JPS55130137A - Inspection method of semiconductor wafer and probe card - Google Patents

Inspection method of semiconductor wafer and probe card

Info

Publication number
JPS55130137A
JPS55130137A JP3687479A JP3687479A JPS55130137A JP S55130137 A JPS55130137 A JP S55130137A JP 3687479 A JP3687479 A JP 3687479A JP 3687479 A JP3687479 A JP 3687479A JP S55130137 A JPS55130137 A JP S55130137A
Authority
JP
Japan
Prior art keywords
semiconductors
sides
semiconductor devices
connecting terminal
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3687479A
Other languages
Japanese (ja)
Inventor
Masayoshi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3687479A priority Critical patent/JPS55130137A/en
Publication of JPS55130137A publication Critical patent/JPS55130137A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To measure the characteristics of a plurality of semiconductor devices by arranging the connection terminals of a semiconductor device on one to three sides of the semiconductor devices. CONSTITUTION:When a connecting terminal 12 of a semiconductor device is arranged along the two sides opposing each other, the pointed end of the probe needle 13 inside the hole of a probe card is arranged in parallel along the two sides of the adjoining semiconductor devices 11 and 12, which are connected to the connecting terminal 12 of the two semiconductors 10 and 11, and the two semiconductors are measured at the same time. If the connecting terminal 22 is arranged along three sides, the semiconductor devices 21 and 22 are arranged alternately making a 180 deg. rotation, and the semiconductors are measured simultaneously by the probe needle 23 in the same way as above-mentioned. According to this method, the probe needle can be arranged around the semiconductors uniformly and the measurement time can be reduced as well.
JP3687479A 1979-03-30 1979-03-30 Inspection method of semiconductor wafer and probe card Pending JPS55130137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3687479A JPS55130137A (en) 1979-03-30 1979-03-30 Inspection method of semiconductor wafer and probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3687479A JPS55130137A (en) 1979-03-30 1979-03-30 Inspection method of semiconductor wafer and probe card

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP27280884A Division JPS60167344A (en) 1984-12-26 1984-12-26 Inspecting device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS55130137A true JPS55130137A (en) 1980-10-08

Family

ID=12481920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3687479A Pending JPS55130137A (en) 1979-03-30 1979-03-30 Inspection method of semiconductor wafer and probe card

Country Status (1)

Country Link
JP (1) JPS55130137A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610943A (en) * 1979-07-06 1981-02-03 Nec Corp Semiconductor wafer whose electric characteristics are easily measurable
US5525912A (en) * 1994-03-10 1996-06-11 Kabushiki Kaisha Toshiba Probing equipment and a probing method
US6091156A (en) * 1996-09-02 2000-07-18 Nec Corporation Semiconductor pellet having plural chips
JP2006288256A (en) * 2005-04-08 2006-10-26 Fulta Electric Machinery Co Ltd Ventilation fan with insect control net for greenhouse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610943A (en) * 1979-07-06 1981-02-03 Nec Corp Semiconductor wafer whose electric characteristics are easily measurable
US5525912A (en) * 1994-03-10 1996-06-11 Kabushiki Kaisha Toshiba Probing equipment and a probing method
US6091156A (en) * 1996-09-02 2000-07-18 Nec Corporation Semiconductor pellet having plural chips
JP2006288256A (en) * 2005-04-08 2006-10-26 Fulta Electric Machinery Co Ltd Ventilation fan with insect control net for greenhouse

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