JPS5440082A - Semiconductor test device - Google Patents
Semiconductor test deviceInfo
- Publication number
- JPS5440082A JPS5440082A JP10653877A JP10653877A JPS5440082A JP S5440082 A JPS5440082 A JP S5440082A JP 10653877 A JP10653877 A JP 10653877A JP 10653877 A JP10653877 A JP 10653877A JP S5440082 A JPS5440082 A JP S5440082A
- Authority
- JP
- Japan
- Prior art keywords
- test device
- semiconductor test
- pads
- projections
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To reduce the wiring capacity as well as to enable a high-speed test by providing conductive projections to the testing substrate in opposition to the electrode lead-out pads which are provided to the tested semiconductor substrate and then performing a test by piling up these projections and pads each other.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10653877A JPS5440082A (en) | 1977-09-05 | 1977-09-05 | Semiconductor test device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10653877A JPS5440082A (en) | 1977-09-05 | 1977-09-05 | Semiconductor test device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5440082A true JPS5440082A (en) | 1979-03-28 |
Family
ID=14436152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10653877A Pending JPS5440082A (en) | 1977-09-05 | 1977-09-05 | Semiconductor test device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5440082A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4585991A (en) * | 1982-06-03 | 1986-04-29 | Texas Instruments Incorporated | Solid state multiprobe testing apparatus |
JPS63122233A (en) * | 1986-11-12 | 1988-05-26 | Nec Corp | Measuring device for semiconductor integrated circuit |
JPH03171749A (en) * | 1989-11-30 | 1991-07-25 | Toshiba Corp | Probe card and semiconductor testing device |
JPH04103115U (en) * | 1991-01-25 | 1992-09-04 | 荒川化学工業株式会社 | sachet |
JPH04266043A (en) * | 1990-10-31 | 1992-09-22 | Hughes Aircraft Co | Apparatus and method for test of integrated circuit |
JPH05211218A (en) * | 1991-08-26 | 1993-08-20 | Hughes Aircraft Co | Electrical connection provided with molded contact |
-
1977
- 1977-09-05 JP JP10653877A patent/JPS5440082A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4585991A (en) * | 1982-06-03 | 1986-04-29 | Texas Instruments Incorporated | Solid state multiprobe testing apparatus |
JPS63122233A (en) * | 1986-11-12 | 1988-05-26 | Nec Corp | Measuring device for semiconductor integrated circuit |
JPH03171749A (en) * | 1989-11-30 | 1991-07-25 | Toshiba Corp | Probe card and semiconductor testing device |
JPH04266043A (en) * | 1990-10-31 | 1992-09-22 | Hughes Aircraft Co | Apparatus and method for test of integrated circuit |
JPH04103115U (en) * | 1991-01-25 | 1992-09-04 | 荒川化学工業株式会社 | sachet |
JPH05211218A (en) * | 1991-08-26 | 1993-08-20 | Hughes Aircraft Co | Electrical connection provided with molded contact |
JPH07105420B2 (en) * | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | Electrical connection with molded contacts |
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