JPS6427241A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6427241A JPS6427241A JP15470288A JP15470288A JPS6427241A JP S6427241 A JPS6427241 A JP S6427241A JP 15470288 A JP15470288 A JP 15470288A JP 15470288 A JP15470288 A JP 15470288A JP S6427241 A JPS6427241 A JP S6427241A
- Authority
- JP
- Japan
- Prior art keywords
- observation
- internal signal
- lead line
- layer wiring
- unit cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 238000010276 construction Methods 0.000 abstract 2
- 239000000523 sample Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
PURPOSE:To allow internal signal observation to be made easily and accurately within a complex unit of multi-layer wiring construction by connecting to an upper-layer wiring through a through-hole formed on a specified position of lower-layer wiring. CONSTITUTION:While an element occupation area on layout is reduced by minimizing system wiring pitch, an observation pad P1 or P2 is provided on an output lead line of inverter in one unit cell row (or on an input lead line of, for example NAND, of the other unit cell row). Then, these observation pads P1 and P2 are in vertical pad construction where PS or Al2 has been pulled to the uppermost Al3 on the same coordinate grid point system wiring pitch as an output lead line. By applying a probe for observing potential to Al3, internal signal waveform or internal signal can be directly measured and the observation becomes easy and accurate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15470288A JPS6427241A (en) | 1988-06-24 | 1988-06-24 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15470288A JPS6427241A (en) | 1988-06-24 | 1988-06-24 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6427241A true JPS6427241A (en) | 1989-01-30 |
Family
ID=15590084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15470288A Pending JPS6427241A (en) | 1988-06-24 | 1988-06-24 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6427241A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0541503A (en) * | 1991-06-21 | 1993-02-19 | Nec Ic Microcomput Syst Ltd | Manufacture of semiconductor device by master slice system |
US5226571A (en) * | 1992-05-01 | 1993-07-13 | Central Box And Container Limited | Box dispenser made from corrugated board |
US7103864B2 (en) | 2002-11-01 | 2006-09-05 | Umc Japan | Semiconductor device, and design method, inspection method, and design program therefor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51139286A (en) * | 1975-05-28 | 1976-12-01 | Hitachi Ltd | Multi-layer wiring pattern |
JPS5323570A (en) * | 1976-08-18 | 1978-03-04 | Mitsubishi Electric Corp | Forming method of minute conductive regions to semicond uctor element chip surface |
JPS5325382A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Wiring method of lsi |
JPS53101980A (en) * | 1977-02-17 | 1978-09-05 | Fujitsu Ltd | Semiconductor device |
JPS55143061A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Integrated circuit |
JPS5619634A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Semiconductor device |
-
1988
- 1988-06-24 JP JP15470288A patent/JPS6427241A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51139286A (en) * | 1975-05-28 | 1976-12-01 | Hitachi Ltd | Multi-layer wiring pattern |
JPS5323570A (en) * | 1976-08-18 | 1978-03-04 | Mitsubishi Electric Corp | Forming method of minute conductive regions to semicond uctor element chip surface |
JPS5325382A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Wiring method of lsi |
JPS53101980A (en) * | 1977-02-17 | 1978-09-05 | Fujitsu Ltd | Semiconductor device |
JPS55143061A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Integrated circuit |
JPS5619634A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0541503A (en) * | 1991-06-21 | 1993-02-19 | Nec Ic Microcomput Syst Ltd | Manufacture of semiconductor device by master slice system |
US5226571A (en) * | 1992-05-01 | 1993-07-13 | Central Box And Container Limited | Box dispenser made from corrugated board |
US7103864B2 (en) | 2002-11-01 | 2006-09-05 | Umc Japan | Semiconductor device, and design method, inspection method, and design program therefor |
US7924042B2 (en) | 2002-11-01 | 2011-04-12 | Umc Japan | Semiconductor device, and design method, inspection method, and design program therefor |
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