JPS5666053A - Fixed probing card - Google Patents

Fixed probing card

Info

Publication number
JPS5666053A
JPS5666053A JP14255879A JP14255879A JPS5666053A JP S5666053 A JPS5666053 A JP S5666053A JP 14255879 A JP14255879 A JP 14255879A JP 14255879 A JP14255879 A JP 14255879A JP S5666053 A JPS5666053 A JP S5666053A
Authority
JP
Japan
Prior art keywords
probe
fixed
substrate
sides
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14255879A
Other languages
Japanese (ja)
Inventor
Yoichi Kuramitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14255879A priority Critical patent/JPS5666053A/en
Publication of JPS5666053A publication Critical patent/JPS5666053A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To test a semiconductor chip forming an LSI when the chip is in the form of a wafer by a method wherein a probe is fixed to the both sides of a supporting substrate. CONSTITUTION:Wiring 2 is provided on the both sides of an insulated substrate 8, and a probe 3 divided into two groups is fixed to each side. Therefore, even if circuit electrodes are arranged in two rows on a highly integrated chip, it is unnecessary to increase the number of installation surfaces for fixing the probe to the substrate 8. For this reason, erroneous operation originating in the extended length of the probe can be avoided, while high speed and highly accurate teasting is made possible.
JP14255879A 1979-11-01 1979-11-01 Fixed probing card Pending JPS5666053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14255879A JPS5666053A (en) 1979-11-01 1979-11-01 Fixed probing card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14255879A JPS5666053A (en) 1979-11-01 1979-11-01 Fixed probing card

Publications (1)

Publication Number Publication Date
JPS5666053A true JPS5666053A (en) 1981-06-04

Family

ID=15318124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14255879A Pending JPS5666053A (en) 1979-11-01 1979-11-01 Fixed probing card

Country Status (1)

Country Link
JP (1) JPS5666053A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204246A (en) * 1983-05-03 1984-11-19 ウエントワ−ス・ラボラトリ−ズ，インコ−ポレイテツド Test probe assembly
JP2013541006A (en) * 2010-09-30 2013-11-07 イスメカ セミコンダクター ホールディング エス アー Electrical contacts and test platform

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204246A (en) * 1983-05-03 1984-11-19 ウエントワ−ス・ラボラトリ−ズ，インコ−ポレイテツド Test probe assembly
JP2013541006A (en) * 2010-09-30 2013-11-07 イスメカ セミコンダクター ホールディング エス アー Electrical contacts and test platform

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