JPS5610943A - Semiconductor wafer whose electric characteristics are easily measurable - Google Patents

Semiconductor wafer whose electric characteristics are easily measurable

Info

Publication number
JPS5610943A
JPS5610943A JP8623279A JP8623279A JPS5610943A JP S5610943 A JPS5610943 A JP S5610943A JP 8623279 A JP8623279 A JP 8623279A JP 8623279 A JP8623279 A JP 8623279A JP S5610943 A JPS5610943 A JP S5610943A
Authority
JP
Japan
Prior art keywords
elements
chip
semiconductor wafer
electric characteristics
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8623279A
Other languages
Japanese (ja)
Inventor
Yoshihide Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8623279A priority Critical patent/JPS5610943A/en
Publication of JPS5610943A publication Critical patent/JPS5610943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To reduce the number of contacting of a probe stylus of a probe card with a number of elements on a semiconductor wafer by obtaining a pluraity of chip groups with a number of elements as one chip of the same type when forming a number of elements on the wafer and disposing the bonding pads thereto only on the periphery of the chip groups. CONSTITUTION:When forming a number of elements on a semiconductor wafer as one chip, the chip is formed of similar chips 1A, 1B or 4A-4D repeating in the same shape. When forming bonding pads on a square or rectangular chip thus formed, one side of the periphery is made vacant, and the other three sides are formed of the pads. In this manner, the number of contacting probe stylus of a probe card with the elements are reduced when measuring the electric characteristics of the respective elements by assembling the chips so as to remarkably improve the working efficiency.
JP8623279A 1979-07-06 1979-07-06 Semiconductor wafer whose electric characteristics are easily measurable Pending JPS5610943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8623279A JPS5610943A (en) 1979-07-06 1979-07-06 Semiconductor wafer whose electric characteristics are easily measurable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8623279A JPS5610943A (en) 1979-07-06 1979-07-06 Semiconductor wafer whose electric characteristics are easily measurable

Publications (1)

Publication Number Publication Date
JPS5610943A true JPS5610943A (en) 1981-02-03

Family

ID=13881040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8623279A Pending JPS5610943A (en) 1979-07-06 1979-07-06 Semiconductor wafer whose electric characteristics are easily measurable

Country Status (1)

Country Link
JP (1) JPS5610943A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0429346A (en) * 1990-05-24 1992-01-31 Mitsubishi Electric Corp Semiconductor device
JPH05166895A (en) * 1991-12-19 1993-07-02 Kawasaki Steel Corp Semiconductor integrated circuit
US6764879B2 (en) 2001-08-08 2004-07-20 Matsushita Electric Industrial Co., Ltd. Semiconductor wafer, semiconductor device, and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130137A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Inspection method of semiconductor wafer and probe card

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130137A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Inspection method of semiconductor wafer and probe card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0429346A (en) * 1990-05-24 1992-01-31 Mitsubishi Electric Corp Semiconductor device
JPH05166895A (en) * 1991-12-19 1993-07-02 Kawasaki Steel Corp Semiconductor integrated circuit
US6764879B2 (en) 2001-08-08 2004-07-20 Matsushita Electric Industrial Co., Ltd. Semiconductor wafer, semiconductor device, and method for manufacturing the same

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