LU500710B1 - Laser-assisted soldering apparatus; and solder deposition machine - Google Patents
Laser-assisted soldering apparatus; and solder deposition machine Download PDFInfo
- Publication number
- LU500710B1 LU500710B1 LU500710A LU500710A LU500710B1 LU 500710 B1 LU500710 B1 LU 500710B1 LU 500710 A LU500710 A LU 500710A LU 500710 A LU500710 A LU 500710A LU 500710 B1 LU500710 B1 LU 500710B1
- Authority
- LU
- Luxembourg
- Prior art keywords
- solder
- housing
- solder body
- reservoir
- capillary
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
Abstract
The invention relates to a laser-assisted soldering apparatus (1) comprising a reservoir (2) configured to hold a plurality of solder bodies (3), a solder body holding capillary (4) distanced from the reservoir (2) and configured to hold a solid solder body (3) until it gets liquefied by a laser beam (5), and singulation means (6) configured to transfer single solder bodies (3) from the reservoir (2) towards the solder body holding capillary (4), wherein the singulation means (6) comprises a transport element (7) with at least one receiving hole (8) and wherein the at least one receiving hole (8) is configured to receive a solder body (3) to transport same from the reservoir (2) towards the solder body holding capillary (4) along a predetermined movement path (9), wherein an optical sensor (10) is provided along the movement path (9) between the reservoir (2) and the solder body holding capillary (4) configured to detect the presence of a solder body (3) inside the at least one receiving hole (8). Furthermore, the invention relates to a solder deposition machine (20) comprising the laser-assisted soldering apparatus (1).
Description
PT2503P-LU-0021 1
LU500710
Laser-assisted soldering apparatus; and solder deposition machine
The present invention relates to a laser-assisted soldering apparatus for liquefying a solder body and applying the liquefied solder body onto an electronic component. Furthermore, the invention relates to a solder deposition machine.
Apparatus for applying solder bodies, i.e. solder balls, are well known from the prior art. In this context, reference is made, for example, to US 10,286,470 B2. This document discloses an apparatus for the separate application of solder material deposits. In such an apparatus, a capillary is usually filled with individual solder balls, and the solder balls are melted from there and applied individually to the corresponding electronic component to be manufactured. A conveying device transports the solder balls to the capillary.
However, it has shown that when removing the individual solder body from a reservoir holding a plurality of solder bodies by individual receiving portions of the conveying device, it is not 100% certain that a solder body has actually arrived in the receiving portions. Consequently, some receiving portions remain empty. This results in corresponding delays during filling of the capillary.
It is therefore an object of the present invention to accelerate a soldering process during operation of the laser-assisted soldering apparatus.
This object is solved by the laser coupling unit according to independent claim 1. Preferred embodiments are subject of the dependent claims.
According to the invention the object is solved by the subject matter of claim 1 claiming a laser-assisted soldering apparatus comprising a reservoir configured to hold a plurality of solder bodies, a solder body holding capillary distanced from the reservoir and configured to hold a solid solder body until it gets liquefied by a laser beam, and singulation means configured to transfer single solder bodies from the reservoir towards the solder body holding capillary, wherein the singulation means comprises a transport element with at least one receiving hole and wherein the at
PT2503P-LU-0021 2
LU500710 least one receiving hole is configured to receive a solder body to transport same from the reservoir towards the solder body holding capillary along a predetermined movement path, wherein an optical sensor is provided along the movement path between the reservoir and the solder body holding capillary configured to detect the presence of a solder body inside the at least one receiving hole.
Consequently, by the optical sensor an optical detection, which detects the loading condition of a receiving portion by reflection, is provided between the reservoir and a discharge opening being connected with the solder body holding capillary. As a result, the average separation speed of the solder bodies is increased.
Due to the optical predetection, empty receiving portions can simply be skipped or quickly removed towards the reservoir and the whole soldering process is accelerated.
According to an aspect of the present invention, the optical sensor is mounted on a housing of the apparatus and is configured to emit a light beam to the transport element through an optical passage of the housing, which opens to the predetermined movement path. Thus, the optical sensor monitors a portion of the transport element along the movement path through the optical passage of the housing. This allows the measuring range of the optical sensor to be focused as precisely as possible on the receiving hole.
According to a further aspect of the present invention, the optical sensor is mounted on an outer side of a housing of the apparatus. This allows an easy assembly and maintenance of the optical sensor.
According to another aspect of the present invention the solder body holding capillary penetrates a housing of the apparatus by forming a first opening as laser beam entry at a first side of the housing and a second opening as solder material outlet at a second side of the housing opposite to the first side, and wherein the optical sensor is arranged on the first side of the housing laterally displaced relative to the first opening. This allows a place saving fixation of the optical sensor.
PT2503P-LU-0021 3
LU500710
According to an aspect of the present invention, the transport element is provided as a disk rotatably supported in the housing. Preferably the receiving holes are arranged along a circumferential direction of the disk (preferably at a common diameter). This allows a fast and continuous conveying of the solder bodies.
According to an aspect of the present invention, the transport element is provided as a plate translatory displaceable supported in the housing. Therewith a compact design is achieved.
According to an aspect of the present invention, the transport element comprises a plurality of receiving holes each configured for receiving one solder body and arranged (distanced from each other) along the movement path. This further increases the speed of solder application.
Furthermore, the invention relates to a solder deposition machine comprising a laser-assisted soldering apparatus according to any of the preceding aspects and comprising a laser generating device arranged and configured for producing a laser beam for beaming inside the solder body holding capillary.
In the following, preferred embodiments of the present invention are described with reference to following drawings:
Fig. 1 shows a schematic sectional view of a laser-assisted soldering apparatus, wherein singulation means interacting with an optical sensor according to a preferred embodiment of the invention can be seen in detail,
Fig. 2 shows a perspective view of the laser-assisted soldering apparatus according to fig. 1.
The figures are merely schematic in nature and are intended solely for the purpose of understanding the invention. For example, it is noted that in fig. 1 several “passages” are shown, for the sake of simplicity, as lying in a same cross-sectional plane of the laser-assisted soldering apparatus, while such “passages” actually may lie in different cross-sectional planes of the laser-assisted soldering apparatus. For
PT2503P-LU-0021 4
LU500710 example, the movement path 9 is shown as lying the drawing plane, although it extends curved-shaped into the drawing plane.
With Fig. 1 a laser-assisted soldering apparatus 1, hereinafter abbreviated as apparatus 1, for soldering an electronic component 17, like a circuit board, is shown.
The apparatus 1 is constructed as machine / bond head to be supported at a robot arm. The electronic component 17 preferably represents a through-hole device in which a pin gets fixed via a soldering. Such apparatus is, in principle, known from US 10,826,470 B2. Therefore, the preferred field of application of the apparatus 1 is a solder deposition machine 20, as is as simplified indicated.
The solder deposition machine 20 includes among others a laser generating device 19 configured to produce a laser beam 5. Furthermore the solder deposition machine 20 includes a robotic system for moving the apparatus 1 and controlling the laser beam 5 produced by the laser generating device 19 during operation.
In figure 1, also the electronic component 17 to be applied with the soldering is visible. This electronic component 17 preferably represents a through-hole device in which a pin gets fixed via the soldering.
As can further be seen from figure 1, the apparatus 1 works for soldering the electronic component 17 by using a solder body 3, like in the form of a solder ball, and also referred to as preform. This solder body 3 is liquefied and jetted by using a solder jetting section 18 of the apparatus 1. For this reason the solder jetting section 18 comprises a solder body holding capillary 4, hereinafter abbreviated as capillary 4.
This capillary 4 has a main passage 21 extending (preferably) straight through a housing 11 of the apparatus 1.
As can also be seen in figure 2, the housing 11 has an essential plate like design and therefore extends essentially flat along an imaginary extension plane 22 having a first side 14 (upper side) and an opposed second side 16 (lower side). The capillary 4 penetrates the housing 9 essentially perpendicular to the extension plane 22. The capillary 4, as can be seen in fig. 1, has a first opening 13 as laser beam
PT2503P-LU-0021
LU500710 entry at the first side 14 and a second opening 15 as solder material outlet at the second side 16.
As can further be seen in figure 1, the capillary 4 tapers / rejuvenates towards its second opening 15 at the side of the component 17. For this purpose, the capillary 4 is provided with a jetting nozzle 23 directly forming the second opening 15. This jetting nozzle 23 directly forms a passage / hole that tapers / rejuvenates towards the second opening 15. The jetting nozzle 23 is attached to the housing 9. In that way the diameter of the opening 26 of the capillary 4 is smaller than a (minimal) diameter of the solid solder body 3 which is used to produce a liquefied solder body. As a result, the solid solder body 3 is held at a position where the diameter of the capillary 4 corresponds to the diameter of the solid solder body 3. The diameter of a solid solder body 3 in the form of a ball can be in the range from 30 um to 2000 um.
In order to jet the liquefied solder body towards the spot on the component 17 to be soldered pressure gas is applied to the capillary 4 by a pressure gas arrangement (not shown). Preferably an inert gas, like nitrogen (Nz), is used for this purpose.
Furthermore, the solder jetting section 18 interacts with the laser beam 5 that is generated in the usual way by the laser generating device 19. The laser beam 5 is supplied to the solid solder body 3 in order to produce a liquefied solder body. When the solid solder body 3 is liquefied, the liquefied solder body becomes deformed such that it can exit the capillary 4 and is jetted out of the capillary 4 towards the component 17, due to the pressure inside the capillary 4.
In order to control and move the capillary 4 and to control the laser beam 5, i.e. the power and duration of the laser beam 5, and the pressure gas arrangement 25, the apparatus 1 / the solder deposition machine 20 comprises control and drive means (not shown). The control means are implemented by a computer including a
CPU, a memory as well as input/output means. The memory may store a control program that is executed by the CPU. The drive means are implemented by electromechanical drives for driving the capillary 4 and other means of the apparatus 1, e.g. holding means (not shown) for holding the electronic component 17.
PT2503P-LU-0021 6
LU500710
As can further seen in figure 1, singulation means 6 are provided for singulation of a plurality of solder bodies 3 stored in a reservoir 2. The singulation means 6 comprises a transport element 7. The transport element 7 is a disk that can be rotated about its central axis. The disk is arranged parallel to the extension plane 22.
According to further embodiments according to the invention the transport element 7 can also be movable transversely / translator (perpendicular to the capillary 4). The transport element 14 is then provided as a sliding plate translatory slidable received inside the housing 11.
Furthermore, figure 1 shows that the reservoir 2 is distanced from the capillary 4 and the transport element 7 works to remove single solder bodies 3 from the reservoir 2 and transport them individually towards the capillary 4 / a discharge opening 24 being connected with the capillary 4. In further embodiments according to the invention, this discharge opening 24 can also be a further channel being connected with the capillary 4 with one end and opens towards the transport element 7 with the other end at a certain distance to the capillary 4.
As can also be seen, the reservoir 2 is integrated in the housing 11, although it can be provided by a further element being attached to the housing 11, like by a funnel. The reservoir 2 is arranged towards the first side 14 with respect to the transport element 7.
For receiving the single solder bodies 3 the transport element 7 is provided with several receiving holes 8 each arranged and dimensioned for receiving one solder body 3 only. Each receiving hole 8 can be provided as a through-hole of the transport element 7 being limited by the housing 11. Each receiving hole 8 has a dimension according to the dimension of the solder body 3. Thus, the length of the receiving hole 8 (dimension transverse to the extension plane of the housing) as well as the width of the receiving hole 8 (dimension along the extension plane of the housing) are each at least shorter than twice the (maximum) diameter of a solder body 3.
Moreover, it becomes clear from fig. 1 that, when the transport element 7 becomes positioned with one empty receiving hole 8 below the reservoir 2 / an exit opening 25 of the reservoir 2, one solder body 3 falls into the receiving hole 8 on its
PT2503P-LU-0021 7
LU500710 own / by gravity. In this way, the transport element 7 transports one solder body 3 after the other towards the capillary 4. As the receiving holes 8 are arranged along a common diameter / circumferential direction of the transport element 7 (disk), the receiving holes 8 / the solder bodies 3 are moved along a common movement path 9 by moving / rotating the transport element 7. Besides the exit opening 25, of course also the discharge opening 24 is arranged along the movement path 9 so that the solder body 3 falls down into the capillary 4 when reaching the discharge opening 24.
According to the invention, an optical sensor 10 is arranged along the movement path 9 between the reservoir 2 and the capillary 4 for detecting the presence of a solder body 3 inside each receiving hole 8 (for the receiving holes 8 that are moved from the reservoir 2 towards the capillary 4). The optical sensor 10 is attached on the first side 14 of the housing 11, preferably directly on a upper surface of the housing 11. The optical sensor 10 is positioned laterally / along the extension plane 22 displaced from the first opening 13. The optical sensor 10 is coupled with the transport element 7 via a measuring hole 12 that is open towards the optical sensor 10 as well as towards the transport element 7 / the movement path 9 of the receiving holes 8. À measuring field of the optical sensor 10 is oriented into the measuring hole 12 so that it is able to detect the existence of a solder body 3 inside each receiving hole 8 of the transport element 7 depending on a reflected light quantity. It is therefore self-evident that the solder bodies 3 are formed in that way that they reflect a different light quantity as compared to a bottom of the receiving hole 8 (/ as compared to an empty receiving hole 8).
The optical sensor 10 is in turn connected to the control and drive means (not shown) of the laser-assisted soldering apparatus 1 / the solder deposition machine for changing the movement pattern of the transport element 7 depending on the presence of the solder body 3 inside each receiving hole 8.
Furthermore, it can be seen from fig. 1 that the transport element 7 with its receiving holes 8 is provided in that way that an empty receiving hole 8 that is arranged in the main passage 21 / capillary solves as laser passage in the process step of liquefying the solder body 3 inside the capillary 4. However, in further
PT2503P-LU-0021 8
LU500710 embodiments, the transport element 7 can be completely distanced from the capillary 4.
PT2503P-LU-0021 9
LU500710
List of reference signs 1 laser-assisted soldering apparatus 2 reservoir 3 solder body 4 solder body holding capillary laser beam 6 window 7 transport element 8 receiving hole 9 movement path optical sensor 11 housing 12 measuring hole 13 first opening 14 first side second opening 16 second side 17 electronic component 18 solder jetting section 19 laser generating device solder deposition machine 21 main passage 22 extension plane 23 jetting nozzle 24 discharge opening exit opening
Claims (8)
1. Laser-assisted soldering apparatus (1) comprising: a reservoir (2) configured to hold a plurality of solder bodies (3), a solder body holding capillary (4) distanced from the reservoir (2) and configured to hold a solid solder body (3) until it gets liquefied by a laser beam (5), and singulation means (6) configured to transfer single solder bodies (3) from the reservoir (2) towards the solder body holding capillary (4), wherein the singulation means (6) comprises a transport element (7) with at least one receiving hole (8) and wherein the at least one receiving hole (8) is configured to receive a solder body (3) to transport same from the reservoir (2) towards the solder body holding capillary (4) along a predetermined movement path (9), wherein an optical sensor (10) is provided along the movement path (9) between the reservoir (2) and the solder body holding capillary (4) configured to detect the presence of a solder body (3) inside the at least one receiving hole (8).
2. Apparatus (1) according to claim 1, wherein the optical sensor (10) is mounted on a housing (11) of the apparatus (1) and is configured to emit a light beam to the transport element (7) through an optical passage (12) of the housing (11), which opens to the predetermined movement path (9).
3. Apparatus (1) according to claim 1 or 2, wherein the optical sensor (10) is mounted on an outer side (13) of a housing (11) of the apparatus (1).
4. Apparatus (1) according to any of the preceding claims, wherein the solder body holding capillary (4) penetrates a housing (11) of the apparatus (1) by forming a first opening (13) as laser beam entry at a first side (14) of the housing (11) and a second opening (15) as solder material outlet at a second side (16) of the housing (11) opposite to the first side (14), and wherein the optical sensor (10) is arranged on the first side (14) of the housing (11), laterally displaced relative to the first opening (13).
PT2503P-LU-0021 11 LU500710
5. Apparatus (1) according to any of the preceding claims, wherein the transport element (7) is provided as a disk rotatably supported in the housing (11).
6. Apparatus (1) according to any of the preceding claims, wherein the transport element (7) is provided as a plate translatory displaceable supported in the housing (11).
7. Apparatus (1) according to any of the preceding claims, wherein the transport element (7) comprises a plurality of receiving holes (8) arranged along the movement path (9).
8. Solder deposition machine (20) comprising an apparatus (1) according to any of the preceding claims and comprising a laser generating device (19) arranged and configured for producing a laser beam (5) for beaming inside the solder body holding capillary (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LU500710A LU500710B1 (en) | 2021-10-06 | 2021-10-06 | Laser-assisted soldering apparatus; and solder deposition machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LU500710A LU500710B1 (en) | 2021-10-06 | 2021-10-06 | Laser-assisted soldering apparatus; and solder deposition machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU500710B1 true LU500710B1 (en) | 2023-04-06 |
Family
ID=77989961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU500710A LU500710B1 (en) | 2021-10-06 | 2021-10-06 | Laser-assisted soldering apparatus; and solder deposition machine |
Country Status (1)
| Country | Link |
|---|---|
| LU (1) | LU500710B1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080179298A1 (en) * | 2007-01-29 | 2008-07-31 | Tdk Corporation | Method of detecting an object to be detected in a joining device, joining device, and joining method |
| CN202114398U (en) * | 2010-08-24 | 2012-01-18 | 武汉凌云光电科技有限责任公司 | A welding apparatus realizing single output of welding materials |
| CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
| US20160354853A1 (en) * | 2013-12-19 | 2016-12-08 | Pac Tech - Packaging Technologies Gmbh | Device for the separate application of solder material deposits |
| US20170165773A1 (en) * | 2014-07-15 | 2017-06-15 | Pac Tech - Packaging Technologies Gmbh | Device for the separate application of bonding material deposits |
| US10286470B2 (en) | 2013-10-16 | 2019-05-14 | PAC Tech—Packaging Technologies GmbH | Device for the separate application of connecting material deposits |
| US10826470B2 (en) | 2019-03-13 | 2020-11-03 | Omnivision Technologies, Inc. | Integrating ramp circuit with reduced ramp settling time |
-
2021
- 2021-10-06 LU LU500710A patent/LU500710B1/en active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080179298A1 (en) * | 2007-01-29 | 2008-07-31 | Tdk Corporation | Method of detecting an object to be detected in a joining device, joining device, and joining method |
| CN202114398U (en) * | 2010-08-24 | 2012-01-18 | 武汉凌云光电科技有限责任公司 | A welding apparatus realizing single output of welding materials |
| US10286470B2 (en) | 2013-10-16 | 2019-05-14 | PAC Tech—Packaging Technologies GmbH | Device for the separate application of connecting material deposits |
| US20160354853A1 (en) * | 2013-12-19 | 2016-12-08 | Pac Tech - Packaging Technologies Gmbh | Device for the separate application of solder material deposits |
| US20170165773A1 (en) * | 2014-07-15 | 2017-06-15 | Pac Tech - Packaging Technologies Gmbh | Device for the separate application of bonding material deposits |
| CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
| US10826470B2 (en) | 2019-03-13 | 2020-11-03 | Omnivision Technologies, Inc. | Integrating ramp circuit with reduced ramp settling time |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
Effective date: 20230406 |