KR102097489B1 - A Method And Apparatus For Controlling A Solder Ball Jetting Device - Google Patents

Abstract

The present invention relates to a control method of a solder ball jetting device, comprising: a primary preheating step of using a laser to preheat a target arranged below a jetting nozzle unit; a secondary preheating step of preheating the target while a solder ball is loaded on the jetting nozzle unit by a disk driving unit included in a housing unit connected to the jetting nozzle unit; a laser emitting step of emitting a laser to the solder ball after loading of the solder ball on the jetting nozzle unit is completed to melt at least a portion of the solder ball; and a post-heat treatment step of emitting a laser to the target on which the discharged solder ball is placed after the solder ball is discharged from the jetting nozzle unit. Accordingly, the target to be jetted is preheated several times at regular intervals to maintain a constant temperature of the target to improve work efficiency and improve the productivity of a product.

Description

A method and apparatus for controlling a solder ball jetting device

The present invention relates to a method of controlling a solder ball jetting device, and more specifically, to improve the product reliability by effectively dispersing the solder balls on the object to be jetted and effectively bonding the printed circuit board and the object, to a control method of the solder ball jetting device. It is about.

Typical jetting systems include high-viscosity materials such as solder balls, solder pastes, potting compounds, and ink to bond objects on a printed circuit board (PCB). You are using a jetting device that jets the data. In the jetting device, a pneumatic non-contact injection method in which a viscous material is ejected from a nozzle unit while moving the nozzle unit using pneumatic pressure, and a non-contact type of energy using a + -laser as a heat source are applied in a non-contact manner to the solid state loaded in the nozzle unit with thermal energy. Various jetting methods such as a laser jetting method for bonding an object by melting a high-viscosity material are used.

At this time, the laser-jetting method can minimize the loss of peripheral parts due to heat by accurately aiming the solder ball at the work target point and joining the object.

However, the laser jetting device currently being used has a problem in that when the temperature of the object is low, the highly viscous material is not evenly distributed to the object and is jetted in a convex shape in some areas. Accordingly, the point where the joints on the printed circuit board are not flat and remain convex, and problems such as cracks may occur inside the convex, thereby deteriorating product reliability.

In addition, the high-viscosity material has a problem in that the solder ball is deformed by the high energy of the laser in the process of being loaded in the nozzle portion, so that some or all of the solder ball is not discharged from the opening of the nozzle portion, and may remain as a residue.

Therefore, there is a technical need, such as maintaining the object to be jetted at an appropriate temperature and removing the residue of the nozzle portion.

[Related technical documents]

Solder ball bonding device and solder ball bonding method (Japanese Patent Publication No. 2002-25025)

The problem to be solved by the present invention is to provide a control method of a solder ball jetting apparatus that improves the reliability of a product by maintaining an object at an appropriate temperature so that the solder balls are evenly distributed on the object to be jetted.

Another problem to be solved by the present invention is to provide a solder ball jetting control method capable of effectively preventing clogging of the nozzle part by automatically determining whether the nozzle part is clogged by disposing a low pressure detection sensor and automatically discharging the residue at high pressure. .

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the problems as described above, a control method of a solder ball jetting apparatus according to an embodiment of the present invention includes a primary preheating step of preheating an object disposed under a jetting nozzle unit using a laser; A secondary preheating step of preheating the object while the solder ball is loaded into the jetting nozzle portion by the solder ball disk included in the housing portion connected to the jetting nozzle portion; A laser irradiation step of melting at least a portion of the solder ball by irradiating a laser to the solder ball after the loading of the solder ball is completed in the jetting nozzle portion; And a post-heat treatment step of irradiating the laser to the object on which the discharged solder ball is placed, after the solder ball is discharged from the jetting nozzle unit. Accordingly, the object to be jetted may be preheated several times at regular intervals to maintain the temperature of the object constant, thereby improving work efficiency and improving product productivity.

According to another feature of the present invention, the second preheating step may irradiate a laser having an intensity lower than the intensity of the laser irradiated during the first preheating step so that the solder balls injected into the jetting nozzle unit do not melt after the first preheating step.

According to another feature of the invention, in the first preheating step, the laser is irradiated with energy that can melt the solder ball, and in the second preheating step, the laser can be irradiated with energy that does not melt the solder ball.

According to another feature of the invention, it may further include the step of determining whether the solder ball is loaded through the micro-pressure detection sensor.

According to another feature of the present invention, when the solder ball in the jetting nozzle portion is detected by the low pressure detection sensor, the pressure of the jetting nozzle portion may be further adjusted to discharge the solder ball.

According to another feature of the present invention, when the solder ball is not loaded for the object, and the pressure abnormality occurs, the method may further include providing a notification sound.

Solder ball jetting apparatus according to another embodiment of the present invention to solve the problems as described above is a jetting (Jetting) nozzle unit for receiving the solder ball in the opening and discharged on the object; A disk driving unit for driving the solder ball disk rotating to load the solder ball onto the jetting nozzle unit; A solder ball disc and a jetting nozzle, which is airtightly connected, and includes a lens; A laser driver arranged to irradiate the opening through the lens; When the solder ball is loaded on the jetting nozzle portion, the air pressure adjusting portion pressurizes the solder ball to be discharged from the jetting nozzle portion; And a control unit for controlling the disk driving unit and the laser driving unit, wherein the control unit first preheats the object disposed under the jetting nozzle unit before loading the solder ball into the opening, while the solder ball is being loaded from the solder ball disk into the opening of the jetting nozzle unit. Subjects are preheated secondary.

Accordingly, by loading the solder ball conveyed through the connection portion from the solder ball disk accommodating the solder ball in the groove provided in the outer circumferential portion into the opening of the nozzle portion, effective jetting can be performed by discharging a certain amount of high-viscosity material to the object.

According to another feature of the invention, the solder ball may be loaded into the opening of the jetting nozzle portion as the solder ball disk rotates.

According to another feature of the present invention, the laser driving unit may irradiate a laser having an intensity lower than that of the laser irradiated during primary preheating so that the solder balls do not melt during secondary preheating.

According to another feature of the invention, the laser driving unit may irradiate the laser with energy that can melt the solder ball during primary preheating, and irradiate the laser with energy that does not melt the solder ball during secondary preheating.

According to another feature of the invention, it may further include a pressure detection sensor for determining whether a plurality of solder balls are loaded.

According to another feature of the invention, when the loading of the solder ball is detected by the low pressure detection sensor, it may further include an air pressure adjusting unit for adjusting the pressure of the jetting nozzle unit to discharge the solder ball.

According to another feature of the present invention, when the solder ball is discharged to the object, the laser driving unit may heat-treat the object on which the discharged solder ball is placed.

According to another feature of the present invention, when the solder ball to the object is not loaded, an alarm providing unit that provides a notification sound when a pressure abnormality occurs may be further included.

Specific details of other embodiments are included in the detailed description and drawings.

The present invention has an effect of improving work efficiency and improving product reliability at the same time by preheating the object to be jetted to the point at which the solder ball is loaded into the opening of the jetting nozzle portion to keep the temperature of the object constant.

The present invention has an effect capable of effectively preventing clogging of the nozzle portion by automatically determining whether the nozzle portion is clogged and discharging the pressure.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a schematic diagram of a solder ball jetting device according to an embodiment of the present invention.
2 is a flowchart illustrating a solder ball jetting method according to an embodiment of the present invention.
3 is a schematic diagram of a solder ball discharge unit according to an embodiment of the present invention.
4A to 4D are views illustrating a solder ball jetting method according to an embodiment of the present invention.
5 is a view for explaining a control process of the solder ball jetting method according to an embodiment of the present invention.
6 is a view for explaining the effect on the solder ball jetting method according to an embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the present embodiments allow the disclosure of the present invention to be complete, and the ordinary knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for describing the embodiments of the present invention are exemplary and the present invention is not limited to the illustrated matters. In addition, in the description of the present invention, when it is determined that detailed descriptions of related known technologies may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. When 'include', 'have', 'consist of', etc. mentioned in this specification are used, other parts may be added unless '~ man' is used. When a component is expressed as a singular number, the plural number is included unless otherwise specified.

In analyzing the components, it is interpreted as including the error range even if there is no explicit description.

In the case of the description of the positional relationship, for example, when the positional relationship of two parts is described as '~ top', '~ upper', '~ bottom', '~ side', etc. Alternatively, one or more other parts may be located between the two parts unless 'direct' is used.

When an element or layer is referred to as another element or layer (on), it includes all cases in which another layer or another element is interposed immediately above or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first component mentioned below may be the second component within the technical spirit of the present invention.

The same reference numerals refer to the same components throughout the specification.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each of the features of the various embodiments of the present invention may be partially or totally combined with or combined with each other, and technically various interlocking and driving may be possible as those skilled in the art can fully understand, and each of the embodiments may be independently implemented with respect to each other. It can also be implemented together in an association relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram of a solder ball jetting system according to an embodiment of the present invention. Referring to FIG. 1, the solder ball jetting apparatus 1000 includes a laser driving unit 110, a disk driving unit 120, a control unit 130, an air pressure adjusting unit 140, and a pressure detection circuit 150.

It is a device that can bond the printed circuit board 700 and the object 600 by jetting the solder ball (B) onto the printed circuit board 700 using a solder ball jetting device. The solder ball jetting apparatus 1000 according to an embodiment of the present invention may discharge the solder ball B by irradiating a laser.

The laser driving unit 110 is a component for driving the laser 500 based on the control signal of the control unit 130. The laser driving unit 110 may heat-treat the object 600 and the solder ball by applying a driving signal for irradiating a laser beam to the laser 500. The laser driving unit 110 may control the temperature of the object 600 by adjusting the power of the laser 500 by the control signal of the control unit 130.

The disk driving unit 120 is a component for rotating the solder ball disk 330 by a control signal from the control unit 130. The disk driving unit 120 may load the solder ball B accommodated in the solder ball disk 330 into the opening of the jetting nozzle unit 400 by rotating the solder ball disk 330. Here, a detailed description of the solder ball disk 330 and the jetting nozzle unit 400 will be described later with reference to FIG. 3.

The control unit 130 is a component that is electrically connected to the laser driving unit 110 and the disk driving unit 120 to control the laser 500 and the solder ball disk 330. The control unit 130 may operate the laser 500 by applying a laser control signal to the laser driving unit 110. For example, the control unit 130 may control the intensity and irradiation time of the laser 500.

In addition, the control unit 130 may operate the solder ball disk 330 by applying a control signal to the disk driving unit 120. For example, the control unit 130 may adjust the rotation direction and rotation speed of the solder ball disk 330.

The air pressure adjusting unit 140 is a component that pressurizes some of the molten solder ball B by the laser to be discharged from the jetting nozzle unit 400 when the solder ball B is loaded into the opening of the jetting nozzle unit 400. The air pressure regulating unit 140 is electrically connected to the air pressure regulating device 211 and sends air to the connecting part 200 of the solder ball jetting device 800 through the air pipe 212 connected to the air pressure regulating device 211. Can be injected The detailed description of the connection unit 200 will be described later with reference to FIG. 3.

The pressure detection circuit 150 is a component for detecting the position of the solder ball B by detecting pressure through the low pressure detection sensor 213. When the pressure detection circuit 150 determines whether to detect the pressure by the low pressure detection sensor 213, when the pressure is detected, the solder ball B is detected in the opening of the jetting nozzle unit 400, or the solder ball B It is preferable to understand that the residue of the is detected, and when the pressure is not detected, the discharge residue of the solder ball B or the solder ball B is not detected in the opening of the jetting nozzle unit 400.

Hereinafter, the solder ball discharge unit 800 of the solder ball jetting apparatus 1000 according to an embodiment of the present invention will be described in detail with reference to FIGS. 2 and 3 together.

2 is a flowchart illustrating a solder ball jetting method according to an embodiment of the present invention. 3 is a schematic diagram of a solder ball discharge unit 800 according to an embodiment of the present invention. Referring to FIG. 3, the solder ball discharge part 800 includes a housing part 300, a solder ball disk 330, a connection part 200, a jetting nozzle part 400, a laser 500 and a pressure providing part 210. do.

First, the object 600 disposed under the jetting nozzle unit 400 is first preheated using the laser 500 (S100).

The laser 500 is a configuration for irradiating a laser beam to the object 600 through the lens 220, and may locally heat-treat an upper surface of the object 600 disposed under the jetting nozzle unit 400. Here, the laser 500 is excimer laser (eximer laser), carbon dioxide laser (CO ₂ laser), a type of diode laser and the like, but a diode laser capable of minimizing the path of the laser is most preferred, but is not limited thereto. .

In the first preheating step, the solder ball B is not loaded in the opening of the jetting nozzle part 400, that is, the state before the solder ball is discharged from the groove of the solder ball disk to the connection part, and the solder ball B is to be melted. The object 600 is irradiated with as much energy as possible. The object 600 primarily preheated by the laser 500 may be maintained at a constant temperature. However, after loading the solder ball B from the solder ball disk 330 to the jetting nozzle unit 400 after preheating, the temperature of the primary preheated object 600 may rapidly decrease.

Thus, while the solder ball (B) is loaded into the opening of the jetting nozzle unit 400 by the solder ball disk 330 included in the housing part 300 air-tightly connected to the jetting nozzle unit 400, the object 600 is 2 Preheat the car (S200). In this case, during loading into the opening of the jetting nozzle part 400, the solder ball B accommodated in the solder ball disk 330 is discharged and means a time period before loading into the opening through the connection part 200.

Referring to FIG. 3, the housing part 300 is a component including a solder ball disk 330 having a groove capable of accommodating a plurality of solder balls B, and a plurality of solder balls on the upper part of the housing part 300. (B) is disposed, and a solder ball disk 330 and a connection part 200 are disposed under the solder ball B.

Referring to FIG. 3, the solder ball disk 330 is disposed inside the housing part 300, and a plurality of grooves are disposed along the outer circumference of the solder ball disk 330. Here, solder balls B may be accommodated in the plurality of grooves formed in the solder ball disk 330. Specifically, the solder ball disk 330 may be rotated in a constant direction, for example, clockwise or counterclockwise, by the disk driving unit 120. As the solder ball disk 330 rotates, the plurality of solder balls B disposed on the upper part of the housing part 300 may be inserted into the grooves of the solder ball disk 330 located in the upper direction of the housing part 300 by gravity. have. A more detailed description in this regard will be described later with reference to FIGS. 4A to 4D.

Subsequently, after loading of the solder ball B into the opening of the jetting nozzle part 400 is completed, the laser is irradiated to the solder ball B (S300). When the loading of the solder ball B into the opening is completed, the internal pressure is increased while the inside of the connection part and the jetting nozzle part 400 is sealed, and the low pressure detection sensor 213 detects the internal pressure at this time, thereby completing the loading. Whether it is detected and transmits a completion signal to the control unit 130.

Referring to FIG. 3, the connection part 200 is connected to the lowermost part of the solder ball disk 330 at the lower part of the housing part 300 to open the solder ball B discharged from the solder ball disk 330 and jetting the nozzle B 400. As a passage to load in, the solder ball disc 330 and the jetting nozzle unit 400 are air-tightly connected, and a condensing lens 220 is provided, so that an external laser irradiates the opening of the jetting nozzle unit 400. It is configured to be able to. Here, the lens 220 is disposed on the upper surface of the connection part 200 other than the part connected to the solder ball disk 330, and serves to condense the laser beam irradiated from the upper part of the lens 220.

Referring to FIG. 3, the jetting nozzle unit 400 is a component that receives the solder ball B in the opening and discharges it on the object 600, and is disposed to correspond to the lens 220 at the lower portion of the connection unit 200. . The jetting nozzle unit 400 may load the solder ball B loaded from the connection unit 200 into the opening, and discharge the loaded solder ball B onto the object 600.

Thereafter, a laser beam is irradiated to the object 600 on which the discharged solder ball B is placed (S400).

Referring to FIG. 3, the object 600 is disposed under the jetting nozzle unit 400 and may be a work target point for a user to jet the solder ball B. The object 600 may be disposed on the printed circuit board 700 and bonded to the printed circuit board 700 by the jetted solder balls B. For the sake of simplicity, in the present specification, the object 600 is expressed as being joined to the printed circuit board 700, but this expression indicates that the object 600 is a printed circuit as one contact on the printed circuit board 700. Bonding with other contacts on the substrate 700 is also a comprehensive concept.

Referring to FIG. 3, a pressure providing unit 210 is disposed on a side of the connection unit 200. The pressure providing unit 210 is an air pressure adjusting device 211, And an air tube 212 and a low pressure detection sensor 213. Specifically, the air pipe 212 is a passage through which air is introduced from the outside, and the amount of air introduced from the outside can be controlled by the air pressure regulating device 211. At this time, the amount of air that the air pressure regulating device 211 will flow from the outside receives the signal sensed by the micro pressure detection sensor 213 disposed under the air pipe 212 from the control unit 130 so that the control unit 130 Can decide.

The low pressure detection sensor 213 measures the internal pressure in the air tube 212 through the pressure detection circuit 150 to operate the air pressure regulating device 211 based on the measured internal pressure. You can let it. Specifically, when pressure is detected in the low pressure detection sensor 213, the solder ball B is loaded into the opening of the jetting nozzle part 400 or the residue of the solder ball B is detected, and the pressure is not detected. In the opening of the jetting nozzle unit 400, a solder ball B or a residue of the solder ball B may not be detected. Therefore, when the solder ball B in the jetting nozzle unit 400 is detected by the low pressure detection sensor 213, the jetting nozzle unit 400 is used using the air pressure adjusting device 211 so that the solder ball B is discharged. The pressure can be adjusted.

However, when the pressure of? Is measured inside the connection part and the jetting nozzle part, the controller can determine that the solder ball (B) is loaded, lower than the above-described sealed internal pressure and no solder ball (B) at all. When a pressure higher than the base pressure is measured, the control unit 130 may determine that there is a residue of the solder ball B.

Hereinafter, a solder ball jetting method according to an embodiment of the present invention will be described in detail with reference to FIGS. 4A to 6.

4A to 4D are views illustrating a solder ball jetting method according to an embodiment of the present invention. 5 is a view for explaining a control process of the solder ball jetting method according to an embodiment of the present invention, Figure 6 is a view for explaining the effect on the solder ball jetting method according to an embodiment of the present invention.

The solder ball discharge unit 800 shown in FIGS. 4A to 4D is substantially the same as the solder ball discharge unit 800 shown in FIG. 3, and a duplicate description will be omitted.

Referring to FIG. 5, the horizontal axis represents a loading section in which the solder ball B is loaded, and the vertical axis represents a control signal applied by the control unit 130 of the solder ball jetting apparatus 1000.

First, the object 600 is first preheated by irradiating a laser to the object 600 disposed on the upper portion of the printed circuit board 700 and the jetting nozzle unit 400. As illustrated in FIG. 5, section ① is a section for pre-heating the object 600 first, and the control signal by the laser driving unit 110 is rapidly changed while the control signal by the disk driving unit 120 remains unchanged. You can see that it goes down. Accordingly, it can be seen that in the first preheating step, only the laser is irradiated while the solder ball disk 330 is not rotated. At this time, the laser 500 is preferably irradiated with a power higher than the melting point of the solder ball B, that is, the energy that the solder ball B can be melted.

As shown in FIG. 4A, the laser 500 disposed on the connection part 200 irradiates the laser beam in the downward direction of the laser 500 through the lens 220 interposed on the upper surface of the connection part 200. Here, the laser beam may condense the laser beam by the lens 220 to locally heat the top surface of the object 600.

Subsequently, the object 600 is secondary while the solder ball B is discharged from the solder ball disk 330 included in the housing part 300 connected to the jetting nozzle part 400 and loaded into the opening of the jetting nozzle part 400. You can also preheat. As shown in FIG. 5, in section ②, since the control signal by the disk driving unit 120 is rapidly lowered while the control signal by the laser driving unit 110 remains unchanged, the solder ball disk is rotated by rotating the solder ball disk 330. The section for loading the solder ball B to 330 is shown. Subsequently, section ③ indicates a section in which the object 600 is preheated because the laser is irradiated while the solder ball disk 330 rotates and stops. At this time, it can be seen that the intensity of the laser irradiated in section ③ is greater than the intensity of the laser irradiated in section ①.

Specifically, as shown in Figure 4b, the solder ball disk 330 is rotated clockwise by the disk drive unit 120, a plurality of solder balls (B) disposed on the upper portion of the housing 300, the solder ball disk 330 ) Is inserted one by one into the groove located on the outer periphery. Accordingly, each of the solder balls B sequentially received in the grooves may move toward the jetting nozzle unit 400 through the connection part 200 connected to the lower portion of the solder ball disk 330 while facing toward the lower direction of the solder ball disk 330.

At this time, before the solder ball B is loaded into the opening of the jetting nozzle unit 400, the laser beam is irradiated through the lens 220 to preheat the object 600. In the second preheating step, it is preferable to irradiate the laser with energy that does not melt the solder ball B. That is, in the second preheating step, a laser having an intensity lower than that of the laser irradiated during the first preheating step is irradiated so that the solder balls B injected into the jetting nozzle unit 400 after the first preheating step do not melt. The inventor of the present invention discovered that the shape of the solder ball B is deformed when the solder ball B comes into contact with the laser beam during loading. Therefore, a part or all of the opening of the jetting nozzle part is blocked due to the shape deformation of the solder ball. In addition, when the laser beam is not continuously applied during loading, the temperature of the object is rapidly lowered, so that cracks are generated in the part joined by the solder ball, or in some cases, cold solder is generated. In the present invention, all of these problems have been solved by considering all of these points and changing the temperature appropriately for a short time before the solder ball is discharged from the solder ball disk and loaded into the opening of the jetting nozzle part. In this case, the moment the solder ball is discharged from the disc is determined by determining the rotation angle of the solder ball disc by the control unit, and the moment the solder ball is loaded is detected by the low pressure detection sensor. In order to detect the rotation angle in the control unit, an additional rotation angle detection sensor such as a rotation angle detection sensor, for example, a non-contact type sensor or a variable resistance type sensor, is provided between the solder ball disk and the housing, or the control unit detects the rotation angle by calculation You may.

Specifically, referring to FIG. 4C, after the second preheating step, the solder ball B is loaded into the opening of the jetting nozzle unit 400. At this time, while irradiating the laser to melt at least a part of the solder ball (B) by irradiating the laser to the solder ball (B) loaded in the opening of the jetting nozzle unit 400 above the melting temperature of the solder ball (B), the connecting portion and jetting The solder ball B is discharged from the opening of the jetting nozzle unit 400 by increasing the pressure of the nozzle unit. Thus, as shown in ⑤ and ⑥ of FIG. 5, the laser is irradiated so that the solder ball B can be discharged, and the discharged solder ball B is larger than when discharged so that it can be better bonded to the object. You can also irradiate a laser of size.

Referring to FIG. 4D, after the solder ball B is discharged from the jetting nozzle unit 400, the object 600 is post-heated by irradiating a laser to the object 600 on which the discharged solder ball B is placed. When a post-heat treatment is performed using the laser 500, it is a curing operation for curing the solder balls B which are discharged onto the object 600 and evenly distributed along the object 600 upper surface. In FIG. 4D, the solder ball B discharged onto the object 600 is shown as having a spherical shape, but may have a uniformly distributed shape to correspond to the top surface of the object 600 by a post-heat treatment step.

Since a general jetting device preheats an object or a printed circuit board or a substrate for a short period of time before work, there is a problem in that a highly viscous material is not evenly dispersed in the object because the object rapidly cools at a target point and the remaining area after a certain period of time. . Thus, as shown in Figure 6, in the case of the comparative example, it can be seen that the solder ball is convexly jetted on the object.

In addition, the jetting method using a general laser is designed to load a high-viscosity material in the nozzle portion and aim at a target point of work. However, in this case, there is also a problem in that a large amount of high-viscosity material is loaded on the nozzle portion, so that a large amount of high-viscosity material can be discharged to the work target point.

Accordingly, the solder ball jetting apparatus 1000 according to an embodiment of the present invention performs efficient jetting while maintaining the object 600 to be jetted at a constant temperature by preheating the object 600 at least twice at a predetermined interval before jetting. can do. Accordingly, as shown in FIG. 6, it can be seen that in the case of the embodiment, the solder ball B is jetted evenly on the object 600.

The embodiments of the present invention have been described in more detail with reference to the accompanying drawings, but the present invention is not necessarily limited to these embodiments, and may be variously modified without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The scope of protection of the present invention should be interpreted by the claims below, and all technical spirits within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

1000: solder ball jetting device
110: laser driving unit
120: disk drive
130: control unit
140: air pressure control unit
150: pressure detection circuit
200: connection
210: pressure providing unit
211: air pressure regulator
212: air tube
213: low pressure detection sensor
220: lens
300: housing
330: solder ball disc
B: Solder ball
400: jetting nozzle
500: laser
600: object
700: printed circuit board
800: solder ball outlet

Claims (14)

In the control method using a solder ball jetting device comprising a jetting nozzle unit for receiving the solder ball in the opening and discharging it on the object and a disk driving unit for rotating the solder ball disk to load the solder ball to the jetting nozzle unit,
A first preheating step of preheating an object disposed under the jetting nozzle part by using a laser before solder balls are loaded into the opening of the jetting nozzle part;
A second preheating step of preheating the object while the solder ball is loaded into the jetting nozzle part by the solder ball disk included in the housing part connected to the jetting nozzle part;
A laser irradiation step of melting at least a portion of the solder ball by irradiating a laser to the solder ball after the loading of the solder ball is completed in the jetting nozzle part; And
And a post-heat treatment step of irradiating a laser beam to the object on which the discharged solder ball is placed, after the solder ball is discharged by an air pressure adjusting unit that presses the jetting nozzle unit. According to claim 1,
The second preheating step,
After the first preheating step, the solder ball jetting device control method for irradiating a laser having an intensity lower than the intensity of the laser irradiated during the first preheating step so that the solder balls injected into the jetting nozzle unit do not melt. According to claim 2,
In the first preheating step, the laser is irradiated with energy capable of melting the solder ball, the angle of the solder ball disc is sensed, and the moment when it is loaded into the jetting nozzle part of the solder ball is sensed, and the second preheating step is entered, and the second is performed. In the preheating step, the solder ball is irradiated with energy that does not melt, and in response to the solder ball being loaded by the low pressure detection sensor, the energy to melt the solder ball is increased to irradiate the laser and then detect that the solder ball is discharged by the low pressure detection sensor. A method of controlling a solder ball jetting device, which controls the laser beam to be irradiated with energy that melts the solder ball for a certain period of time. According to claim 1,
Further comprising the step of determining whether the solder ball is loaded through the pressure sensor, solder ball jetting device control method. According to claim 4,
When the solder ball in the jetting nozzle portion is detected by the low pressure detection sensor, further comprising the step of adjusting the pressure of the jetting nozzle portion to discharge the solder ball, solder ball jetting device control method. According to claim 1,
A method of controlling a solder ball jetting device further comprising the step of providing a notification sound when a pressure abnormality occurs when the solder ball for the object is not loaded. A jetting nozzle unit for receiving the solder ball in the opening and discharging it on the object;
A disk driving unit driving a solder ball disk rotating to load the solder ball onto the jetting nozzle unit;
A connection portion including the lens and hermetically connecting the solder ball disc and the jetting nozzle portion;
A laser driver arranged to irradiate the opening through the lens;
When the solder ball is loaded on the jetting nozzle unit, an air pressure adjusting unit for pressing the solder ball to be discharged from the jetting nozzle unit; And
It includes a control unit for controlling the disk driving unit and the laser driving unit,
The control unit pre-heats an object disposed under the jetting nozzle unit before loading the solder ball into the opening, and pre-heats the object while the solder ball is being loaded into the opening of the jetting nozzle unit from the solder ball disk. , Solder ball jetting device. The method of claim 7,
The solder ball is loaded into the opening of the jetting nozzle unit as the solder ball disk rotates, the solder ball jetting device. The method of claim 7,
The laser driving unit senses the angle of the solder ball disk, detects the moment when it is loaded into the jetting nozzle portion of the solder ball, enters the secondary preheating, and irradiates the laser with energy that does not melt the solder ball during the secondary preheating, and detects a low pressure sensor Solder ball jetting device that irradiates the laser by increasing the energy that the solder ball melts in response to the solder ball being loaded by and then irradiates the laser with the energy that the solder ball melts for a certain time after detecting that the solder ball is discharged by the low pressure detection sensor. . The method of claim 9,
The laser driving unit irradiates the laser with energy that can melt the solder ball during the first preheating, and irradiates the laser with energy that does not melt the solder ball during the secondary preheating, a solder ball jetting device. The method of claim 7,
A solder ball jetting device further comprising a pressure detection sensor for determining whether the plurality of solder balls are loaded. The method of claim 11,
When the loading of the solder ball is detected by the low-pressure detection sensor, the solder ball jetting device further comprises an air pressure adjusting unit for adjusting the pressure of the jetting nozzle unit to discharge the solder ball. The method of claim 7,
When the solder ball is discharged to the object, the laser driving unit post-heats the object on which the discharged solder ball is placed, a solder ball jetting device. The method of claim 7,
A solder ball jetting device further comprising an alarm providing unit that provides a notification sound when the solder ball to the object is not loaded and a pressure abnormality occurs.

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