JPS6427241A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6427241A
JPS6427241A JP15470288A JP15470288A JPS6427241A JP S6427241 A JPS6427241 A JP S6427241A JP 15470288 A JP15470288 A JP 15470288A JP 15470288 A JP15470288 A JP 15470288A JP S6427241 A JPS6427241 A JP S6427241A
Authority
JP
Japan
Prior art keywords
observation
internal signal
lead line
layer wiring
unit cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15470288A
Other languages
Japanese (ja)
Inventor
Koji Masuda
Minoru Fujita
Shinji Katono
Masao Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15470288A priority Critical patent/JPS6427241A/en
Publication of JPS6427241A publication Critical patent/JPS6427241A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To allow internal signal observation to be made easily and accurately within a complex unit of multi-layer wiring construction by connecting to an upper-layer wiring through a through-hole formed on a specified position of lower-layer wiring. CONSTITUTION:While an element occupation area on layout is reduced by minimizing system wiring pitch, an observation pad P1 or P2 is provided on an output lead line of inverter in one unit cell row (or on an input lead line of, for example NAND, of the other unit cell row). Then, these observation pads P1 and P2 are in vertical pad construction where PS or Al2 has been pulled to the uppermost Al3 on the same coordinate grid point system wiring pitch as an output lead line. By applying a probe for observing potential to Al3, internal signal waveform or internal signal can be directly measured and the observation becomes easy and accurate.
JP15470288A 1988-06-24 1988-06-24 Semiconductor integrated circuit device Pending JPS6427241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15470288A JPS6427241A (en) 1988-06-24 1988-06-24 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15470288A JPS6427241A (en) 1988-06-24 1988-06-24 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6427241A true JPS6427241A (en) 1989-01-30

Family

ID=15590084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15470288A Pending JPS6427241A (en) 1988-06-24 1988-06-24 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6427241A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541503A (en) * 1991-06-21 1993-02-19 Nec Ic Microcomput Syst Ltd Manufacture of semiconductor device by master slice system
US5226571A (en) * 1992-05-01 1993-07-13 Central Box And Container Limited Box dispenser made from corrugated board
US7103864B2 (en) 2002-11-01 2006-09-05 Umc Japan Semiconductor device, and design method, inspection method, and design program therefor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139286A (en) * 1975-05-28 1976-12-01 Hitachi Ltd Multi-layer wiring pattern
JPS5323570A (en) * 1976-08-18 1978-03-04 Mitsubishi Electric Corp Forming method of minute conductive regions to semicond uctor element chip surface
JPS5325382A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Wiring method of lsi
JPS53101980A (en) * 1977-02-17 1978-09-05 Fujitsu Ltd Semiconductor device
JPS55143061A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Integrated circuit
JPS5619634A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139286A (en) * 1975-05-28 1976-12-01 Hitachi Ltd Multi-layer wiring pattern
JPS5323570A (en) * 1976-08-18 1978-03-04 Mitsubishi Electric Corp Forming method of minute conductive regions to semicond uctor element chip surface
JPS5325382A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Wiring method of lsi
JPS53101980A (en) * 1977-02-17 1978-09-05 Fujitsu Ltd Semiconductor device
JPS55143061A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Integrated circuit
JPS5619634A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541503A (en) * 1991-06-21 1993-02-19 Nec Ic Microcomput Syst Ltd Manufacture of semiconductor device by master slice system
US5226571A (en) * 1992-05-01 1993-07-13 Central Box And Container Limited Box dispenser made from corrugated board
US7103864B2 (en) 2002-11-01 2006-09-05 Umc Japan Semiconductor device, and design method, inspection method, and design program therefor
US7924042B2 (en) 2002-11-01 2011-04-12 Umc Japan Semiconductor device, and design method, inspection method, and design program therefor

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