JP4108177B2 - Film-like workpiece processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for processing a film workpiece such as a film substrate for a film probe unit. .
[0002]
[Prior art]
One probe card used in a current-carrying test for a flat inspection object such as a semiconductor integrated circuit or a liquid crystal display panel uses an elastically deformable film-like probe unit (for example, JP-A-4-363671). No. 5,221,897).
[0003]
In this probe unit, a film-like substrate is manufactured by forming a wiring pattern on a film-like substrate in which a metal layer having spring properties and a resin layer having electrical insulation properties are laminated by a so-called printed wiring technique. A slit is formed on the film substrate to cut the probe unit from the film substrate, and a plurality of slits are formed on the film substrate to separate the region including one or more wiring portions of the wiring pattern into a finger shape. Thus, a part of each wiring portion is used as a probe element.
[0004]
A probe card using this type of film-like probe unit usually includes a plurality of probe units. The probe unit is assembled as a probe card by adhering the probe unit to the probe attachment body with an adhesive, and then attaching the probe attachment body to the plate-like wiring board with an appropriate attachment, and provided at the tip of each probe element. The protrusion is used in a state where it is pressed against the flat electrode portion of the flat plate-shaped object to be inspected.
[0005]
[Problems to be solved by the invention]
However, in the above film-like probe unit, when the slit is formed by the laser beam capable of cutting the metal layer, both the metal layer and the resin layer can be removed, but the resin layer is greatly damaged, and as a result, the probe The element does not function as a probe.
[0006]
In addition, if an attempt is made to form a slit with a laser beam that does not damage the resin, the slit is not formed in the metal layer because the energy of the laser beam is too weak. When the slit is formed by a cutting machine such as a dicer, the resin layer is peeled off from the metal layer.
[0007]
In a film-like probe unit, it is important to cut both the hard layer and the soft layer beautifully and accurately.
[0008]
[Solution, action and effect]
The processing device of the present invention is a laser oscillator that outputs first and second laser beams having different wavelengths and intensities, and a processing stage that receives a film-like workpiece, and is selected as the first and second processing regions. Movable stage, first optical means for directing the first laser beam to the first processing area, and second optical means for directing the second laser beam to the second processing area, including.
[0009]
The processing stage is moved to the first processing area when a slit is formed in a hard layer such as a metal layer, and is moved to the second processing area when a slit is formed in a soft layer such as a resin layer. Is done. For example, the workpiece is irradiated with a strong first laser beam in the first processing region to form a slit in the hard layer, and is irradiated with a weak second laser beam in the second processing region. Thus, a slit is formed in the soft layer.
[0010]
The slit is formed in one of the resin layer and the metal layer, and then formed in the other of the resin layer and the metal layer using the slit. However, if the slit is formed in the hard layer first, and then the soft layer is irradiated with the second laser beam through the slit, the slit is formed in the hard layer. Since the strong first laser beam is not applied to the slit of the soft layer, the shape of the slit of the soft layer is not damaged, and the slit of the hard layer may be damaged by the weak second laser beam. Absent.
[0011]
According to the present invention, the processing stage that receives the film-like workpiece is selectively moved to the first and second processing regions, and the first and second laser beams having different wavelengths and intensities are respectively transmitted to the first and second laser beams. Since it is directed to the second processing region, it is possible to form beautifully and accurately slits in both the hard layer and the soft layer of the workpiece such as a film-like probe unit having a hard layer and a soft layer. it can.
[0012]
Further, in the present invention, the alignment mark formed on the workpiece is arranged at an alignment position different from the first and second machining areas so as to photograph the alignment mark from the back side (the side opposite to the beam irradiation side) of the workpiece. Includes an alignment camera . Thus, the alignment mark can be photographed without hindering the irradiation of the laser beam to the workpiece and without the alignment camera being contaminated with dust scattered from the workpiece.
[0013]
The processing stage may be provided with a through hole that allows the alignment mark to be taken by the alignment camera. Thereby, since the alignment camera can image | photograph an alignment mark directly through a through-hole, the precision of positioning improves.
[0014]
The processing stage can include a table that receives the workpiece, and an XY stage that moves the table in a two-dimensional manner within a plane perpendicular to the axial direction of the irradiation beam to the workpiece.
[0015]
The table has a recess that opens to the beam irradiation side of the workpiece and is supported by the XY stage, and a recess in the main base that can move in the axial direction of the laser beam to receive the workpiece. An intermediate base disposed between the main base and the intermediate base, and a lid that is detachably attached to the beam irradiation side of the main base to the workpiece and has an opening in the center. And one or more elastic bodies that press the intermediate base toward the lid. As a result, since the workpiece is sandwiched between the intermediate base and the lid, the position of the surface of the workpiece (beam irradiation surface) in the axial direction of the laser beam is constant even if the thickness dimension of the workpiece is different. Thus, the machining accuracy is further stabilized and improved.
[0016]
Furthermore, the 1st and 2nd television camera which image | photographs the process position of the to-be-processed object in a 1st and 2nd process area | region, respectively can be included.
[0017]
The first optical means includes a first mirror that directs the first laser beam to the first processing region, and a beam on the processing stage that has moved the beam that has passed through the first mirror to the first processing region. A first condenser lens disposed between the first mirror and the first processing region for focusing on the processing body, and the second optical means applies the second laser beam to the second processing light. A second condensing lens disposed between the second mirror and the second processing region may be included to converge on the workpiece on the processing stage moved to the region.
[0018]
The first and second condenser lenses can be supported by the first and second autofocus mechanisms to adjust the beam spot diameter on the workpiece, respectively. Accordingly, a more beautiful slit can be accurately formed by both the hard layer and the soft layer.
DETAILED DESCRIPTION OF THE INVENTION
First, an example of the workpiece 10 will be described with reference to FIGS. Hereinafter, two directions orthogonal to each other in a plane parallel to the workpiece 10 are referred to as an X direction and a Y direction, and a direction perpendicular to the workpiece 10 (the direction of the axis of the laser beam irradiated to the workpiece 10) is Z. It is called direction.
[0020]
In the illustrated example, the workpiece 10 is a film-like substrate for finishing into a film-like probe unit 12 and has a circular shape.
[0021]
The film-like substrate, that is, the workpiece 10 includes a resin layer 14 formed into a flexible film shape by an electrically insulating material such as polyimide resin, and a film disposed on one surface (front surface) of the resin layer 14. And a wiring pattern having a plurality of wiring portions 18 formed on the other surface (back surface) of the resin layer 14.
[0022]
The resin layer 14, the metal layer 16, and the wiring portion 18 are cut along the cutting line 20 as shown by the broken line in the workpiece 10, and an elongated notch 22 shown by the broken line is formed in the workpiece 10, By forming the groove 24 shown in the metal layer 16, it acts as a member for forming the probe unit 12. As will be described later, the cutting and the groove formation are performed by forming a slit in the workpiece 10 using two types of laser beams having different wavelengths and intensities.
[0023]
The resin layer 14 is formed into a flexible sheet by laminating an electrically insulating resin material on one surface of the sheet-like metal layer 16 by an appropriate technique such as coating. 16 is fixed. However, the flexible electrically insulating sheet-like resin layer 14 and the metal layer 16 may be laminated by an appropriate method such as adhesion or welding.
[0024]
The metal layer 16 is formed of a conductive film-like spring material such as stainless steel, copper, brass, beryllium, etc., and is overlaid on the resin layer 14. In the illustrated example, the metal layer 16 is disposed on one entire surface of the resin layer 14. However, the metal layer 16 may be laminated at least on the portion of the resin layer 14 corresponding to one end portion of the wiring portion 18.
[0025]
The wiring pattern is formed on the other surface of the electrically insulating member, that is, the resin layer 14 by a so-called printed wiring technique. Each wiring part 18 extends linearly from one end edge of the resin layer 14 between adjacent probe regions 20. Each wiring portion 18 has a protrusion 26 formed at an end portion thereof by an appropriate method such as nickel plating.
[0026]
In the illustrated example, each protrusion 26 is a hemispherical protrusion or bump formed by nickel plating. However, the protrusions manufactured in a predetermined shape in advance may be fixed to the wiring part 18 with a conductive adhesive. A pair of each wiring part 18 and the protrusion 26 provided on this acts as a probe element.
[0027]
The workpiece 10 also has one or more alignment marks 28 on the back surface of the resin layer 14. The alignment mark 28 is a cross-shaped mark formed in advance on the resin layer 14 together with the latitude line portion 18, but may be another mark such as an L-shape. Further, instead of forming such an alignment mark, a corner portion of at least one wiring portion 18 may be used as the alignment mark.
[0028]
Next, an embodiment of a laser processing apparatus 30 for forming a slit in the workpiece 10 will be described with reference to FIGS.
[0029]
The laser processing apparatus 30 selectively generates two types of laser beams 32a and 32b having different wavelengths and intensities from the laser oscillator 34, and the first and second optical beams pass through the first and second optical paths, respectively. Directed to the second machining area. In the illustrated example, the laser beams 32a and 32b are output from the output ports 36a and 36b, respectively.
[0030]
As the laser oscillator 34, an oscillator including a YAG laser can be used. The laser oscillator 34 outputs a laser beam 32a so as to output a laser beam 32a when processing the workpiece 10 in the first processing region and to output a laser beam 32b when processing the workpiece 10 in the second processing region. Can be switched.
[0031]
The wavelength and average output of the laser beam 32a can be 355 nm and 0.6 W, respectively. On the other hand, the wavelength and average output of the laser beam 32b can be set to 266 nm and 0.3 W, respectively.
[0032]
In the optical path of the laser beam 32a, a pair of filter mirrors 40a and 42a, a collimator 44a, a stop 46a, a half mirror 48a, and a condenser lens 50a are arranged in that order. On the other hand, a pair of filter mirrors 40b and 42b, a collimator 44b, a diaphragm 46b, a half mirror 48b, and a condenser lens 50b are arranged in that order in the optical path of the laser beam 32b.
[0033]
The laser beams 32a and 32b output from the laser oscillator 34 are directed to the collimators 44a and 44b by the filter mirrors 40a, 42a and 40b and 42b, respectively, and the beam spot diameters are enlarged in the collimators 44a and 44b, and the apertures 46a and 46b After being corrected to a circular beam spot at 46b, it is directed to the condenser lenses 50a and 50b by the half mirrors 48a and 48b.
[0034]
The condensing lenses 50a and 50b respectively adjust the focal positions of the laser beams 32a and 32b on the workpiece so as to focus the laser beams 32a and 32b on the workpieces in the first and second processing regions. It is supported by automatic focus mechanisms 52a and 52b for automatic adjustment.
[0035]
The laser processing apparatus 30 also includes television cameras 54a and 54b for photographing the processing states of the workpieces in the first and second processing regions, respectively. The television cameras 54a and 54b respectively collect the processing points of the workpieces in the first and second processing regions, by focusing lenses 56a and 56b, optical path changing mirrors 58a and 58b, half mirrors 48a and 48b, and focusing. Shooting through lenses 50a and 50b. The condenser lenses 56a and 56b are also supported by the automatic focusing mechanisms 60a and 60b.
[0036]
The laser processing apparatus 30 is further formed on the back surface of the workpiece 10 and the processing stage 62 that is selectively moved to the first and second processing regions and the alignment position while receiving the workpiece 10. An alignment camera 64 disposed at the alignment position so as to photograph the alignment mark 28 taken from the back side of the workpiece 10 is included. In the illustrated example, the first and second processing regions and the alignment position are adjacent to each other in the X direction.
[0037]
In the processing stage 62, the laser beam 32a or 32b is applied to the workpiece 10 by the XY stage 68 using a plurality of linear motors while the workpiece 10 is received in a substantially horizontal state by the table 66. Are moved two-dimensionally in the X and Y directions within a plane perpendicular to the axial direction (Z direction).
[0038]
The table 66 includes a disk-shaped main base 70 supported by the XY stage 68, a disk-shaped intermediate base 72 disposed on the main base, and the intermediate base 72 so as to receive the workpiece 10. A circular transparent glass plate 74 disposed above, a lid 76 that is detachably attached to the main base 70 from the irradiation side (in the illustrated example, the upper side) of the laser beam to the workpiece, and the main base 70 And a plurality of elastic bodies 78 disposed between the intermediate base 72 and the intermediate base 72.
[0039]
The main base 70 has a flat circular recess that opens upward, and the intermediate base 72 is received in the recess so as to be movable up and down and non-rotatable around the Z axis. The intermediate base 72 also has a flat circular recess that opens upward, and a glass plate 74 is received in the recess so as to be movable up and down.
[0040]
The diameter dimension of the glass plate 74 is substantially the same as the diameter dimension of the workpiece 10. The lid 76 has a shallow cup shape and is screwed onto the outside of the main base 70. The lid 76 has a circular opening 80 at the center that is slightly smaller than the glass plate 74. The workpiece 10 is irradiated with the laser beam through the opening 80. The elastic body 76 is a compression coil spring in the illustrated example, and presses the intermediate base 72 toward the lid 74 at all times.
[0041]
The XY stage 68 includes an X-axis guide rail 83 and an X-axis extending in parallel to the X direction with an interval in the Y direction on the X-axis base 82 extending in the X direction passing through the first and second processing regions and the alignment position. A linear rail 84 is attached, and an X-axis linear stage, that is, an X-axis slider 86 is supported by the X-axis guide rail 83 and the X-axis linear rail 84 so as to be movable in the X direction. The Y-axis guide rail 85 and the Y-axis linear rail 87 that extend parallel to the Y direction are attached, and the Y-axis linear stage, that is, the Y-axis slider 88 can be moved in the Y-axis direction to the Y-axis guide rail 85 and the Y-axis linear rail 87. The column 90 is attached to the Y-axis slider 88. The table 66 is attached to the upper end portion of the support column 90 in the main base 70.
[0042]
The X-axis base 82, the X-axis linear rail 84, and the X-axis slider 86 are arranged at the X-axis stage that moves the Y-axis slider 88 and the table 66 minutely in the X direction, the first and second processing regions, and the alignment position. It also serves as a moving mechanism to move. The Y-axis slider 88 acts as a Y-axis stage that finely moves the table 66 in the Y direction. The XY stage 68 may be an XYZ stage that further includes a Z stage that moves the table 66 in the Z direction.
[0043]
The XY stage 68, the main base 70, and the intermediate base 72 have holes 92, 94, and 96, respectively. The holes 92, 94 and 96 are aligned when the table 66 is moved to the alignment position. Accordingly, the holes 92, 94 and 96 jointly act as through holes. The alignment camera 64 is disposed below the through holes 92, 94, and 96 so as to photograph the alignment mark through the through holes 92, 94, and 96 when the table 66 is moved to the alignment position.
[0044]
At the time of processing, first, in a state where the lid 76 of the table 66 is removed, the workpiece 10 is on the upper side (front side) of the metal layer 16, the wiring portion 18 is on the lower side (back side), and the alignment mark 28 is through-hole 92. , 94 and 96 are placed on the glass plate 74 so as to face each other.
[0045]
Next, the lid 76 is attached to the main base 70. As a result, the workpiece 10 is sandwiched between the glass plate 74 and the intermediate base 72 and the lid 76 by the spring force of the elastic body 78. For this reason, even if the thickness dimension of the workpiece 10 is different, the position of the surface (beam irradiation surface) of the workpiece 10 in the Z direction is maintained constant.
[0046]
Next, the table 66 is moved to the alignment position, and the alignment mark 28 of the workpiece 10 is photographed by the alignment camera 64. The output signal of the alignment camera 64 is used as information for correcting the origin position of the coordinate axis of the control signal for moving the XY stage 68 for processing in a signal processing circuit (not shown). Thereby, positioning of the to-be-processed object 10 with respect to the laser processing apparatus 30 is performed.
[0047]
The alignment camera 64 images the alignment mark 28 through the through holes 92, 94 and 96. For this reason, compared with the case where the alignment mark 20 is imaged through a mirror or the like, the imaging accuracy of the alignment mark 28 and the positioning accuracy of the workpiece 10 are significantly improved.
[0048]
Next, the table 66 is moved to the first processing region, and the metal layer 16 is processed by the laser beam 32a having a relatively large output (strong) in the first processing region. When the processing of the metal layer 16 is finished, the table 66 is moved to the second processing region, and the resin layer 14 is processed by the laser beam 32b having a relatively small output (weak) in the second processing region.
[0049]
The beam irradiation position (working location) on the workpiece 10 is moved by moving the table 66 minutely two-dimensionally in the XY direction by the XY stage 68. During processing, the processing portion of the processing target 10 is photographed by the television cameras 54a and 54b and displayed on a monitor (not shown).
[0050]
As described above, the workpiece 10 irradiates the laser beam 32a, 32b intermittently to the processing location of the metal layer 16, and repeatedly moves the irradiation position to the processing location along the processing location. Slits are sequentially formed at predetermined positions of the layer 16 and the resin layer 14. Thus, the workpiece 10 is cut into the shape indicated by the cutting line 20, the notch 22 is formed in the resin layer 14 and the metal layer 16, and the groove 24 is formed in the metal layer 16.
[0051]
As a result, a beautiful slit is accurately formed in the metal layer 16 and the resin layer 14 of the workpiece 10, and the film-like probe unit 12 is manufactured. The manufactured film probe unit 12 includes a resin layer 14, a metal layer 16, a wiring part 18, a notch part 22, a groove 24, and a protrusion 26. The film-like probe unit 12 is assembled into a probe card used for a current-carrying test of a plate-like object to be inspected, such as an integrated circuit and a liquid crystal display panel, in the same manner as a conventional film-like probe unit.
[0052]
As described above, if the slit is formed in the resin layer 14 after the slit is formed in the metal layer 16 by irradiating the workpiece 10 with the laser beam from the metal layer 16 side, the strong laser beam 32a is generated. Since the slit of the resin layer 14 is not irradiated, there is no possibility that the shape of the slit of the resin layer 14 is damaged. Further, when the slit is formed in the resin layer 14, the weak laser beam 32 b is irradiated to the resin layer 14 through the slit formed in the metal layer 16, but such a laser beam 32 b is irradiated to the metal layer 16. However, since the metal layer 16 is not cut, there is no possibility that the slit of the metal layer 16 is damaged by the laser beam 32b. As a result, a slit having a small width dimension and a large depth dimension can be formed beautifully.
[0053]
The laser beam may be irradiated from the resin layer 14 side. In this case, the workpiece 10 is processed by the laser beam 32a in the second processing region, and then processed by the laser beam 32a in the first processing region.
[0054]
The spot diameter of the laser beam on the processing surface, the pulse interval of the laser beam, and the displacement speed of the beam spot on the processing site are set to values at which intermittent laser beam spots overlap on the processing surface. The focal point of the laser beam is moved in the Z direction by the automatic focusing mechanisms 52a and 52b according to the depths of the slits on which the condenser lenses 50a and 50b are formed, respectively. Can be combined. In this manner, if the laser beam is focused on a new processing surface each time it is repeated, a slit having a small width dimension and a large depth dimension can be formed.
[0055]
Cutting the workpiece 10, forming the notch 22, and forming the groove 24 can be performed separately. The workpiece 10 can be cut, for example, by dividing the portion to be cut for each straight line portion and for each divided straight line portion. The notch 22 and the groove 24 can be formed for each notch 22 and for each groove 24.
[0056]
The part to be processed of the workpiece 10 is finely processed by the material being repeatedly irradiated with a pulsed laser beam and gradually being repeatedly broken and peeled off. As a result, the film-like probe unit 12 is manufactured. The destructive material is removed from the processing site.
[0057]
If the material at the processing location is removed by destroying it as described above, the effect on the vicinity of the processing location will be significantly less than when the material at the processing location is removed by thermal melting as in conventional laser processing. The layer 14 is not damaged, and fine slits are beautifully formed in the resin layer 14 and the metal layer 16.
[0058]
Further, if the first and second processing regions and the alignment position are different from each other, the debris scattered from the workpiece 10 during processing does not reach the alignment camera 64, and therefore the alignment camera 64 is processed. The alignment mark 28 can be photographed without being contaminated by the destructive matter scattered from the body 10, and the alignment camera 64 does not hinder the irradiation of the laser beam on the workpiece 10.
[0059]
The present invention is not limited to the above embodiments. For example, the workpiece may be a film unit substrate for a probe unit in which a plurality of resin layers and wiring patterns are formed on a metal layer, or a protective film that prevents the wiring part from being peeled off from the resin layer. It may be a film-like substrate for a probe unit provided with a sheet-like workpiece other than the film-like substrate for a probe unit.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of a laser processing apparatus according to the present invention.
FIG. 2 is a front view showing one embodiment of a processing stage used in the laser processing apparatus shown in FIG.
3 is a plan view of the processing stage shown in FIG. 2. FIG.
4 is an enlarged view of a table portion of the processing stage shown in FIG.
FIG. 5 is a plan view of a tip portion showing an embodiment of a workpiece.
6 is a front view of the workpiece shown in FIG. 5. FIG.
[Explanation of symbols]
10 Workpieces 32a and 32b Laser beam 36 Laser oscillators 36a and 36b Output ports 40a, 40b, 42a and 42b Filter mirrors 44a and 44b Collimators 46a and 46b Apertures 48a and 48b Mirrors 50a and 50b Condensing lenses 52a and 52b Autofocus mechanism 54a, 54b Television cameras 56a, 56b Condensing lenses 58a, 58b Half mirrors 60a, 60b Autofocus mechanism 62 Processing stage 64 Alignment camera 66 Table 68 XY stage 70 Main base 72 Intermediate base 74 Glass plate 76 Lid 78 Elastic body 80 Lid Opening 82 X-axis base 83 X-axis guide rail 84 X-axis linear rail 85 Y-axis guide rail 86 X-axis slider (X-axis linear stage)
87 Y-axis linear rail 88 Y-axis slider (Y-axis linear stage)
90 Prop 92, 94, 96 Through hole

Claims (5)

  A laser oscillator that outputs first and second laser beams having different wavelengths and intensities, and a processing stage that receives a film-like workpiece and is capable of being selectively moved to the first and second processing regions First optical means for directing the first laser beam to the first processing region, second optical means for directing the second laser beam to the second processing region, and a workpiece An apparatus for processing a film-like workpiece, comprising: an alignment camera arranged at an alignment position different from the first and second machining areas to photograph an alignment mark formed on the body from the back side of the workpiece.   The processing apparatus according to claim 1, wherein the processing stage includes a through hole that allows an alignment mark to be captured by the alignment camera.   The processing stage includes a table that receives a workpiece, and an XY stage that moves the table two-dimensionally in a plane perpendicular to the axial direction of an irradiation beam to the workpiece. The processing apparatus as described.   The table has a recess that opens to the beam irradiation side of the workpiece, and is supported by the XY stage, and a recess in the main base that is movable in the axial direction to receive the workpiece. An intermediate base disposed at a position, a lid that is detachably attached to the beam irradiation side of the main base to the workpiece, and has a central opening; and between the main base and the intermediate base The processing apparatus according to claim 3, further comprising: one or more elastic bodies that are disposed on the intermediate base and press the intermediate base toward the lid.   5. The processing apparatus according to claim 1, further comprising first and second television cameras that respectively image processing positions of the workpiece in the first and second processing regions.

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