JPH05235536A - Electronic parts correction equipment - Google Patents

Abstract

PURPOSE:To realize automating wherein a robot is used for correction work, instead of the conventional hand working, when inspection is performed and an imperfect parts is corrected, after the electronic parts is mounted on a substrate by soldering. CONSTITUTION:The title equipment is provided with a substrate carrying part 6 which conveys a substrate judged to be imperfect from a supply position to a correction position 8, and a correction head 3 which is moved in the correction position by an X-Y robot and performs correction work. The correction head 3 heats an electronic parts connection terminal as an correction object with laser light, and detaches the object electronic parts by using a parts sucking nozzle connected with a vacuum source. Thereby hand working is not necessary, and correction is enabled while the damage to an electronic parts and a substrate is reduced to a minimum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention inspects a board, to which a large number of electronic parts have been attached and then soldered, with an inspection device, and automatically corrects the failure if a failure is found in the board after soldering. Related to the device.

[0002]

2. Description of the Related Art Recently, electronic circuits have been assembled on a substrate by an IC,
After mounting a large number of electronic parts such as capacitors by a robot, the terminals of the electronic parts are electrically connected by collective soldering. After that, the board after soldering is inspected by an inspection apparatus, and if a defect is found, it is manually corrected.

FIG. 15 shows a state of manual correction work when the solder amount of the terminal 62 of the electronic component 14 is insufficient. As shown in the figure, a rod-shaped solder 101 is used for the soldering iron 1
Melt by 31 and add an appropriate amount. When the amount of solder is excessive, the solder is melted by the soldering iron and the excess solder is sucked by a solder sucker (not shown).

Since the electronic component itself may be defective depending on the content of the defect, in that case, the defective electronic component may be removed and replaced with a normal electronic component. FIG.
Shows the work of removing such an electronic component. When the terminal of the electronic component is heated at the tip of the soldering iron 131 and the solder melts, the tweezers 132 are used to connect the terminal 62b of the electronic component to the substrate. It is removed from the terminal 62a. Since a recent IC or the like has a large number of terminals even with one component, the work of removing the terminals requires a great deal of skill and effort.

[0005]

The above-described manual correction work is a difficult work that requires a long time for a skilled worker. Even a relatively simple defect in which solder is added when the amount of solder is insufficient, if the amount of additional solder is too large, it short-circuits with the adjacent terminal and becomes defective.
Further, when the amount of solder is excessive, if the solder is sucked too much, the connection will be weakened and it will also be defective. The above-mentioned work is becoming more and more difficult due to the high packaging density of recent boards and the extremely close spacing of component terminals.

Further, recent electronic parts such as ICs have a large number of connection terminals, but when an electronic part having such a large number of terminals is to be removed, the solder is melted one by one. Then, it is necessary to repeat the work of removing the terminals as many times as there are terminals, which alone is a troublesome task.
Moreover, if the copper foil terminal portion of the substrate is damaged during such work, the entire substrate eventually becomes defective and must be discarded, resulting in a great economic loss.

The present invention is intended to solve the above problems, and an object thereof is to provide an apparatus for automatically correcting a defect of a substrate.

[0008]

In order to achieve the above object, the present invention provides a board transfer section for transferring a board having a plurality of electronic components fixed by soldering from a board supply position to a component correction position, and the board transfer section. It comprises a substrate preheating unit for preheating the substrate on the path, and a correction head which is supported and moved by a robot operable in the X-axis direction and the Y-axis direction at the component correction position.

Further, according to the present invention, the component correcting head heats the component suction nozzle, which is connected to a vacuum source and whose tip is located above the electronic component at the component correcting position, and the solder of the connection terminal of the electronic component without contact. Means for removing the electronic component by the component suction nozzle while melting the solder of the connection terminal by the heating means.

Further, the heating means of the correction head according to the present invention comprises an optical fiber for transmitting a laser beam from a laser light source to a component correction position, an emission optical section for condensing laser light emitted from the tip of the optical fiber, and the emission light. It consists of a cylindrical lens that focuses laser light emitted from the department onto the substrate in an elliptical shape.

[0011]

With the above-described structure, the present invention requires no manual work, minimizes damage to electronic components and boards, corrects soldering of connection terminals of defective electronic components, and eliminates defective electronic components. Good electronic components can be replaced.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an electronic component repairing device for repairing an electronic component which is determined to be defective. The configuration of this device will be described below.

An XY robot 2 is mounted on the body frame 1.
Is installed, and a correction head 3 described later is locked on the XY robot.

The component transfer device 4 transfers the electronic components stored in the component storage section 5 to the movable range of the XY robot 2. The board 27 is carried by the board carrying section 6 to the component correction position 8 via the board preheating section 7. The operation of the entire component correction device is performed by the operation panel 9 provided on the entire surface of the device. The present embodiment is an example in which a YAG laser is used as a heating source for melting the solder necessary for correcting electronic parts, and YA
The G laser is a laser power source 10 and a laser optical system 1.
1 and is transmitted to the correction head 3 through the optical fiber 12. Reference numeral 13 is a flux applying section.

Next, the basic operation of removing the electronic component at the component correction position 8 will be described with reference to FIGS. Figure 4
14 is an electronic component determined to be defective, and the electronic component 14 has a large number of connection terminals 62a, 62b, 62c, 6
Soldered to the board at 2d. To remove the electronic component from the substrate, the component suction nozzle 34 connected to the vacuum source while melting the solder at the connection terminal 62 is connected.
And pull it up to remove. In this embodiment, a laser beam is used as a heat source for melting solder,
As described in FIG. 1, the laser beam is the optical fiber 12
Is transmitted to the component correction position 8. As shown in FIG. 6, at the tip of the optical fiber 12, there is an output optical part 59 composed of a condenser lens 65, and the output optical part 59 of the optical fiber core system 2 is provided.
Focus the laser light up to 3 times the size. The laser light emitted from the emission optical section 59 is further reflected by the cylindrical lens 6
It is polarized into an elliptical shape by 0 and focuses on the substrate. A plurality of emission optical parts and a cylindrical lens are provided at the component correction position 8 to simultaneously heat the connection terminals 62 surrounding the electronic component as shown in FIG. That is, the laser light emitted from the cylindrical lens 60a melts the solder of the connection terminal 62a, and the laser light emitted from the cylindrical lens 60b melts the solder of the connection terminal 62b (emission optical parts corresponding to the connection terminals 62c and 62d and The cylindrical lens is not shown).

On the other hand, the tip of the component suction nozzle 34 connected to the vacuum source has an electronic component 1 as shown by ΔH in FIG.
Since it is located slightly away from the upper surface of No. 4, when the solder is melted by the heating by the laser light and the joining force of the solder becomes lower than the vacuum suction force, the electronic component 14 is brought into close contact with the component suction nozzle 34 as shown in FIG. Then it is removed upwards.

Next, referring to FIG. 2, a detailed structure of the component transfer device 4, the board transfer section 6, and the board preheating section 7 will be described.

The component transfer device 4 includes a component regulating section 16 having a component regulating claw 15 for precisely regulating the position of the electronic component 14.
The component regulating section 16 is moved on the rail 17 by a transfer motor 18 to transfer the electronic component 14.

The substrate carrying section 6 comprises a pair of carrying rails 21 having a pulley 19 and a carrying belt 20, and the substrate 27 is moved by the operation of the carrying belt 20.

The substrate preheating section 7 includes a substrate preheating box 22.
And a duct hose 23a for supplying the hot air generated by the air dryer 24a to the substrate preheating box 22, and a voltage for adjusting the power supply voltage to a suitable state in order to control the heat quantity of the hot air generated by the air dryer 24a. The regulator 25a is arranged in series.

On the other hand, a board setting cylinder 26 is provided at the component correction position 8 to position the board 27 with high accuracy. At the component correction position 8, the hot air from the air dryers 24b, 24c, 24d is guided by the duct hoses 23b, 23c, 23d in order to prevent the temperature of the substrate 27 from decreasing. In addition, the air dryers 24b, 24c, 24
In order to control the amount of heat of the warm air generated by d, the substrate preheating unit 7
Of the voltage regulators 25b, 25
c and 25d are arranged.

The flux applying section 13 comprises a hydrometer 28, a dirt sensor 29 and a liquid level sensor 30. After the flux 31 is poured into the concave portion of the flux block 32, it is pumped up by the flux applying cylinder 33 and held by the component suction nozzle 34. The flux 31 is applied from below to the bonding electrode portion of the electronic component 14 that is being formed. Also,
Reference numeral 35 is a parts disposal box.

Next, the structure of the correction head unit 3 using vacuum suction as the electronic component removing means will be described with reference to FIG. The correction head 3 is provided on the X-axis mount 36 of the XY robot 2 of FIG. 1 via the LM guide 37 and the head frame 38, slides on the LM guide 37 in the X-axis direction, and its drive is It is performed by a ball screw 39 connected to an X-axis motor (not shown). The spline shaft 40 is locked to the head frame 38 via a bearing 41 and a spline nut 42. Further, the spline shaft 40 can be freely rotated in the θ direction by a rotating means composed of a pulley 43a connected to the spline nut 42, a timing belt 44a, and a nozzle rotation motor 45. Further, as a means for raising and lowering the spline shaft 40, the rotation of the nozzle up / down motor 46 causes the ball screw 4 to pass through the pulley 43b and the timing belt 44b.
7, and the nozzle up / down block 48 is moved up and down. A cam follower 49 is provided on the nozzle upper / lower block 48, and since the cam follower 49 sandwiches the disc 50 locked by the spline shaft 40, the spline shaft 40 is moved in the vertical direction.

Since the spline shaft 40 is splined only on the movable portion of the nozzle and is held by the spline nut 42, it can be operated smoothly in the vertical direction.

The spline shaft 40 has a hollow structure so that the vacuum state generated in the vacuum unit 51 can be controlled by the piping component 52, the hose 53 and the rotatable piping component 5.
4 to the component suction nozzle 34 to suck the electronic component 14. The shaft guide 55 is the spline shaft 4
It is a sliding guide provided to suppress the shake of 0 in the rotation direction, and is installed on a block 56 locked to the head frame 38.

The spring 57 provided between the spline shaft 40 and the component suction nozzle 34 serves to absorb the impact force generated when the spline shaft 40 descends to mount the electronic component 14 on the substrate 27. do.
Reference numeral 58 denotes an air pipe, which blows air for cooling the solder melted by the laser light. 59a, 59b,
Reference numerals 59c and 59d denote laser light emitting optics, and 60a and 6d.
Reference numerals 0b, 60c and 60d denote cylindrical lenses, and 61 denotes a light shielding plate.

Next, the operation of correcting the electronic parts will be described. 1 to 6, based on the data of the defective portion and the content obtained by the board inspection, if the electronic component is misaligned or the electric characteristic is defective, the correction head 3 locked by the XY robot 2 should be corrected. The nozzle vertical motor 45 is driven to rotate the ball screw 47 so as to face the electronic component 14, and the component suction nozzle 34 is lowered to the height of ΔH from the upper surface of the electronic component 14 as shown in FIG. Vacuum suction unit 51 provided on
The electronic component 14 is vacuum-sucked by the suction nozzle 34, and at the same time, the laser light transformed into an elliptical shape by the cylindrical lens 60 is collectively applied to the joint portion 62. When the solder is re-melted by the heating by the laser light and the bonding force of the solder is lower than the vacuum suction force, the vacuum suction force removes the electronic component 14 upward (FIG. 5). Since the vacuum degree of the vacuum suction unit 51 rises when the electronic component 14 is sucked by the suction nozzle 34, the pressure detecting means 63 detects the vacuum degree to judge that the removal of the electronic component 14 is completed. Electronic component 1 removed
In step 4, the XY robot 2 moves the correction head 3 to the parts discard box 35 and discards it.

Next, the non-defective electronic component 14 stored in the component storage section 5 is transferred to the component control section 16 on the component transfer apparatus 4 shown in FIG. 2 by transfer means (not shown). .. On the component regulating section 16, the component regulating claw 15 is attached to the electronic component 1.
4 is subjected to position regulation, and at the same time, the component regulation section 16 itself moves on the rail 17 by the drive of the transfer motor 18. The electronic components 14 thus stored in the component storage section 5
Are sequentially transferred to the movable range of the XY robot 2 in a state where the position is regulated. The correction head 3 described with reference to FIG. 3 is made to face the electronic component 1 at a predetermined position above the electronic component 14 thus transferred by the XY robot 2.
4 is sucked by the component suction nozzle 32.

Next, the attracted electronic component 14 is positioned above the flux applying section 13 shown in FIG. 2, the flux 31 is applied to the electronic component 14, and the new electronic component 14 is moved to the position of the defective removed electronic component. List. Then, the solder again melts the solder on the joint portion 62 on the substrate 27, the nozzle vertical motor 46 lowers the component suction nozzle 34 to press the electronic component 14 against the substrate 27, and the solder is heated and joined to correct the electronic component. To complete.

At this time, the board 27 is already preheated by the upstream board preheating unit 7 shown in FIG.
Since it is being preheated by the hot air from the air dryers 24b, 24c, 24d even when it is in the component correction position 8, it is possible to mitigate the thermal damage due to the rapid heating by the laser. it can.

Usually, a plurality of electronic components are already soldered to the substrate, and when the internal temperature of the substrate preheating unit 7 on the substrate transport unit 6 becomes too high, the solder melts and the electronic components are lost. Air dryer 24a
The amount of heat of the warm air generated by is adjusted to a suitable value by the voltage adjuster 25a. Further, the air dryers 24b, 24c, which supply hot air to the component correction position 8,
For the same reason, the voltage regulators 25b, 2
5c and 25d are arranged to maintain the preheating effect.

Since a plurality of electronic components are already connected when the electronic component is repaired, if the elliptical shape remains, the solder of the adjacent electronic components may be melted or the electronic component itself may be damaged by the laser beam. Cause. Therefore, as shown in FIG. 3, by providing a light shielding plate 61 on the optical path of the laser light, it is possible to prevent the influence on the surroundings and to irradiate only a necessary portion. An infrared temperature measuring device (not shown) is provided near the emitting optical section 59 to measure the temperatures of the substrate 27, the electronic component 14, and the connection terminal 62. Figure 7
Shows the temperature change near the connection terminal 62, and at the time T _{0 when} it is loaded into the component correction apparatus, the substrate 27 is at almost the same temperature as the room temperature S ₁ . The substrate 27 is the substrate preheating unit 7
Is preheated around the preheating temperature S ₂ (about 100 to 120 ° C.), and is transported to the component correction position 8 at time T ₁ . At this time, inside the substrate preheating unit 7, the temperature of the substrate is the preheating temperature S.
_Since the heat quantity of the air dryer 24a is adjusted by the voltage regulator 25a so that the voltage does not rise to more than ₂ , even if the board 27 may stay inside the board preheating part 7 due to an abnormality in the device, soldering There is no possibility that the solder in the bonded portion of the electronic component is melted and the electronic component is out of stock. At time T ₂ , as shown in FIG. 5, when the laser light is irradiated so as to face the upper side of the electronic component 14, the temperature rises rapidly, but the temperature rises temporarily near the melting point S _{3 at} which the solder is remelted. Time T ₃ when the solder stops and the melting of the solder is completed
Then, the temperature rises sharply again.

Here, when the solder melts and the joining force of the solder becomes weaker than the vacuum suction force, the electronic component 14 is removed, the electronic component 14 is sucked by the suction nozzle 34, and the increase in the degree of vacuum is detected by the pressure detection means 63. Then the laser irradiation is stopped.
At that time, the time is T ₄ and the temperature is the temperature S ₄ . Figure 4,
When the electronic component 14 has a plurality of bonding electrode portions as shown in FIG. 5, the time until the solder melts differs depending on the respective bonding electrode portions. For example, as shown in FIG. 8, if the time until the solder is melted varies from place to place, such as T _{a to} T _d , the bonding electrode laser with a long time starts irradiation early and all the solder melts. Irradiation of a plurality of lasers is controlled so that the time T ₃ to be adjusted is made uniform. In this way, when there is a difference in the melting time depending on the pattern of the board 27 or the electronic component 14, the solder is heated from the place where it is difficult to melt, and the heat damage to the board 27 and the electronic component 14 is performed without excessive heating. Can be minimized.
Further, since the timing of melting all the solder is controlled to be constant, it is not necessary to continuously perform vacuum suction until the solder is melted and the bonding force of the solder becomes lower than the pulling force of the vacuum. After the solder melts, the component suction nozzle 34
It can be removed by pressing and vacuum suction. Thus, by measuring the temperature, it is possible to detect the preheating temperature and the abnormality in the heating when the solder is melted, and it is possible to prevent the unmelting of the solder and the burning of the substrate. The electronic parts removed by the above work are subjected to shape inspection and electric characteristic inspection, and if they are non-defective, they are reused. If it is defective, discard it in the waste box. In the above embodiment, the laser optical system 11 is a half mirror (not shown).
Optical fiber 12
Can be provided in plurality, and a plurality of joints of the electronic component can be simultaneously irradiated. If the substrate is a multi-layer substrate, the joint is an earth land, or the electronic component is a housing, it is necessary to constantly heat the substrate or the electronic component because the heat capacity is large. It is valid.

Further, in the above embodiment, the vacuum suction is used as the means for removing the electronic component. However, depending on the shape of the electronic component, the vacuum suction may not be used. Therefore, a method for removing electronic components that cannot be vacuum-sucked will be described below.

9 and 10 show the mechanical removing means. Similar to the suction nozzle, the mechanical removal means is provided on the correction head 3 that is locked to the XY robot 2, and is connected to the tip of the spline shaft 40 in FIG. The mechanical chuck 93 has a claw 94 and an opening / closing cylinder 95, and can hold the electronic component 14. A spring 96 is provided above the opening / closing cylinder 95, and the spring 96 constantly pulls the mechanical chuck 93 upward, and the upper limit sensor 97 detects the upper limit.

The operation of the mechanical detaching means will be described. The correction head 3 is opposed to above the electronic component 14, and the mechanical chuck 9 is driven by the nozzle vertical motor 46 shown in FIG.
Drop 3 Opening / closing cylinder 9 of the mechanical chuck 93
5, the claw 94 is closed, the electronic component 14 is gripped, the nozzle vertical motor 46 is lifted upward by ΔH, and the laser light is emitted while being constantly pulled upward by the spring 96. When the solder is re-melted and the joining force of the solder becomes weaker than the elastic force of the spring 96, the electronic component 14 is removed, the upper limit sensor 97 detects this, and the completion of removal of the electronic component is detected.

Further, the joining of the electronic components can be corrected by transferring the electronic components by a mechanical chuck as in the case of vacuum suction.

The correction work when the electronic component is removed has been described above, but as the next embodiment, a method of correcting a defect due to excess solder or insufficient solder at the connection terminal portion, not the electronic component itself is described. To do. Of course, in this case as well, it is needless to say that the preheating effect is exhibited by preheating the substrate as in the above embodiment.

In the case of excess solder as shown in FIG. 11, laser is locally irradiated to melt the solder, and the solder sucker 9 is used.
The solder is removed by 8 and the joint failure due to the excess solder is corrected. At this time, since the solder is not removed too much, the inspection pin (not shown) can be used to detect the conduction between the joints, and the correction can be finished when the conduction is lost.

In the case of insufficient solder as shown in FIG. 12, the dispenser 99 supplies the cream solder 100 to the insufficient solder portion and locally irradiates the laser to melt the cream solder 100 to perform solder joining. Correct the joint failure. Here, the cream solder 10 is used as the bonding medium.
Although 0 was used, the same effect can be obtained by supplying the thread solder 101.

Further, in the above embodiments, the air dryer was used as the heat source of the substrate preheating section 7, but other light irradiating means such as a xenon lamp or an infrared lamp shown in FIG. 13 may be used, and also shown in FIG. The heat block 103 having the heater 102 built therein is used as a heat source, and the heater driving means 104 is used.
With the method of preheating the substrate 27, the same effect can be obtained.

As described above, according to the electronic component repairing apparatus of the present invention, the connection terminal of the defective electronic component can be repaired without requiring manual work.

[0044]

As is apparent from the above embodiments, according to the present invention, a substrate in which a defect is found by the inspection device is conveyed from the supply position to the correction position and is automatically corrected by the correction head at the correction position. Since it is possible to perform work, it is possible to completely eliminate conventional manual work, and it is possible to minimize damage to electronic components and boards during repair work, thus improving productivity, and It is a great place to contribute to quality improvement.

[Brief description of drawings]

FIG. 1 is an external view of an electronic component correcting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a board conveying section, a board preheating section, and a correction position of an electronic component correcting apparatus according to an embodiment of the present invention.

FIG. 3 is a perspective view of a repair head of an electronic component repair apparatus according to an embodiment of the present invention.

FIG. 4 is a perspective view of the electronic component repairing apparatus according to the embodiment of the present invention when the heating means is operated while the component suction nozzle is close to the electronic component.

FIG. 5 is a perspective view when an electronic component is removed by a component suction nozzle in the electronic component correction device according to the embodiment of the present invention.

FIG. 6 is a sectional view of a laser optical system of a heating means of an electronic component repairing device according to an embodiment of the present invention.

FIG. 7 is a diagram showing a temperature change of an object in the electronic component repairing apparatus according to the embodiment of the present invention.

FIG. 8 is an operation timing chart of the heating means of the electronic component correcting apparatus according to the embodiment of the present invention.

FIG. 9 is a perspective view of a mechanical detaching means of an electronic component repairing device according to an embodiment of the present invention.

FIG. 10 is an operation explanatory view of a mechanical detaching means of the electronic component correcting device according to the embodiment of the present invention.

FIG. 11 is an explanatory diagram of a solder sucking operation of the electronic component repairing device according to the embodiment of the present invention.

FIG. 12 is an explanatory diagram of a solder addition operation of the electronic component repairing device according to the embodiment of the present invention.

FIG. 13 is a conceptual diagram of a second embodiment of the substrate preheating method of the electronic component repairing apparatus according to the embodiment of the present invention.

FIG. 14 is a conceptual diagram of a third embodiment of a substrate preheating method for an electronic component repairing apparatus according to an embodiment of the present invention.

FIG. 15 is an explanatory diagram of a manual board correction work of a conventional example.

FIG. 16 is an explanatory view of a conventional manual removal work of an electronic component.

[Explanation of symbols]

 3 Correcting Head 4 Component Transfer Device 6 Substrate Transfer Section 7 Substrate Preheating Section 8 Component Correcting Position 12 Optical Fiber 22 Substrate Preheating Box 23 Duct Hose 24 Air Dryer 25 Voltage Regulator 27 Substrate 34 Component Adsorption Nozzle 40 Spline Shaft 59 Emitting Optical Unit 60 Cylindrical Lens 61 Light shield 62 Connection terminal 63 Pressure detection means

Claims (13)

[Claims] 1. A board transfer section for transferring a board, to which a plurality of electronic parts are fixed by soldering, from a board supply position to a part correction position, a board preheating section for preheating the board on the board transfer path, and the part correction. An electronic component correction device including a correction head that is supported and moved by a robot that can move in the X-axis direction and the Y-axis direction at a position. 2. A correction head comprises a component suction nozzle whose tip is connected to a vacuum source and whose tip is located above the electronic component at the component correction position, and heating means for heating the solder of the connection terminal of the electronic component in a non-contact manner. The electronic component correcting apparatus according to claim 1, wherein the electronic component is removed by the component suction nozzle while melting the solder of the connection terminal by the heating means. 3. The heating means of the correction head comprises an optical fiber for transmitting a laser beam from a laser light source to a component correction position, an emission optical section for condensing the laser beam emitted from the tip of the optical fiber, and the emission optical section. 3. The electronic component repairing device according to claim 2, comprising a cylindrical lens that focuses the emitted laser light on the substrate in an elliptical shape. 4. A board preheating section, a board preheating box, an air dryer for generating hot air, and a duct hose for transmitting hot air from the air dryer to the board preheating box.
The electronic component correcting apparatus according to claim 1, comprising a voltage regulator that controls the hot air temperature of the air dryer. 5. An air dryer for generating hot air for heating the substrate at the correction position, a duct hose for transmitting hot air from the air dryer to the substrate at the correction position, and a voltage regulator for controlling the hot air temperature of the air dryer. 2. The electronic component correcting apparatus according to claim 1, wherein is arranged at a correction position. 6. A component suction nozzle is attached to the tip of a spline shaft having a hollow center, and an up / down means for moving the spline shaft in the axial direction and a rotating means for rotating the spline shaft about the axis. The electronic component correcting apparatus according to claim 2, further comprising: 7. A pressure detecting means for measuring the degree of vacuum is provided in the middle of a pipe connecting the component suction nozzle and the vacuum source, and completion of removal of the electronic component is detected by the degree of vacuum by the pressure detecting means. Electronic component repair device. 8. The electronic component repairing apparatus according to claim 3, wherein in the heating means, a part of the laser light is shielded by a light shielding plate in the middle of the optical path from the cylindrical lens to the focal point. 9. The electronic component repairing apparatus according to claim 3, wherein the heating time of the laser light is controlled based on the heat capacity of the object to be heated to prevent unnecessary heating and minimize damage to the substrate. 10. An electronic component repairing apparatus according to claim 3, wherein an infrared temperature measuring device is arranged in the vicinity of the emitting optical section, and the heating time of the heating means is controlled based on the temperature measurement data of the object by the infrared temperature measuring device. .. 11. The correction head comprises a mechanical removing means having a plurality of opening and closing claws and a heating means for heating the solder of a connection terminal of an electronic component in a non-contact manner. 2. The electronic component correcting apparatus according to claim 1, wherein the electronic component correcting device is located above the electronic component, and the heating means melts the solder of the connection terminal while the nail of the mechanical detaching means grips and removes the electronic component. 12. The electronic component repairing apparatus according to claim 1, wherein the substrate preheating section uses an infrared lamp as a heat source. 13. A board transfer part for transferring a board, to which a plurality of electronic parts are fixed by soldering, from a board supply position to a part correction position, a board preheating part for preheating the board on the board transfer path, and the part correction. A correction head that is supported and moved by a robot that can move in the X-axis direction and the Y-axis direction at a position, and component transfer that transports a good electronic component to the component correction position after removing a defective electronic component by the correction head. An electronic component correction device consisting of a device.