JP3367110B2 - Component connection method and component connection device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting electronic parts .
And connection device .

[0002]

2. Description of the Related Art Conventionally, when mounting an electronic component on a circuit board, an adhesive is applied to the electronic component mounting position on the circuit board and reflow solder is applied to the electrode. The electronic component supply unit sucks the electronic component to be mounted by the suction nozzle, conveys the electronic component to the electronic component mounting position on the circuit board, mounts the electronic component, and temporarily fixes the electronic component with an adhesive. When the mounting of all electronic components is completed, the circuit board is inserted into a reflow furnace, the reflow solder is reflowed, the electronic components are permanently fixed by soldering, and electrical connection is performed.

Further, when soldering weakly heat-resistant electronic parts that cannot be collectively reflow-soldered as described above, or electronic parts that cannot be ultrasonically cleaned, such as a crystal oscillator, from FIG. 23. Soldering was performed according to the flow shown in FIG. 23 is a method for manually soldering a weak heat resistant electronic component, and FIG. 24 is a method for low temperature reflow soldering a weak heat resistant electronic component, which is a composite module component 96 including a plurality of electronic components. When soldering a weak heat-resistant electronic component such as the above, if soldering is performed by batch reflow at the same time as other electronic components, the solder that electrically couples the electronic components on the composite module component 96 will melt. Such a composite module component is usually soldered by low temperature reflow, because the module may be destroyed.

Further, FIG. 25 is a flow chart of soldering an electronic component such as a crystal oscillator, which cannot be ultrasonically cleaned, to a substrate by a manual work, and FIGS.
The state of the manual soldering work whose flow is shown in FIG.

[0005]

However, in the above-mentioned conventional method of connecting electronic components, first, since the binding force of the electronic components by the adhesive is small, the handling of the circuit board while the electronic components are temporarily fixed is handled. Was difficult and the workability was poor. If the binding force of the adhesive is increased in order to solve this problem, a stringing state occurs when the adhesive is applied to the circuit board, which makes stable application difficult and lowers productivity.

Further, two steps are required: a step of mounting electronic components on a circuit board and temporarily fixing them with an adhesive, and a step of inserting the circuit board into a reflow furnace and permanently fixing the electronic components to the circuit board. Therefore, there is a problem that the area productivity is low.

In addition, when weakly heat-resistant electronic components that cannot be collectively reflow-soldered or electronic components that cannot be cleaned such as a crystal oscillator are soldered to a substrate, in many cases, as shown in FIG. Since it is carried out manually, the soldering quality is easily influenced by the degree of skill of the operator, and it is difficult to reduce the variation in the soldering quality.
There was a problem that it was not suitable for mass production.

Further, when manually soldering an electronic component that cannot be cleaned to a substrate, as shown in FIG. 26, a soldering iron 98 is used to preheat the substrate electrode portion and the electronic component before soldering. Since 95 is supplied and melted and the two are electrically connected by pouring into the connection portion, when solder is melted, minute solder balls 99 scatter and stay on the substrate, impairing the function of the electronic circuit. Since there is a potential problem, normal electronic components are collectively cleaned after soldering. However, for electronic components containing the crystal oscillator 97, ultrasonic waves may destroy the crystal oscillator. Therefore, there is a problem that cleaning is impossible and there is no way to hit.

Further, in the case of low temperature reflow soldering of a weak heat resistant electronic component such as a composite module component 96 composed of a plurality of electronic components, the melting point of the low temperature solder is about 150 ° C., on the other hand, this composite module component is constituted. Since the melting point of the eutectic solder connecting the electronic components is close to 183 ° C., the eutectic solder melts and destroys the module unless the temperature is carefully controlled during low temperature reflow. have.

In view of the above-mentioned conventional problems, the present invention stably mounts various kinds of electronic components including weak heat resistant electronic components and electronic components that cannot be washed on a substrate by an automatic machine without damaging the characteristics. It is an object of the present invention to provide a method and a device for soldering to.

Also, a method of joining electronic components, which is capable of improving productivity by mounting and permanently fixing electronic components in one step, and a method thereof.
The purpose is to provide a device .

[0012]

In order to achieve the above object, the component connecting method of the first invention of the present application is a suction nozzle made of a light-transmitting material, and a processing light beam irradiation means for irradiating a processing light beam through the suction nozzle. In the component connecting device equipped with
While the component is transferred and gripped by the suction nozzle, the component is positioned above the electrode portion of the substrate that has been surface-treated in advance, and the processing light beam is generated by the processing light beam scanning means provided on the axis of the suction nozzle. The component electrode portion or the substrate electrode portion is scanned through the suction nozzle to be preheated, and then the component is brought into close contact with the substrate electrode portion, and subsequently the processing light beam is irradiated to connect the component to the substrate. Further, in order to achieve the above object, the component connecting method of the second invention of the present application is a component connecting device comprising a suction nozzle and a processing light beam irradiation means for irradiating a processing light beam, wherein the component held by the suction nozzle is A component connecting method for connecting onto a substrate, wherein the processing beam is applied to the electrode portion of the component and the substrate by the processing beam irradiating means in a state where the suction nozzle holds the component above the substrate before mounting the component. And the electrode part of the component and the electrode part on the substrate are preheated to a temperature at which soldering is possible. In order to achieve the above object, the component connecting method of the third invention of the present application recognizes a mark on a substrate by using a recognition optical system for recognizing the processing light beam irradiation position,
The recognized mark is recognized by the mark recognition means provided integrally with the suction nozzle, and the scanning position of the processing beam scanning means is corrected based on the result of recognition of the mark by both of them.

Further, in order to achieve the above object,
4 parts connecting device of the present invention includes a suction nozzle to be connected to the substrate by grasping the part, before mounting the components, in a state where the suction nozzle grips the parts above the substrate, the electrode portion of the working beam components And a processing light beam irradiation means for irradiating the electrode portion on the substrate and preheating the electrode portion of the component and the electrode portion on the substrate to a temperature at which soldering is possible.

[0014]

According to the first invention of the present application, with the above configuration, the electrode portion of the component and the electrode portion of the substrate are preheated before mounting.
By doing so, the influence of the distortion of the electrode part due to the temperature rise
With the component removed, the component is mounted and the electrode of the component and the board are electrically charged.
After connecting with the pole and mounting, continue to the electrode of the component
Precise soldering by heating the electrode part of the board
I can get hurt. As a result, the reflow process in the reflow furnace can be eliminated.

Further, according to the second and fourth inventions of the present application, by the structure described above, the electrode portion of the component and the electrode portion of the substrate are preheated before mounting, so that the influence of the distortion of the electrode portion due to the temperature rise is exerted. It is possible to mount the component and join the electrode portion of the component and the electrode portion of the substrate in a state where the component is excluded. That is, in the state where the component part is mounted and the electrode part of the component and the electrode part of the substrate are in contact with each other, the electrode part of the component and the electrode part of the substrate expand while being pressed against each other, resulting in mutual strain. It is possible to prevent a problem in which the joining occurs while the extra stress remains and the extra stress remains. Further, since the processing light beam is applied to the electrode part of the component and the electrode part on the board, the temperature of the preheating of the electrode part of the part and the electrode part on the board can be controlled under the same conditions at the same time. Can be attached. Therefore, in the component mounting process, the electrode part of the component and the electrode part on the board can be preheated to a solderable temperature and the electrode part of the component can be soldered to the electrode part of the board. Soldering can be performed under suitable conditions. Further, according to the third invention of the present application, with the above-mentioned configuration, the mark on the substrate is recognized by using the recognition optical system for recognizing the processing light beam irradiation position, and the recognized mark is integrated with the suction nozzle. The processing light beam scanning means corrects the scanning position of the processing light beam scanning means on the basis of the result of recognition by the processing light beam and the recognition of the mark by both the processing light beam scanning means and the processing light beam scanning means.

Further, even weakly heat resistant electronic parts and electronic parts which cannot be washed can be stably soldered on the substrate without impairing the characteristics thereof.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view of a head portion of an electronic component connecting device according to the present invention, and FIG. 2 is a perspective view of the entire electronic component connecting device. In FIG. 2, on the main body frame 46,
An XY robot 42 is installed, and a head portion 49 is mounted on the XY robot 42. The head portion 49 transfers electronic components and supplies the electronic components onto a substrate for connection. The component transfer device 51 transfers the electronic components stored in the component storage unit 50 within the movable range of the XY robot 42. The board 41 is carried to the board preheating section 45 and the component connection position 44 by the board carrying section 48.

The operation of the entire electronic component connecting apparatus is performed by the operation panel 47 provided on the front surface of the apparatus. In this embodiment, a YAG laser is used as a heating heat source for connecting electronic parts. The YAG laser is a laser power source 54.
The laser light is generated by the laser optical system 53 and transmitted to the head unit 49 through the optical fiber 1.
52 is a flux application part.

Next, referring to FIG. 3, a detailed structure of the component transfer device 51, the board transfer section 48, the board preheating section 45 and the flux coating section 52 will be described. The component transfer device 51 has a component control claw 60 that positions the electronic component 40 with high precision, and the component control section 59 moves the rail 58 on the rail 57.
The electronic component 40 is transferred by being driven by the electronic component. The substrate transport unit 48 includes a pair of transport rails 74 having a pulley 63 and a transport belt 73, and moves the substrate 41 by the operation of the transport belt 73.

The substrate preheating section 45 is composed of a duct hose 64a for supplying the hot air generated from the air dryer 61a to the substrate preheating box 75, and controls the heat quantity of the hot air generated from the air dryer 61a, so that the power supply voltage is suitable. The slidac 62a which adjusts to such a state is arranged in series.

On the other hand, a board setting cylinder 65 is provided at the component connecting position 44 to position the board 41 with high accuracy. Further, in order to prevent the temperature of the substrate from decreasing, warm air from the air dryers 61b, 61c, 61d is guided by the duct hoses 64b, 64c, 64d. Further, in order to control the amount of heat of the warm air generated by the air dryers 61b, 61c, 61d, the slidac 62b, 62d are controlled.
c and 62d are arranged.

The flux applicator 52 includes a hydrometer 66 and a dirt detection sensor 67. After the flux 71 is poured into the recess of the flux block 70, the flux applicator upper and lower cylinders 69 draw it up and the tip nozzle 23 holds the electron. Flux is applied to the electrode portion of the component 40 from below.

Next, the structure of the head portion 49 will be described with reference to FIG. The head unit 49 is mounted on the X-axis mount 10 of the XY robot 42 (FIG. 2) on the LM guide 9 and the head frame 1.
3 is installed via the LM guide 9, slides in the X-axis direction on the LM guide 9, and is driven by a ball screw 8 connected to an X-axis motor (not shown). The head unit 49 is roughly classified into a scanning optical unit 27 that scans a laser beam.
Can be divided into a holding part 32 that holds and transfers electronic components.

The nozzle 23 at the tip of the grip 32 is an electronic component 4
0 is sucked and gripped, but the tip nozzle 23 is locked to the nozzle 21 via the compression spring 39 and the nozzle holder 22 in a vertically cushionable state. The nozzle 21 is inserted and fixed in a hole provided in the center of the light transmitting plate 38, and the light transmitting plate 38 together with another light transmitting plate 36 that is arranged to face the light transmitting plate holder 20. It is fixed to. On the outer periphery of the transparent plate holder 20,
A large number of ventilation holes 19 are provided, and these ventilation holes 19
Is connected to the vent hole 17 of the inner holder 18 and the port 16 of the outer holder 15 in a state where the airtightness is maintained sufficiently. Therefore, when vacuum suction is performed from the port 16 of the outer holder 15, A negative pressure is generated on the component suction surface of the nozzle 23, and the component can be suction-held. Conversely, if compressed air is supplied from the port 16 of the outer holder 15, the suction state of the component at the tip nozzle 23 can be released.

The inner holder 18 and the cross roller bearing 34 together with the outer holder 15
The cam follower 12, the pulley 33, and the timing belt 6, which are locked in a rotatable state with respect to the rotation direction, are slidably in contact with the groove portion above the outer holder 15 in the rotational direction. It is transmitted from a motor (not shown) via. On the other hand, in the vertical direction, the outer holder 15 itself can be moved by driving the nozzle vertical motor 28 via the ball screw 30 and the coupling 29.

Next, the scanning optical section 27 will be described.
The laser light transmitted from the laser optical system 53 through the optical fiber 1 is guided to the collimator lens system 2 of the scanning optical unit 27, collimated to a size of about 1 to 3 mm which is optimum for soldering, and then the dichroic. Mirror 3
Is reflected by the galvanometer 24 and guided to the mirror 25 which can be swung in the X direction by the galvanometer 24, and the mirror 26 which can be swung in the Y direction by the galvanometer 11 to be sequentially reflected.

Next, this laser light is emitted from the fθ lens 31.
The surface of the substrate 41 is irradiated in a telecentric manner by the action of. Further, since the dichroic mirror 3 has a property of reflecting laser light but transmitting visible light, the optical axis of the dichroic mirror 3 coincides with that of the laser light reflected by the dichroic mirror 3, and the laser irradiation point on the substrate 41 is With the CCD camera 4 arranged so as to form an image on the CCD element, the laser irradiation point on the substrate 41 can be recognized no matter how the galvanometers 24 and 11 scan the laser beam.

Further, a half mirror 5 is provided on the optical axis that connects the CCD camera 4 and the dichroic mirror 3, and a temperature sensor 7 is placed on the opposite side of the half mirror 5 from the CCD camera 4 to form a half mirror. The optical axis coincides with the light beam reflected by 5 and the temperature of the laser irradiation point on the substrate 41 is arranged so that the temperature can be measured. Therefore, no matter how the galvanometers 24 and 11 scan the laser, The temperature at the laser irradiation point on 41 can be measured.

Further, in the peripheral portion of the transparent plate 38, it is possible to detect the reflected light of the laser light applied to the electrode portion of the electronic component 40 and provide the position information of the point where the reflected light hits. The shape detecting means 37 is provided. Of the above description, FIG. 4 is a diagram showing a simplified outline of the irradiation path of the laser light.

Next, the operation of the component connecting device will be described. 1 to 4, the electronic component 40 accommodated in the component accommodating section 50 is transferred to the component regulating section 59 on the component transfer apparatus 51 by a transfer means (not shown). On this component regulation part 59, the component regulation claw 60 regulates the position of the electronic component 40, and at the same time, the component regulation part 59 itself moves on the rail 57 by the drive of the transfer motor 58. Parts storage section 5
The electronic components 40 housed in 0 are sequentially transferred within the movable range of the XY robot 42 in a state where the position is regulated.

Next, the head portion 49 engaged with the XY robot 42 is positioned opposite to a predetermined position above the electronic component 40 which has been transferred after completion of position regulation, and the nozzle vertical motor 28 is driven. At the same time when the outer holder 15 is moved down by being transmitted to the ball screw 30, a vacuum pump (not shown) connected to the port 16 of the outer holder 15 is operated to adsorb the electronic component 40 to the tip nozzle 23.

Next, the tip nozzle 23 sucking the electronic component 40 is raised again together with the outer holder 15 so that the electronic component 40 is located at a predetermined position above the flux block 70 of the flux applying section 52 so as to face XY. The robot 42 is moved. In the flux applying section 52, the flux block 70 previously submerged in the flux 71 whose specific gravity, dirt condition and liquid level are controlled by the hydrometer 66, the dirt detecting sensor 67 and the liquid level sensor 68 is applied. It is moved up and down by the up and down cylinder 69, and the flux 71 is pumped up into the concave portion and applied to the electrode portion of the electronic component 40 which is located above and above it. After applying flux, flux block 7 again
0 is lowered by the flux applying upper and lower cylinders 69 to sink into the flux 71, and a series of flux applying operations is completed.

The flux is applied to clean the electrode part of the substrate and the electronic parts, to remove the oxide film adhering to the electrode part, and to reduce the surface tension of the solder at the time of soldering. This is so that the melted solder spreads to every corner of the electrode portion. When cream solder is applied to the supplied substrate in advance, the flux applying step is not necessary because the cream solder itself contains flux.

After the position of the electronic component 40 with the flux applied to the electrode portion is recognized by the component recognition camera 43, the board setting cylinder 6 is placed at the component connection position 44.
It is moved by the XY robot 42 to a predetermined position above the substrate 41 whose position is regulated by 5. At this time, the board 41 has already been preheated to a temperature suitable for component connection by the upstream board preheating unit 45 and then conveyed to the component connection position, and even when waiting at the component connection position, the air dryers 61b, 61c are also provided. , 61d continue to be preheated by the warm air.

This component connecting device is used for the subsequent mounting of an electronic component that may be thermally destroyed or the electrical characteristics thereof may be impaired in a normal mounting process involving reflow. Many electronic components are already soldered to the board that is installed and supplied after. Therefore, if the temperature of the board becomes too high in the board preheating section of this apparatus, the solder of the electronic components that have already been reflow-soldered by melting may melt and the electronic components may be missing. Therefore, the heat quantity of the warm air generated by the air dryer 61a is adjusted to a suitable quantity by the sliderac 62a and supplied to the substrate preheating box 75. Further, also for the air dryers 61b, 61c, 61d supplying the hot air to the component connecting position 44, the slidac 62b, 62c, 62d are arranged for the same reason to maintain the preheating effect.

Further, as shown in FIG. 5, with respect to the electrode portion of the component whose position is recognized by the component recognition camera 43,
By sequentially scanning and irradiating the laser light with the scanning optical unit 27, the electrode part of the electronic component is preheated to the optimum temperature for soldering and transferred onto the substrate 41 waiting at the component connection position 44. can do. At this time, needless to say, the temperature of the electrode part of the electronic component can be monitored by the temperature measuring sensor 7 provided in the scanning optical system.

Furthermore, as shown in FIG.
0 is offset by ΔX in the X-axis direction, ΔY in the Y-axis direction, ΔZ in the Z-axis direction, and Δθ in the θ direction with respect to the normal mounting position, and the laser light is scanned and irradiated to obtain the same field of view. Inside the electrode part of the electronic component 40 and the substrate 4
It is possible to preheat while monitoring the temperature measuring sensor 7 until the temperature of the electrode portion 1 together with the electrode portion 1 is suitable for soldering.

Control of the amount of heat applied during preheating is performed by controlling the scanning speed and the on / off timing of the laser light output while keeping the laser light output constant, and the laser light output and on / off control while keeping the scanning speed constant. There is a method of controlling timing.

Subsequently, after the electronic component electrode portion and the substrate electrode portion have reached a predetermined preheating temperature, ΔX, ΔY, Δ
Reset the offset values of Z and Δθ to zero, and
By mounting the electronic component 40 on the regular position on 1 and subsequently scanning and irradiating with laser light, soldering is performed on all the electrode portions. At this time, as shown in FIG. 6, the CCD camera 4 installed in the scanning optical unit 27 places the substrate electrode portion 81 and the electronic component electrode portion 80 within the same recognition field of view through the translucent plates 36 and 38. Since it is captured, the electronic component 40 can be positioned with respect to the substrate 41 with high accuracy.

Next, a data processing method of the scanning optical system and the recognition optical system in this component connecting apparatus will be described.
FIG. 7 shows a state in which the head portion 49 stands by above the component connecting position 44, and at this time, the board setting cylinder 6
The CCD camera 4 recognizes the board mark 79 provided on the board 41 whose position is adjusted by 5, and this recognition screen is shown in FIG. The intersection of the cross lines 82 drawn in the screen is the irradiation position of the laser light, and is the center of the screen of the scanning optical system. Furthermore, the same board mark 79
However, the head part 49 is moved so as to enter the center of the visual field of the board recognition camera 78, and the board mark 79 is recognized again by the board recognition camera 78 to obtain the recognition screen of FIG. As described above, the positions of the galvanometers 24 and 11 can be constantly corrected by the obtained recognition image information of FIGS. 8 and 9 and the NC data relating to the position information of the XY robot.

Next, the head portion 49 is moved as it is above the component recognition camera 43, and the electronic component 40 held by the tip nozzle 23 is recognized, and the image on the left side of FIG. 10 can be obtained. In this state, the inner holder 18 is rotated by a predetermined amount in the θ direction by driving a motor (not shown), and the image on the right in FIG. 10 is obtained. From the two image information, the inner holder 18 and the tip nozzle 23
The rotation center position of can be calculated. By adding the correction amount of the galvanometers 24 and 11 previously calculated to the rotation center position, the NC data for driving the XY robot and the position of the scanning optical system can be corrected with high accuracy. .

Next, the mounting position information for each electronic component,
Of the part data that is the connection condition by laser light,
Especially, regarding the teaching method of the laser beam irradiation condition, FIG.
~ It demonstrates based on FIG. Operation panel 4 for teaching work
7. First, the state of writing data is set, and then the preheating by laser light and the connection are set. Teaching can be performed with or without gripping an electronic component, and it is possible to select whether or not to use laser preheating as well. By inputting the laser light irradiation start position and the irradiation end position, the laser scanning speed between these two points, the laser light output, the number of repeated executions, etc. according to the flow of FIG. 11, the laser light as shown in FIGS. The irradiation conditions can be set freely.

In the patent specification (Japanese Patent Application No. 3-37198) filed previously, the applicant of the present invention mounts the electrode parts of electronic parts after remelting the preliminary solder of all the substrate electrode parts by laser light. However, although an electronic component connecting method for soldering (a flow chart is shown in FIG. 16) is proposed, the same can be applied to the electronic component connecting device according to the present invention.

Further, in the above invention, the melting of the solder in the substrate electrode portion was controlled by the time of supplying energy such as laser light, but in the electronic component connecting apparatus according to the present invention, the temperature measuring sensor 7 is used. Since it is possible to control the laser light irradiation conditions while constantly monitoring the temperature of the laser light irradiation position, soldering can be performed with the minimum required energy supply, and excessive thermal shock to both the board and electronic components. The connection time can be greatly shortened without adding the.

Further, of the laser light emitted for soldering, the light reflected from the irradiation position is caught by the detection surface of the shape detection means 37 installed in the inner holder 18, and the reflected light hits. Position information and mirrors 25 and 26 swung by the galvanometers 24 and 11.
The angle reflected at the irradiation position can be calculated from the position information of. Further, the shape at the laser light irradiation position can be calculated and obtained by detecting the reflection information of the laser light at the peripheral portion while sequentially scanning the laser light. Then, based on the information from the shape detecting means 37, the irradiation condition of the laser light is controlled while detecting the remelting condition of the preliminary soldering part and the forming condition of the fillet formed on the electrode part of the electronic component. It is possible to

Further, in the above invention, as shown in FIG. 17, laser light is linearly irradiated through the emission optical section 83 and the cylindrical lens 84, and a plurality of connecting sections are simultaneously heated for soldering. However, in the component connecting device of the present invention, as shown in FIG.
Thus, by irradiating the laser light at high speed a plurality of times, the same state as that in which pseudo linear light is radiated can be created and soldering can be performed.

Further, even when the preliminary solder portion is previously formed by batch reflow, the flux component contained in the cream solder is evaporated by the reflow process and the solder is solidified. Even if the component connecting device scans and irradiates the laser beam to re-melt the component, and then mounts the electronic component and solders it, a solder ball is not generated.

In the above embodiment, the air dryer is used as the heat source for preheating the substrate 41 in the substrate preheating section 45. However, as shown in FIG. 19, a light beam irradiating means 85 such as a xenon lamp, an ultraviolet lamp, an infrared lamp, or the like. Figure 20
The heater block 87 having the heater 86 shown in FIG. 2 as a heat source is used as a heat source, and the heater driving unit 88 positions the heat block 87 at a suitable position with respect to the substrate 41.
Even with the method of preheating No. 1, the same effect can be obtained.

The structure and operation of means for applying flux at a higher speed than the above-described embodiment will be described with reference to FIG. When the bubble generation block 91 is submerged in the flux tank 92 filled with the flux 71, and air is sent into this through the hose 90, flux bubbles 89 are generated on the liquid surface. By gripping the electronic component 40 by the tip nozzle 23 and moving the flux bubble 89, the flux 71 can be applied to the electrode portion. According to this method, it is possible to apply the flux at a higher speed without having to stop the head portion 49 by facing the head portion 49 at a predetermined position above the flux applying portion 52. However, since cleaning is required after the flux is applied even to the peripheral portion of the electrode part, it cannot be applied to electronic parts that cannot be cleaned.

All of the flux applying means described above apply the flux 71 to the electrode portion of the electronic component 40, but a method of applying the flux 71 to the electrode portion of the substrate 41 will be described. In FIG. 22, the flux 71 filled in the container is brush 93 via a hose 94.
Is supplied to. The tip of the brush 93 is formed by a large number of capillaries, and an appropriate flux is continuously supplied without interruption due to the capillary phenomenon. Since the brush 93 is gripped by a driving unit (not shown) in a state in which it can be arbitrarily moved in the three-dimensional direction, the flux can be applied to an arbitrary portion on the substrate 41. According to this method, a required amount of flux, which is smaller than that using a dispenser, can be stably applied to the preliminary solder portion of the substrate.

[0051]

According to the present invention, a weak heat resistant electronic component,
Various types of electronic components including non-cleanable electronic components can be stably soldered on a substrate by an automatic machine without damaging the characteristics. Further, since the electronic parts can be mounted and permanently fixed in one step to improve the productivity, it is possible to contribute to the improvement of the area productivity of the factory.

[Brief description of drawings]

FIG. 1 is a perspective view of a head portion of a component connecting device of the present invention.

FIG. 2 is a perspective view of the entire component connecting device.

FIG. 3 is a perspective view showing a detailed configuration of a main part of the electronic component connecting device of FIG.

FIG. 4 is a perspective view showing an outline of an optical system.

FIG. 5 is a perspective view illustrating the operation of the electronic component connecting device.

FIG. 6 is a diagram showing a positional relationship between the electronic component and the substrate in a state where the electronic component is opposed to the substrate.

FIG. 7 is a diagram in which the head part of the electronic component connecting device is opposed to the positioned substrate.

FIG. 8 is a diagram of an image captured by a scanning optical system.

FIG. 9 is a diagram of an image captured by a substrate recognition optical system.

FIG. 10 is a diagram of an image captured by a component recognition camera.

FIG. 11 is a flowchart illustrating a teaching method of connection conditions.

FIG. 12 is a diagram for explaining how to give a laser light output.

FIG. 13 is a diagram showing an example of laser irradiation.

FIG. 14 is a diagram showing an example of laser irradiation.

FIG. 15 is a diagram showing an example of laser irradiation.

FIG. 16 is a flowchart showing a method of connecting electronic components of the prior application.

FIG. 17 is a diagram showing a method of connecting electronic components using a cylindrical lens.

FIG. 18 is a view showing a method of reciprocating a light beam at high speed and irradiating it as pseudo-linear light by the electronic component connecting device of the present application.

FIG. 19 is a diagram showing a light beam irradiation means as a heat source for substrate preheating.

FIG. 20 is a diagram showing a heat block as a heat source for substrate preheating.

FIG. 21 is a diagram showing a flux application example as a second embodiment of the present application.

FIG. 22 is a diagram showing a flux application example as a third embodiment of the present application.

FIG. 23 is a diagram showing a flow of manually connecting a weak heat resistant component to a board.

FIG. 24 is a diagram showing a flow for connecting a weak heat resistant component to a board by low temperature soldering.

FIG. 25 is a diagram showing a flow of manually connecting electronic components that cannot be cleaned to a board.

FIG. 26 is a diagram showing a method for manually connecting electronic components to a board.

[Explanation of symbols]

3 dichroic mirror 4 CCD camera (recognition optical system) 7 Temperature sensor (temperature detection means) 23 Tip nozzle (suction nozzle) 27 Scanning optical unit (processing beam scanning means) 37 Shape detection means 40 electronic components 41 substrate 53 Laser optical system (Processing light irradiation means)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References Japanese Patent Laid-Open No. 2-10897 (JP, A) Japanese Patent Laid-Open No. 2-306693 (JP, A) Japanese Patent Laid-Open No. 3-184668 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H05K 13/04 G01B 11/00

Claims (14)

(57) [Claims] 1. A component connecting device comprising a suction nozzle made of a translucent material and a processing light beam irradiating means for irradiating a processing light beam through the suction nozzle, wherein the component is transferred and gripped by the suction nozzle. Is positioned above the electrode portion of the substrate that has been surface-treated in advance, and the processing light beam is scanned by the processing light beam scanning means provided on the axis of the suction nozzle to the component electrode portion or the substrate electrode portion through the suction nozzle. After preheating, attach the parts to the board electrode parts,
A component connection method that irradiates a processing beam to connect components onto a substrate. 2. The processing light beam irradiation before mounting is performed by scanning the processing light beam at a high speed by the processing light beam scanning means, and after melting the preliminary solder of all the substrate electrode portions, the component gripped by the suction nozzle is mounted. The component connection method according to claim 1, wherein the components are connected together. 3. A component connecting method comprising a suction nozzle and a processing light beam irradiation means for irradiating a processing light beam, which is a component connection method for connecting a component gripped by the suction nozzle onto a board. Before processing, while the suction nozzle is gripping the component above the substrate, the machining beam irradiating means irradiates the machining beam onto the electrode part of the component and the electrode part on the substrate, and the electrode part of the component and the substrate. A method of connecting parts that preheats to a temperature at which it can be soldered together with the electrode part. 4. The component connecting method according to claim 3 , wherein the component is slightly horizontally offset with respect to the regular mounting position so that the machining beam can be emitted together with the electrode portion of the component and the electrode portion of the substrate. 5. A scanning by the machining beam scanning means for scanning the working beam, component connection according to any one of claims 3 to 4 for controlling the amount of heat of the preheating by adjusting the speed of the scanning Method. 6. suction nozzle consists of a translucent material, wherein the claims 3 to 5 for preheating by scanning through the suction nozzle machining beam by the machining beam scanning means provided on the axis of the suction nozzle The method for connecting components according to any one of items. 7. The component connecting method according to claim 6 , wherein the processing light beam scanning means scans the processing light beam with respect to the irradiation target of the processing light beam whose position has been recognized by the component recognition means. 8. A dichroic mirror is provided in the middle of the optical axis of the processing light beam, a recognition optical system for recognizing the periphery of the suction nozzle is arranged coaxially with the processing light beam, and the processing light beam is scanned while recognizing the irradiation position of the processing light beam. Claim 1, Claim 2, Claim
6. The component connection method according to claim 7 . 9. A mark on a substrate is recognized by using a recognition optical system for recognizing a processing light beam irradiation position, and the recognized mark is recognized by a mark recognizing means integrated with a suction nozzle,
9. The component connecting method according to claim 8, wherein the scanning position of the processing beam scanning means is corrected based on the result of recognition of the mark by both sides. 10. A dichroic mirror is provided midway along the optical axis of the processing light beam, and temperature detection means for detecting the temperature of the processing light beam irradiation position is provided coaxially with the processing light beam, and processing is performed while detecting the temperature of the processing light beam irradiation position. The component connecting method according to any one of claims 1, 2, 6 , 7 , 8 , 9 , and 9 , which scans a light beam. 11. A suction nozzle for gripping a component and connecting the component to the substrate, and before mounting the component, while the suction nozzle grips the component above the substrate, the machining light beam is applied to the electrode portion of the component and the substrate. And a processing beam irradiating unit that preheats the electrode part of the component and the electrode part on the substrate to a temperature at which soldering is possible. 12. A suction nozzle for gripping a component and connecting it to a substrate, and irradiating a machining light beam to an electrode portion of the component and an electrode portion on the substrate, and together with the electrode portion of the component and the electrode portion on the substrate. A process light beam irradiation means for preheating to a temperature at which soldering is possible, and a process light beam irradiated by the process light beam irradiation means scans the electrode part of the component and the electrode part on the substrate and adjusts the scanning speed. And a processing beam scanning means for controlling the amount of preheating by means of the component connecting device. 13. suction nozzle consists of a translucent material, machining beam application means is part connection device according to any one of claims 11 to 12 for irradiating the processing light through the suction nozzle. 14. A flux coating section for applying flux to the component gripped by the suction nozzle by generating flux bubbles on the flux liquid surface up to a height at which the component gripped by the suction nozzle moves. Item 11
The component connection device according to any one of claims 1 to 13 .