JPS5323570A - Forming method of minute conductive regions to semicond uctor element chip surface - Google Patents

Forming method of minute conductive regions to semicond uctor element chip surface

Info

Publication number
JPS5323570A
JPS5323570A JP9905776A JP9905776A JPS5323570A JP S5323570 A JPS5323570 A JP S5323570A JP 9905776 A JP9905776 A JP 9905776A JP 9905776 A JP9905776 A JP 9905776A JP S5323570 A JPS5323570 A JP S5323570A
Authority
JP
Japan
Prior art keywords
chip surface
element chip
conductive regions
minute conductive
forming method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9905776A
Other languages
Japanese (ja)
Other versions
JPS5845811B2 (en
Inventor
Sunao Nishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51099057A priority Critical patent/JPS5845811B2/en
Publication of JPS5323570A publication Critical patent/JPS5323570A/en
Publication of JPS5845811B2 publication Critical patent/JPS5845811B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain minute conductive regions conforming to patterns by radiating a laser light beam to a minute conductive material such as Al, In, Sb, Bi, etc. covered and formed beforehand on a transparent glass plate and transferring this to a semiconductor element chip surface.
COPYRIGHT: (C)1978,JPO&Japio
JP51099057A 1976-08-18 1976-08-18 Method for forming minute conductive regions on semiconductor chip surface Expired JPS5845811B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51099057A JPS5845811B2 (en) 1976-08-18 1976-08-18 Method for forming minute conductive regions on semiconductor chip surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51099057A JPS5845811B2 (en) 1976-08-18 1976-08-18 Method for forming minute conductive regions on semiconductor chip surface

Publications (2)

Publication Number Publication Date
JPS5323570A true JPS5323570A (en) 1978-03-04
JPS5845811B2 JPS5845811B2 (en) 1983-10-12

Family

ID=14237033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51099057A Expired JPS5845811B2 (en) 1976-08-18 1976-08-18 Method for forming minute conductive regions on semiconductor chip surface

Country Status (1)

Country Link
JP (1) JPS5845811B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619634A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
JPS57122539A (en) * 1981-01-22 1982-07-30 Toshiba Corp Integrated circuit
JPS57211744A (en) * 1981-06-24 1982-12-25 Hitachi Ltd Semiconductor integrated circuit device
JPS60207335A (en) * 1984-03-31 1985-10-18 Dainippon Printing Co Ltd Pattern correcting method
JPS6419739A (en) * 1988-06-24 1989-01-23 Hitachi Ltd Semiconductor integrated circuit device
JPS6427241A (en) * 1988-06-24 1989-01-30 Hitachi Ltd Semiconductor integrated circuit device
JP2012515256A (en) * 2009-01-14 2012-07-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method for depositing at least one electrically conductive film on a substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619634A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
JPS57122539A (en) * 1981-01-22 1982-07-30 Toshiba Corp Integrated circuit
JPS57211744A (en) * 1981-06-24 1982-12-25 Hitachi Ltd Semiconductor integrated circuit device
JPS60207335A (en) * 1984-03-31 1985-10-18 Dainippon Printing Co Ltd Pattern correcting method
JPS6419739A (en) * 1988-06-24 1989-01-23 Hitachi Ltd Semiconductor integrated circuit device
JPS6427241A (en) * 1988-06-24 1989-01-30 Hitachi Ltd Semiconductor integrated circuit device
JP2012515256A (en) * 2009-01-14 2012-07-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method for depositing at least one electrically conductive film on a substrate

Also Published As

Publication number Publication date
JPS5845811B2 (en) 1983-10-12

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