JPS6484630A - Measuring jig for semiconductor integrated circuit - Google Patents

Measuring jig for semiconductor integrated circuit

Info

Publication number
JPS6484630A
JPS6484630A JP62242912A JP24291287A JPS6484630A JP S6484630 A JPS6484630 A JP S6484630A JP 62242912 A JP62242912 A JP 62242912A JP 24291287 A JP24291287 A JP 24291287A JP S6484630 A JPS6484630 A JP S6484630A
Authority
JP
Japan
Prior art keywords
jig
parts
terminal parts
tab
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62242912A
Other languages
Japanese (ja)
Inventor
Masaharu Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62242912A priority Critical patent/JPS6484630A/en
Publication of JPS6484630A publication Critical patent/JPS6484630A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

PURPOSE:To obtain a good contact between the terminals of a TAB.IC and the terminal parts for measurement of a measuring jig by a method wherein a jig obtainable by superposing an insulative film for protection on an insulative film in such a way that the terminal parts for measurement and the prescribed regions only of a lead pattern are exposed on the insulative film is used as the measuring jig. CONSTITUTION:Terminal parts 3 of a pattern 2 on a film 1 are exposed through holes 7 and at the same time, terminal parts 4a of the end parts of lead parts 4 are exposed without being covered with an insulative film 6 for protection. The other parts of the pattern 2 are covered with the film 6. A jig 10 constituted in such a way is superposed on a TAB.IC, which is intended to measure its electrical characteristics, and terminals of the TAB.IC and the terminal parts 3 for measurement of the jig 10 are brought into contact to each other. Thereby, a good contact is obtained between the terminals of the TAB.IC and the terminal parts 3 of the jig 10.
JP62242912A 1987-09-28 1987-09-28 Measuring jig for semiconductor integrated circuit Pending JPS6484630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242912A JPS6484630A (en) 1987-09-28 1987-09-28 Measuring jig for semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242912A JPS6484630A (en) 1987-09-28 1987-09-28 Measuring jig for semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS6484630A true JPS6484630A (en) 1989-03-29

Family

ID=17096061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242912A Pending JPS6484630A (en) 1987-09-28 1987-09-28 Measuring jig for semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6484630A (en)

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