JPS6439559A - Probe card - Google Patents
Probe cardInfo
- Publication number
- JPS6439559A JPS6439559A JP62197471A JP19747187A JPS6439559A JP S6439559 A JPS6439559 A JP S6439559A JP 62197471 A JP62197471 A JP 62197471A JP 19747187 A JP19747187 A JP 19747187A JP S6439559 A JPS6439559 A JP S6439559A
- Authority
- JP
- Japan
- Prior art keywords
- probes
- chips
- semiconductor
- substrate
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To test many semiconductor chips only by bringing probes into contact with the top surface of a semiconductor wafer once by providing the probes at prescribed positions so that the probes contact the pads of the semiconductor chips at the same time. CONSTITUTION:A probe 1 made of a conductive elastic material is provided on the main surface of each pad so as to probe the pads of all chips in the semiconductor wafer at a time. Two rows and two columns of probes 1 are arranged for each chip and the probes 1 are arranged in a matrix for all the chips and fixed by a substrate 4 made of a transparent substrate material so as to confirm probing positions. When all the chips in the semiconductor chip are measured at a time, a wiring layer 5 made of a transparent electrode which connects a tester to the probes 1 through a tester connection part 2 is provided on the substrate 4 so that input pins are processed in parallel and other pins are processed independently; and a compressed base-sealed layer 6 surrounded with a partition wall 7 made of a transparent material is provided on the wiring layer 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62197471A JPS6439559A (en) | 1987-08-06 | 1987-08-06 | Probe card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62197471A JPS6439559A (en) | 1987-08-06 | 1987-08-06 | Probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6439559A true JPS6439559A (en) | 1989-02-09 |
Family
ID=16375033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62197471A Pending JPS6439559A (en) | 1987-08-06 | 1987-08-06 | Probe card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6439559A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983908A (en) * | 1989-10-11 | 1991-01-08 | Mitsubishi Denki Kabushiki Kaisha | Probing card for wafer testing and method of manufacturing the same |
WO1998052218A1 (en) * | 1997-05-09 | 1998-11-19 | Hitachi, Ltd. | Connector and probing system |
JP2000200812A (en) * | 1990-02-16 | 2000-07-18 | Glenn J Leedy | Manufacture and test method for integrated circuit using high density probe point |
-
1987
- 1987-08-06 JP JP62197471A patent/JPS6439559A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983908A (en) * | 1989-10-11 | 1991-01-08 | Mitsubishi Denki Kabushiki Kaisha | Probing card for wafer testing and method of manufacturing the same |
US5042148A (en) * | 1989-10-11 | 1991-08-27 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a probing card for wafer testing |
JP2000200812A (en) * | 1990-02-16 | 2000-07-18 | Glenn J Leedy | Manufacture and test method for integrated circuit using high density probe point |
WO1998052218A1 (en) * | 1997-05-09 | 1998-11-19 | Hitachi, Ltd. | Connector and probing system |
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