JPS53145576A - Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method - Google Patents

Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method

Info

Publication number
JPS53145576A
JPS53145576A JP5976177A JP5976177A JPS53145576A JP S53145576 A JPS53145576 A JP S53145576A JP 5976177 A JP5976177 A JP 5976177A JP 5976177 A JP5976177 A JP 5976177A JP S53145576 A JPS53145576 A JP S53145576A
Authority
JP
Japan
Prior art keywords
measuring
electrical characteristics
probe card
semiconductor wafers
card used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5976177A
Other languages
Japanese (ja)
Inventor
Shinaya Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5976177A priority Critical patent/JPS53145576A/en
Publication of JPS53145576A publication Critical patent/JPS53145576A/en
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To shorten measurement time by superposing and pressing soft and plateform probe cards, which have a plurality of measuring terminals corresponding to the measuring electrodes of respective circuit elements at one end, onto a semiconductor wafer, connecting the cords conneted thereto a measuring apparatus and measuring the characteristics of the circuit elements selectively.
COPYRIGHT: (C)1978,JPO&Japio
JP5976177A 1977-05-25 1977-05-25 Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method Pending JPS53145576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5976177A JPS53145576A (en) 1977-05-25 1977-05-25 Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5976177A JPS53145576A (en) 1977-05-25 1977-05-25 Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method

Publications (1)

Publication Number Publication Date
JPS53145576A true JPS53145576A (en) 1978-12-18

Family

ID=13122563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5976177A Pending JPS53145576A (en) 1977-05-25 1977-05-25 Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method

Country Status (1)

Country Link
JP (1) JPS53145576A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159928U (en) * 1981-04-03 1982-10-07
JP2000200812A (en) * 1990-02-16 2000-07-18 Glenn J Leedy Manufacture and test method for integrated circuit using high density probe point

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57159928U (en) * 1981-04-03 1982-10-07
JP2000200812A (en) * 1990-02-16 2000-07-18 Glenn J Leedy Manufacture and test method for integrated circuit using high density probe point

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