JPS57193277A - Soldering device by laser - Google Patents
Soldering device by laserInfo
- Publication number
- JPS57193277A JPS57193277A JP56078974A JP7897481A JPS57193277A JP S57193277 A JPS57193277 A JP S57193277A JP 56078974 A JP56078974 A JP 56078974A JP 7897481 A JP7897481 A JP 7897481A JP S57193277 A JPS57193277 A JP S57193277A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- soldering
- parts
- path
- optical path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To facilitate soldering in X and Y directions without turning a printed wiring substrate or moving laser optical systems by providing a prism for changing of optical path movably into and out of the laser optical path of the laser optical system for soldering. CONSTITUTION:The electronic parts 3, 4 to be soldered to the patterns 2 consisting of conductive films on a printed wiring substrate 1 are disposed respectively in X, Y directions, and the laser L oscillated from the laser oscillators 7 of laser optical systems 6a, 6b is condensed with condenser lenses 8 and is irradiated to soldering parts 5, 5, whereby solder materials 11, 11 are melted and parts are soldered. For the electronic parts 3 in the X direction, the path 9 is directed directly to the soldering parts 5, 5. For the parts 4 in the Y direction, said substrate 1 is moved by 1 pitch to locate the system 6a so as to face one soldering part 5 and a prism 10 for changing optical path is projected into the path 9 of the system 6b to refract the laser L, whereby said laser is irradiated to the other soldering part 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56078974A JPS5812106B2 (en) | 1981-05-25 | 1981-05-25 | Laser soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56078974A JPS5812106B2 (en) | 1981-05-25 | 1981-05-25 | Laser soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57193277A true JPS57193277A (en) | 1982-11-27 |
JPS5812106B2 JPS5812106B2 (en) | 1983-03-07 |
Family
ID=13676867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56078974A Expired JPS5812106B2 (en) | 1981-05-25 | 1981-05-25 | Laser soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812106B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62165071U (en) * | 1986-04-07 | 1987-10-20 | ||
JPS62199264U (en) * | 1986-06-03 | 1987-12-18 | ||
JPH02175071A (en) * | 1988-12-27 | 1990-07-06 | Matsushita Electric Ind Co Ltd | Laser mounting parts joining device |
JPH0426666U (en) * | 1990-06-27 | 1992-03-03 | ||
US5222170A (en) * | 1987-04-03 | 1993-06-22 | Bt&D Technologies Ltd. | Optical fiber device fabrication |
US6998572B2 (en) * | 2001-09-28 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Light energy processing device and method |
JP2007220958A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Corp | Solder bonding method |
-
1981
- 1981-05-25 JP JP56078974A patent/JPS5812106B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62165071U (en) * | 1986-04-07 | 1987-10-20 | ||
JPH037072Y2 (en) * | 1986-04-07 | 1991-02-21 | ||
JPS62199264U (en) * | 1986-06-03 | 1987-12-18 | ||
JPH037073Y2 (en) * | 1986-06-03 | 1991-02-21 | ||
US5222170A (en) * | 1987-04-03 | 1993-06-22 | Bt&D Technologies Ltd. | Optical fiber device fabrication |
JPH02175071A (en) * | 1988-12-27 | 1990-07-06 | Matsushita Electric Ind Co Ltd | Laser mounting parts joining device |
JPH0426666U (en) * | 1990-06-27 | 1992-03-03 | ||
US6998572B2 (en) * | 2001-09-28 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Light energy processing device and method |
JP2007220958A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Corp | Solder bonding method |
Also Published As
Publication number | Publication date |
---|---|
JPS5812106B2 (en) | 1983-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES475242A1 (en) | Process for the application of soldering masks to printed circuits with through holes for contacting. | |
DE3677937D1 (en) | MODULE WITH TWO PRINTED CIRCUIT BOARDS. | |
EP0128401A3 (en) | Additive or subtractive chemical process | |
EP0376541A3 (en) | Removing meltable material | |
JPS57193277A (en) | Soldering device by laser | |
FR2585210B1 (en) | METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS | |
JPS5581095A (en) | Ultra-fine hole processing method | |
JPS5671173A (en) | Pattern detection method of printed circuit substrate | |
JPS5768098A (en) | Semiconductor laser synthesizer | |
SE9002663D0 (en) | MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTS | |
JPS5421753A (en) | Linear pattern projector | |
ATE45692T1 (en) | THERMOPLASTIC SOLDER, METHOD AND APPARATUS. | |
JPS5756984A (en) | Assembling method for semiconductor light emitting device | |
JPS5717369A (en) | Method for soldering by laser | |
JPS5323570A (en) | Forming method of minute conductive regions to semicond uctor element chip surface | |
JPS6430034A (en) | Semiconductor laser driver | |
JPS6427286A (en) | Semiconductor device | |
JPS5929496A (en) | Method of soldering multileg electronic part | |
JPS5545501A (en) | Soldering tool | |
JPS6427289A (en) | Semiconductor device | |
IT1200402B (en) | Wave soldering chips on circuit board | |
JPS6418049A (en) | Inspection for mounting of chip part | |
GB1305605A (en) | ||
CA2157264A1 (en) | Method and apparatus for fluxing and soldering terminals on a printed circuit board | |
JPS5388567A (en) | Laser scribing apparatus |