JPS54112176A - Selection method of semiconductor element - Google Patents
Selection method of semiconductor elementInfo
- Publication number
- JPS54112176A JPS54112176A JP2017078A JP2017078A JPS54112176A JP S54112176 A JPS54112176 A JP S54112176A JP 2017078 A JP2017078 A JP 2017078A JP 2017078 A JP2017078 A JP 2017078A JP S54112176 A JPS54112176 A JP S54112176A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- elements
- mark
- shape
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To protect normal elements adjoining to a defective element against damage by checking electric characteristics of semiconductor elements arrayed on a wafer at a fixed interval and by giving a mark to marking bodies provided closely to the wafer corresponding to them.
CONSTITUTION: Although many semiconductor elements 2 are formed on semiconductor wafer 1 provided with orientation flat 4 indicating a crystal azimuth, they include defective elements 2a which do not meet standard requirements. On the other hand, paper or synthetic-resin marking body 20 is provided with wafer shape 21 of the same size as wafer 1, element shape 22, flat shape 24, and guide mark 25 indicating the 24 side, and arranged on the XY table where wafer 1 is mounted. Next, electric characteristics of each element 2 of wafer 1 are checked and a defect signal against defective element 2a is used to append defect mark 23 to corresponding element 22a of marking body 20 by the marker. Consequently, normal elements on wafer 1 can be protected against damage.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017078A JPS54112176A (en) | 1978-02-22 | 1978-02-22 | Selection method of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017078A JPS54112176A (en) | 1978-02-22 | 1978-02-22 | Selection method of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54112176A true JPS54112176A (en) | 1979-09-01 |
Family
ID=12019687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017078A Pending JPS54112176A (en) | 1978-02-22 | 1978-02-22 | Selection method of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54112176A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100432A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Mounting device for semiconductor pellet |
| JPH01214133A (en) * | 1988-02-23 | 1989-08-28 | Nec Corp | Marking of semiconductor wafer |
| CN110243840A (en) * | 2019-07-05 | 2019-09-17 | 德淮半导体有限公司 | Defect detecting system and its defect inspection method |
-
1978
- 1978-02-22 JP JP2017078A patent/JPS54112176A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100432A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Mounting device for semiconductor pellet |
| JPH01214133A (en) * | 1988-02-23 | 1989-08-28 | Nec Corp | Marking of semiconductor wafer |
| CN110243840A (en) * | 2019-07-05 | 2019-09-17 | 德淮半导体有限公司 | Defect detecting system and its defect inspection method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5228280A (en) | Semiconductor device | |
| JPS54112176A (en) | Selection method of semiconductor element | |
| JPS5352072A (en) | Pattern for alignment | |
| JPS53114685A (en) | Manufacture for semiconductor device | |
| JPS5599734A (en) | Pattern-sheet for characteristic test of semiconductor element | |
| JPS534472A (en) | Semiconductor package | |
| JPS526465A (en) | Manufacturing method of semi-conductor pellet slices for integrated ci rcuit | |
| JPS5378173A (en) | Manufacture of semiconductor device | |
| JPS5427772A (en) | Production of semiconductor devices | |
| JPS547279A (en) | Socket adapter for ic measurement | |
| JPS5318972A (en) | Monitoring method of wafer positioning state by probes | |
| JPS52132777A (en) | Ic pin number display method | |
| JPS544078A (en) | Inspection method of performance of circuit element | |
| JPS55113331A (en) | Photomask and its manufacture | |
| JPS6433962A (en) | Linear image sensor | |
| JPS52122084A (en) | Inspection system for semiconductor substrates | |
| JPS52115188A (en) | Prober | |
| JPS5293791A (en) | Preparation of acylamides | |
| JPS51148375A (en) | Mesuring method of specific characteristics of semicondutor element | |
| JPS52119875A (en) | Formation of isolation area | |
| JPS5359370A (en) | Positioning method | |
| JPS5587149A (en) | Photomask for preparation of semiconductor wafer | |
| JPS5228377A (en) | Temperature distribution measuring device | |
| JPS5338969A (en) | Wrapping method of semiconductor element | |
| JPS524118A (en) | Package system of electronic calculator |