JPH10335806A - Method and equipment for manufacture circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit module by which a problem of a poor connection has been eliminated and components can be connected properly by a laser beam. SOLUTION: Solder 5 on lands 4 is melted by energy of an irradiating laser beam LB and then external electrodes 1a of an electronic component 1 are pushed against the molten solder 5 before the solder 5 hardens. In other words, the solder 5 on the lands 4 is sufficiently heated and melted by the cast laser beam LB and then, using this sufficiently heated and molten solder 5, the external electrodes 1a of the electronic component 1 can be connected to the lands 4. With this method, without setting the energy of the cast laser beam LB at a high value, a problem of a poor connection caused by a part of the solder 5 kept numelted can be eliminated, and the components can be connected extremely properly by the laser beam LB.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit module for electrically connecting an electronic component and a substrate by using a laser beam, and to a circuit module manufacturing apparatus suitable for implementing the method. is there.

[0002]

2. Description of the Related Art Japanese Patent Laying-Open No. 4-314390 discloses a method of mounting an electronic component on a substrate using a laser beam. Specifically, after mounting the electronic component on the substrate so that the external electrodes thereof are in contact with the cream solder previously applied to the land surface, by irradiating a laser beam toward the cream solder and melting it, A method of electrically connecting an external electrode and a land via solder is shown.

[0003]

In this connection method, an electronic component is mounted on a substrate so that its external electrodes come into contact with cream solder previously applied to a land surface, and then a laser beam is irradiated to the cream solder. Therefore, it is not possible to directly irradiate the laser beam directly to the portion of the cream solder sandwiched between the external electrode and the land and shaded.

[0004] In other words, there is a problem that the undissolved portion of the cream solder in the shaded portion sandwiched between the external electrode and the land causes poor connection due to insufficient connection area and strength.

This problem can be alleviated to some extent by setting the energy (product of power and irradiation time) of the irradiation laser beam to a high value. However, when the power of the laser beam is increased, the electronic components are strongly damaged by heat, which causes problems such as quality deterioration and characteristic change. on the other hand,
If the irradiation time of the laser beam is made longer, the connection time per component becomes longer, making it impossible to cope with high speed.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing a circuit module which can solve the problem of poor connection and can perform good component connection by a laser beam. Another object of the present invention is to provide an apparatus for manufacturing a circuit module, which can appropriately execute the manufacturing method.

[0007]

In order to achieve the above object, a manufacturing method according to the present invention comprises irradiating a bonding material provided in advance on an electrode of a substrate with a laser beam, and irradiating the bonding material with the energy of the laser beam. The main feature is that the electrodes of the electronic component are pressed against the molten bonding material before the molten bonding material hardens after the melting, and the electronic component is mounted on the substrate. According to this manufacturing method, the bonding material of the substrate electrode can be sufficiently heated and melted by the irradiation laser beam, and the problem of undissolved bonding material can be solved. The electrode can be connected to the substrate electrode without any defect.

On the other hand, the manufacturing apparatus of the present invention irradiates a component mounting apparatus for sucking and mounting an electronic component on a substrate and irradiating a laser beam to a bonding material provided in advance on an electrode of the substrate corresponding to the mounted component. A laser beam irradiation device and the component mounting and laser beam irradiation are performed so that the electrodes of the electronic components are pressed against the molten bonding material before the molten bonding material is cured after the bonding material is melted by the energy of the irradiation laser beam. And a control device for controlling. According to this manufacturing apparatus, the above-described manufacturing method can be accurately performed by the component mounting device, the laser beam irradiation device, and the control device that controls them.

[0009]

1 to 5 show a first embodiment of the present invention. FIGS. 1A to 1F show a component mounting process, and FIG. 2 shows a component mounting process. FIG. 3 is a configuration diagram of the optical system and the control system, FIG. 3 is a timing chart of component mounting, FIG.
FIG. 5 is a diagram showing how a land is irradiated with a laser beam.

In FIG. 1, reference numeral 1 indicates an electronic component, and reference numeral 2
Is a suction nozzle capable of moving up and down, reference numeral 3 is a substrate, reference numeral 4 is a land (substrate electrode), and reference numeral 5 is solder.

The electronic component 1 is a flat quadrangular prism-shaped component having external electrodes 1a at both ends in the longitudinal direction, for example, a chip component such as a chip resistor, a chip capacitor or a chip inductor.

The solder 5 has a melting temperature of 150 to 4 obtained by kneading solder particles made of a Sn—Pb alloy and flux.
It is a cream solder of about 00 degrees, and is coated in advance on the entire upper surface of the land 4. Of course, the solder 5 includes solder particles other than Sn-Pb-based alloy, for example, solder particles including Sn-based alloy, Ag-based alloy, IN-based alloy, and Au-based alloy, laser type and wavelength, It can be used according to the heat resistance of the electronic component 1 and the substrate 3 and the electrode material. The solder 5 is not limited to cream solder, but may be pre-coated by solder plating or other methods, or may be bump-shaped.

In FIG. 2, reference numeral 11 denotes a computer for controlling the operation of the suction nozzle 2 and the laser oscillation in sequence.
Reference numeral 12 denotes a laser power supply, reference numeral 13 denotes a laser oscillator, reference numeral 14 denotes a beam splitter, reference numeral 15 denotes an optical fiber for transmitting a laser beam, reference numeral 16 denotes an objective optical element including a condenser lens, and reference numeral LB denotes a laser beam. .

The laser oscillator 13 is a laser having a wavelength in the infrared region, such as a CW oscillation or pulse oscillation YAG laser, CO ₂ laser, or CO laser, and has a power of 100 W class. Of course, other infrared lasers or YAG: SH
A visible light laser such as G can be used. The type and wavelength of the laser are appropriately selected depending on the type and physical properties of the solder 5, the heat resistance of the electronic component 1 and the substrate 3, the electrode material, and the like. A YAG laser having a small reflection loss on the solder surface is preferably used. it can. The laser oscillator 13 has a built-in shutter (not shown) for controlling laser oscillation.

The beam splitter 14 includes a half mirror 14a
And three mirrors 14b.
Is split into two beams having the same energy. Of course, as long as the laser beam LB emitted from the laser oscillator 13 can be branched and irradiated simultaneously without a difference in optical path, the number and configuration of the mirrors are not limited to those in the illustrated example. For example, the half mirror 14a and one mirror 14b may be provided.

The optical fiber 15 transmits the split laser beam LB to each of the two objective optical elements 16.
The optical fiber 15 is appropriately selected from quartz-based fibers, KRS-based fibers, and other known optical fibers according to the type and wavelength of the laser used.

The objective optical element 16 irradiates a laser beam LB toward two lands 4 corresponding to the electronic component 1. In the illustrated example, the two objective optical elements 16 are symmetrically arranged on both sides in the longitudinal direction of the vertically descending electronic component 1 at an acute angle with respect to the mounting surface of the substrate 3.

Here, the component mounting process in the first embodiment will be described with reference to FIG. 1 and FIGS.

First, the suction nozzle 2 picks up the center of the upper surface of the electronic component 1 that is supplied in a horizontal position to a component supply location (not shown), and removes the suction nozzle 2 holding the electronic component 1 onto the substrate 3. After moving, the external electrode 1a of the electronic component 1 is aligned with the land 4 corresponding to the external electrode 1a and waits.

Next, the electronic component 1 is lowered vertically (at a right angle to the mounting surface of the substrate 3) from the standby position by the suction nozzle 2 at a constant speed, and as shown in FIG. When a predetermined time t1 has elapsed since then, the laser beam LB is simultaneously applied to the solder 5 of each land 4. The power of each irradiation laser beam LB varies depending on the type of the solder 5, the heat resistance of the electronic component 1 and the substrate 3, the electrode material, and the like, but is generally 1 to 50 W.

As can be seen from FIG. 1A, each irradiation laser beam LB is inclined at an acute angle θ (about 75 degrees in the drawing) with respect to the mounting surface of the substrate 3, and each laser beam LB is tilted. LB is radiated obliquely toward each solder 5 from both sides in the longitudinal direction of the electronic component 1.

The irradiation shape IS of the laser beam LB on the land 4 may be circular or elliptical as shown in FIG. 4A. However, even when the land 4 has a rectangular planar shape, the solder 5
In order to heat and melt the whole without unevenness, it is desirable to make the size of the irradiation shape IS as close as possible to the plane shape of the land 4. For example, when the planar shape of the land 4 is rectangular, the irradiation shape IS of the laser beam LB may be made to be substantially rectangular by using a mask or the like (see FIG. 4B), or the planar shape of the land 4 may be circular. In the case of (1), if the irradiation shape Is of the laser beam LB is made to be a circular shape almost corresponding to this (FIG.
(See (c)), the entire solder 5 can be uniformly heated to prevent uneven melting.

The laser beam LB for the land 4
5A, an image forming heating method based on using a mask M as shown in FIG. 5A, and a focus heating method based on not using a mask as shown in FIG. 5B. Can be used as appropriate. In the case of the imaging heating method, an arbitrary irradiation shape can be obtained depending on the shape of the mask. In the case of the focus heating method, there is no energy loss because the laser beam LB is not blocked by the mask.

When a predetermined time t2 has elapsed since the start of the irradiation of the laser beam LB, as shown in FIG. 1B, the external electrode 1a of the electronic component 1 enters the optical path of the irradiation laser beam LB, and Part of the beam LB hits the external electrodes 1a of the electronic component 1, respectively. At the time t2,
The entire solder 5 is irradiated with the laser beam LB, and the energy of the laser beam LB sufficiently heats and melts each solder 5.

When a predetermined time t3 elapses after the external electrode 1a of the electronic component 1 enters the optical path of the laser beam LB, as shown in FIG. The lower surface of the electrode 1a contacts. At the time t3, the external electrode 1a of the electronic component 1
The energy of B is warmed to a temperature higher than room temperature.

Until a predetermined time t4 elapses after the external electrode 1a of the electronic component 1 comes into contact with the molten solder 5, FIG.
As shown in (d), each external electrode 1a is pressed against the molten solder 5, and the molten solder 5 wraps around and adheres to the other surface of each external electrode 1a. By the way, the external electrode 1 of the electronic component 1
The maximum amount of pressure when pressing a to the molten solder 5 is 300
２０００2000 g.

Although the irradiation of the laser beam LB is stopped when the time t4 has elapsed, the pressing of the electronic component 1 is stopped after the irradiation of the laser beam LB is stopped, as shown in FIG. The operation is continued until the predetermined time t5 elapses. At this time t5, the molten solder 5 hardens, and the external electrodes 1a of the mounted electronic component 1 and the lands 4 of the substrate 3 are electrically connected via the solder 5.

When the time t5 has elapsed, FIG.
As shown in (e), the negative pressure of the suction nozzle 2 is released and the suction nozzle 2 rises, and the mounting of one electronic component 1 is completed.

The times t1, t2, t3 and t5 are all about 10 ms, and the time t4 is about 5 ms. In other words, the time required to mount one electronic component 1 is
Approximately 45 ms after the electronic component 1 starts lowering the standby position
Thus, component mounting can be performed in a very short time.

The time (= t3 + t4) during which the laser beam LB hits the external electrode 1a of the electronic component 1 is about 1
5 ms, but the same time, or the ratio of the same time to t2, can be defined by the inclination angle θ of the irradiation laser beam LB and the mounting speed of the electronic component 1. That is, if the angle θ is reduced or the mounting speed is increased, the time during which the external electrode 1a is irradiated with the laser beam LB can be reduced.

As described above, according to the first embodiment, after the solder 5 on the land 4 is melted by the energy of the irradiation laser beam LB, the external electrode 1a of the electronic component 1 is removed before the melted solder 5 hardens. Since the solder 5 is pressed against the molten solder 5, the laser beam L
B, and the external electrode 1a of the electronic component 1 is connected to the substrate 3 by using the solder 5 that has been sufficiently heated and melted.
Land 4. Therefore, even if the energy of the irradiation laser beam LB is not set to a high value, the problem of poor connection due to unmelted solder 5 can be solved, and components can be connected very well by the laser beam LB.

The external electrode 1a of the electronic component 1 mounted on the substrate 3 is irradiated with the irradiation laser beam L
B is made to enter the optical path of B, and a part of the irradiation laser beam LB is applied to the external electrode 1a. Therefore, the external electrode 1a before soldering is heated to a temperature higher than room temperature, thereby melting the external electrode 1a. It is possible to improve the riding of the solder 5 and to perform the soldering with high quality.

Further, the irradiation of the laser beam LB to the solder 5 is continued until the time t4 has elapsed since the external electrode 1a of the electronic component 1 was pressed against the molten solder 5, so that the contact with the external electrode 1a The melted state of the solder 5 can be appropriately maintained by compensating for the deprived heat, and the molten solder 5 can satisfactorily wrap around the surface of the external electrode 1a.

Furthermore, since the mounting of one electronic component 1 can be completed in about 45 ms after the electronic component 1 at the standby position starts lowering, the time required for mounting one electronic component 1 is shortened and the speed is increased. In addition to this, there is an advantage that it can sufficiently follow a high-speed electronic component supply device having a supply speed of 0.1 sec per component.

Further, since only the solder 5 of the land 4 on which the electronic component 1 is mounted can be heated and melted by the irradiation laser beam LB, the solder 5 of the adjacent land 4 is also heated and melted at the same time as in the case of reflow soldering. The problem of short-circuiting can be solved, and components can be mounted at a narrow pitch with high accuracy and without any trouble.

In the first embodiment described above, the power of the irradiation laser beam LB is kept constant and the irradiation is controlled on / off. However, the power of the irradiation laser beam LB may be variably controlled. FIG. 6 shows an example of this variable control. In this example, the irradiation laser beam L is maintained until the time t2 elapses from the start of the irradiation of the laser beam LB.
The power of B is gradually increased to the MAX value, and the electronic component 1
Of the irradiation laser beam LB until the time t3 elapses after the external electrode 1a has entered the optical path of the irradiation laser beam LB.
Is lower than the MAX value, and the power of the irradiation laser beam LB is gradually reduced until the time t4 elapses after the external electrode 1a of the electronic component 1 contacts the molten solder 5, and the time t4 elapses Incidentally, the irradiation of the laser beam LB is stopped. In this way, the solder 5
Can be prevented from being rapidly heated to generate solder balls and the like, and thermal damage to the electronic component 1 caused by the irradiation laser beam LB hitting the external electrode 1a can be suppressed.

Incidentally, as a method of changing the power of the irradiation laser beam LB, the power source 12 of the laser oscillator 13 is used.
A method of interposing an intensity adjustment filter such as an ND filter in the middle of the optical path, or a method of interposing an optical element having an intensity control hole such as a slit in the middle of the optical path to change the amount of the laser beam LB passed. Alternatively, a method of changing the energy density of the irradiation laser beam LB using a lens, a beam expander, or the like can be appropriately employed.

FIGS. 7 and 8 show a laser beam irradiation method different from that of the first embodiment.

The irradiation method shown in FIGS. 7A and 7B is as follows.
Each laser beam LB is irradiated obliquely from one side in the width direction of the electronic component 1 toward each solder 5. Each irradiation laser beam LB (the laser beam on the back side is omitted)
Are inclined at an acute angle θ (about 75 degrees in the drawing) with respect to the mounting surface of the substrate 3, and each laser beam L
B is irradiated obliquely from one side in the width direction of the electronic component 1 toward each solder 5. Also in this case, similarly to the first embodiment, after the solder 5 of the land 4 is melted by the energy of the irradiation laser beam LB, the external electrode 1a of the electronic component 1 is melted before the melted solder 5 hardens. The external electrode 1 of the electronic component 1 which can be pressed against the solder 5 and is being lowered
a can be heated by applying a laser beam LB to it.

The irradiation method shown in FIGS. 8A and 8B
Each laser beam LB is irradiated vertically (perpendicular to the mounting surface of the substrate 3) toward the solder 5 of each land 4. Each laser beam LB (the laser beam on the back side is omitted) is irradiated perpendicularly to each solder 5, and the moving path when descending the electronic component 1 by the suction nozzle 2 is formed at an acute angle with respect to the substrate 3. θ (about 50 degrees in the drawing)
So that a part of the irradiation laser beam LB strikes the external electrode 1a of the electronic component 1 mounted on the substrate 3 during the downward movement. Also in this case, similarly to the first embodiment, after the solder 5 of the land 4 is melted by the energy of the irradiation laser beam LB, the external electrode 1a of the electronic component 1 is melted before the melted solder 5 hardens. It can be pressed against the solder 5, and can be heated by applying the laser beam LB to the external electrode 1 a of the electronic component 1 which is moving down.

FIGS. 9A to 9E show configurations of an optical system different from those of the first embodiment.

The optical system shown in FIG.
The laser beam LB is applied obliquely from one side in the width direction to the solder of the land 4 and can be adopted in the laser beam irradiation method shown in FIG. A laser beam LB from a laser oscillator (not shown) is simultaneously irradiated to two lands 4 corresponding to the electronic component 1 via an optical fiber 15 and an objective optical element 16.

The optical system shown in FIG.
The laser beam LB is obliquely applied to the solder of the land 4 from both sides in the length direction and one side in the width direction, and can be adopted in the laser beam irradiation method shown in FIGS. A laser beam LB from a laser oscillator (not shown) is
And a reflection beam LB emitted from the reflection mirror 17 via the objective optical element 16 to the electronic component 1.
Are simultaneously irradiated toward the two lands 4 corresponding to.

The optical systems shown in FIGS. 9C and 9D are also the same as the optical system shown in FIG. 9B except for the position and orientation of the objective optical element 16 and the configuration of the reflection mirror 17. Basically the same. In these optical systems, the position of the irradiation laser beam LB can be adjusted by changing the angle of the reflection mirror 17.

The optical system shown in FIG. 9E irradiates the laser beam LB vertically to the solder of the land 4 and can be employed in the laser beam irradiation method shown in FIG. Laser beam LB from laser oscillator not shown
Are simultaneously irradiated toward two lands 4 corresponding to the electronic component 1 via the optical fiber 15 and the objective optical element 16.

FIG. 10 shows a configuration of a suction nozzle different from that of the first embodiment.

The suction nozzle 21 shown in FIGS. 10 (a) and 10 (b) has a flange 21a which covers the upper surface of the electronic component 1 at its tip. When the suction nozzle 21 is used, it is possible to prevent the laser beam LB from hitting mainly the upper surface of the external electrode 1a of the electronic component 1 being lowered by the flange portion 21a, thereby suppressing the thermal damage to the electronic component 1. Can be.

FIGS. 11A and 11B show the structure of a suction nozzle different from that of the first embodiment.

The suction nozzle 22 shown in FIG. 11A has a flange 22a at its tip for covering the upper surface of the electronic component 1, and a concave portion 22b conforming to the upper surface shape of the electronic component 1 on the inner surface of the flange 22a. Have. When the suction nozzle 22 is used, it is possible to prevent the laser beam LB from hitting mainly the upper surface of the external electrode 1a of the electronic component 1 being lowered by the flange portion 22a, thereby suppressing the thermal damage to the electronic component 1. Can be. Further, the positioning of the electronic component 1 with respect to the suction nozzle 22 can be performed using the concave portion 22b.

The suction nozzle 23 shown in FIG. 11B has a filter 23a at its tip for covering the upper surface of the electronic component 1. The filter 23a is composed of, for example, a reflective ND filter formed by evaporating chromium on a glass substrate, and the like.
The intensity of the laser beam LB mainly hitting the upper surface of the external electrode 1a of the electronic component 1 can be reduced by the filter 23a, so that thermal damage to the electronic component 1 can be suppressed.

FIG. 12 shows a method of heating and melting the solder 5 by using the second laser beam together. This method is useful when using a substrate 31 that is transparent to a laser beam, and when irradiating the laser beam LB1 from the upper side of the substrate 31 to the solder 5 of the land 4, the lower side (back side) of the substrate 31 is used. ), The laser beam LB2 is irradiated to the land 4 through the substrate 31. In this way, the amount of heat required for heating and melting the solder 5 can be supplemented by the lower laser beam LB2, so that the same component connection is performed even if a lower energy laser beam LB1 is used. Therefore, thermal damage to the electronic component 1 caused by the irradiation of the upper laser beam LB1 can be suppressed.

The method shown in FIG. 12 is also useful when using a substrate having no laser beam transmission.
When irradiating the laser beam LB1 from the upper side of the substrate to the solder 5 of the land 4 and irradiating the laser beam LB2 from the lower side (back side) of the substrate to the land 4, the laser beam LB2 applies The lower portion of the land 4 is mainly heated, and the heat can assist the heating and melting of the solder 5.

FIGS. 13A to 13D show a structure for mechanically controlling the timing of laser beam irradiation and its operation. Reference numeral 41 in the figure denotes a moving arm that supports the suction nozzle 2 so as to be able to move up and down under the urging of a coil spring 42, 43 denotes a laser beam-on switch provided outside the moving arm 41, and 44 denotes a moving arm 41. The reference numeral 44a denotes a beam passing hole provided in the light shielding plate 44, and the reference numeral 45 denotes a laser beam off switch provided inside the moving arm 41. The configuration of the optical fiber 15, the objective optical element 16, and the reflection mirror 17 is the same as that of the optical system shown in FIG.

When the moving arm 41 is lowered from the standby position by a predetermined distance, the switch 43 for turning on the laser beam is operated, and the laser beam LB is emitted from the objective optical element 16 as shown in FIG. At this time, since the light shielding plate 44 has entered between the objective optical element 16 and the mirror 17, the laser beam L
B is blocked by the light shielding plate 44.

When the moving arm 41 is further lowered, FIG.
As shown in FIG. 3C, the beam passage holes 44 of the light shielding plate 44 are formed.
a coincides with the optical path of the laser beam LB, and the objective optical element 1
The laser beam LB emitted from the laser beam 6 passes through the beam passage hole 44.
a to the reflection mirror 17 and the reflection mirror 1
The reflected beam from 7 is applied to the solder on the land 4.

The laser beam irradiation is performed in the beam passage hole 4
The operation is continuously performed in accordance with the lowering of the electronic component 1 by the vertical length of 4a. After the descending external electrode of the electronic component 1 is pressed against the solder (molten solder) of the land 4, the suction nozzle 2 is moved inside the moving arm 41 against the urging force of the coil spring 42 as the moving arm 41 is lowered. Dive into. And
When a predetermined time elapses after the external electrodes of the electronic component 1 are pressed against the solder (melted solder) on the lands 4, the light shielding plate 44 is again placed between the objective optical element 16 and the mirror 17, as shown in FIG. Enters, and the laser beam LB emitted from the objective optical element 16 is blocked by the light shielding plate 44. At the same time, the switch 45 for turning off the laser beam is operated by the suction nozzle 2 sunk into the moving arm 41, and the laser beam emission from the objective optical element 16 is stopped.

With such a configuration, the irradiation timing of the laser beam LB is mechanically controlled by the operation of the moving arm 13 without performing the sequence control as in the first embodiment. Similar component mounting can be performed. Of course, if the operating positions of the laser beam on switch 43 and the laser beam off switch 45 can be accurately defined, the light shielding plate 44 is not always necessary.

FIGS. 14 to 16 show a second embodiment of the present invention. FIG. 14 is a structural diagram of a mounting machine, an optical system and a control system used therein, and FIG. 15 is a top view of a rotary head. FIG. 16 is a diagram showing a method of correcting the position of the sucked electronic component.

In FIG. 14, reference numeral 51 denotes a mounting machine, reference numeral 52 denotes a computer for performing sequence control of operation of the mounting machine and laser oscillation, reference numeral 53 denotes a laser power supply, reference numeral 54 denotes a laser oscillator, and reference numeral 55 denotes a beam splitter. The configurations of the laser power supply 53, the laser oscillator 54, and the beam splitter 55 are the same as those in the first embodiment, and thus the description thereof will be omitted.

The mounting machine 51 includes a rotary head 51a, twelve rods 51b provided at an angle of 30 degrees on the lower surface side of the rotary head 51a, and a suction nozzle 51c provided on the lower surface of each rod 51b. Table 51d for supporting the substrate 3, a pair of objective optical elements 51e, an XY table 51f for supporting the objective optical element 51e, and a laser beam LB from the beam splitter 55.
1e for transmitting an optical fiber 51g.

The rotary head 51a rotates intermittently at intervals of 30 degrees in a counterclockwise direction when viewed from above by a driving source (not shown). Each rod 51b is rotatable and vertically movable about an axis, and is rotated or vertically moved by a drive source (not shown).

In the mounting machine 51, the electronic component 1 is suctioned at the position A of the rotary head 51a shown in FIG. 15, the height of the suction component 1 is inspected at the position B, and the width and the width of the suction component 1 are measured at the position C. Performs length inspection and direction detection, and picks up the suction part 1 at the D position.
Angle correction. Further, after the mounting position and the laser beam irradiation position are corrected at the position E, the suction component 1 is mounted on the substrate 3, a defective product is discharged at the position F, and the nozzle is cleaned at the position G.

Here, a component mounting process in the second embodiment will be described.

First, when one of the rods 51b stops at the position A due to the intermittent rotation of the rotary head 51a, the rod 51b is lowered from the raised position, and is supplied to the lower side of the same position in a horizontal posture. The center of the upper surface of the electronic component 1 is sucked and taken out by the suction nozzle 51c, and the rod 51b is returned from the lowered position to the raised position.

Next, when the rod 51b sucking the electronic component 1 stops at the position B due to the intermittent rotation of the rotary head 51a, a side view of the electronic component 1 sucked by the suction nozzle 51c is not shown. The image is taken by a CCD camera and the quality of the height dimension is determined based on the image data.

Next, when the rod 51b sucking the electronic component 1 stops at the position C due to the intermittent rotation of the rotary head 51a, the lower surface image of the electronic component 1 sucked by the suction nozzle 51c is not shown. And the quality of the width and length dimensions and the quality of the orientation are determined based on the image data, and in the case of a poor orientation, the amount of displacement in the XYθ direction is detected.

The detection of the deviation amount in the XYθ directions is performed as follows. First, as shown in FIG. 16A, a shift amount α in the θ direction of the electronic component 1 with respect to a reference line passing through the center P1 of the suction nozzle 51c is detected from a lower surface image of the electronic component 1 obtained through the CCD camera. . And FIG.
As shown in (b), the position of the center P1 of the suction nozzle 51c and the center P2 of the electronic component 1 in the XY coordinate system when the suction nozzle 51c is rotated by the shift amount α in the θ direction is detected, and the mutual positions are determined. , The shift amount in the X direction and the shift amount in the Y direction are respectively detected.

Next, when the rod 51b holding the electronic component 1 is stopped at the position D due to the intermittent rotation of the rotary head 51a, the suction component 1 has the deviation amount α in the θ direction as described above. In order to correct this,
b is rotated by a shift amount α in the θ direction.

Next, when the rod 51b holding the electronic component 1 is stopped at the position E due to the intermittent rotation of the rotary head 51a, if the suction component 1 has a displacement amount in the XY directions as described above. Table 5 to correct this
The mounting position is corrected by displacing 1d in the XY directions, and the laser beam irradiation position is corrected by displacing the table 51f in the XY directions. Then, the rod 51b (the suction nozzle 51c) is lowered from the raised position, and the rod 51b (FIG. 1A)
Component connection is performed in the same process as in (f).

As a result of the dimension inspection at the positions B and C,
If it is determined that the product is defective in size, the component mounting at the position E is not executed, and the electronic component 1 moves to the position F in the suction state. Then, when the rod 51b stops at the F position due to the intermittent rotation of the rotary head 51a, the suction of the suction nozzle 51c is released, and the electronic component 1 having a dimensional defect drops by its own weight and is collected in a container or the like.

Next, when the rod 51b stops at the G position due to the intermittent rotation of the rotary head 51a, air is blown toward the suction nozzle 51c to perform nozzle cleaning.

As described above, according to the second embodiment, during the operation of intermittently rotating the rotary head 51a, it is possible to continuously carry out component mounting using the same laser beam as in the first embodiment.

Further, the shift amount in the XYθ direction of the electronic component 1 sucked by the suction nozzle 51c is detected, and the component mounting position and the laser beam irradiation position are corrected based on the shift amount before the component mounting. The electronic components 1
Can be mounted at an accurate position with respect to the substrate 3.

Further, the size of the electronic component 1 sucked by the suction nozzle 51c is detected, and if it is determined that the size is defective, the component mounting is not executed and the defective electronic component 1 is collected. Therefore, it is possible to prevent the electronic component 1 having a dimensional defect from being erroneously mounted on the board 3.

In the above-described second embodiment, an example is described in which the laser beam irradiation position is corrected by moving the objective optical element 51e itself, but FIGS. 9B to 9D.
By using the mirror-based optical system shown in (1), the laser beam irradiation position can be similarly corrected by changing the angle of the mirror. Of course, the same correction can be performed by using another optical path changing element such as a prism instead of the mirror.

In the second embodiment, the suction nozzle 51c has a flat tip end surface.
As shown in FIG. 7A, if a guide recess 51c1 having a tapered surface is provided in the suction nozzle 51c, the configuration shown in FIG.
As shown in FIG. 7B, the position of suction of the electronic component 1 with respect to the suction nozzle 51c can be corrected by using the guide recess 51c1 to eliminate the deviation in the θ direction.

As described above, in the above-described first and second embodiments, an example in which the flat rectangular prism having external electrodes at both ends in the longitudinal direction is described as an electronic component, the electronic component having a shape other than the flat rectangular prism is used. It goes without saying that the same mounting method can be applied to electronic components having external electrodes at positions other than both ends in the longitudinal direction, and electronic components having lead terminals regardless of the type of component.

Further, in the first and second embodiments described above, an example using solder as a bonding material has been exemplified. However, a metal material other than solder which can be melted by the energy of a laser beam, a conductive resin material, or the like is bonded. Even when used as a material, similar component mounting can be performed.

[0079]

As described in detail above, according to the present invention,
Since the bonding material of the electrode of the substrate is sufficiently heated and melted by the irradiation laser beam, the electrode of the electronic component can be connected to the electrode of the substrate by using the sufficiently heated bonding material. Even if the energy is not set to a high value, the problem of poor connection due to undissolved bonding material can be solved, thereby making it possible to connect the components with a laser beam very well.

[Brief description of the drawings]

FIG. 1 is a diagram showing a component mounting process according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of an optical system and a control system used for component mounting according to the first embodiment.

FIG. 3 is a timing chart of component mounting according to the first embodiment.

FIG. 4 is a view showing an irradiation shape of a laser beam on a land according to the first embodiment.

FIG. 5 is a diagram showing a state of laser beam irradiation on a land according to the first embodiment.

FIG. 6 is a timing chart showing a method for variably controlling the power of an irradiation laser beam.

FIG. 7 is a diagram showing a modified form of a method of irradiating a land with a laser beam.

FIG. 8 is a diagram showing a modified form of a method of irradiating a land with a laser beam.

FIG. 9 is a diagram showing a modified form of the optical system.

FIG. 10 is a diagram showing a modified form of a suction nozzle.

FIG. 11 is a view showing a modified form of a suction nozzle.

FIG. 12 is a view showing a method of heating and melting solder by using a second laser beam together.

FIG. 13 is a diagram showing a configuration for mechanically controlling the timing of laser beam irradiation and its operation.

FIG. 14 is a configuration diagram of a mounting machine and an optical system and a control system used for the same according to a second embodiment of the present invention.

FIG. 15 is a top view of a rotary head according to a second embodiment.

FIG. 16 is a diagram showing a method for correcting the position of a sucked electronic component according to the second embodiment.

FIG. 17 is a diagram showing a modified form of the suction nozzle.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... External electrode, 2 ... Suction nozzle, 3 ...
Substrate, 4 land (substrate electrode), 5 solder, LB laser beam, IS laser beam irradiation shape, 11 computer, 12 laser power supply, 13 laser oscillator,
14: beam splitter, 15: optical fiber, 16: objective optical element, 17: reflection mirror, 21, 22, 23 ... suction nozzle, LB1, LB2 ... laser beam, 51 ... mounting machine,
51a: rotating head, 51c: suction nozzle, 51d: table, 51e: objective optical element, 51f: table, 5
1g: optical fiber, 52: computer, 53: laser power supply, 54: laser oscillator, 55: beam splitter.

Claims (16)

[Claims] 1. A method of manufacturing a circuit module for connecting an electrode of an electronic component to an electrode of a substrate via a bonding material, the method comprising: irradiating a bonding material provided on the electrode of the substrate with a laser beam; A circuit module, wherein the electronic component is mounted on a substrate by pressing the electrodes of the electronic component against the molten bonding material before the molten bonding material is cured after being melted by the energy of the irradiation laser beam. Manufacturing method. 2. A method of irradiating a bonding material with a laser beam,
The method according to claim 1, wherein the process is continued until the electrodes of the electronic component are pressed against the fusion bonding material. 3. The method for manufacturing a circuit module according to claim 1, wherein at least a part of the irradiation laser beam is applied to an electrode of the electronic component mounted on the substrate from the middle thereof. 4. An electrode of an electronic component mounted on a substrate is positioned halfway by inclining at least one of a laser beam irradiation optical path and an electronic component mounting path at an acute angle to a mounting surface of the substrate. 4. The method for manufacturing a circuit module according to claim 3, wherein the laser beam enters the irradiation optical path of the laser beam. 5. A time during which an irradiation laser beam is applied to an electrode of an electronic component is defined by at least one of an inclination angle of at least one of an irradiation optical path of the laser beam and a mounting path of the electronic component, and a mounting speed of the electronic component. The method for manufacturing a circuit module according to claim 4, wherein: 6. The irradiation after the electrode of the electronic component enters the irradiation optical path of the laser beam, rather than the power of the irradiation laser beam until the electrode of the electronic component mounted on the substrate enters the irradiation optical path of the laser beam. The method for manufacturing a circuit module according to claim 4, wherein the power of the laser beam is reduced. 7. When irradiating a laser beam from a mounting surface side of a substrate to a bonding material of an electrode, irradiating a second laser beam toward an electrode of the substrate from a surface side opposite to a mounting surface of the substrate. The method for manufacturing a circuit module according to any one of claims 1 to 6, wherein 8. The method according to claim 7, wherein the substrate has transparency to the second laser beam. 9. The circuit module according to claim 1, wherein an irradiation shape of the laser beam applied to the bonding material matches a planar shape of the bonding material. Method. 10. The method for manufacturing a circuit module according to claim 1, wherein the bonding material is solder. 11. A device for manufacturing a circuit module for connecting an electrode of an electronic component to an electrode of a substrate via a bonding material, comprising: a component mounting device having a suction nozzle for sucking and mounting the electronic component on the substrate; A laser beam irradiator that irradiates a laser beam toward the bonding material provided in advance, and melts the bonding material by the energy of the irradiated laser beam, and then melts the electrodes of the electronic component before the molten bonding material hardens A device for manufacturing a circuit module, comprising: a control device for controlling component mounting and laser beam irradiation so as to press against a bonding material. 12. The control device controls component mounting and laser beam irradiation such that the laser beam irradiation on the bonding material is continued until the electrode of the electronic component is pressed against the molten bonding material. The circuit module manufacturing apparatus according to claim 11, wherein 13. An irradiation optical path of a laser beam from the laser beam irradiation device and an electronic component by the component mounting tool such that an electrode of the electronic component mounted on the substrate enters the irradiation optical path of the laser beam from the middle thereof. 13. The circuit module manufacturing apparatus according to claim 11, wherein at least one of the mounting paths is inclined so as to form an acute angle with the mounting surface of the substrate. 14. The laser beam irradiation apparatus according to claim 11, wherein an irradiation shape of the laser beam applied to the bonding material from the laser beam irradiation device is adjusted to match a planar shape of the bonding material. An apparatus for manufacturing the circuit module according to claim 1. 15. The apparatus according to claim 11, wherein the component mounting device includes a rotary head having a plurality of suction nozzles. 16. A detecting device for detecting a shift amount of an electronic component sucked by a suction nozzle of the component mounting device, a correcting device for correcting a component mounting position and a laser beam irradiation position according to the detected shift amount. The circuit module manufacturing apparatus according to any one of claims 11 to 15, further comprising: