JP4014476B2 - Component mounting apparatus and component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus and a component mounting method for mounting a component such as a chip component including a resistor and a capacitor on a substrate such as a flexible printed circuit board (FPC substrate) via a viscous material such as cream solder. About.
[0002]
[Prior art]
As this type of component mounting apparatus, for example, a substrate transport mechanism that continuously transports a plurality of substrates in one direction, and solder coating that applies cream solder to a substrate positioned at a predetermined position of the substrate transport mechanism Some devices include a device, a component mounting device that mounts a component on a substrate on which solder has been applied by a solder coating device, and a reflow device that reflows the solder and fixes the component on the substrate. The substrate is transported on the substrate transport mechanism in the order of a solder coating device, a component mounting device, and a reflow device, and the processing is performed in these devices. (For example, refer to Patent Document 1.)
[0003]
[Patent Document 1]
JP 2001-326453 A
[0004]
[Problems to be solved by the invention]
In the solder application device, there may be cases where the application amount is excessive or insufficient, such as so-called stringing, due to a change in the discharge pressure due to a change in the remaining amount of cream solder in the syringe or a change in the viscosity of the cream solder. . As a method for detecting these defects, it is known that the applied solder is imaged with a camera and the quality of the application is inspected using an image recognition technique.
[0005]
2. Description of the Related Art Conventionally, there is known an inspection apparatus that is interposed between the solder application apparatus and the component mounting apparatus and performs application defect detection by the image recognition. However, when this type of inspection apparatus is provided, the length of the component mounting apparatus becomes long and it is difficult to secure the installation space. Moreover, since the capital investment increases due to the introduction of a dedicated inspection device, it becomes a factor that hinders the reduction of the production cost of the component mounting board.
[0006]
As an inspection method that does not use the dedicated inspection device, it is conceivable to use a substrate recognition camera provided in the solder coating device for substrate recognition. That is, after the application is completed, the substrate recognition camera can be sequentially moved above the applied solder and imaged, and the quality of the application can be inspected from the image recognition result. However, in general, the time required for the solder coating apparatus to apply solder to a plurality of locations on the substrate is longer than the time required for the component mounting apparatus to mount the component on the solder coated substrate. Therefore, if all the coating positions are inspected using the substrate recognition camera of the solder coating device, the takt time of the solder coating device is significantly longer than the takt time of the component mounting device. A large imbalance occurs. Due to this imbalance in tact balance, the tact of the entire component mounting apparatus is extended, and the work efficiency is lowered.
[0007]
The tact balance imbalance will be described with reference to a timing chart of the solder application device and the component mounting device shown in FIG. In the example of FIG. 24, the solder application device applies solder to four points on the substrate, and checks the quality of the solder application with a recognition camera for the four points after application. Further, the component mounting apparatus includes two suction nozzles, and simultaneously sucks two components from the component supply unit, and mounts the two components separately on the substrate.
[0008]
The application head moves and applies during one application, and the movement takes 100 ms and application takes 460 ms. Accordingly, the time required for one application is 560 ms. In addition, the coating head moves and inspects during one inspection, and the movement requires 100 ms and the inspection requires 350 ms. Therefore, the time required for one inspection is 450 ms. The total time of four times of coating and four times of inspection, that is, the takt time of the solder coating device is 4040 ms.
[0009]
On the other hand, the component mounting apparatus moves to the component supply unit (requires 300 ms), adsorbs components (requires 120 ms), moves upward of the component recognition camera (requires 100 ms), and components by the component recognition camera. Recognition (requires 350 ms), movement onto the board (requires 100 ms), and mounting of components (requires 250 ms). Therefore, the tact time of the component coating apparatus is 1220 ms, and the tact time (4040 ms) of the solder coating apparatus is more than three times that of this, and the tact balance of both is significantly impaired.
[0010]
The above problems are the type of viscous material supplied to the substrate, that is, which of solder, cream solder, conductive adhesive, etc., to be supplied to the substrate, and the type of component to be mounted, that is, mounted. Regardless of whether the component is a chip component including a resistor or a capacitor, an IC component, a mechanical component, or an optical component, it is common in conventional component mounting apparatuses.
[0011]
Therefore, the present invention inspects the quality of the supply of viscous materials such as solder to the substrate while maintaining the balance of the tact balance between the viscous material supply unit, which is, for example, a solder application device, and the component mounting unit in the component mounting apparatus. The challenge is to do.
[0012]
[Means for Solving the Problems]
Accordingly, the first invention is a component mounting apparatus for mounting a component on a substrate via a viscous material, the substrate transport mechanism transporting the substrate in one direction, and a first predetermined position of the substrate transport mechanism. A viscous material supply unit that supplies the viscous material to a plurality of locations with respect to the substrate positioned on the substrate; A component mounting unit that mounts a component on the substrate positioned at the second predetermined position of the substrate transport mechanism via the viscous material supplied to the plurality of locations, and the viscous material supply unit includes at least Viscous material supply that is movable in a substrate conveyance direction and a direction orthogonal to the substrate conveyance direction, supplies viscous material to a plurality of locations of the substrate positioned at the first predetermined position, and includes a first recognition camera The viscous supply head is controlled so that the first recognition camera images a viscous material supplied to an arbitrary position among a plurality of viscous materials supplied onto the substrate by the head and the viscous material supply head. And a first inspection unit that inspects the supply of the viscous material based on the image of the viscous material imaged by the first recognition camera, and the component mounting unit includes: , It can move at least in the substrate transport direction and in the direction perpendicular to this substrate transport direction. Yes, the second predetermined position Was positioned on Substrate Mounting parts via viscous material supplied to multiple locations, and Second recognition camera A mounting head comprising: Of the plurality of viscous materials supplied onto the substrate by the viscous material supply head, the second recognition camera images a viscous material supplied to a location other than the location imaged by the first recognition camera. A second control unit for controlling the mounting head, , Said second recognition camera Imaged by Viscous image To check the supply of the viscous material Second inspection department A component mounting apparatus is provided.
[0013]
In the component mounting apparatus of the present invention, the mounting head first 2 Based on the image of the viscous material captured by the recognition camera 2 The inspection unit inspects whether or not the viscous material is supplied to the substrate by the viscous material supply unit. In general, the time required for the component mounting unit to mount the component on the substrate to which the viscous material has been supplied is shorter than the time required for the viscous material supply unit to supply the viscous material to a plurality of locations on the substrate. Therefore, in other words, in the present invention, the quality of the viscous material supply is inspected not on the viscous material supply unit side with a long tact but on the component mounting unit side with a short tact. Therefore, the tact balance of the viscous material supply unit and the component mounting unit is balanced, and the quality of the supply of the viscous material to the substrate can be inspected while improving the tact as the whole apparatus. In addition, since the tact balance of the viscous material supply unit and the component mounting unit is balanced, the number of substrates having viscous material supply defects in the apparatus can be reduced when the apparatus is stopped by detecting defective supply of viscous materials. Can do. Furthermore, since it is not necessary to introduce a dedicated inspection device, the length of the component mounting device can be reduced, and an increase in capital investment that hinders production cost reduction can be avoided.
[0014]
2nd invention is the component mounting method in the component mounting apparatus which mounts components via a viscous material on a board | substrate, Comprising: The said component mounting apparatus is the said Transport the substrate in one direction A viscous material supply unit that supplies viscous material to a plurality of locations with respect to the substrate positioned at the first predetermined position of the substrate transport mechanism, and the substrate positioned at a second predetermined position of the substrate transport mechanism A component mounting portion for mounting components via the viscous material supplied to the plurality of locations, wherein the viscous material supply unit supplies the viscous material to the plurality of locations on the substrate by the viscous material supply head, Among the viscous materials supplied to the location, the viscous material supplied to an arbitrary location is imaged by a first recognition camera included in the viscous material supply head, and the viscous material imaged by the first recognition camera Based on the above, the quality of the viscous material supplied by the viscous material supply head is inspected, and in the component mounting portion, the viscous material supplied to the plurality of locations other than the location imaged by the first recognition camera The viscous material supplied to the location is imaged by a second recognition camera included in the mounting head, and the viscous material is supplied by the viscous material supply head based on the viscous material image captured by the second recognition camera. Provided is a component mounting method for inspecting pass / fail and mounting a plurality of components via a viscous material supplied onto the substrate by the mounting head.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in detail based on embodiments shown in the drawings.
[0017]
Thereafter, the cream solder 2 (FIG. 9B) is applied to the FPC board 1 (see FIG. 9A), the chip component 3 (see FIG. 9C) is mounted through the solder 2, and the solder is further soldered. 2 will be described as an example. However, in the present invention, the type of the substrate, the type of the viscous material for mounting the component on the substrate, and the type of the component to be mounted are not limited. Specifically, in addition to the FPC board, the board may be a resin board, a paper-phenol board, a ceramic board, a circuit board such as a glass-epoxy board, a circuit board such as a single-layer board or a multilayer board, a component, a housing, or It includes objects on which circuits such as frames are formed. The substrate may be a tape-like or film-like substrate in which a plurality of substrates are continuously arranged. In addition to cream solder, the viscous material may be solder, a conductive adhesive, or the like. In addition to the chip component, the component may be another electronic component such as an IC component, a mechanical component, an optical component, or the like.
[0018]
(First Reference example )
Referring to FIGS. 1 and 2, the component mounting apparatus 5 is a magazine-type substrate supply device 6 (only shown in FIG. 1) that stores an FPC board before component mounting, and applies solder and mounts components. A component mounting device 7, a reflow device 8 for performing soldering by reflow, and a magazine-type substrate recovery device 9 (shown only in FIG. 1) that stores FPC substrates on which components are mounted are provided.
[0019]
As shown in FIGS. 1 and 3, the component mounting apparatus 7 includes a substrate transport path (substrate transport mechanism) 12 for continuously transporting the FPC board 1 in one direction on the machine base 11, and the FPC board 1. A solder application unit (viscous material supply unit) 13 that applies the solder 2 to a plurality of locations and a component mounting unit 14 that mounts the chip component 3 on the FPC board 1 via the solder 2 are provided. Since the solder application unit 13 and the component mounting unit 14 are provided on a common machine base 11, the apparatus can be downsized as compared with the case where separate solder application devices and component mounting devices are provided.
[0020]
As shown in FIG. 4, the FPC board 1 is sandwiched between an upper plate 15 a and a lower plate 15 b constituting the pallet 15. The upper plate 15a and the lower plate 15b are provided with windows 15c and 15d, and the FPC board 1 is exposed at these windows 15c and 15d. The FPC board 1 is stored in the board supply device 6 while being held on the pallet 15, and is collected by the board collection device 9 through the steps of the component mounting device 7 and the reflow device 8.
[0021]
As shown in FIGS. 5A and 5B, the substrate transport path 12 includes upper guide rails 12a and 12b and a pair of lower guide rails 12c and 12d that can be raised and lowered. Each lower guide rail 12c, 12d is provided with a belt conveyor type transport mechanism for moving the pallet 15 holding the FPC board 1. In the following description, the FPC board 1 means both the FPC board 1 and the pallet 15 holding the FPC board 1 unless otherwise specified.
[0022]
As shown in FIGS. 1 and 3, the solder application unit 13 is in the direction of conveyance of the FPC board 1 on the substrate conveyance path 12 (X-axis direction in the drawing) and in the direction orthogonal to the conveyance direction (Y-axis direction in the drawing). A movable XY robot 21 and a coating head 22 attached to the XY robot 21 are provided.
[0023]
As shown in FIG. 7, the coating head 22 includes a pair of syringes 23a and 23b that contain cream solder. Each syringe 23a, 23b accommodates an extruder that is rotationally driven by a motor M1, and an amount of solder corresponding to the number of rotations of the motor M1 is discharged from the discharge nozzle 24 at the tip of the syringe 23a, 23b. As the rotation time of the motor M1 becomes longer, the discharge amount of the solder 2 from the discharge nozzle 24 of each cylinder 23a, 23b increases. The coating head 22 includes a substrate recognition camera 25 for recognizing an image of the posture of the FPC board 1 and the solder coating position on the FPC board 1. The coating head 22 is fixed to the tip of the XY robot 21 by screwing the attachment portion 22a.
[0024]
The solder application unit 13 includes a backup stage 27 for positioning the FPC board 1 at a predetermined position (second predetermined position) during solder application. The backup stage 27 can move up and down between the raised position shown in FIG. 5 (A) and the lowered position as shown in FIG. 5 (B). Above the backup stage 27, a backup tool 28 having a shape corresponding to the windows 15c and 15d of the pallet 15 is provided. As shown in FIG. 6, a plurality of suction holes 28 a are provided on the upper surface of the backup tool 28. These suction holes 28a are connected to the suction pump P1. 5B, the lower guide rails 12c and 12d of the substrate transport path 12 are pressed against the upper guide rails 12a and 12b, and both ends of the pallet 15 are sandwiched therebetween. As a result, the position of the FPC board 1 is fixed. Further, the lower surface of the FPC board 1 is sucked by the suction holes 28a of the backup tool 28, thereby preventing the FPC board 1 from being displaced. Further, the backup stage 27 is connected to the lower end of a positioning pin 29 extending upward. When the backup stage 27 reaches the raised position in FIG. 5B, the tip of the positioning pin 29 is inserted into the positioning hole of the pallet 15, whereby the FPC board 1 is accurately held in a desired posture.
[0025]
As shown in FIG. 2, the solder application unit 13 includes a control unit 30 </ b> A that controls operations of the XY robot 21, the application head 22, the substrate recognition camera 25, and the backup stage 27. In FIG. 3, 32 is a discard cassette.
[0026]
As shown in FIGS. 1 and 3, the component mounting unit 14 includes an XY robot 33 that can move in the transport direction of the FPC board 1 on the substrate transport path 12 and a direction orthogonal to the transport direction, and the XY robot. And a mounting head 34 attached to the robot 33.
[0027]
As shown in FIG. 8, the mounting head 34 can mount five suction nozzles 35. Each suction nozzle 35 can move up and down and rotate around its own axis, as indicated by arrows A1 and A2. Also, Mounting head 34 Includes a board recognition camera 37 for recognizing an image of the posture of the FPC board 1 and the mounting position of the chip component 3 on the FPC board 1. As will be described in detail later, this board recognition camera 37 is also used for inspection of solder applied to the FPC board 1. The mounting head 34 is fixed to the tip of the XY robot 33 by screwing the mounting portion 34a.
[0028]
The component mounting unit 14 includes a backup stage 38 for positioning the FPC board 1 at a predetermined position (first predetermined position) at the time of component mounting. The structure of the backup stage 38 is the same as that of the backup stage 27 of the solder application unit 13 described above.
[0029]
The component mounting unit 14 includes a component supply unit 39 that supplies the chip component 3. Book Reference example The component supply unit 39 includes a plurality of component cassettes 40 in which the chip components 3 are accommodated.
[0030]
As shown in FIG. 2, the component mounting unit 14 includes a control unit 30 </ b> B that controls operations of the XY robot 33, the mounting head 34, the board recognition camera 37, and the backup stage 38.
[0031]
Further, the component mounting unit 14 includes an inspection unit 31 </ b> A that inspects the quality of solder application by the solder application unit 13 based on the image of the solder 2 captured by the board recognition camera 37. In FIG. 3, reference numeral 41 denotes a component recognition camera for recognizing components held by the mounting head 34, and is fixed on the machine base 11. Reference numeral 42 denotes a disposal box in which defective parts are discarded.
[0032]
As schematically shown in FIGS. 2 and 10B, the reflow apparatus 8 is an XY for moving the FPC board 1 on which the chip component 3 transferred from the board transfer path 12 is mounted in a horizontal plane. A stage 45 and a laser generator 46 for locally irradiating the solder 2 applied to the FPC board 1 with laser light for reflowing are provided. The laser generator 46 is an optical system including a lens 48a, a galvanometer mirror 48b, and the like for adjusting the irradiation position of the laser light emitted from the laser light source 47 and condensing the laser light on the FPC board 1. 48.
[0033]
Next, referring to the flowcharts of FIGS. 9 and 10 and FIGS. Reference example A component mounting method using the component mounting apparatus will be described. In the following description, attention is focused on one FPC board 1, but a plurality of FPC boards 1 are continuously transported on the board transport path 12, and the solder application unit 13 and the component mounting unit 14 of the component mounting apparatus 7 are reflowed. The work in the apparatus 8 is proceeding simultaneously.
[0034]
FIG. 9A shows the substrate 1 before processing accommodated in the substrate supply device 6. As shown in FIG. 9A, an electrode 1a is provided at a location where the solder 2 of the substrate 1 is applied. The substrate 1 conveyed from the substrate supply device 6 to the component mounting device 7 through the substrate conveyance path 12 is positioned by the backup stage 27 of the solder application unit 13. When the positioning is completed, work in the solder application unit 13 shown in the flowchart of FIG. 11 is started.
[0035]
In step S11-1 of FIG. 11, the coating head 22 driven by the XY robot 21 moves to the solder 2 coating position on the FPC board 1 (position where the electrode 1a is present). Next, in step S <b> 11-2, the application head 22 applies the solder 2 to the application position of the FPC board 1. Specifically, as shown in FIG. 9B, the solder 2 is discharged from the syringes 23a and 23b onto the electrode 1a. The discharge amount of the solder 2 is determined by the rotation time of the motor M1 (see FIG. 7) that drives the extruder in the syringes 23a and 23b. The above operations are repeated until the solder 2 is applied to all application positions in step S11-3.
[0036]
When the work in the solder application unit 13 is completed, the FPC board 1 is transferred to the component mounting unit 14 on the board transfer path 12. When the positioning of the FPC board 1 by the backup stage 38 is completed, the operation in the component mounting unit 14 shown in the flowchart of FIG. 12 is started.
[0037]
First, in step S12-1 of FIG. 12, the mounting head 34 driven by the XY robot 33 moves to one of the positions where the solder 2 of the FPC board 1 is applied. Next, in step S12-2, the board recognition camera 37 included in the mounting head 34 images the solder 2 on the FPC board 1 (see FIG. 9C). The image recognition result by the board recognition camera 37 is sent to the inspection unit 31A. In step S <b> 12-3, the inspection unit 31 </ b> A calculates the shape of the applied solder 2, the XY coordinate deviation, the application diameter, and the area from the image recognition result of the substrate recognition camera 37. Next, in step S12-4, the inspection unit 31A compares the preliminarily stored application diameter or area or a composite threshold value thereof with the application diameter or area calculated in step S12-3, and the calculated value is the threshold value. If it is within, the operation from step S12-1 to step S12-4 is repeated until the inspection is completed for all the application positions in step S12-5.
[0038]
On the other hand, if the calculated value is not within the threshold value in step S12-4, the equipment is stopped in step S12-8. Specifically, a stop command is transmitted from the inspection unit 31A to the solder application unit 13, the component mounting unit 14, and the control units 30A, 30B, and 30C of the reflow device 8, and the component mounting device 7 and the reflow device are based on this command. The operation No. 8 is stopped.
[0039]
When the inspection is completed for all the application positions in step S12-5, the mounting of the chip component 3 by the mounting head 34 is started in step S12-6. Specifically, the suction head 34 is driven by the XY robot 33 and moves to the component supply unit 39 to suck and hold the chip component 3 from the component cassette 40 by the suction nozzle 35. Next, the suction head 34 moves above the component recognition camera 41 and the component recognition camera 41 recognizes an image of the chip component 3 held by the suction nozzle 35. Next, the suction head 34 moves to a predetermined position on the positioned FPC board 1, that is, above a position where the individual chip component 3 to which the solder 2 has been applied is to be mounted (see FIG. 10A). ). Thereafter, the suction nozzle 35 is lowered and the chip component 3 is mounted on the FPC board 1 via the solder 2. In step S12-7, when the mounting of the chip component 3 is completed by the mounting head 34 for all points, the work in the component mounting unit 14 is completed.
[0040]
The FPC board 1 on which the chip component 3 has been mounted is conveyed to the reflow device 8. In the reflow device 8, each chip component 3 is soldered by the solder 2 by reflow. The FPC board 1 that has been soldered is collected by the board collection device 9.
[0041]
As mentioned above, the first Reference example Then, based on the image of the solder 2 imaged by the board recognition camera 37 of the mounting head 34, the inspection unit 31A of the component mounting unit 14 inspects whether the solder application unit 13 applies the solder 2 to the FPC board 1 or not. The time required for the component mounting unit 13 to mount the chip component 3 on the solder coated substrate is shorter than the time required for the solder applying unit 13 to apply the solder 2 to a plurality of locations on the substrate 1. . Therefore, in other words, the book Reference example Then, the quality of solder application is inspected not on the solder application part 13 side with a long tact but on the part mounting part 14 side with a short tact. Therefore, the tact balance of the solder application unit 13 and the component mounting unit 14 is balanced, and the quality of the supply of the solder 2 to the substrate can be inspected while improving the tact of the entire apparatus. In addition, since the tact balance between the solder application unit 13 and the component mounting unit 14 is balanced, the number of substrates having application defects in the apparatus can be reduced when the apparatus is stopped upon detecting a solder application defect. .
[0042]
The tact balance between the solder application unit 13 and the component mounting unit 14 will be described with reference to the timing chart of FIG. In this timing chart, the application head 22 of the solder application unit 13 applies the solder 2 to four locations on the substrate 1. Further, the mounting head 34 of the component mounting unit 14 simultaneously sucks two chip components 3 from the component supply unit 39 and simultaneously recognizes these two chip components 3 by the component recognition camera 41, and then attaches them to the substrate 1. The chip parts 3 are mounted one by one. Furthermore, the time required for the coating head 22 to move to the coating position is 100 ms, and the time required for the coating head 22 to apply the solder 2 is 460 ms. The time required for the mounting head 34 to move to the position on the substrate 1 where the solder 2 is applied is 100 ms, and the time required to image the solder 2 and recognize the image is 350 ms. Further, the time required for the mounting head 34 to move to the component supply unit 39 is 300 ms, the time required to suck the chip component 3 from the component supply unit 39 is 120 ms, and the time required to move above the component recognition camera 41 is The time required is 100 ms, the time required to recognize and image the chip component 3 with the component recognition camera 41 is 350 ms, the time required to move to the mounting position is 100 ms, and the time required to mount the chip component 3 is 250 ms. is there. The solder application head 22 applies the solder 2 sequentially to the four positions of the FPC board 1; the mounting head 34 simultaneously adsorbs, recognizes, and mounts the two chip components 3; The time required for the application head 22 to move and apply, and the time required for the mounting head 34 to move, recognize, adsorb, etc. are the same as those in FIG. 24 described above and FIGS. 17, 19, and 20 described later.
[0043]
Since the coating head 22 applies solder to four locations and 560 ms is required for one application, the tact time of the solder application unit 13 is 2240 ms. On the other hand, the mounting head 34 inspects the solder 2 at four locations, and one inspection takes 450 ms. In addition, the time required for the mounting head to pick up and mount the two chip components 3 is 1220 ms. Therefore, the tact time of the component mounting unit 14 is 3020 ms. When the inspection of the solder 2 is performed for all points by the substrate recognition camera 25 of the coating head 22 described with reference to FIG. 24, the tact of the solder coating unit 13 is three times or more than the tact of the component mounting unit 14. Against the book Reference example Then, the tact balance of the solder application part 13 and the component mounting part 14 is significantly improved.
[0044]
Also book Reference example Then, since the mounting head 34 shoots the solder 2 with the board recognition camera 37 which is necessarily provided for the board 1 recognition, it is not necessary to introduce a dedicated inspection apparatus, and the length of the component mounting apparatus is reduced. In addition to being able to reduce, it is possible to avoid an increase in capital investment that hinders production cost reduction. Further, it is not necessary to provide a dedicated camera for inspection on the mounting head 34 in addition to the board recognition camera 37, and the configuration of the component mounting apparatus 7 is not complicated in this respect. However, even when a mounting-dedicated camera is provided on the mounting head 34 in addition to the board recognition camera 37, the tact balance between the above-described pad coating unit 13 and the component mounting unit 14 is improved, and the length of the component mounting apparatus is reduced. Can be achieved.
[0045]
(No. 1 Embodiment)
First of the present invention 1 In the component mounting apparatus 5 according to the embodiment, as shown in FIG. 14, the solder application unit 13 includes an inspection unit 31 </ b> B that inspects the quality of solder application based on the image of the solder 2 imaged by the board recognition camera 25. ing. First Reference example In this case, all of the solder 2 applied to a plurality of locations on the substrate 1 is inspected by the component mounting portion 14, whereas this first 1 In the embodiment, the solder application unit 22 of the solder application unit 13 inspects the solder 2 applied first to the substrate 1 and the solder 2 applied last in the solder application unit 13, and the remaining solder 2 is removed. The component mounting unit 14 inspects.
[0046]
Referring to the flowcharts of FIGS. 1 A component mounting method by the component mounting apparatus 5 of the embodiment will be described. When the substrate 1 is positioned by the backup stage 27, the operation in the solder application unit 13 shown in the flowchart of FIG. 15 is started.
[0047]
In step S15-1 in FIG. 15, the coating head 22 moves to the solder 2 coating position on the FPC board 1. Next, the coating head 22 applies the solder 2 to the FPC board 1 in step S15-2. The movement of the application head 22 and the application of the solder 2 are repeated until the solder 2 is applied to all application positions in step S15-3.
[0048]
Next, the application head 22 moves to the application position of the solder 2 applied first. For example, when the solder 2 is sequentially applied to four locations on the FPC board 1 in the processes of steps S15-1 to 15-3, the application head 22 moves to the first application position. Next, in step S15-5, the substrate recognition camera 25 included in the coating head 22 images the solder 2 at the first coating position. The image recognition result by the board recognition camera 25 is sent to the inspection unit 31B. In step S15-6, the inspection unit 31B calculates the shape, displacement, application diameter, and area of the solder 2 applied first. Next, in step S5-7, the inspection unit 31B compares the application diameter or area stored in advance or a composite threshold value thereof with the application diameter or area calculated in step S15-6. If the calculated value is within the threshold value in step S15-6, the process proceeds to step S15-8.
[0049]
In step S15-8, the application head 22 moves to the application position of the solder 2 applied last. For example, when the solder 2 is sequentially applied to four locations on the FPC board 1 in the processes of steps S15-1 to 15-3, the application head 22 moves to the fourth application position. Next, in step S15-9, the substrate recognition camera 25 included in the coating head 22 images the solder 2 at the last coating position. The application diameter or area of the solder 2 calculated from the image recognition result by the substrate recognition camera 25 in step S15-10 is compared with a threshold value in step S15-11. If the calculated value is within the threshold value in step S15-11, the operation in the solder application unit 13 is completed.
[0050]
On the other hand, if the calculated value is not within the threshold value in steps S15-7 and S15-11, the equipment is stopped in step S15-12. Specifically, a stop command is transmitted from the inspection unit 31B to the solder application unit 13, the component mounting unit 14, and the control units 30A to 30C of the reflow device 8, thereby stopping the operation of the component mounting device 7 and the reflow device 8. Is done.
[0051]
When the FPC board 1 transported to the component mounting unit 14 on the substrate transport path 12 is positioned by the backup stage 38, the operation in the component mounting unit 14 shown in the flowchart of FIG.
[0052]
In FIG. 16, steps S <b> 16-1 to S <b> 16-5 are inspections of the solder 2 by the board recognition camera 35 of the mounting head 34. The inspection by the substrate recognition camera 35 is the first except that the first application position and the last application position that have already been inspected by the substrate recognition camera 25 of the application head 22 are not inspected. Reference example This is the same as the inspection of the mounting head 34 by the substrate recognition camera 35 (step S12-1 to step S12-5 in FIG. 12).
[0053]
In steps S16-4 and S16-5, for all application positions except the first and last application positions, the calculated values of the solder 2 application diameter and area calculated from the image recognition result by the substrate recognition camera 35 are within the threshold value. For example, the mounting of the chip component 34 by the mounting head 34 is executed for all points.
[0054]
On the other hand, if the calculated value is not within the threshold value in step S16-4, the equipment is stopped in step S16-8. Specifically, a stop command is transmitted from the inspection unit 31A to the solder application unit 13, the component mounting unit 14, and the control units 30A to 30C of the reflow device 8, thereby stopping the operation of the component mounting device 7 and the reflow device 8. Is done.
[0055]
First 1 The tact balance between the solder application unit 13 and the component mounting unit 14 in the embodiment will be described with reference to the timing chart of FIG. In this timing chart, the coating head 22 of the solder coating unit 12 applies solder 2 to four locations on the FPC board 1, and image recognition of the solder 2 at the first and fourth application positions by the board recognition camera 25. Inspect based on results. Since the time required for one application is 460 ms and the time required for one inspection is 450 ms, the tact time of the solder application part 13 is 3140 ms. On the other hand, the mounting head 34 of the component mounting unit 14 inspects the solder 2 at the second and third application positions with the substrate recognition camera 37 and mounts the two chip components 3 on the FPC board 1. Since the time required for one inspection is 450 ms and the time required for mounting the chip product 3 is 1220 ms, the tact time of the component mounting portion 14 is 2120 ms. When the inspection of the solder 2 is performed for all points by the substrate recognition camera 25 of the coating head 22 described with reference to FIG. 24, the tact of the solder coating unit 13 is more than three times that of the component mounting unit 14. In this embodiment, the tact balance between the solder application part 13 and the component mounting part 14 is greatly improved.
[0056]
(No. 2 Embodiment)
First of the present invention 2 In the component mounting apparatus according to the embodiment, among the locations where the solder 2 is applied by the solder application portion 13 of each FPC board 1, the application position where the solder 2 is first applied by the application head 22, and finally the solder 2. The inspection is performed only by the image recognition of the board recognition camera 37 of the component mounting unit 14 only on the application position where the is applied. First 2 Other configurations and operations of the embodiment are the same as those in the first embodiment. Reference example It is the same.
[0057]
At the first and last application positions, the state of the solder 2 discharged from the discharge nozzle 24 of the application head 22 is relatively unstable, and faintness and excessive or insufficient application are particularly likely to occur. On the other hand, when there is no fading or excessive or insufficient application at the first and last application positions, there is often no occurrence of excessive or insufficient application at other application positions. Therefore, even if only the first and last application positions are inspected, it is possible to detect faintness and excessive or insufficient application with a certain degree of accuracy.
[0058]
Referring to the flowchart of FIG. 2 The operation of the component mounting unit 14 of the embodiment will be described. First, in step S18-1, the mounting head 34 moves to the first application position. In step S18-2, the solder 2 on the FPC board 1 is imaged by the board recognition camera 37, and the shape, the XY coordinate shift, the coating diameter, and the area of the solder 2 to which the inspection unit 31A is applied based on the image recognition result. Is calculated. Next, in step S18-4, the inspection unit 31A compares a calculated value such as an area with a threshold value stored in advance. If the calculated value is within the threshold value, the same processing is repeated for the solder 2 at the last application position (step S18-5 to step S18-8). If the calculated value such as the area is within the threshold value in step S18-8, the mounting of the chip component 3 is executed for all points in steps S18-9 and S18-10.
[0059]
On the other hand, in step S18-4 or step S18-8, the calculated value such as the area is a threshold value. If not within In step S18-11, the equipment is stopped. Specifically, a stop command is transmitted from the inspection unit 31A to the control units 30A, 30B, and 30C, and the operations of the component mounting device 7 and the reflow device 8 are stopped based on this command.
[0060]
First 2 The tact balance between the solder application unit 13 and the component mounting unit 14 in the embodiment will be described with reference to the timing chart of FIG. In this timing chart, the application head 22 of the solder application unit 12 applies the solder 2 to four locations on the FPC board 1. Since the time required for one application is 560 ms, the tact time of the solder application part 13 is 2240 ms. On the other hand, the mounting head 34 of the component mounting unit 14 inspects the solder 2 at the first and fourth application positions with the substrate recognition camera 37 and then mounts the two chip components 3 on the FPC board 1. Since the time required for one inspection is 450 ms and the time required for mounting the chip component 3 is 1220 ms, the tact time of the component mounting portion 14 is 2120 ms. When the inspection of the solder 2 is performed for all points by the substrate recognition camera 25 of the coating head 22 described with reference to FIG. 24, the tact of the solder coating unit 13 is more than three times that of the component mounting unit 14. In this embodiment, the tact balance between the solder application part 13 and the component mounting part 14 is greatly improved.
[0061]
First reference example, First embodiment , And the second 2 In the embodiment, the substrate recognition cameras 25 and 37 of the coating head 22 and the mounting head 34 recognize the image of the solder 2 at one application position by one imaging. The images of the solders 2 at a plurality of application positions in the field of view 37 may be simultaneously recognized. For example, as shown in FIG. 20, the board recognition camera 37 of the mounting head 34 images and inspects the solder 2 at the first and second application positions at the same time, and checks the third and fourth application positions. The solder 2 may be simultaneously imaged and inspected.
[0062]
(No. 2 Reference examples )
First of the present invention 2 Reference examples Controls the number of revolutions of the motor M1 for driving the extruder housed in the syringes 23a and 23b of the coating head 22 from the image recognition result of the substrate recognition camera 37 of the mounting head 34, thereby discharging the solder from the discharge nozzle 24. Adjust the amount. First 2 Reference examples Other configurations and effects of the first are Reference example It is the same.
[0063]
The FPC board 1 on which the solder 2 is applied to all application positions in the solder application unit 13 is conveyed to the component mounting unit 14. Referring to the flowchart of FIG. 21, in the component mounting unit 14, the mounting head 34 moves to one of the application positions of the solder 2 in step S22-1 and the board recognition camera 37 images the solder 2 in step S22-2. To do. Further, in step S22-3, the inspection unit 31A calculates the shape of the solder 2, the XY coordinate deviation, the coating diameter, and the area from the image recognition result of the board recognition camera 37. If the calculated value such as the area is outside the threshold value in step S22-4, the equipment is stopped in step S22-12. On the other hand, if the calculated value is within the threshold value in step S22-4, the inspection unit 31A stores the area of the solder 2 calculated from the image recognition result by the board recognition camera 37 in step S22-5. The processes from step S22-1 to step S22-6 are repeated until the inspection is completed for all the application positions in step S22-6.
[0064]
Next, in step S22-7, the inspection unit 31A calculates the average value of the application area of the solder 2 at each application position, and the average value of the application area is transmitted to the control unit 30A of the application unit 13. In step S22-8, the control unit 30A of the application unit 13 adjusts the rotation time of the solder discharge motor M1 based on the average value of the application areas calculated by the inspection unit 31A. For example, the control unit 30A obtains a ratio of the average value of the application area of the solder 2 to a predetermined reference area, and multiplies the current rotation time of the motor M1 by this ratio and a predetermined coefficient to thereby determine the motor M1. A correction value for the rotation time is calculated. After setting the rotation time of the motor M1 to the correction value calculated in step S22-9, the chip component 3 is mounted on all points (steps S22-10 and S22-11).
[0065]
As described above, the result of image recognition of the solder 2 at each application position on the component mounting unit 14 side is fed back to the discharge amount of the solder 2 from the syringes 23a and 23b in the solder application unit 13, thereby causing the application failure of the solder 2. Can be suppressed.
[0066]
Second Reference example The average value of the application area of the solder 2 may be calculated from the image recognition results of the substrate recognition cameras 25 and 37 of the application head 22 and the mounting head 34, and the rotation speed of the motor M1 may be controlled based on the average value.
[0067]
(No. 3 Reference examples )
As schematically shown in FIG. 3 Reference examples Then Component mounting part 14 Includes a bat mark application device 50. The bat mark application device 50 includes an elevating mechanism composed of, for example, an air cylinder attached to the mounting head 34, and a mechanism for applying paint provided at the lower end of the elevating mechanism. The elevating mechanism is normally in the raised position, but is in the lowered position according to a command from the control unit 30B. When the elevating mechanism is in the lowered position, the mechanism for applying the paint comes into contact with the upper surface of the FPC board 1, thereby applying a mark on the FPC board 1. However, the configuration of the bat mark application device 50 is not particularly limited as long as it can apply any mark on the FPC board 1.
[0068]
Also, as detailed later, 3 Reference examples Then, the inspection result of the solder 2 by the inspection unit 31A is transmitted not to the control unit 30A of the component mounting unit 13 but to the control unit 30C of the reflow device 8, and the control unit 30C uses the received inspection result to control the reflow device 8. Use. First 3 Reference examples The other structure and operation of the first is Reference example It is the same.
[0069]
First 3 Reference examples The FPC board 1 on which the solder 2 is applied to all application positions in the solder application unit 13 is conveyed to the component mounting unit 14. In the component mounting unit 14, the mounting head 34 moves to any solder 2 application position in step S23-1 of FIG. 23, and the board recognition camera 37 images the solder 2 in step S23-2. In step S23-3, the inspection unit 31A calculates the shape of the solder 2, the XY coordinate shift, the coating diameter, and the area from the image recognition result of the board recognition camera 37. If the calculated value is not within the predetermined threshold value in step S22-4, that is, if the application of the solder 2 is defective, the application position is stored in step S23-5. Also, In step S23-6, A mark is applied by the bad mark application device 50 in the vicinity of the application position on the FPC board 1. The processes in steps S23-1 to S23-6 are repeated until the inspection is completed for all the application positions in step S23-7.
[0070]
Next, mounting of the chip component 3 by the mounting head 34 is started in step S23-8. When mounting the component, the chip component 3 is mounted if it is not the application position where the application failure is detected in step S23-9 (step S23-10), but if it is the application position where the application failure is detected, the chip component is mounted. 3 is not attached (step S23-11). When the mounting of the chip component 3 to all the application positions other than the position where the application failure is detected in step S23-12 is completed, the inspection unit 31A detects the application failure in the control unit 30C of the reflow apparatus 8 in step S23-13. The application position is notified, and the operation in the component mounting unit 14 is completed.
[0071]
The control unit 30C of the reflow apparatus 8 executes reflow by the laser generator 46 for the application position where no application failure is detected, but does not execute reflow by the laser generator 47 for the application position where application failure is detected. .
[0072]
First 3 Reference examples Then, the chip component 3 is not mounted at the location where the application failure of the FPC board 1 occurs, and the solder 2 is left without being subjected to the reflow process. Further, a mark is given by the butt mark application device 50 in the vicinity of the location where the application failure occurs. Therefore, it is easy to repair a defective application portion by manual work or the like, and the defective application portion can be easily confirmed visually.
[0073]
The first From Reference Example to Third Reference Example, and First 1 and 2 In the embodiment, the reflow device 8 individually reflows the solder 2 at each application location by the laser beam generated by the beam generator 46. However, when the application failure location is not reflowed, that is, other than the fifth embodiment. In this case, a reflow apparatus 8 that reflows the solder 2 at all the application locations at once can be used.
[0074]
【The invention's effect】
As is clear from the above description, in the apparatus and method of the present invention, the first of the mounting heads. 2 On the basis of the image of the viscous material imaged by the recognition camera, whether or not the viscous material is supplied to the substrate by the viscous material supply unit is inspected. In general, the time required for the component mounting unit to mount the component on the substrate to which the viscous material has been supplied is shorter than the time required for the viscous material supply unit to supply the viscous material to a plurality of locations on the substrate. Therefore, in other words, in the present invention, the quality of the viscous material supply is inspected not on the viscous material supply unit side with a long tact but on the component mounting unit side with a short tact. Therefore, the tact balance of the viscous material supply unit and the component mounting unit is balanced, and the quality of the supply of the viscous material to the substrate can be inspected while improving the tact as the whole apparatus. In addition, since the tact balance of the viscous material supply unit and the component mounting unit is balanced, the number of substrates having viscous material supply defects in the apparatus can be reduced when the apparatus is stopped by detecting defective supply of viscous materials. Can do. Furthermore, since it is not necessary to introduce a dedicated inspection device, the length of the component mounting device can be reduced, and an increase in capital investment that hinders production cost reduction can be avoided.
[Brief description of the drawings]
FIG. 1 shows the first of the present invention. Reference example It is a perspective view which shows the component mounting apparatus which concerns on.
FIG. 2 shows the first of the present invention. Reference example It is a block diagram which shows the component mounting apparatus which concerns on.
FIG. 3 shows the first of the present invention. Reference example It is a schematic plan view which shows the component mounting apparatus which concerns on.
FIG. 4 is a partial plan view showing a substrate transfer path.
5A and 5B are cross-sectional views taken along line VV in FIG. 4, where FIG. 5A shows the lowered position of the backup stage, and FIG. 5B shows the raised position of the backup stage.
FIG. 6 is a plan view showing a backup stage.
FIG. 7 is a perspective view showing a coating head.
FIG. 8 is a perspective view showing a mounting head.
FIG. 9 shows the first of the present invention. Reference example It is typical sectional drawing for demonstrating the process in the component mounting apparatus which concerns on this, (A) shows the FPC board before a process, (B) shows the application | coating process of cream solder, (C) is a mounting head. The inspection process is shown by the substrate recognition camera.
FIG. 10 shows the first of the present invention. Reference example It is typical sectional drawing for demonstrating the process in the component mounting apparatus which concerns on this, (A) shows the mounting process of a chip component, (B) shows the reflow process.
FIG. 11 shows the first of the present invention. Reference example It is a flowchart for demonstrating operation | movement of the solder application part in FIG.
FIG. 12 shows the first of the present invention. Reference example It is a flowchart for demonstrating operation | movement of the components mounting part in.
FIG. 13 shows the first of the present invention. Reference example 5 is a timing chart for explaining the tact balance between the solder application part and the component mounting part in FIG.
FIG. 14 shows the first of the present invention. 1 It is a block diagram which shows the component mounting apparatus of embodiment.
FIG. 15 shows the first of the present invention. 1 It is a flowchart for demonstrating operation | movement of the solder application part in embodiment.
FIG. 16 shows the first of the present invention. 1 It is a flowchart for demonstrating operation | movement of the component mounting part in embodiment.
FIG. 17 shows the first of the present invention. 1 It is a flowchart for demonstrating the tact balance of the solder application part and component mounting part in embodiment.
FIG. 18 shows the first of the present invention. 2 It is a flowchart for demonstrating operation | movement of the component mounting part in embodiment.
FIG. 19 shows the first of the present invention. 2 It is a flowchart for demonstrating the tact balance of the solder application part and component mounting part in embodiment.
FIG. 20 is a timing chart for explaining a case where a plurality of application positions are collectively inspected.
FIG. 21 shows the first of the present invention. 2 Reference examples It is a flowchart for demonstrating operation | movement of the components mounting part in.
FIG. 22 shows the first of the present invention. 3 Reference examples It is a block diagram which shows the component mounting apparatus which concerns on.
FIG. 23 shows the first of the present invention. 3 Reference examples It is a flowchart for demonstrating operation | movement of the components mounting part in.
FIG. 24 is a flowchart for explaining tact balance between a solder coating apparatus and a component mounting apparatus when performing a coating inspection with a board recognition camera of a solder coating head.
[Explanation of symbols]
1 FPC board
2 Solder
3 Chip parts
5 Component mounting equipment
6 Substrate supply device
7 Component mounting device
8 Reflow device
9 Substrate recovery device
11 units
12 Substrate transport path
12a, 12b Upper guide rail
12c, 12d Lower guide rail
13 Solder application part
14 Parts mounting part
15 palettes
15a Upper plate
15b Lower plate
15c, 15d window
21,33 XY robot
22 Application head
22a Mounting part
23a, 23b Syringe
24 Discharge nozzle
25, 37 Board recognition camera
27,38 Backup stage
28 Backup tool
28a Suction hole
29 Positioning pin
30A, 30B, 30C control unit
31A, 31B Inspection Department
32 Discard cassette
34 Mounting head
34a Mounting part
35 Suction nozzle
39 Parts supply department
40 parts cassette
41 Parts recognition camera
42 Waste box
45 XY stage
46 Laser light generator
47 Laser light source
48a lens
48b Galvano mirror
50 Bad mark application device

Claims (6)

A component mounting apparatus for mounting a component on a substrate via a viscous material,
A substrate transport mechanism for transporting the substrate in one direction;
A viscous material supply unit for supplying viscous material to a plurality of locations with respect to the substrate positioned at a first predetermined position of the substrate transport mechanism;
A component mounting portion that mounts a component on the substrate positioned at the second predetermined position of the substrate transport mechanism via the viscous material supplied to the plurality of locations;
The viscous material supply unit includes:
A viscous material that is movable in at least the substrate conveyance direction and a direction orthogonal to the substrate conveyance direction, supplies viscous material to a plurality of locations of the substrate positioned at the first predetermined position, and includes a first recognition camera. A feeding head;
A first control unit that controls the viscosity supply head so that the first recognition camera captures an image of a viscous material supplied to an arbitrary position among a plurality of viscous materials supplied onto the substrate by the viscous material supply head. A control unit of
A first inspection unit that inspects the supply of the viscous material based on the image of the viscous material imaged by the first recognition camera;
The component mounting part is
It is possible to move at least in the substrate transport direction and in a direction orthogonal to the substrate transport direction, mount the component via the viscous material supplied to the plurality of locations of the substrate positioned at the second predetermined position, and the second A mounting head equipped with a recognition camera of
Of the plurality of viscous materials supplied onto the substrate by the viscous material supply head, the second recognition camera images a viscous material supplied to a location other than the location imaged by the first recognition camera. A second control unit for controlling the mounting head,
A component mounting apparatus comprising: a second inspection unit that inspects the supply of the viscous material based on an image of the viscous material imaged by the second recognition camera.   The first control unit and the second control unit are configured such that the first recognition camera is configured to inspect whether or not the viscous material is supplied on the side having a short tact among the viscous material supply unit and the component mounting unit. The component mounting apparatus according to claim 1, wherein the component recognition apparatus controls the second recognition camera. The first control unit includes a viscous material supply head so that the first recognition camera captures an image of the first and last viscous materials supplied from the viscous material supply head onto the substrate. Control
The second control unit is configured such that the second recognition camera detects a viscous material other than the viscous material imaged by the first recognition camera among the plurality of viscous materials supplied onto the substrate by the viscous material supply head. The component mounting apparatus according to claim 1, wherein the mounting head is controlled to take an image. A component mounting method in a component mounting apparatus for mounting a component on a substrate via a viscous material,
The component mounting apparatus includes:
A viscous material supply unit that supplies viscous material to a plurality of locations with respect to the substrate positioned at a first predetermined position of a substrate transport mechanism that transports the substrate in one direction;
A component mounting portion that mounts a component on the substrate positioned at the second predetermined position of the substrate transport mechanism via the viscous material supplied to the plurality of locations;
In the viscous material supply unit,
The viscous material supply head supplies viscous material to multiple locations on the substrate,
Among the viscous materials supplied to the plurality of locations, the viscous material supplied to any location is imaged by a first recognition camera provided in the viscous material supply head,
Based on the image of the viscous material imaged by the first recognition camera, the quality of the viscous material supplied by the viscous material supply head is checked.
In the component mounting part,
Among the viscous materials supplied to the plurality of locations, the viscous material supplied to a location other than the location imaged by the first recognition camera is imaged by a second recognition camera included in the mounting head,
Based on the image of the viscous material imaged by the second recognition camera, the quality of the viscous material supplied by the viscous material supply head is checked.
A plurality of components are mounted via the viscous material supplied onto the substrate by the mounting head.
Component mounting method.   The first recognition camera and the second recognition camera are controlled so as to inspect whether or not the viscous material is supplied on the side having a short tact among the viscous material supply unit and the component mounting unit. Component mounting method.   The component mounting method according to claim 5, wherein the first recognition camera and the second recognition camera are controlled so that a tact balance between the viscous material supply unit and the component mounting unit is balanced.

Images