of the solder ball jetting unit 800 at the same time while receiving the solder ball (B) stably. Therefore, compared to the conventional solder ball jetting system which controls the movement and rotation separately, the tact time is significantly reduced. In particular, in the experiment performed by the inventor of the present invention, the tact time increased more than twice as compared to the conventional control method.

Meanwhile, hereinafter, a method of processing the residue of the solder ball B remaining in the opening of the nozzle part 400 by the solder ball jetting part 800 according to the embodiment of the present invention will be described in detail with reference to FIGS. 11A and 11B. Explain.

11A through 11B are flowcharts illustrating a solder ball jetting unit according to an exemplary embodiment of the present invention.

Referring to FIG. 11A, a pressure providing unit 1210 including an air pressure regulating device 211, an air pipe 212, and a differential pressure sensor 1213 is disposed at a side of the body 200. Thus, the solder ball jetting unit according to another embodiment of the present invention may check the residue in the opening of the nozzle unit 400 by disposing the pressure providing unit 1210 on the side of the body 200.

In detail, when the micro pressure is detected by the differential pressure sensor 1213, at least part of the solder ball B or the solder ball B, that is, the residue on the solder ball B, remains in the opening of the nozzle unit 400. As determined, the air pressure regulating device 211 may be operated to transfer air introduced from the outside through the air pipe 212 to the body 200. For example, when the residue of the solder ball B is left in the opening of the nozzle unit 400, the pressure of the nozzle unit 400 may be increased by about 10 times or more by the air pressure regulating device 211.

In addition, the solder ball jetting unit 800 according to another embodiment of the present disclosure may additionally provide a notification sound when the solder ball B for the object 850 is not loaded but a pressure abnormality occurs. Thus, the user can know that the solder ball (B) is not loaded in the nozzle unit 400 through the notification sound.

Therefore, the solder ball jetting unit according to another embodiment of the present invention connects the pressure providing unit 1210 to the body 200 of the solder ball jetting unit 800 to determine whether the nozzle unit 400 is clogged quickly and accurately. Can be.

Therefore, the solder ball jetting system 1000 according to the embodiment of the present invention can significantly improve the work speed by significantly shortening the tact time compared to the conventional solder ball jetting system.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: fixed block 110: drive motor
111: axis of rotation 200: body
211: internal space 213: input pipe
215: sight window 220: detection sensor
230: gas filling fitting 300: solder ball injection unit
310: fixing jig 311: guide projection
313: pressure supply line 315: supply line
317: connector 319: fastening member
320: rotating body 321: insertion groove
323: engaging projection 330: vertical disk
331: mounting groove 333: coupling hole
340: magnet 350: guide cover
351: accommodation hole 353: expansion housing
355: Yudo-ro 357: guide ball
360: solder ball supply box 400: nozzle
410: nozzle adapter 411: communication hole
412: step 420: nozzle
450: nozzle holder 451: pressure hole
452 knurling 500 laser oscillator
510: moving means 511: horizontal moving block
513: lifting block 515: micrometer
600: pressure supply fitting 700: solder ball feeder
800: solder ball jetting unit 850: the object
860: printed circuit board B: solder ball
O: O-ring

Claims (10)

A solder ball jetting unit including a fixed block including a driving motor, a solder ball input for supplying and jetting solder balls, a laser oscillator for melting the solder balls, and a pressure providing fitting;
Soldering position control unit for controlling the moving means for moving the solder ball jetting unit;
A disk driver for driving the driving motor connected to the vertical disk accommodated in the solder ball inserter of the solder ball jetting part; And
A control unit for controlling the soldering position control unit and the disk drive unit,
The solder ball injector,
A body having an inner space formed to be inclined toward the lower side to penetrate the laser beam therein, and an input pipe communicating with the inner space so that the solder balls can be introduced into the inner space;
A solder ball input unit adjacent to the body and individually inserting solder balls into the input pipe of the body through rotation of a vertical disk connected to a rotation shaft of the driving motor in a state where a plurality of solder balls are accommodated; And
Is coupled to the lower side of the body, comprising a nozzle unit for jetting the molten solder ball by a laser oscillator,
The control unit controls the disk drive unit and the soldering position control unit to move the solder ball jetting unit, characterized in that the vertical disk rotates at the same time, the solder ball jetting system. The method of claim 1,
The solder ball jetting unit may further include a differential pressure sensor for measuring a pressure in the internal space, and the control unit is configured to irradiate the solder ball with a laser having energy capable of melting the solder ball when the differential pressure sensor senses a pressure. And controlling the driving unit to control the pressure-providing fitting to raise the pressure in the inner space so that the solder balls are discharged. The method of claim 2,
The controller controls the laser beam to be irradiated to the solder ball for a predetermined time after the solder ball is discharged, and controls the disk drive unit and the soldering position control unit after the predetermined time passes and moves the solder ball jetting unit to the vertical type. Solder ball jetting system, characterized in that the disk to rotate at the same time. The method of claim 1,
The solder ball injection unit is
A fixing jig fixed to the fixing block in a state adjacent to the body and having a supply path for receiving a solder ball thereon;
A rotating body accommodated in the fixing jig while being coupled to the rotating shaft of the driving motor;
A vertical disc disposed between the body and the fixing jig in a state of being coupled with the rotating body, and having a plurality of seating grooves formed around the solder ball; And
And a guide cover disposed on the fixing jig while accommodating the vertical disc and discharging the seated solder ball while seating the solder ball in at least one seating groove of the vertical disc. Solder Ball Jetting System. The method of claim 4, wherein
The guide cover has a receiving hole for accommodating the vertical disk, and an upper side of the receiving hole is formed with an expansion receiving portion for exposing at least one seating groove while accommodating a plurality of solder balls through a supply path, and a seating recess at a lower side. The solder ball jetting system, characterized in that the induction path having a predetermined inclination for guiding the solder ball seated on the inlet pipe of the body is formed. The method of claim 4, wherein
The supply path is formed to be inclined in an upward direction, characterized in that the supply pipe is connected to the connector for receiving the solder ball from the solder ball supply box, the solder ball jetting system. The method of claim 4, wherein
O-ring is further provided between the guide cover, the body and the fixing jig, the solder ball jetting system. The method of claim 1, wherein the nozzle unit,
A nozzle adapter having a communication hole formed at an inner side thereof so as to communicate with the inner space under the body, and having a stepped portion at a lower portion of the communication hole;
A nozzle inserted into the stepped portion of the communication hole; And
And a nozzle holder helically coupled to the nozzle adapter while penetrating the nozzle to press the tapered surface of the nozzle. The method of claim 8,
The center of the lower surface of the nozzle holder is formed with a pressing hole having an inclined inner surface through which the nozzle corresponds to the tapered surface of the nozzle, and a knurling formed on the outer periphery of the nozzle holder, solder ball jetting system. A solder ball jetting unit including a fixed block including a driving motor, a solder ball input for supplying and jetting solder balls, a laser oscillator for melting the solder balls, and a pressure providing fitting; Soldering position control unit for controlling the moving means for moving the solder ball jetting unit; A disk driver for driving the driving motor connected to the vertical disk accommodated in the solder ball inserter of the solder ball jetting part; And a control unit controlling the soldering position control unit and the disk drive unit.
Loading the solder ball onto the nozzle unit;
Discharging the loaded solder ball and irradiating a laser to the discharged solder ball for a predetermined time; And
And controlling the disk drive unit and the soldering position control unit to simultaneously rotate the vertical disc while the solder ball jetting unit moves.
The solder ball injector may include a body having an inner space formed to be inclined toward the lower side so that the laser beam penetrates therein, and an inlet pipe communicating with the inner space to allow the solder ball to be introduced into the inner space; A solder ball input unit adjacent to the body and individually inserting solder balls into the input pipe of the body through rotation of a vertical disk connected to a rotation shaft of the driving motor in a state where a plurality of solder balls are accommodated; And a nozzle unit coupled to the lower side of the body and jetting the molten solder ball by a laser oscillator.

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