JPS5440082A - Semiconductor test device - Google Patents

Semiconductor test device

Info

Publication number
JPS5440082A
JPS5440082A JP10653877A JP10653877A JPS5440082A JP S5440082 A JPS5440082 A JP S5440082A JP 10653877 A JP10653877 A JP 10653877A JP 10653877 A JP10653877 A JP 10653877A JP S5440082 A JPS5440082 A JP S5440082A
Authority
JP
Japan
Prior art keywords
test device
semiconductor test
pads
projections
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10653877A
Other languages
Japanese (ja)
Inventor
Masaru Hitosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10653877A priority Critical patent/JPS5440082A/en
Publication of JPS5440082A publication Critical patent/JPS5440082A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To reduce the wiring capacity as well as to enable a high-speed test by providing conductive projections to the testing substrate in opposition to the electrode lead-out pads which are provided to the tested semiconductor substrate and then performing a test by piling up these projections and pads each other.
COPYRIGHT: (C)1979,JPO&Japio
JP10653877A 1977-09-05 1977-09-05 Semiconductor test device Pending JPS5440082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10653877A JPS5440082A (en) 1977-09-05 1977-09-05 Semiconductor test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10653877A JPS5440082A (en) 1977-09-05 1977-09-05 Semiconductor test device

Publications (1)

Publication Number Publication Date
JPS5440082A true JPS5440082A (en) 1979-03-28

Family

ID=14436152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10653877A Pending JPS5440082A (en) 1977-09-05 1977-09-05 Semiconductor test device

Country Status (1)

Country Link
JP (1) JPS5440082A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
JPS63122233A (en) * 1986-11-12 1988-05-26 Nec Corp Measuring device for semiconductor integrated circuit
JPH03171749A (en) * 1989-11-30 1991-07-25 Toshiba Corp Probe card and semiconductor testing device
JPH04103115U (en) * 1991-01-25 1992-09-04 荒川化学工業株式会社 sachet
JPH04266043A (en) * 1990-10-31 1992-09-22 Hughes Aircraft Co Apparatus and method for test of integrated circuit
JPH05211218A (en) * 1991-08-26 1993-08-20 Hughes Aircraft Co Electrical connection provided with molded contact

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
JPS63122233A (en) * 1986-11-12 1988-05-26 Nec Corp Measuring device for semiconductor integrated circuit
JPH03171749A (en) * 1989-11-30 1991-07-25 Toshiba Corp Probe card and semiconductor testing device
JPH04266043A (en) * 1990-10-31 1992-09-22 Hughes Aircraft Co Apparatus and method for test of integrated circuit
JPH04103115U (en) * 1991-01-25 1992-09-04 荒川化学工業株式会社 sachet
JPH05211218A (en) * 1991-08-26 1993-08-20 Hughes Aircraft Co Electrical connection provided with molded contact
JPH07105420B2 (en) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー Electrical connection with molded contacts

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