JPS55145360A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55145360A
JPS55145360A JP5391679A JP5391679A JPS55145360A JP S55145360 A JPS55145360 A JP S55145360A JP 5391679 A JP5391679 A JP 5391679A JP 5391679 A JP5391679 A JP 5391679A JP S55145360 A JPS55145360 A JP S55145360A
Authority
JP
Japan
Prior art keywords
electrodes
corners
disposed
protruded
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5391679A
Other languages
Japanese (ja)
Inventor
Miyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5391679A priority Critical patent/JPS55145360A/en
Publication of JPS55145360A publication Critical patent/JPS55145360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To uniformly bond a plurality of protruded electrodes of a semiconductor device as a result of forming the protruding height of the protruded electrodes arranged thereon at the respective corners than the other portions to earlier bond the electrodes at the corners than the other electrodes. CONSTITUTION:A plurality of protruded electrodes are disposed at predetermined interval on the peripheral portion of a main surface 2 of planar rectangular shape formed with active elements of a semiconductor substrate 11. The electrodes 13a disposed at the respective corners or corresponding corners are formed higher than the other electrodes 13b disposed on the respective peripheral portions. Then, the electrodes 13a, 13b are positioned at the respective lead pieces on a carrier film and uniformly bonded thereto in the same manner as the conventional process.
JP5391679A 1979-04-27 1979-04-27 Semiconductor device Pending JPS55145360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5391679A JPS55145360A (en) 1979-04-27 1979-04-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5391679A JPS55145360A (en) 1979-04-27 1979-04-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55145360A true JPS55145360A (en) 1980-11-12

Family

ID=12956027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5391679A Pending JPS55145360A (en) 1979-04-27 1979-04-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55145360A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0499079A1 (en) * 1991-02-11 1992-08-19 International Business Machines Corporation Electronic packaging with varying height connectors
US5266520A (en) * 1991-02-11 1993-11-30 International Business Machines Corporation Electronic packaging with varying height connectors
JP2009176938A (en) * 2008-01-24 2009-08-06 Denso Corp Method for manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0499079A1 (en) * 1991-02-11 1992-08-19 International Business Machines Corporation Electronic packaging with varying height connectors
US5173763A (en) * 1991-02-11 1992-12-22 International Business Machines Corporation Electronic packaging with varying height connectors
US5266520A (en) * 1991-02-11 1993-11-30 International Business Machines Corporation Electronic packaging with varying height connectors
JP2009176938A (en) * 2008-01-24 2009-08-06 Denso Corp Method for manufacturing semiconductor device

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