JPS5812106B2 - Laser soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser soldering device for soldering electronic components placed on a printed wiring board using laser light.

As a means for soldering the electrode portions of electronic components arranged on a printed wiring board to the pattern of the printed wiring board, a laser soldering device is known in which the electrode portions are irradiated with laser light and soldered.

However, since the electronic components placed on the printed wiring board are oriented in both the X direction and the Y direction, when soldering the electrode parts at both ends of these electronic components to the pattern, first electronic components are soldered, and then the printed wiring board is rotated 90 degrees or the laser optical system is moved to solder the remaining electronic components in the Y direction.

That is, either the printed wiring board is rotated to align the electrode part of the electronic component with the irradiation point of the laser beam, or the printed wiring board is fixed and the laser optical system is moved to irradiate the electrode part of the electronic component. ing.

Therefore, the supporting device for the printed wiring board or the supporting device for the laser optical system becomes complicated and expensive, and it is difficult to position the soldered portion for irradiating the laser beam.

This invention was made in view of the above circumstances, and its purpose is to be able to change the laser irradiation position without rotating the printed wiring board or moving the laser optical system. The purpose of laser soldering is to provide a laser soldering device that can easily solder electronic components arranged in a mixed manner in the X direction and the Y direction.

The present invention will be described below based on an embodiment shown in the drawings.

In the figure, 1 is a printed wiring board, on the surface of which a pattern 2 made of a conductive film is provided.

On this printed wiring board 1, there are a first electronic component 3 arranged in the X direction and a second electronic component 3 arranged at right angles thereto, that is, in the Y direction.
electronic components 4 are provided in a mixed manner.

The electrode parts 3a, 3a, 4a, 4a at both ends of these first and second electronic components 3, 4 are in contact with the pattern 2, and these contact parts are soldered to the parts 5,
5.

Furthermore, laser optical systems 6a and 6b are provided at the upper portions corresponding to the soldering parts 5 and 5.

These laser optical systems 6a and sb consist of a laser oscillator 7 and a condensing lens 8 that condenses the laser light oscillated from the laser oscillator 7 and irradiates it onto the part 5 to be soldered. An optical path changing prism 10 that can go in and out of the optical path 9 is provided in front of the condensing lens 8 of 6b.

This optical path changing prism 10 is attached to a holder (not shown).

), and in this embodiment, the optical path changing prism 10 is sometimes submerged when the first electronic component 3 is soldered, and sometimes is supported by the optical path 9 when the second electronic component 4 is soldered.
It protrudes to the side and refracts the laser beam.

Next, the operation of the above embodiment will be explained.

First, as shown in FIG. 1A and B, in the X direction, that is, in the first
When soldering the electrode parts 3a and 3a of the electronic component 3 to the pattern 2, the soldering target is the solder 11 of the part 5.5.
, 11 are irradiated with laser light from the laser optical systems 6a and 6b to melt and solder the solders 11 and 11.

Next, in the Y direction, that is, the electrode portion 4a of the second electronic component 4
, 4a to the pattern 2, as shown in FIGS. 2A and 2B, the printed wiring board 1 is moved one pitch so that one electrode portion 4a faces the laser optical systems 6a and 6b.

In this state, the optical path changing prism 10 is projected into the optical path 9 of the laser optical system 6b, and the respective laser optical systems 6a,
When laser light is irradiated from the laser optical system 6b, the laser light from one laser optical system 6a is focused by the condensing lens 8, and then is irradiated onto the solder 11 of the part 5 to be soldered on one side, and the laser light from the other laser optical system 6b is The laser beam is condensed by a condensing lens 8 and then refracted by an optical path changing prism 10, and the other solder target irradiates the solder 11 of the part 5 to melt and solder the solder 11 and 11.

Therefore, when soldering electronic components 3 and 4 arranged in a mixed manner in the X direction and the Y direction on the printed wiring board 1, one laser optical system 6 is selected depending on the orientation of the electronic components 3 and 4.
By simply moving the optical path changing prism 10 into and out of the optical path 9 of b, the laser beam can be refracted and irradiated onto the part 5 to be soldered.

As explained above, the present invention is for soldering the electrode portions at both ends of electronic components arranged in a mixed manner in the X direction and the Y direction on a printed wiring board, in which a laser beam is applied to the electrode portions of the electronic components. Since the optical path changing prism is installed in the optical path of either one of the pair of laser optical systems to be irradiated and soldered, it is possible to change the optical path of the laser beam according to the X and Y arrangement directions of the electronic components. can.

Therefore, it is possible to rotate the printed wiring board as in the past,
There is no need to move the laser optical system, the laser beam can be irradiated to the target area, and the apparatus can be simplified and miniaturized.

[Brief explanation of the drawing]

The drawings show one embodiment of this invention, and FIGS. 1A and 1B
FIG. 2A is a front view and a plan view of an electronic component arranged in the X direction irradiated with a laser. B is a front view and a plan view of electronic components arranged in the Y direction irradiated with a laser. 1...Printed wiring board, 2...Pattern, 3, 4...Electronic component, 3a, 4a...
... Electrode part, 6a, 5b ... Laser optical system, 9 ... Optical path, 10 ... Prism for changing optical path, L ... Laser light.

Claims (1)

[Claims] 1 Laser soldering, in which the electrodes at both ends of electronic components arranged in a mixed manner in the X and Y directions on a printed wiring board are soldered to the pattern of the printed wiring board, is performed using a device that A pair of laser optical systems that irradiate laser beams and solder the parts, and a pair of laser optical systems that are installed so that they can enter and exit the optical path of either one of these laser optical systems, and that control the optical path of the laser beam according to the X and Y arrangement directions of the electronic components. A laser soldering device characterized by comprising a prism for changing an optical path.