JPS5795643A - Probing method for large-scale integrated lead pin in mounting substrate - Google Patents

Probing method for large-scale integrated lead pin in mounting substrate

Info

Publication number
JPS5795643A
JPS5795643A JP55170997A JP17099780A JPS5795643A JP S5795643 A JPS5795643 A JP S5795643A JP 55170997 A JP55170997 A JP 55170997A JP 17099780 A JP17099780 A JP 17099780A JP S5795643 A JPS5795643 A JP S5795643A
Authority
JP
Japan
Prior art keywords
pin
probing
pins
lead
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55170997A
Other languages
Japanese (ja)
Inventor
Shingo Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55170997A priority Critical patent/JPS5795643A/en
Publication of JPS5795643A publication Critical patent/JPS5795643A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To conduct a desired lead pin positively, and to decrease persons required for the inspection of the substrate to zero and increase the speed of the inspection by putting anisotropic rubber sheets among the lead pins arranged at minute pitches as connectors and attaching the sheets by pressure by means of a probing pin. CONSTITUTION:In a probing test for a LSI 1 mounted to the circuit substrate, the desired lead pin is selected from a large number of the lead pins 3, which are disposed around the LSI 1 at minute pitches and connected to a conductive pattern of the substrate, and the probing pin 16 is conducted. The lead pins are probed in such a manner that the anisotropic rubber sheets 17 in which conductive rubbers 18 and insulating rubbers 19 are alternately laminated and arranged in the length L direction are put among three rows of the lead pins and the probing pin 16. The lead pin can be conducted positively even when more or less displacement delta exists among the pins 3 and the pin 16 by setting an arranging pitch P of the anisotropic rubber sheets 17 to proper value. Accordingly, the pins 3 are easily selected, and the speed of the probing test for the substrate to which a large number of the LSIs are mounted can be increased and persons for the test can be decreased to zero.
JP55170997A 1980-12-05 1980-12-05 Probing method for large-scale integrated lead pin in mounting substrate Pending JPS5795643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55170997A JPS5795643A (en) 1980-12-05 1980-12-05 Probing method for large-scale integrated lead pin in mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55170997A JPS5795643A (en) 1980-12-05 1980-12-05 Probing method for large-scale integrated lead pin in mounting substrate

Publications (1)

Publication Number Publication Date
JPS5795643A true JPS5795643A (en) 1982-06-14

Family

ID=15915194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55170997A Pending JPS5795643A (en) 1980-12-05 1980-12-05 Probing method for large-scale integrated lead pin in mounting substrate

Country Status (1)

Country Link
JP (1) JPS5795643A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01291167A (en) * 1988-05-18 1989-11-22 Canon Inc Probe card and measuring method for parts to be measured using the same card
JPH01291168A (en) * 1988-05-18 1989-11-22 Canon Inc Probe card and measuring method for parts to be measured using the same card
JPH03200345A (en) * 1989-12-27 1991-09-02 Mitsubishi Electric Corp Semiconductor testing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01291167A (en) * 1988-05-18 1989-11-22 Canon Inc Probe card and measuring method for parts to be measured using the same card
JPH01291168A (en) * 1988-05-18 1989-11-22 Canon Inc Probe card and measuring method for parts to be measured using the same card
JPH03200345A (en) * 1989-12-27 1991-09-02 Mitsubishi Electric Corp Semiconductor testing device

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