KR102110763B1 - Soldering apparatus, apparatus and method for laser processing - Google Patents

Abstract

A head unit that irradiates the inspection light to the object; Includes a control unit for matching the surface information obtained by irradiating the surface information and inspection light of the previously input soldering target area; and, through the matching of the surface information, according to one or more positioning factors, the first position that is the reference position or A laser processing apparatus is provided in which soldering is performed at a second position, which is distance-compensated from a reference position.

Description

Soldering device, laser processing device and processing method {SOLDERING APPARATUS, APPARATUS AND METHOD FOR LASER PROCESSING}

An embodiment of the present invention relates to a soldering apparatus, a laser processing apparatus and a processing method.

Processing by a general laser processing method and apparatus is performed in the form of drilling, masking, soldering, etc. for various electronic parts using a laser. Among them, soldering performed by a laser processing apparatus and method is an apparatus for electrically connecting electrical components using a conductive material (for example, a solder ball), and may be used for manufacturing various electronic products.

Republic of Korea Registered Patent Publication No. 10-0332378 (2002. 03. 30.)

An embodiment of the present invention relates to a laser processing apparatus, and includes a vision inspection module or step for performing soldering using a laser but determining a soldering position, and a laser soldering module or step, and a rapid and highly efficient laser processing apparatus and method It aims to provide.

A head unit that irradiates the inspection light to the object; Includes a control unit for matching the surface information obtained by irradiating the surface information and inspection light of the previously input soldering target area; and, through the matching of the surface information, according to one or more positioning factors, the first position that is the reference position or A soldering apparatus is provided in which soldering is performed at a second position that is distance compensated from a reference position.

In addition, the positioning factor may include a separation distance between terminals to be soldered, a difference in size of terminals to be soldered, an angle formed between terminals to be soldered, and a size of solder balls to be soldered.

In addition, the separation distance between terminals is a distance spaced in the lateral or longitudinal direction, and may be a positioning factor that allows distance compensation in the spaced direction.

In addition, the size difference of the terminal is a difference in the direction across the terminal to be soldered, and may be a positioning factor that allows distance compensation in the cross direction.

In addition, the angle formed by the terminal is an angle formed between the terminals to be soldered, and the degree of distance compensation from the first position decreases as the angle decreases, and the degree of distance compensation from the first position increases as the angle increases. Can be.

In addition, as the size of the solder ball increases, the degree of distance compensation from the first position decreases, and as the size of the solder ball decreases, the degree of distance compensation from the first position may increase.

In addition, when the positioning factor is detected, the second position may be determined by reflecting one or more factors of the positioning factor.

In addition, the head unit may perform pre-heating to a soldering target region through a laser before soldering is performed.

In addition, the soldering target region may be included in the region where the inspection light reaches.

Further, by rotating the object by the rotation of a jig fixing the object, soldering may be performed on two or more surfaces of the object.

In addition, the rotation of the jig for fixing the object is rotated by multiple axes to change the soldering target position toward the head portion.

Irradiating the inspection light from the head unit to the object, matching the surface information of the object obtained by irradiating the inspection light with the surface information of the previously input object, and as a matched result, the first determination is made by detecting whether the positional factor difference is detected. The soldering position is determined by the position or the second position, and the positioning factors include the separation distance between terminals to be soldered, the size of the terminal to be soldered, the angle of the terminal to be soldered, and the size of the solder ball to be soldered. A laser processing method is provided, wherein a second position is determined by one or more conditions detected among the positioning factors, and the second position is a soldering position determined by distance compensation from the first position by a difference in the positioning factors. .

And, one of the first inspection (Pre-Inspection) to detect the alignment of the object by the inspection unit and the second inspection (Post-inspection) to detect whether internal cracks and pores in the solder portion sent to the object are detected. The above steps may be further included.

Also, a second inspection (post-inspection) may be performed simultaneously with the execution of the soldering.

In addition, after the second inspection (Post-inspection) may further include the step of sorting (Sorting) the object by the predetermined quality criteria.

A jig on which the object is loaded; A first inspection unit that detects an alignment state of the object loaded on the jig (Detect) and performs a first inspection (Pre-Inspection); A moving unit for loading and unloading the object to the jig; A second inspection unit selectively performing a second inspection (Post-Inspection) on the object; And a processing unit including a head unit and a control unit, wherein the head unit is controlled by the control unit, irradiates a laser to the object, and the control unit irradiates surface information and inspection light of a previously input soldering target region. Provided is a laser processing device that matches the obtained surface information and, through matching of the surface information, soldering is performed at a first position that is a reference position or a second position that is distance-compensated from the reference position according to one or more positioning factors. do.

In addition, the second inspection (Post-Inspection) may be an inspection for detecting whether cracks and pores are generated in the soldering.

In addition, the second inspection (Post-Inspection) may further include a classification device for sorting (Sorting) the object by a predetermined quality criteria.

In addition, after the inspection (Post-Inspection) step further comprises a cleaning device (Cleaning Device) for removing dust and debris, the cleaning device, a blowing (Dry Air Blowing) device that provides dry air, carbon dioxide snow cleaning ( CO2 Snow Cleaning) and an inert gas blowing device.

In addition, the soldering performed on the object may further include a pre-soldering pre-soldering part.

Embodiments of the present invention can implement a rapid and highly efficient laser processing apparatus and method, including a vision inspection module or step, and a laser soldering module or step.

1 is a view showing a camera module according to an embodiment of the present invention,
2 and 3 are views showing a laser processing method according to an embodiment of the present invention,
4 is a view showing a camera module as a soldering object according to an embodiment of the present invention;
5 is a view showing a heating process according to an embodiment of the present invention,
6 is a view showing that the solder ball is moved by the nozzle according to an embodiment of the present invention,
7 is a view showing the cone angle and wavelength of the laser according to an embodiment of the present invention,
8 is a graph showing laser energy output according to an embodiment of the present invention.
9 is a view showing a VCM (Voice Coil Motor) Soldering equipment employed in the camera manufacturing process according to an embodiment of the present invention,
10 is a view showing that soldering according to an embodiment of the present invention is used to connect a terminal,
11 is a view showing an example of bonding through soldering according to an embodiment of the present invention,
12 is a view showing a laser processing apparatus including a nozzle according to an embodiment of the present invention,
13 is an enlarged cross-sectional view of a nozzle according to an embodiment of the present invention,
14 and 15 is a flow chart showing a soldering method according to an embodiment of the present invention,
16 is a perspective view showing a jig according to an embodiment of the present invention,
17 is a view showing determining a soldering position according to an embodiment of the present invention,
18 is a view showing that the solder ball device according to an embodiment of the present invention determines the soldering position according to the separation distance between terminals;
19 is a view showing that the solder ball device according to an embodiment of the present invention determines the soldering position according to the size of the terminal,
20 is a view showing that the solder ball device according to an embodiment of the present invention determines the soldering position according to the angle of the joint surface,
21 is a view showing that the solder ball device according to an embodiment of the present invention determines the soldering position according to the solder ball size.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is only an example and the present invention is not limited thereto.

In describing the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to a user's or operator's intention or practice. Therefore, the definition should be made based on the contents throughout this specification.

The technical spirit of the present invention is determined by the claims, and the following examples are merely a means for effectively explaining the technical spirit of the present invention to a person having ordinary knowledge in the technical field to which the present invention pertains.

Through the laser processing apparatus and method according to an embodiment of the present invention, marking, drilling, welding and soldering may be performed on a laser processing object. Hereinafter, the laser processing apparatus and method of the present invention will be described as an example of performing soldering. That is, a laser processing apparatus may be employed as a soldering apparatus, and only a process for soldering may be performed. Hereinafter, in this case, the laser processing apparatus can be described as a soldering apparatus.

Of course, the laser processing object can be applied to the manufacture of various electronic components such as various electronic components including the camera module 20. Hereinafter, an object to be soldered will be described with reference to a camera module (20 in FIG. 1).

The camera module 20 described below can be used for various portable devices such as a smart phone and a tablet pc, as well as smart home appliances, home appliances including home appliances, vehicles, or security cameras (CCTV), and various medical devices. Needless to say, the optical element can be mounted and used in various devices. For example, when used in automobiles, it can be applied to various electric components, ABS sensors, and batteries for vehicles, and for home appliances, it can be applied to turning cases, flat screen monitor PCBs, photosensors, and the like. In addition, when applied to a portable device, it can be applied to a Simos sensor, a smart watch, etc. included in various ICs, and can be applied to a CCD camera module 20, a USB connection terminal, a battery terminal, etc. in a portable device.

Furthermore, the laser processing apparatus included in the laser processing apparatus according to the embodiment of the present invention can be included in various processes such as welding, soldering, and bonding, and the material on which each process is performed also includes polymer, metal, and dielectric (dielectric). ), of course, it can be applied to various materials such as semiconductors.

First, FIG. 1 is a diagram showing the configuration of an object. The camera module 20 may include a lens module 21 (Lens Actuator) and an image sensor module 22.

The lens actuator may include a lens module 21 (Module Lens or Lens Module), a lens cover, a VCM driving unit, a holder, an IR filter, and the like. In addition, the image sensor module 22 may include a semiconductor sensor chip, ACF, FPCB, and the like.

Specifically, the camera module 20 or the compact camera module 20 includes a lens module 21, an AF actuator, an optical image stabilizer, It may include an image sensor, an AF driver, a PCB, an FPCB, a socket, and the like. The lens module 21 may include a plurality of lenses, for example, imaging lenses for imaging, and may include a support supporting a plurality of lenses. Also, a plurality of IR filters may be used. It may be included on one side of the lens, the IR filter may be supported by a support. In addition, the image sensor may be included in the image sensor module 22, and the image sensor module 22 may include a sensitivity enhancing MLA (Sensitivity Improving MLA), CCD or CMOS.

Here, the image sensor is a sensor that converts the captured image into an electrical signal, and a number of lenses serve to collect the image. In addition, the PCB serves as a wire-bonding and support for the image sensor and a passage for inputting and outputting the electrical signal of the sensor to the outside, and the FPCB includes a connection line directly connected to an external backend chip. Do it.

Next, FIG. 2 is a diagram briefly showing a manufacturing process of the camera module 20 according to an embodiment of the present invention.

The camera module 20 according to an embodiment of the present invention is manufactured by the lens module 21, the manufacturing of the packaging module through packaging of the manufactured lens module 21, the camera module 20 through the further completion of the packaging module ).

Specifically, the manufacturing of the camera module 20 includes a processing assembly and inspection process of the camera module 20, and more specifically, a single lens injection, a single lens cut, a single lens coat, and a single lens. This includes defect inspection, lens assembly, lens performance inspection, and lens holder assembly. Packaging module manufacturing may include wafer saw, die attach, wire bond, clean, lens holder mount. In addition, the completion of additional packaging modules includes Lens Pre-Ass'y, Focus UV Lock, Sensor Test, FPCB Attachment, Case Assembly, and Includes shipping inspection.

Meanwhile, the manufacturing process of the camera module 20 used in portable devices such as smart phones and mobile phones will be described in detail with reference to FIG. 3.

First, a wafer for manufacturing a sensor chip is supplied (①), a sensor chip is prepared by cutting the supplied wafer (②), and the prepared sensor chip is attached (③) to the printed circuit board (PCB). , After connecting (④) the sensor chip and the printed circuit board with a gold wire, attach (⑤) the lens fixture to the top. Next, after separating (⑥) into individual camera modules (20), FPCB is joined (⑦), the module is rotated and focus is set (⑧). Next, after fixing (⑨) the focus of the module through epoxy curing, the light passing through the camera module 20 (CM module) is irradiated to the test chart to check the image and color and set it. (⑨⑩).

In the above-described process, a laser processing apparatus (Laser Soldering Apparatus) may be used for FPCB attachment, case assembly, and the like. In order to connect the terminals in the FPCB attach and case assembly process, a soldering, that is, a soldering process is required, and in this process, a laser processing apparatus included in an embodiment of the present invention can be used.

As shown in FIG. 4, such a laser processing apparatus may be used for two-side soldering or three-side soldering in the camera module 20. In the case of two-side soldering, 6 to 8 points soldering can be made on the upper surface of the camera module 20, and 6 to 8 points (6 to 8 points soldering) can be made on the lower surface opposite to the upper surface. . On the other hand, in the case of three-sided soldering, a total of 16 points may be made over the three-sided soldering. In this case, the camera module 20 may be an OIS (Optical Image Stabilizer) camera module 20.

The laser soldering process performed by the laser processing apparatus will be described with reference to FIG. 5 as follows.

First, a process of pre-heating (PH1) by irradiating a laser to a soldering point may be performed. The area irradiated with the laser emits heat, for example, planar heat such as circular, square, or ring. Next, heat is transferred to the surrounding area and the temperature can be increased. Next, a solder ball (S; solder) is supplied and a post-heat (PH2) process may be performed by a laser. Next, a soldering process is performed through a cool down (CD). If necessary, the soldering process is completed through the supply of solder balls (S; solder), post-heat (PH2; post-heat) process and cool down (CD) process without the pre-heat process (PH1). You may.

The laser soldering device may have a different device configuration and laser irradiation method according to one of a case where a solder wire is used, a solder ball S is used, and a solder paste is used.

In particular, in the case of using the solder ball S, as shown in FIG. 6, the solder ball S is placed at a required position by picking up and moving the solder ball S, and the solder ball S is irradiated with a laser to melt and drop. There may be a pick and place soldering method to join as much as possible.

In addition, there may be a solder jetting method in which the solder ball S is transported through the nozzle to be melted and jetted inside the nozzle.

Furthermore, the nozzle may be replaced when an abnormal condition is detected. The nozzle may further include a sensing unit that detects whether the abnormality includes contamination and deformation. The sensing unit may include a first sensing unit and a second sensing unit.

The first sensing unit is a sensor for checking the state of the nozzle 100, and may be a charge-coupled device (CCD) camera. If the first sensing unit inspects the state of the nozzle and there is no abnormality in the state of the nozzle, a normal solder ball application operation may be performed. However, when the first sensing unit senses the abnormality of the nozzle, the abnormality of the nozzle may be detached by the detachable unit, and a new nozzle stored in the nozzle cartridge unit may be taken and attached to the coupling unit. When the new nozzle is attached to the engaging portion, the alignment of the new nozzle can be performed through the alignment portion.

Further, the second sensing unit may be a charge-coupled device (CCD) camera, an area sensor, a hole sensor, or a capacitive sensor. The abnormal state of the disk, in particular, the abnormal state of the solder ball transfer port may be checked by the second sensing unit and transmitted to the control unit. That is, when the contamination state of the solder ball feed port is checked, the signal indicating that the solder ball feed port is in an abnormal state is indicated when the contamination level is such that it interferes with the supply of the solder ball (for example, when the diameter in the solder ball feed port is equal to or less than a predetermined value). It can be transmitted to the control side. The control unit may provide information to allow the user to replace the disk by displaying it to the user when the abnormal state of the disk moving and providing the solder ball S is confirmed.

As an example, to more specifically describe the pick and place soldering method through FIG. 6, as shown in FIG. 6(a), one or more nozzles pick up the prepared solder ball (S) (Step 1) (Step 2) soldering Position it on the upper part of this required position (Step 3). The solder ball S located at the top is melted by laser irradiation, and the solder ball S is dropped at a required position (Step 4). Meanwhile, as shown in FIG. 6(b), when the nozzle picks up two or more solder balls S, the laser may be sequentially irradiated to each solder ball S. Of course, FIG. 6 illustrates a case in which the nozzle picks up two or more solder balls S, but is not limited thereto, and may also include a case where the nozzle picks up one solder ball S and drops it in a position where soldering is required. Of course

The following technical content and FIG. 7 may be considered when examining solder wire, solder paste, and pre-deposited solder, unlike FIG. 6 (Pick and Place).

In such a laser processing apparatus, it is necessary to operate the laser according to factors to be considered. The size of the heated area by the laser, the prevention of errors, and the occurrence of errors and securing of the focal length (focus distance) that enables smooth laser soldering even if errors occur, the laser is irradiated to the surrounding components Consideration should be given to the angle of the cone of the laser to prevent it from being blocked by or blocking the surrounding components.

Therefore, as illustrated in FIG. 7, the size and focal length of the area heated by the laser can be adjusted by adjusting the cone angle and wavelength of the laser having a cone shape. In addition, by reducing the cone angle of the laser, it may be possible to prevent a defect due to contact with the surrounding configuration. In order to control the cone angle and wavelength of the laser, the laser processing apparatus according to the embodiment of the present invention may include a laser wavelength adjusting unit and a laser cone angle adjusting unit in an upper laser supply unit supplying the laser of the nozzle 16. have.

In addition, considerations such as the cycle cycle of the laser processing apparatus, the operating temperature, and the temperature sensitivity of the material to be soldered, the contact sensitivity, and the allowable temperature for smooth performance of the next process may be comprehensively considered.

The reflow timing considerations in the laser processing apparatus will be described in detail as follows.

First, it is possible to consider the thermal load of the soldering object. The larger the object, the slower the heat transfer, and the higher the thermal conductivity, the object may act as a heat sink.

Second, the mass of the solder paste (solder ball S) can be considered. This is because the laser must add enough energy to evaporate the flux and liquefy the alloy. In addition, because the flux steam affects the heating rate and may be auto-ignited.

Third, the distance to the wetted place can be considered. The longer the distance, the longer the laser irradiation time. This is because the alloy must be liquid enough to flow and wet across the surface.

Fourth, joint geometry can be considered. This is because if the joint shape is a complex shape such as a stranded wire, it may take longer for the alloy to be completely wet. This is because the alloy must be liquid enough to flow and wet across the surface.

Fifth, thermal sensitivity can be considered. Parts and solder must be heated quickly to limit the total amount of heat absorbed. This is because excessive heat can conduct to the surrounding components and damage them.

As shown in FIG. 8, since the laser can control energy power over time, it is possible to profile heating so as to make the most of the required heating effect. For point-to-point heating without consideration, the profile can be a single power level at a time. If cycle time is important and a minimal amount of time is required for the part to get completely wet, the laser is high enough to initiate a reflow before it drops to a lower power to keep the area heated to maintain reflow without overheating. Level can be applied. The laser may be ramped from one output level to another by linearly changing the output level over time.

This laser soldering process can be automated. For example. Vision recognition for recognizing an object may be performed in a laser processing device, and vision recognition and laser soldering may be controlled to be performed on the same line. In addition, efficiency of control and workability can be improved by including a linear motor. In addition, it is of course possible to improve workability by including two or more nozzle 16 heads performing laser soldering. In addition, two or more heads and two or more tables each laser soldering is included to correspond to the heads may be performed in parallel. Furthermore, although such a laser processing apparatus is not shown in detail in the drawings, it is of course possible to include a moving platform including a motor that allows the laser soldering nozzle 16 to be moved in two or more directions, for supplying a laser. A laser supply unit and a solder ball (S) supply unit capable of supplying solder may be included. In addition, the laser processing device may include a rotating motor to rotate the nozzle 16, and the nozzle 16 is rotated by rotation of the rotating motor to irradiate the laser obliquely to a portion where the object requires laser soldering. have.

The laser processing device may be manufactured in a desktop type, or may be provided in a robot automation type in which the laser soldering nozzle 16 can be moved by a robot. Furthermore, as a configuration of an automated system on a manufacturing process line, it may be provided as an automated device or a standalone system. Furthermore, as shown in FIG. 9, as a voice coil motor (VCM) soldering equipment of the camera module 20 process, a voice coil motor terminal (VCM terminal) / yoke terminal and a ceramic multilayer substrate (HTCC substrate, High Temperature Coried Ceramics) can also be applied as a device for soldering using a laser.

In addition, the laser processing apparatus according to the embodiment of the present invention may include a control unit, and perform control necessary for laser soldering. The controller may be able to start, upgrade the embedded system and program through an external signal, or may be controlled or controlled through input/output of soldering parameters. The laser processing apparatus according to the embodiment of the present invention may include a display unit for easily grasping the operation status and control status of the apparatus.

Furthermore, the laser processing apparatus according to the embodiment of the present invention may include a non-contact temperature sensor that allows measurement of one or more temperatures of the object and the solder. Also, a feeder for precise solder feeding may be included. In addition, the control unit may include two or more selectable soldering profiles, and laser soldering may be possible without inputting a separate control factor. For example, the laser processing apparatus according to the embodiment of the present invention may have a plurality of soldering profiles, and each laser soldering profile may be divided into 3 steps and 8 steps in order to enable flexible and accurate parameter control. Meanwhile, the control unit of the laser processing apparatus according to the embodiment of the present invention may be provided to select two or more laser head options among focal length, IR temperature sensing, and real-time soldering quality monitoring.

Meanwhile, the laser soldering profile may include a laser output, a laser irradiation time, a number of laser irradiations, and a slope in relation to the laser output and irradiation time.

The laser profile corresponding to the size of the solder ball and the soldering environment may be determined by various combinations of the above four conditions. For example, when the solder ball is large, the melting of the solder ball may not be completely performed, so a laser irradiation for heating may be performed multiple times to melt the soldering. Reflow soldering may be performed depending on the size of the solder ball. In addition, when heating is completed, slow cooling may be performed. In the case of rapid cooling, cold soldering may occur, and cracks may occur in the soldering portion. Therefore, slow cooling can be performed.

Meanwhile, the slow cooling may also include slow cooling performed by continuously reducing the laser power and slow cooling performed by gradually reducing the power. Even in the case of slow cooling by continuously reducing the laser power, the larger the slope in the relationship between the laser power and the irradiation time, the more similar the effect of rapid cooling can be.

That is, various laser profiles may be selected in order to form one or more output sections in the soldering process through a combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope between the laser output and the irradiation time.

According to the laser processing apparatus described above, as shown in FIG. 10, soldering may be applied to electrical connections of various terminals. For example, soldering can be smoothly performed even when the terminals are positioned on the same plane or at an angle. Thus, as shown in Figure 11 (a) to 11 (d), the laser processing apparatus according to an embodiment of the present invention, corner bonding (Corner connection), cavity bonding (Cavity connection), omnidirectional bonding (All connection) ) And various connections.

First, a description of an apparatus including a laser processing apparatus nozzle 16 according to an embodiment of the present invention may be made through FIG. 12.

Part of the device according to the embodiment of the present invention includes an upper base 17 and a lower base 18, and includes a hole disk positioned between the upper base 17 and the lower base 18. The hole disk can be rotated by the rotation shaft 6 and includes a plurality of holes, so that the solder balls located in each hole can be moved to the laser transmission channel 14 by rotation about the rotation shaft 6. That is, the solder ball S introduced through the solder ball inlet 2 is located in one of the plurality of holes provided in the hole disk, and the solder ball S located in one hole of the hole disk by rotation of the rotation shaft 6 Can be moved toward the laser transmission channel 14.

Here, the solder ball S supplied to the solder ball inlet 2 may be temporarily stored in the storage chamber 3, and the solder ball S exit by supply of nitrogen gas through the nitrogen gas inlet 11 and 4 The port 5 may be moved, and the solder ball S moved to the outlet port 5 may be located in one of the plurality of holes provided in the hole disk.

The upper base 17 is provided with a structure capable of rotatably supporting the rotating shaft 6, and an adapter 7 may be included on the upper side. In addition, a receiving port 10 and a transmission port 9 penetrating the upper base 17 and the lower base 18 may be included. The solder ball S moved toward the laser transmission channel 14 may be moved toward the nozzle 16 through the solder ball S outlet channel 12.

The transparent glass 13 may be provided on the upper side of the laser transmission channel 14, and the laser irradiated via the transparent glass 13 may be irradiated toward the nozzle 16 via the laser transmission channel 14. .

The nozzle 16 may be coupled with a lock screw of the nozzle 16 provided on the lower base 18. In this way, replacement of the nozzle 16 can be facilitated by allowing the nozzle 16 to be coupled via the lower base 18 and the nozzle 16 lock screw. In the embodiment of the present invention, the nozzle 16 lock screw has been described as an example, but the coupling structure to the nozzle 16 and the lower base 18 to allow the nozzle 16 to be replaced may be variously employed. to be. In addition, the nitrogen gas inlet 11 for supplying nitrogen gas to the upper side of the laser transmission channel 14 so that the solder ball S inside the nozzle 16 melted by the laser can be discharged to a portion requiring laser soldering (4) ) Can be provided.

Looking at an enlarged view of the nozzle 16 included in the laser processing apparatus according to the embodiment of the present invention, it may be as illustrated in FIG. 13.

The nozzle 16 illustrated in FIG. 13 may be provided with a cylindrical shape and a through hole including a truncated cone shape coupled to a lower portion of the cylindrical shape. The solder ball S is introduced into the nozzle 16 via the solder ball S outlet channel 12, and then falls by gravity through a cylindrical shape. The falling solder ball (S) is caught in a cone-shaped portion and does not go out of the nozzle (16). The laser beam is irradiated through the transparent glass 13 to the hanging solder fire of the cone-shaped portion, and the molten solder ball S is discharged to the outside by nitrogen gas.

On the other hand, a cap may be provided on one side of the solder ball inlet 2, and the cap may be opened only when the solder ball S is moved toward the solder ball inlet 2 in the solder ball S supply chamber in which the solder ball S is stored. . In addition, the cap provided at the solder ball inlet 2 may be opened so that the solder ball S can be supplied only when the laser processing apparatus according to the embodiment of the present invention is used.

In addition, although only the nitrogen gas was mainly described in the above-described laser processing apparatus, all of the gases that can be used as carriers as inert gases, such as helium gas and argon gas, can be used in addition to nitrogen gas.

Hereinafter, A to F and A'to F'will be described later with reference to FIGS. 14 and 15, which sequentially show some processes as examples of the laser processing apparatus. The flowcharts (A to F) described in Fig. 14 will be briefly described.

First, after the object is loaded, the object moves to the vision inspection position (A), and then the object's alignment, rotation, and placement are detected (B). Then, it is moved to the soldering position (C) to be soldered (D) by the laser processing device. Next, it is moved to the unloading position (E) and unloaded. When the next object is loaded (F), it is moved back to the vision inspection position (A). Meanwhile, an option of moving to a vision inspection position may be added to inspect the quality of soldering after laser soldering.

The flowcharts (A' to F') shown in Fig. 15 will be briefly described. First, when the soldered object is positioned at the unloading position (A), the soldered object is taken out and the object to be soldered is loaded at the unloading position (B) and then moved to the vision inspection position (C). Next, the alignment, rotation and arrangement of the object are detected (D). Then, it is moved to the soldering position (E) to be soldered (F) by the laser processing device. An option that can be added here is the step of moving the object to the vision inspection position (position) to inspect the quality of soldering after laser soldering, and aligning, rotating after detecting alignment, rotation, and arrangement on the object And/or if the arrangement is not normal, the option of moving to the unloading position and unloading and loading again may be added.

The processing sequence described through FIGS. 14 and 15 is controlled by a control unit, and may be described in more detail through FIG. 17 showing a conceptual diagram. Soldering is performed by the machining portion, which includes a head. The head may include at least one of a laser beam focusing optical head and a solder ball depositing device, and the processing unit may further include a nozzle for discharging the solder ball. In addition, the control unit may determine a predetermined state of the nozzle 16, that is, a state such as contamination or damage, and may determine the time of washing or replacement. Furthermore, the control unit can record the laser output and correct the laser output. In addition, quality control of the soldered portion, which is a soldered portion, may be performed by the control of the control unit, which may be controlled to discard or collect the solder balls used in the bonding test and defective solder balls having defects during manufacturing. .

In the quality inspection process, the laser may be re-irradiated on a solder portion that does not meet a predetermined quality standard to re-melt the solder portion, thereby improving solder wettability or removing and re-soldering through re-melting. As another example, it may be classified by a classification device. The control unit may perform control to correct the laser beam position, the nozzle position and the vision inspection position. In addition, the control unit may control the soldering to be performed by the profile of the laser determined by the combination of the output of the laser, the laser irradiation time, the number of laser irradiations, and the slope between the laser output and the irradiation time.

According to the above-described laser processing apparatus and laser processing apparatus and method, an apparatus or method according to an embodiment of the present invention may include the following configurations. Meanwhile, the inspection described below may include a first inspection (pre-inspection) and a second inspection (post-inspection) performed by the inspection unit. In the case of the first inspection (pre-inspection), the alignment state including the seating state, that is, the rotation and the placement state of the object is detected before soldering is performed, and in the case of the second inspection (post-inspection), after the soldering is performed It may be an inspection that detects one or more of cracks and pores in the solder portion. As described below, as a result of the second inspection, an object that does not satisfy the quality criterion may be classified as an object that satisfies the quality criterion, and resoldering may be performed on an object that does not satisfy the quality criterion.

First, the laser supplied from the laser supply device may be a laser having a wavelength with a high laser absorption rate depending on the solder material. In addition, it may be a solid-state laser such as a fiber laser or a diode laser. The laser beam generated from the laser generator can be transmitted to the laser soldering head through the optical fiber without a separate optical mirror. As a result, a stable operation of the laser and precise operation during soldering by laser irradiation may be possible.

Second, the laser processing device may include a pick and place soldering head or a jet soldering head including a laser soldering nozzle 16. The laser soldering head may include a laser beam focusing optical head, a solder ball (S) supply device, and a nozzle 16. Here, if the laser soldering head means a head portion, it may be composed of a single head as well as a dual head including two heads. In addition to this, of course, it may be composed of a head body including three or more heads. When two or more laser soldering heads are included in this way, the productivity of the device can be increased.

Third, it may include a Vision Inspection Module/unit or a Vision Inspection step. By including such a vision inspection module or step, it is possible to inspect the position of the camera module 20 to be soldered, check the alignment status (Pre-Inspection), and check the soldering quality after soldering if necessary (Post-Inspection). can do.

Therefore, 1) equipped with a vision inspection module consisting of a low magnification and a high magnification lens or 2) a motorized variable zoom lens (1X to x18: the maximum magnification can be further increased depending on the zoom lens design). It is possible to automatically inspect a small area at a high magnification and a large area at a low magnification.

Pre-Inpsection and Post-Inpsection can be used as one vision inspection module, but can be configured as separate vision inspection modules to increase productivity (e.g., pre-inspection). (Consists of one for the Pre-Inpsection function and one for the Post-Inpsection function).

When the Pre-Inpsection and Post-Inpsection are provided as one vision inspection module, the object that has undergone the Pre-Inpsection is moved to the location for soldering and soldered. , It can be post-inspected by returning to the previous position. When two vision inspection modules are provided, i.e. one for the Pre-Inpsection function and one for the Post-Inpsection function, the Pre-Inpsection module and laser soldering The object may be sequentially moved and inspected and soldered in the order in which the module and the post-inspection module are positioned.

Moreover, the soldering quality can be monitored in real time to control parameters or to further include an infrared (red) inspection device for post-inspection, such as inspection of internal cracks and pores in the soldered area. .

Fourth, after the post-inspection (Post-inspection) may further include a sorting (Sorting) device that can classify objects that do not meet the required soldering quality standards.

Fifth, after the post-inspection (Post-inspection) may further include a repair device capable of repairing an object that does not meet the required soldering quality standards. Such a repair device may re-irradiate the laser to re-melt the solder portion to improve solder wettability or remove pre-soldered solder and resoldering. When removing the soldered solder, it can be removed automatically by using a mechanical tool such as a pin or by remelting using a laser to suck and remove automatically.

Sixth, for cleaning quality after soldering, a cleaning device including a dust collecting device for removing dust and foreign substances may be further included. The cleaning device may further include one or more of a dry air blowing device, a carbon dioxide snow cleaning device, and an inert gas blowing device.

Seventh, a soldering prepayment part may be further included in advance depending on the type of the substrate to be soldered. In addition, by including a laser soldering head (Soldering Head), it is possible to maximize the soldering quality and improve productivity.

Although not described in the above-described embodiment, it can also be used for bonding where a solvent (solder ball) is not required. That is, the supply of the solder ball (S) as a solvent may be optional, and in the laser processing apparatus in which the supply of the solder ball (S) is not made, it is also used for bonding between metals, bonding between metals and resins, and plastic welding. Can be applied. Depending on the nature of the object to which the laser is irradiated, conditions such as the irradiation intensity of the laser, the irradiation time, and the irradiation cycle may be varied to bond both base materials.

Subsequently, when an additional laser processing method and apparatus are described in addition to FIG. 16 showing the shape of a jig as an embodiment, a plurality of nozzles 16 may be included in the laser processing apparatus. That is, when the solder ball S is supplied to the nozzle 16 side by the hole disk 8, the solder ball S may be provided by the hole disk 8 to correspond to the plurality of nozzles 16. That is, it is possible to selectively provide movements that are not provided to one nozzle 16 among a plurality of nozzles 16 but are provided at the same time. For example, according to the above-described movement, the solder balls S are provided to the sides of the dual laser bonding head, and after being dissolved by the laser, they can be discharged from the head by the discharge of nitrogen gas. The soldering time can be shortened because this process can be performed simultaneously on the two heads. A device in which two heads (dual laser bonding heads) are provided is, for example, a larger number of heads, which can of course improve work efficiency.

And, the laser processing apparatus may further include a jig (jig). The jig may be a rotating fixture jig. A fixture jig channel including a plurality of jigs employing the rotational movement method may be provided. For example, three fixture jig channels may be provided in which three or more jigs moving in a rotational movement manner are provided in combination. The fixture jig channel may include or seat a plurality of objects to be soldered. Here, when performing one or more operations of soldering and bonding to two or more points of the object, if soldering or bonding is performed to one of the two points present in one object, the object is present The jig can be moved so that it can be laser processed at the remaining two points. Here, the movement of the jig may be a rotation, may be a movement by a linear motion, or may be a movement by a combination of the rotation and a linear motion. When the movement is completed, soldering or bonding may be performed at the remaining points.

As a specific example, the first head (laser bonding head 1) performs bonding (bonding) on the first jig section (fixture jig channel 1), and the head 2 (laser bonding head 2) is the third jig section (fixture jig channel) 3) Bonding can be performed on the phase.

When the head (laser bonding head 1 and laser bonding head 2) at each position completes bonding, the first head may perform bonding on the second jig portion.

In addition, when the first jig portion is positioned at an unloading position deviating from the laser irradiation position, the object to which the bonding operation is completed may be taken out. A new object is positioned on the first jig portion from which the object is taken out, so that a joining operation can be waited for.

When the bonding operation is completed with respect to the object located in the third jig portion, the object is taken out and a new object is placed on the third jig portion from which the object is taken out, so that the bonding operation can be waited for.

The first head may perform the bonding operation to the object located on the first jig portion when the bonding operation to the object positioned on the second jig portion is completed.

In addition, when the second jig unit is positioned at the unloading position, the object having completed the bonding operation is taken out, and a new object is positioned on the second jig unit to wait for the bonding operation.

When the second head completes the bonding operation on the object on the third jig unit, the second head may perform the bonding operation on the second jig unit. The above bonding operation is repeatedly performed, and laser processing can be performed.

More specifically, each jig 30 in which a plurality of objects are disposed in a loaded or unloaded position may be mounted on the first jig portion. In addition, each jig in which a plurality of objects are disposed in a loaded or unloaded position may be mounted on the second jig unit. Also, each jig in which a plurality of objects are disposed in a loaded or unloaded position may be mounted on the third jig unit.

When the first jig portion is positioned at the joining work position, the vision inspection unit may check whether the object is to be operated, such as alignment, rotation, and arrangement.

The first head may bond a bonding surface formed on each object disposed on the first jig portion. While the first jig unit performs the bonding operation, the vision inspection unit may check whether or not normal operation of rotation, arrangement, etc. of the alignment state of each object disposed in the third jig unit is performed.

The second head may bond a bonding surface formed on each object disposed on the second jig portion. When the bonding operation of one side of each object disposed on the first jig unit is completed, each jig included in the first jig unit may move to the bonding operation position of the other side. The movement can be rotation.

While the bonding operation is performed on the object disposed in the third jig unit, the vision inspection unit may check the alignment, arrangement, and the like of each object positioned on the first jig unit.

In addition, the other side of the object on the first jig portion that is moved and arranged by the first head may be joined. When the bonding operation is completed, the first jig unit may be moved to the unloading position. When the bonding is completed, the object is taken out on the first jig portion, and a new object may be disposed on the first jig portion.

When one of the two surfaces to be joined of each object disposed in the third jig unit is completed, each jig included in the third jig unit may be moved to a bonding operation position of the other side.

Thereafter, the vision inspection unit may inspect the alignment, arrangement, and the like of each object rotated in the third jig unit. In addition, the second head may join the other side of each object disposed on the third jig portion.

While the second head joins the object positioned on the third jig unit, the vision inspection unit determines the alignment, rotation, and placement of each object disposed on the second jig unit. Can be checked.

The first head joins one surface of each object disposed in the second jig unit, and the first jig unit in which the object to be newly bonded is disposed may wait until the operation of the second jig unit is completed. Therefore, the above process can be repeated for the subsequent work process.

Each object of the fixture jig channel where the work is completed may perform post-inspection with one or two inspectionvision inspection modules/units.

On the other hand, the nozzle 16 is pressurized through a gas such as nitrogen, and in the process of discharging the solvent (solder ball S) located inside, the nozzle 16 is in contact with the inner surface, that is, the molten solvent (16) ) May be contaminated. The contaminants include a solvent that is not discharged but remains and adheres, a foreign substance generated in the process of thermal damage due to the temperature at which the solvent is dissolved, and a foreign substance generated on the surface by repeated discharge of gas (such as nitrogen). can do. When the foreign matter or the like accumulates, there is a possibility that it affects the laser processing efficiency and causes an indeterminate result. Therefore, as a process of inspecting the condition and quality of the nozzle 16, it is necessary to clean it periodically or intermittently. By measuring the degree of contamination, a predetermined level of contamination is reached or determined based on a predetermined unit time. During the cycle, foreign substances and dusts may be removed by a nozzle cleaning unit while being moved to a washing area or washed or an object is not positioned. It may be cleaned by a method such as physical or chemical, and a configuration for performing this, may include a vision unit, a nozzle 16 monitor.

Furthermore, when the laser is irradiated with a preset laser irradiation intensity corresponding to the degree of laser processing, the actual laser intensity (energy) emitted by the laser intensity (energy) output detection unit (laser power (energy) detection unit) ), and when a difference is generated from the preset laser irradiation intensity, the laser intensity may be adjusted to compensate for the difference. Accordingly, the control unit (not shown) and the laser power (energy, output) detection unit are connected to each other to receive the laser intensity (energy, output) detection unit from the laser power (energy) detection unit. The intensity of the irradiated laser can be increased or decreased compared to the preset laser intensity based on the obtained information.

In addition, the laser processing apparatus further includes a waste ball collecting unit that discards or collects the solder ball S used during the bonding test and the defective solder ball S having defects during manufacturing. can do. For example, the solder ball S may be collected and discarded in the process of being moved before being discharged from the nozzle 16 from immediately after the solder ball S is provided to the laser processing apparatus by the waste ball collecting unit.

Meanwhile, a calibration plate for correcting a laser beam position, a nozzle 16 position, and a vision inspection position, further includes a calibration plate (not shown) The calibration plate connected to the control unit immediately detects information on one or more of the absolute and relative coordinates of the laser beam, nozzle 16 and vision inspection. Comparing with the preset value by compensating for the difference from the preset value, the actual beam location, the nozzle 16 location, and the vision inspection location It can be moved to converge to the set value. Furthermore, when it is not located at a preset value, a malfunction associated with laser irradiation can be prevented by not performing a laser irradiation step.

The following drawings are illustratively illustrated to describe a process of determining a soldering position. The soldering object may be the camera module 20 or may be another battlefield. Therefore, it goes without saying that it is not limited to the shape of the illustrated example.

17 is a view showing determining a soldering position according to an embodiment of the present invention.

First, in order to determine the soldering position, the inspection light L may be irradiated from the head 110 toward the soldering target region P2. Here, the head portion 110 is configured to include a nozzle, and may function to discharge the solder ball S. By irradiating the inspection light L, surface information of the soldering target region P2 may be input, and the surface information may be matched with previously input soldering information. Therefore, the soldering target region P2 may be included in the region to which the inspection light L is irradiated.

In addition, when matching is performed through the matched pre-entered soldering information and the surface information, soldering may be performed at the first position SP1 which is a reference value, and the soldering position may be compensated for some unmatched information. Determined and soldering can be performed. The unmatched information will be described below as a positioning factor to specifically describe soldering positioning.

Referring to FIG. 17(a), the inspection light L may be emitted from the head unit 110. The irradiation area of the inspection light L may be an area including an area occupied by the plurality of terminal parts 50 to be soldered so that the plurality of terminal parts 50 are electrically connected to each other by soldering.

And, through the inspection light (L), the laser processing device can detect the position of the terminal portion 50, the separation distance between the terminal portions 50, and the angle between the terminal portions 50, and the like. Through the sensed information, it is possible to determine a location where the solder ball S is discharged, that is, a soldering location. And, by determining the soldering position, it is possible to control the bonding force by soldering and to control the distribution of the solder balls (S). The meaning of adjusting the bonding force means that the area where the solder ball S is in contact with the terminal can be adjusted.

After the soldering position is determined, the head unit 110 may perform soldering. In determining the soldering position, various positioning factors may exist. The positioning factors include the separation distance between the terminals, the size difference of the terminals (the difference in the width or the exposed area), the angle at the time of bonding, and the size of the solder ball S.

To describe the positioning factor, the default will be described later with reference to FIG. 17(b). As shown, when the separation distance and size of the two terminals 50 are the same and the angle at the time of joining is the same as the inputted data and the inspected angle at the inspection light L, and the size of the solder ball S is a predetermined size. , The soldering position is determined as the first position SP1, so that soldering can be performed.

Based on this, the case where the soldering position is changed from the first position SP1 due to the influence of the positioning factor will be described.

18 is a view showing that the solder ball (S) device according to an embodiment of the present invention determines the soldering position according to the separation distance between terminals.

Referring to FIG. 18, a difference may occur in the position where the separation distance between terminals is previously input data (the default value) and the inspection light L. In this case, soldering may be performed from the first position SP1 to the second position SP2, which is a position corrected by a distance reflecting the separation distance.

Here, when the separation distance is the separation in the illustrated X direction, the corrected soldering position, the second position SP2, may also be determined as the compensated position in the X direction. For example, when the center positions of the two terminals 50 are 0.3 mm apart from each other, the soldering position of the second position SP2 is compensated by 0.15 mm from the center position, and the center positions of the two terminals 50 spaced apart from each other Can be determined as. The distance compensated for the separation distance is an example, and, of course, may be changed by other positioning factors, and is not limited to the above values except for other positioning factors.

On the other hand, since the separation distance is compensated and soldered to the determined second position SP2, each terminal 50 has a uniformly formed joint area of the solder ball S, so that soldering is performed at the first position SP1. Conductivity can be improved. For example, when soldering is performed at the first position SP1, one terminal of the two terminals 50 matches the previously input data and the other terminal is not matched. When the first position SP1 is determined and soldering is performed, the other one terminal and the first position SP1 are disposed at a position spaced apart from the one terminal and the first position SP1. Therefore, while the contact area with the solder ball S is formed non-uniformly with the two terminals 50, the conduction property may be reduced. That is, determining the second position SP2 and performing soldering may improve the conduction property and increase the bonding force.

19 is a view showing that the solder ball (S) device according to an embodiment of the present invention determines the soldering position according to the size of the terminal.

Referring to FIG. 19, the sizes of the two terminals 50 may be formed differently from the default values. The size of each of the different terminals 50 is sensed by irradiation with irradiation light, and the position of soldering may be differently determined according to the size of the terminal. That is, the size of the terminal may be included in the positioning factor. Soldering may be performed from the first position SP1 to the second position SP2, which is a compensated position, depending on the size of the terminal. According to FIG. 18, the compensated position, the second position SP2, may be a position moved from the first position SP1 in the X direction. On the other hand, when the positioning of the soldering in a state in which the sizes of the two terminals 50 are different, it may be a position moved in the Y direction from the first position SP1.

Specifically, when the sizes of the two terminals 50 are different, the solder ball S may be discharged to the terminal of the larger size. That is, the soldering position may be determined from the first position SP1 to the second position SP2 in which the soldering position is moved in the Y direction, which is the direction in which the larger terminal is located. This positioning has the effect that the solder ball (S) increases the contact area with the terminal and improves the electrical conductivity.

Of course, if the separation distance and the size between the terminals are all different, these conditions are reflected and the second position SP2 may be determined from the first position SP1 in the X and Y directions.

20 is a view showing that the solder ball (S) device according to an embodiment of the present invention determines the soldering position according to the angle of the bonding surface.

Referring to FIG. 20, a soldering position may be determined by an angle at which two terminals 50 are formed according to an arrangement of joint surfaces to be joined by soldering. When soldering is performed between the two terminals 50, the two members including the two terminals 50 are disposed at a predetermined angle, so that the solder balls S may be positioned in the valley formed while the two members face each other. have.

Therefore, the water level (H1, H2) of the solder ball (S) in the molten state may vary according to the angle of the bone, so the angle of the joint surface may be included in the positioning factor.

Specifically, the larger the joint surface angle, the lower the water level H2 of the molten solder ball S, and the smaller the joint surface angle, the higher the water level H1 of the molten solder ball S may be. Therefore, the degree of reflecting the second position SP2 determined according to the different sizes of the two terminals 50 can be set low. That is, the higher the level of the solder ball S melted in the bone is, the second position SP2 is determined by different sizes, but the determined second position SP2 may have a small soldering positioning effect. This is because the molten solder ball S can sufficiently contact the two terminals 50 due to the small angled valley.

21 is a view showing that the solder ball (S) device according to an embodiment of the present invention determines the soldering position according to the size of the solder ball (S).

Referring to FIG. 21, the likelihood that the two terminals 50 are joined by soldering may be increased because the higher the solder ball S, the higher the water level H1 is formed. That is, when the solder ball S is large, the contact area between the two terminals 50 may be wider than when the solder ball S is small. Due to this effect, when the solder ball S is large, the effect of the positioning of the soldering may be insignificant, and thus the intervention of the positioning process may be lowered.

On the other hand, when the solder ball S is small, the contact possibility between the two terminals 50 is low, and even if the contact between the two terminals 50 is made, the contact between the terminal 50 and the solder ball S according to the soldering position Differences in area may occur. When the difference occurs, the conduction property and the bonding force may be lowered. Therefore, when the solder ball S is small, the intervention of the positioning process may be increased, and further, the contact area of the solder portion may be increased by increasing the number of soldering times two or more times.

Although the exemplary embodiments of the present invention have been described in detail above, those skilled in the art to which the present invention pertains will understand that various modifications are possible within the limits of the embodiments described above without departing from the scope of the present invention. . Therefore, the scope of rights of the present invention should not be limited to the described embodiments, and should be defined not only by the claims to be described later, but also by the claims and equivalents.

1: cap
2: Solder ball inlet
3: storage chamber
4: Nitrogen gas inlet
5: Solder ball outlet port
6: rotating shaft
7: adapter
8: Hall disc
9: Transmission port
10: receiving port
11: Nitrogen gas inlet
12: Solder ball outlet channel
13: transparent glass
14: laser transmission channel
15: nodlock screw
16: nozzle
17: upper base
18: lower base
20: camera module
21: Lens module
22: sensor module
100: laser processing device
110: head portion
50: terminal
L: Inspection light
P1: Inspection light irradiation area
P2: Area to be soldered
SP1: 1st position
SP2: 2nd position
PH1: Preheat
S: Solder ball
PH2: post hit
CD: Cool down

Claims (20)

A head unit that irradiates the inspection light to the object;
Includes a control unit for matching the surface information obtained by irradiating the inspection light and the surface information of the previously input soldering target area; includes,
Through the matching of the surface information, a reference position according to one or more positioning factors of a separation distance between terminals to be soldered, a size difference between terminals to be soldered, an angle formed between terminals to be soldered, and a size of solder balls to be soldered Soldering device, wherein the soldering is performed at the first position or the second position, which is distance compensated from the reference position.
delete The method according to claim 1,
The separation distance between the terminals,
A soldering device, which is a distance spaced apart in the transverse direction or a longitudinal direction, and is a positioning factor that allows distance compensation in the spaced direction.
The method according to claim 1,
The size difference of the terminal,
A soldering device, which is a difference in the direction across the terminal to be soldered, and is a positioning factor that allows distance compensation in the crossing direction.
The method according to claim 1,
The angle formed by the terminal,
The angle formed between the terminals to be soldered,
The degree of distance compensation from the first position decreases as the angle decreases, and the degree of distance compensation from the first position increases as the angle increases.
The method according to claim 1,
The degree of distance compensation from the first position decreases as the size of the solder ball increases, and the degree of distance compensation from the first position increases as the size of the solder ball decreases.
The method according to claim 1,
When the positioning factor is detected, a second position is determined by reflecting one or more factors of the positioning factor, the soldering apparatus.
The method according to claim 1,
The head portion,
A soldering apparatus that performs pre-heating on the soldering target region through a laser before the soldering is performed.
The method according to claim 1,
The soldering apparatus, wherein the soldering target region is included in an area where the inspection light reaches.
The method according to claim 1,
A soldering apparatus that performs soldering on two or more surfaces of the object by rotating the object by rotation of a jig fixing the object.
The method according to claim 1,
The rotation of the jig for fixing the object is rotated by a multi-axis, so that the soldering target position can be changed toward the head portion.
Irradiating the inspection light from the head to the subject,
The surface information of the object obtained by irradiating the inspection light matches the surface information of the previously input object,
As a result of the match, the soldering position is determined to the first position or the second position depending on whether the positional factor difference is detected,
The positioning factor,
The distance between terminals to be soldered, the size of the terminal to be soldered, the angle to be formed by the terminal to be soldered, and the size of the solder ball to be soldered, and the second position is determined by one or more conditions detected among the positioning factors. Is determined,
The second position is a soldering position that is determined by distance compensation from the first position by the difference in the positioning factor, the laser processing method.
The method according to claim 12,
At least one of the first inspection (Pre-Inspection), which detects the alignment of the object by the inspection unit, and the second inspection (Post-inspection), which detects whether internal cracks and pores in the solder portion soldered to the object are generated. A laser processing method further comprising the step of being performed.
The method according to claim 13,
The second inspection (Post-inspection) is performed at the same time as the soldering, laser processing method.
The method according to claim 13,
And further comprising the step of sorting (Sorting) the object by the predetermined quality criteria after the second inspection (Post-inspection), laser processing method.
A jig on which the object is loaded;
A first inspection unit that detects an alignment state of the object loaded on the jig (Detect) and performs a first inspection (Pre-Inspection);
A moving part for loading and unloading the object on a jig;
A second inspection unit selectively performing a second inspection (Post-Inspection) on the object; And
A processing unit including a head unit and a control unit; includes,
The head portion,
Controlled by the control unit, and irradiating the laser to the object,
The control unit,
Match the surface information obtained by irradiating the surface information and inspection light of the previously input soldering target area,
Through the matching of the surface information, a reference position according to one or more positioning factors of a separation distance between terminals to be soldered, a size difference between terminals to be soldered, an angle formed between terminals to be soldered, and a size of solder balls to be soldered A laser processing apparatus in which soldering is performed at a first position that is distance compensated from a first position or a reference position.
The method according to claim 16,
The second inspection (Post-Inspection) is an inspection that detects whether cracks and pores in the soldering are generated, and a laser processing device.
The method according to claim 16,
And further comprising a sorting device for sorting (Sorting) the object by the predetermined quality criteria after the second inspection (Post-Inspection), laser processing apparatus.
The method according to claim 16,
After the second inspection (Post-Inspection) step further comprises a cleaning device (Cleaning Device) for removing dust and foreign matter,
The cleaning device comprises a blower (Dry Air Blowing) device for providing dry air, a carbon dioxide snow cleaning (CO2 Snow Cleaning) device and at least one of an inert gas blowing device, a laser processing device.
The method according to claim 16,
The soldering performed on the object further includes a pre-soldering part that performs pre-soldering before post-soldering.

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