JPH01291168A - Probe card and measuring method for parts to be measured using the same card - Google Patents

Probe card and measuring method for parts to be measured using the same card

Info

Publication number
JPH01291168A
JPH01291168A JP63119243A JP11924388A JPH01291168A JP H01291168 A JPH01291168 A JP H01291168A JP 63119243 A JP63119243 A JP 63119243A JP 11924388 A JP11924388 A JP 11924388A JP H01291168 A JPH01291168 A JP H01291168A
Authority
JP
Japan
Prior art keywords
measured
holder
electrically conductive
exposed
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63119243A
Other languages
Japanese (ja)
Inventor
Tetsuo Yoshizawa
吉沢 徹夫
Masaaki Imaizumi
昌明 今泉
Hideyuki Nishida
秀之 西田
Hiroshi Kondo
浩史 近藤
Takashi Sakaki
隆 榊
Yasuteru Ichida
市田 安照
Masateru Konishi
小西 正暉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP63119243A priority Critical patent/JPH01291168A/en
Priority to DE68917231T priority patent/DE68917231T2/en
Priority to EP89108882A priority patent/EP0355273B1/en
Publication of JPH01291168A publication Critical patent/JPH01291168A/en
Priority to US08/620,393 priority patent/US5606263A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To execute probing of a semiconductor element having many connecting points by joining plural conductive members which have been buried in a holding body of an electrical connecting member, and electric circuit parts, and also, vibrating one end of the conductive member. CONSTITUTION:A probe card 200 is formed by joining an electrical connecting member 125 and a circuit board 104. The member 125 has a holding body 111 consisting of an electrical insulating material of an organic material, and plural metallic members 107 which have been buried in the holding body 111, and one end of the member 107 is exposed from the surface of the holding body 111. Also, the substrate 104 has a connecting part 102, soldered to one end of the member 107, and moreover, has a vibrator 252 for vibrating the other end of the member 107. In this state, a connecting part 105 of a semiconductor element 101 being parts to be measured, and the member 107 of the member 125 are connected electrically, and an electrical characteristic is measured. In such a way, probing of the semiconductor element having many connecting points can be executed.

Description

【発明の詳細な説明】 [a業上の利用分野] 本発明はプローブカード及びそれを用いた被測定部品の
測定方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Use] The present invention relates to a probe card and a method for measuring a component to be measured using the probe card.

[従来の技術] 従来、被測定部品、例えば電気回路部品を、電気的に測
定するプローブカードに関する技術としては、以下に述
べる技術が知られている。
[Prior Art] Conventionally, the following technology is known as a technology related to a probe card for electrically measuring a component to be measured, for example, an electric circuit component.

■プローブカード方式 第8図および第9図は従来のプローブカードおよびその
プローブカードを用いた電気回路部品の測定方法を示し
ており、以下第8図および第9図に基づき説明する。
(2) Probe Card Method FIGS. 8 and 9 show a conventional probe card and a method for measuring electric circuit components using the probe card, which will be explained below based on FIGS. 8 and 9.

プローブカード809は、電気的導電材料である針80
3の先端部804が所望の位置に配置するように、針8
03を回路基板805にろう材808および固定部材8
06(第9図では固定部材がない)で固定支持した構成
をとる。
The probe card 809 has needles 80 which are electrically conductive material.
3 so that the tip 804 of the needle 804 is located at the desired position.
03 to the circuit board 805 and the brazing material 808 and the fixing member 8.
06 (there is no fixing member in FIG. 9).

第8図では固定部材806は針803を回路基板805
に機械的に固定するだけであるが、ろう材808は針8
03と回路基板805の接続部807とを機械的に固定
すると同時に電気的に接続する。また、第9図では、ろ
う材808は針803と回路基板805の接続部807
とを機械的かつ電気的に接続する。
In FIG. 8, the fixing member 806 connects the needle 803 to the circuit board 805.
The brazing material 808 is only mechanically fixed to the needle 8.
03 and the connecting portion 807 of the circuit board 805 are mechanically fixed and electrically connected at the same time. In addition, in FIG. 9, the brazing material 808 is connected to the connecting portion 807 between the needle 803 and the circuit board 805.
mechanically and electrically connect the

このようにして作られたプローブカード809の針80
3の先端部804を被測定物である半導体素子801の
接続部802に針803のバネの力で押しつけて接触さ
せ、測定を行なう。なお針803の先端部804は、半
導体素子801の接続部802との間の接触抵抗を小さ
くさせるためにたとえ半導体素子801の接続部802
の表面に酸化皮膜等の電気的絶縁物質が存在していても
、電気的絶縁物質をつき破るように針状に鋭く加工され
ている。
Needle 80 of probe card 809 made in this way
The tip 804 of the needle 803 is pressed against the connecting portion 802 of the semiconductor element 801, which is the object to be measured, by the force of the spring of the needle 803 to make the measurement. Note that the tip portion 804 of the needle 803 is connected to the connecting portion 802 of the semiconductor element 801 in order to reduce the contact resistance between the tip portion 804 and the connecting portion 802 of the semiconductor element 801.
Even if there is an electrically insulating material such as an oxide film on the surface of the wire, it is sharply processed into a needle-like shape to break through the electrically insulating material.

■コンタクトスプリングプローブ方式 第10図はコンタクトスプリングプローブを用いたプロ
ーブカードおよびプローブカードを用いた電気回路部品
の測定方法を示しており、以下第10図に基づき説明す
る。
■Contact Spring Probe Method FIG. 10 shows a probe card using a contact spring probe and a method of measuring electric circuit components using the probe card, which will be explained below based on FIG.

プローブカード809は、電気的導電材料であるコンタ
クトスプリングプローブ811の先端部812が所望の
位置に配置するように、コンタクトスプリングプローブ
811を電気的絶縁材料である板815に固定支持した
構成をとる。
The probe card 809 has a structure in which a contact spring probe 811 is fixedly supported on a plate 815 made of an electrically insulating material so that a tip 812 of the contact spring probe 811 made of an electrically conductive material is placed at a desired position.

このようにして作られたプローブカード809のコンタ
クトスプリングプローブ811の先端部812を被測定
物である回路基板813の接続部814にコンタクトス
プリングプローブ811のバネ圧力で押し当てて接触さ
せ、測定を行なう。
The tips 812 of the contact spring probes 811 of the probe card 809 made in this manner are pressed against the connecting portions 814 of the circuit board 813 which is the object to be measured by the spring pressure of the contact spring probes 811 to make a measurement. .

[発明が解決しようとしている問題点]ところで上記し
た従来のプローブカードには次のような問題点があった
[Problems to be Solved by the Invention] The conventional probe card described above has the following problems.

■プローブカード方式 ■半導体素子801の接続部802の最小隣接ピッチ(
隣接する接続部の最小中心間距離)は針803のブロー
ビング部810の直径と取り付は角度・方向等の取り付
は方等により決ってくる量であるが、半導体素子801
の接続部802の隣接ピッチがその量以下だと測定時隣
接するブロービング部810が接触しやすくなるため測
定がむずかしかった。従りて、半導体素子801が接続
部802の隣接ピッチの狭い多ビンの半導体素子である
場合は、半導体素子801は設計上の制約を受けていた
■Probe card method ■Minimum adjacent pitch of connection part 802 of semiconductor element 801 (
The minimum distance between the centers of adjacent connecting parts) is determined by the diameter of the blobbing part 810 of the needle 803 and the angle, direction, etc.
If the adjacent pitch of the connecting portions 802 is less than this amount, the adjacent blobbing portions 810 tend to come into contact with each other during measurement, making measurement difficult. Therefore, when the semiconductor element 801 is a multi-bin semiconductor element in which the adjacent pitch of the connecting portions 802 is narrow, the semiconductor element 801 is subject to design constraints.

■半導体素子801の接続部802を半導体素子801
の外周縁部よりも内側にくるように設計すると、針80
3のブロービング部810の配置が複雑になり、よフて
回路基板805の接続部807への針803の取り付は
方が複雑になり、さらに測定時隣接するブロービング部
810が接触しやすくなるため、測定がむずかしかった
■Connection part 802 of semiconductor element 801 to semiconductor element 801
If the needle is designed so that it is located inside the outer peripheral edge of the
The arrangement of the probing portions 810 of No. 3 is complicated, and therefore the attachment of the needle 803 to the connection portion 807 of the circuit board 805 is complicated, and furthermore, the adjacent probing portions 810 are likely to come into contact during measurement. Therefore, measurement was difficult.

従って、半導体素子801の接続部802は半導体素子
801上の周辺に配置する必要が生じ、特に半導体素子
801が多ビンの半導体素子である場合は、半導体素子
801は回路設計上の制約を受けざるを得なかった。
Therefore, the connection portion 802 of the semiconductor element 801 needs to be placed around the semiconductor element 801, and especially when the semiconductor element 801 is a multi-bin semiconductor element, the semiconductor element 801 is not subject to restrictions in circuit design. I didn't get it.

さらに、半導体素子801上の周辺部に接続部802を
もつ半導体素子801の複数を同時に測定することはむ
ずかしかった。
Furthermore, it is difficult to simultaneously measure a plurality of semiconductor elements 801 having connecting portions 802 on the periphery of the semiconductor elements 801.

■複数の針803の先端部804を所望の位置に配置す
るために複雑な道具が必要となり、かつ時間がかかるた
めにコスト高であった。
(2) In order to arrange the tips 804 of the plurality of needles 803 at desired positions, a complicated tool is required and the cost is high because it takes time.

■半導体素子801の接続部802の配置が異なった半
導体素子には同じプローブカード809を使用できず、
従って、従来のプローブカードには汎用性がなかった。
■The same probe card 809 cannot be used for semiconductor elements in which the connection parts 802 of the semiconductor elements 801 are arranged differently.
Therefore, conventional probe cards lacked versatility.

■半導体素子801の接続部802にかかる針803の
先端部804の力は、複数の針803の1本1本の材料
が同種であるならば主に形状変形によるバネ力であるた
め、針803の形状が異なると半導体素子801の接続
部802にかかる力が異なり、半導体素子801の接続
部802と針803の先端部804の間の接触抵抗値に
バラツキが生じやすかった。さらに、力が異なると半導
体素子801の接続部802に損傷を与えるという等の
問題点が生じやすかフな。また、針803の変形が過大
になると針803の形状が元の形状に戻らなくなる等の
問題が生じていた。
(2) The force of the tip 804 of the needle 803 applied to the connecting portion 802 of the semiconductor element 801 is mainly a spring force due to shape deformation if each of the plurality of needles 803 is made of the same material. When the shape of the needle 803 differs, the force applied to the connecting portion 802 of the semiconductor element 801 differs, and the contact resistance value between the connecting portion 802 of the semiconductor element 801 and the tip 804 of the needle 803 tends to vary. Furthermore, if the forces are different, problems such as damage to the connecting portion 802 of the semiconductor element 801 are likely to occur. Further, if the needle 803 is deformed excessively, there arises a problem that the shape of the needle 803 cannot be returned to its original shape.

■針803の長さが長くなると、電気抵抗値や浮遊容量
が増大する等の、電気測定上の問題が生じやすくかった
(2) When the length of the needle 803 becomes longer, problems in electrical measurement tend to occur, such as an increase in electrical resistance and stray capacitance.

■プローブカード809をくりかえし使用して針803
の先端部804を半導体素子801の接続部802に接
触させる回数を重ねると、針803の先端部804が摩
耗する。針803の先端部804が摩耗し使用できなく
なった場合、プローブカード809をとり替えるか、ま
たは針803をとり替える等の対処をしなくてはならず
、元のままの状態で再生がきかなかった。
■Use the probe card 809 repeatedly to remove the needle 803.
If the tip 804 of the needle 803 is brought into contact with the connecting portion 802 of the semiconductor element 801 many times, the tip 804 of the needle 803 will wear out. If the tip 804 of the needle 803 is worn out and becomes unusable, it is necessary to take measures such as replacing the probe card 809 or replacing the needle 803, and it cannot be regenerated in its original state. Ta.

■コンタクトスプリングプローブ方式 0圓路基板813の接続部814の最小隣接ピッチ(隣
接する接続部の最小中心間距離)は、コンタクトスプリ
ングプローブ811が回路基板813にほぼ垂直に配設
されている第10図の場合、コンタクトスプリングプロ
ーブ811の直径かまたは先端部812の直径のいずれ
か大きい方の1.5〜2倍であり、回路基板813の接
続部814の隣接ピッチがその値以下だと測定が難しか
った。従って、回路基板813が接続部814の隣接ピ
ッチの狭い多点の回路基板であるものでは設計上の制約
を受けていた。
■Contact spring probe method 0 The minimum adjacent pitch (minimum center-to-center distance between adjacent connection parts) of the connection parts 814 of the circuit board 813 is the 10th contact spring probe 811 arranged almost perpendicularly to the circuit board 813. In the case of the figure, it is 1.5 to 2 times the diameter of the contact spring probe 811 or the diameter of the tip 812, whichever is larger, and if the adjacent pitch of the connection part 814 of the circuit board 813 is less than that value, measurement will not be possible. was difficult. Therefore, if the circuit board 813 is a multi-point circuit board with narrow adjacent pitches of the connecting portions 814, there are design restrictions.

■また、コンタクトスプリングプローブ811の直径か
先端部812の直径のいずれか大きい方の値が最小でも
0.5mm程度であるため、隣接ピッチが0.1〜0.
3mm程度の半導体素子をブロービングすることは難し
かった。
(2) Also, since the diameter of the contact spring probe 811 or the diameter of the tip 812, whichever is larger, is at least about 0.5 mm, the adjacent pitch is 0.1 to 0.
It was difficult to blow a semiconductor element of about 3 mm.

■回路基板813の接続部814の配置が異なる回路基
板13には同じプローブカード809を使用できず、従
って、従来のプローブカード809は汎用性がなかった
(2) The same probe card 809 cannot be used for circuit boards 13 in which the connection portions 814 of the circuit boards 813 are arranged differently, and therefore, the conventional probe card 809 lacks versatility.

■プローブカード809をくりかえし使用して回路基板
813の接続部814にコンタクトスプリングプローブ
811の先端部812を接触させる回数を重ねると、コ
ンタクトスプリングプローブ811の先端部812が摩
耗する。コンタクトスプリングプローブ811の先端部
812が摩耗し使用できなくなった場合、プローブカー
ド809をとり替えるか、またはコンタクトスプリング
プローブ811を取り替える等の対処をしなくてはなら
ず、元のままの状態での再生がきかなかった。
(2) If the probe card 809 is used repeatedly and the tip 812 of the contact spring probe 811 is brought into contact with the connecting portion 814 of the circuit board 813 many times, the tip 812 of the contact spring probe 811 will wear out. If the tip 812 of the contact spring probe 811 is worn out and becomes unusable, it is necessary to take measures such as replacing the probe card 809 or the contact spring probe 811. Playback did not work.

(以下余白) [問題点を解決するための手段] 本発明の第1の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の電気的導電部材とを
有し、該電気的導電部材の一端が該保持体の一方の面に
おいて露出しており、また、該電気的導電部材の他端が
該保持体の他方の面において露出している電気的接続部
材と;少なくとも1以上の接続部を有し、該接続部にお
いて、該保持体の一方の面において露出している該電気
的導電部材のうちの少なくとも1つの一端が接続されて
いる少なくとも1以上の電気回路部品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有していることを特徴とするプローブカー
ドに存在する。
(The following is a blank space) [Means for solving the problem] The first gist of the present invention is to provide a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder. and an electrical connection member in which one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. and; at least one or more connecting portions, to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected. An electric circuit component; and at least means for vibrating one end of the electrically conductive member exposed on the other surface of the holder (hereinafter referred to as a vibrator). present on the probe card.

本発明の第2の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の電気的導電部材とを
有し、該電気的導電部材の一端が該保持体の一方の面に
おいて露出しており、また、該電気的導電部材の他端が
該保持体の他方の面において露出している電気的接続部
材と;少なくとも1以上の接続部を有し、該接続部にお
いて、該保持体の一方の面において露出している該電気
的導電部材のうちの少なくとも1つの一端が接続されて
いる少なくとも1以上の電気回路部品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有しているプローブカードを用い、該保持
体の他方の面において露出している該電気的導電部材の
他端に、少なくとも1以上の接続部を有する少くとも1
以上の被測定部品を電気的に接続して該被測定部品の電
気的特性を測定する被測定部品の測定法であって、 該被測定部品の測定前及び/又は測定中に、該電気的導
電部材の他端及び/又は該被測定部品の接続部に振動を
与えて該被測定部品を測定することを特徴とする被測定
部品の測定法に存在する。
A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; at least one or more electrical circuit components to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; at least on the other surface of the holder; A means for vibrating one end of the electrically conductive member exposed on the other side of the holder (hereinafter referred to as a vibrator); at least one electrically conductive member having at least one connection at the other end;
A measuring method for a part to be measured in which the electrical characteristics of the part to be measured are measured by electrically connecting the above parts to be measured, A method for measuring a part to be measured is characterized in that the part to be measured is measured by applying vibration to the other end of a conductive member and/or a connecting portion of the part to be measured.

本発明の第3の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の電気的導電部材とを
有し、該電気的導電部材の一端が該保持体の一方の面に
おいて露出しており、また、該電気的導電部材の他端が
該保持体の他方の面において露出している電気的接続部
材と;少なくとも1以上の接続部を有し、該接続部にお
いて、該保持体の一方の面において露出している該電気
的導電部材のうちの少なくとも1つの一端が接続されて
おり、該接続は、該接続部と該一端とを金属化及び/又
は合金化により接続されている少なくとも1以上の電気
回路部品と;少なくとも、該保持体の他方の面において
露出している該電気的導電部材の一端を振動させるため
の手段(以下振動子という)と; を少なくとも有していることを特徴とするプローブカー
ドに存在する。
A third aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; one end of at least one of the electrically conductive members exposed on one side of the holder is connected at the part, and the connection is made by metallizing and/or at least one electrical circuit component connected by alloying; and at least means for vibrating one end of the electrically conductive member exposed on the other surface of the holder (hereinafter referred to as a vibrator); exists in a probe card characterized by having at least;

本発明の第4の要旨は、電気的絶縁材料よりなる保持体
と、該保持体中に埋設された複数の電気的導電部材とを
有し、該電気的導電部材の一端が該保持体の一方の面に
おいて露出しており、また、該電気的導電部材の他端が
該保持体の他方の面において露出している電気的接続部
材と;少なくとも1以上の接続部を有し、該接続部にお
いて、該保持体の一方の面において露出している該電気
的導電部材のうちの少なくとも1つの一端が接続されて
おり、該接続は、該接続部と該一端とを金属化及び/又
は合金化により接続されている少なくとも1以上の電気
回路部品と;少なくとも、該保持体の他方の面において
露出している該電気的導電部材の一端を振動させるため
の手段(以下振動子という)と; を少なくとも有しているプローブカードを用い、該保持
体の他方の面において露出している該電気的導電部材の
他端に、少なくとも1以上の接続部を有する少くとも1
以上の被測定部品を電気的に接続して該被測定部品の電
気的特性を測定する被測定部品の測定法であって、 該被測定部品の測定前及び/又は測定中に、該電気的導
電部材の他端及び/又は該被測定部品の接続部に振動を
与えて該被測定部品を測定することを特徴とする被測定
部品の測定法に存在する。
A fourth aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; one end of at least one of the electrically conductive members exposed on one side of the holder is connected at the part, and the connection is made by metallizing and/or at least one electrical circuit component connected by alloying; and at least means for vibrating one end of the electrically conductive member exposed on the other surface of the holder (hereinafter referred to as a vibrator); ; using a probe card having at least one of the following, the other end of the electrically conductive member exposed on the other side of the holder has at least one connection portion;
A measuring method for a part to be measured in which the electrical characteristics of the part to be measured are measured by electrically connecting the above parts to be measured, A method for measuring a part to be measured is characterized in that the part to be measured is measured by applying vibration to the other end of a conductive member and/or a connecting portion of the part to be measured.

[作用] 以下に本発明の作用を、本発明の構成要件の個別的な説
明とともに述べる。
[Function] The function of the present invention will be described below along with individual explanations of the constituent elements of the present invention.

(電気回路部品) 本発明における電気回路部品としては、例えば、トラン
ジスタ、■C等の半導体素子や、樹脂回路基板、セラミ
ック基板、金属基板、シリコン基板等の回路基板(以下
単に回路基板ということがある)や、リードフレーム等
があげられる。
(Electrical circuit components) Electric circuit components in the present invention include, for example, semiconductor elements such as transistors and ), lead frames, etc.

なお、電気的接続部材に接続される電気回路部品は、保
持体の1つの面に1つだけ存在してもよいし、複数個存
在してもよい。
Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

電気回路部品としては、導電性の接続部を有する部品が
本発明の対象となる。
As electric circuit components, components having electrically conductive connections are the objects of the present invention.

(電気的接続部材) 本発明に係る電気的接続部材は、電気絶縁材料からなる
保持体に複数の電気的導電部材が埋設されている。埋設
されている導電部材同士は保持体によって電気的に絶縁
されている。
(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of electrically conductive members embedded in a holder made of an electrically insulating material. The buried conductive members are electrically insulated from each other by the holder.

この電気的導電部材の一端は保持体の一方の面において
露出しており、他端は保持体の他方の面においてに露出
している。
One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

さらに電気的接続部材は、1層あるいは2層以上の多層
からなるものでもよい。
Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

本発明ではこの電気的導電部材がブロービング部となる
In the present invention, this electrically conductive member serves as a blobbing section.

(電気的導電部材) 電気的導電部材は電気的に導電性を示すものならば何で
もよい。金属材料が一般的であるが、金属材料以外にも
超電導性を示す材料等でもよい。
(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Although metal materials are generally used, materials other than metal materials such as those exhibiting superconductivity may also be used.

金属部材の材料としては、耐摩耗性に富む材料が好まし
いが、任意の金属あるいは合金を使用できる。例えば、
Au、Ag、Mn、Cr。
As the material of the metal member, a material with high wear resistance is preferable, but any metal or alloy can be used. for example,
Au, Ag, Mn, Cr.

Nb、Zr、Mg、Mo、Ni、W、Fe。Nb, Zr, Mg, Mo, Ni, W, Fe.

Ti、  In、  Ta、  Zn、  Cu、  
A、fl、  Sn。
Ti, In, Ta, Zn, Cu,
A, fl, Sn.

Pb−5n等の金属あるいは合金があげられる。Examples include metals or alloys such as Pb-5n.

また、金属部材および合金部材は同一の電気的接続部材
において同種の金属が存在していてもよいし異種の金属
が存在していてもよい。さらに、電気的接続部材の金属
部材および合金部材の1個が同種金属ないし合金ででき
ていても異種の金属ないし合金でできていてもよい。さ
らに、金属、合金以外であっても導電性を示すならば、
金属材料に有機材料または無機・材料の一方または両方
を包含せしめた材料でもよい、また、導電性を示すなら
ば無機材料と有機材料との組合せでもよい。
Further, the metal member and the alloy member may be the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys. Furthermore, if materials other than metals and alloys exhibit conductivity,
The material may be a metal material containing one or both of an organic material and an inorganic material, or a combination of an inorganic material and an organic material as long as it exhibits conductivity.

さらに、電気的導電部材の断面は円形、四角形その他任
意の形状とするができる。
Further, the cross section of the electrically conductive member can be circular, square, or any other shape.

また、電気的導電部材の太さは特に限定されない。電気
回路部材の接続部のピッチを考慮して、例えば20μm
φ以上あるいは20μmφ以下にしてもよい。
Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection part of the electric circuit member, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

なお、電気的導電部材の露出部は保持体と同一面として
もよいし、また、保持体の面から突出させてもよい。こ
の突出は片面のみでもよいし両面でもよい。さらに突出
させた場合はバンブ状にしてもよい。
Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. If it is made to protrude further, it may be made into a bump shape.

また、電気的導電部材の間隔は、電気回路部品の接続部
同士の間隔と同一間隔としてもよいし、それより狭い間
隔としても゛よい。狭い間隔とした場合には電気回路部
品と電気的接続部材との位置決めを要することなく、電
気回路部品と電気的接続部材とを接続することが可能と
なる。
Further, the distance between the electrically conductive members may be the same as the distance between the connecting portions of the electric circuit components, or may be narrower than that. When the interval is narrow, it becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the electric circuit component and the electrical connection member.

また、電気的導電部材は保持体中に垂直に配する必要は
なく、保持体の一方の面側から保持体の他方の面側に向
って斜行していてもよい。
Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

また、被測定部品側に露出した電気的導電部材(これが
プローブの先端部となる)の形状は針状で鋭角をなして
いてもよいし複数の鋭角を持っていてもよいし任意の形
状でよい。
Furthermore, the shape of the electrically conductive member exposed to the part to be measured (this becomes the tip of the probe) may be needle-like with an acute angle, or may have multiple acute angles, or may be of any shape. good.

望ましくは、両者に損傷がない程度で接触抵抗が小さく
なる形状がよい。
Desirably, the shape is such that the contact resistance is small without causing damage to both.

(保持体) 保持体は、電気的絶縁材料からなる。(Holding body) The holder is made of electrically insulating material.

電気的絶縁材料ならばいかなるものでもよい。Any electrically insulating material may be used.

電気的絶縁材料としては有機材料、無機材料があげられ
る。また、電気的導電部材同士が電気的に絶縁されるよ
うに処理を施した金属又は合金材料でもよい。さらに、
無機材料中に、粉体や繊維等所望の形状をした、有機材
料、金属材料、合金材料の一種か又は複数種を分散させ
て保有せしめてもよい。さらに、無機材料中に、粉体や
繊維等所望の形状をした、有機材料、金属材料、合金材
料の一種か又は複数種を分散させて保有せしめてもよい
。また、金属材料中に、粉体や繊維等所望の形状をした
、無機材料、有機材料の一種ないし複数種を分散させて
保有せしめてもよい。なお、保持体が金属材料よりなる
場合は、例えば、電気的導電部材と保持体との間に樹脂
等の電気的絶縁材料を配設すればよい。
Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more types of organic materials, metal materials, and alloy materials having a desired shape such as powder or fibers may be dispersed and held in the inorganic material. Furthermore, one or more of organic materials, metal materials, and alloy materials in a desired shape such as powder or fibers may be dispersed and held in the inorganic material. Further, one or more kinds of inorganic materials or organic materials having a desired shape such as powder or fibers may be dispersed and held in the metal material. In addition, when the holding body is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holding body.

ここで有機材料としては、例えば絶縁性の樹脂を用いれ
ばよく、樹脂としては、熱硬化性樹脂、紫外線硬化樹脂
、熱可塑性樹脂等のいかなるものでもよい。例えば、ポ
リイミド樹脂、ポリフェニレンサルファイド樹脂、ポリ
エーテルサルフォン樹脂、ポリエーテルイミド樹脂、ポ
リスチレン樹脂、フッ素樹脂、ポリカーボネート樹脂、
ポリジフェニールエーテル樹脂、ポリベンジルイミダゾ
ール樹脂、ポリアミドイミド樹脂、ポリプロピレン樹脂
、ポリ塩化ビニル樹脂、ポリスチレン樹脂、メタクリル
酸メチル樹脂、ポリフェニレンオキサイド樹脂、フェノ
ール樹脂、メラニン樹脂、エポキシ樹脂、尿素樹脂、メ
タクリル樹脂、塩化ビニリデン樹脂、アルキッド樹脂、
シリコン樹脂その他の樹脂を使用することができる。
Here, as the organic material, for example, an insulating resin may be used, and as the resin, any material such as a thermosetting resin, an ultraviolet curing resin, a thermoplastic resin, etc. may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin,
Polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenolic resin, melanin resin, epoxy resin, urea resin, methacrylic resin, chloride vinylidene resin, alkyd resin,
Silicone resin and other resins can be used.

なお、これらの樹脂の中から、熱伝導性のよい樹脂を使
用すれば、半導体素子が熱を持ってもその熱を樹脂を介
して放熱することができるのでより好ましい。さらに、
樹脂として、回路基板と同じかあるいは同程度の熱膨張
率を有するものを選択し、また、有機材料中に少なくと
も1ケの穴あるいは複数の既報を存在せしめれば、熱膨
張・熱収縮に基づく、装置の信頼性の低下を一層防止す
ることが可能となる。
Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. moreover,
If you select a resin that has the same or similar coefficient of thermal expansion as the circuit board, and if there is at least one hole or multiple holes in the organic material, it will be possible to , it becomes possible to further prevent a decrease in reliability of the device.

また、金属材料や合金材料としては、例えば、Ag、C
u、Au、An、Be、Ca、Mg。
In addition, examples of metal materials and alloy materials include Ag, C
u, Au, An, Be, Ca, Mg.

Mo、Fe、Ni、Si、Go、Mn、W。Mo, Fe, Ni, Si, Go, Mn, W.

Cr、Nb、Zr、Ti、Ta、Zn、Sn。Cr, Nb, Zr, Ti, Ta, Zn, Sn.

Pb−5n等の金属又は合金があげられる。Examples include metals or alloys such as Pb-5n.

無機材料としては、例えば、5iOa。As the inorganic material, for example, 5 iOa.

B203* AIL20s 、Na20.に20゜Ca
b、ZnO,Bad、PbO,Sb、Os 。
B203* AIL20s, Na20. 20°Ca
b, ZnO, Bad, PbO, Sb, Os.

As20.、La20.、ZrO,、BaO1P、O,
、Tie、、MgO,SiC,Bed。
As20. , La20. , ZrO, , BaO1P, O,
, Tie, , MgO, SiC, Bed.

BP、 BN、 Aj2N、 B4C,TaC,Ti 
B、。
BP, BN, Aj2N, B4C, TaC, Ti
B.

CrB2 、TiN、S is Na 、Taz Os
等のセラミック、ダイヤモンド、ガラス、カーボン、ボ
ロンその他の無機材料があげられる。
CrB2, TiN, S is Na, Taz Os
Examples include ceramics, diamond, glass, carbon, boron, and other inorganic materials.

分散せしめる粉体および繊維の大きさ、形状、また絶縁
体中における分散位置、数量は、粉体または繊維のため
に絶縁体中に埋設されている金属部材同士が接触・短絡
したりしない範囲内ならば任意である。ただ、粉体およ
び繊維の大きさとしては隣接する金属部材間の距離より
も小さいことが好ましい。すなわち、電気的導電部材同
士が粉体、繊維を介してでも接触しない状態が好ましい
。また粉体、繊維は絶縁体の外部に露出していてもよい
し、露出していなくともよい。また粉体、繊維同士は接
触していてもよいし、接触していなくともよい。
The size and shape of the powder and fibers to be dispersed, as well as the position and quantity of the dispersed particles in the insulator, must be within a range that does not cause contact or short circuit between the metal parts embedded in the insulator due to the powder or fibers. If so, it is optional. However, the sizes of the powder and fibers are preferably smaller than the distance between adjacent metal members. That is, it is preferable that the electrically conductive members do not come into contact with each other even through powder or fibers. Further, the powder and fibers may or may not be exposed to the outside of the insulator. Further, the powder and fibers may or may not be in contact with each other.

(接続、金属化及び/又は合金化接続)接続方法として
は、機械的接続、融接、圧接、ろう接による溶接接続、
(熱)圧着ボンディング接続、接着等の接続が挙げられ
る。
(Connections, metallized and/or alloyed connections) Connection methods include mechanical connections, fusion welding, pressure welding, welded connections by brazing,
Connections such as (thermal) pressure bonding and adhesive connections may be mentioned.

金属化及び/又は合金化による接続は、互いの金属を拡
散せしめ、同種金属であれば同種の結晶構造が得られ、
異種金属であれば固溶体、金属間化合物等のものを作る
Connection by metallization and/or alloying allows the metals to diffuse into each other, and if the metals are of the same type, the same type of crystal structure is obtained;
For dissimilar metals, solid solutions, intermetallic compounds, etc. are created.

なお、1個の電気的接続部材に、1個または2個以上の
電気回路部品が接続されていてもよいが、その接続され
た電気回路部品のうちの少なくとも1個が下記の構成に
よる接続がなされていわばよい。
Note that one or more electric circuit components may be connected to one electrical connection member, but at least one of the connected electric circuit components may be connected by the following configuration. It is good that it is done.

■保持体の面に露出している複数の電気的接続部材の接
続部と電気回路部品の複数の接続部とが金属化および/
又は合金化以外の方法で接続されている構成。
■The connection parts of the plurality of electrical connection members exposed on the surface of the holder and the plurality of connection parts of the electric circuit components are metallized and/or
or configurations connected by methods other than alloying.

■保持体の面に露出している複数の電気的接続部材の接
続部と電気回路部品の複数の接続部とが金属化および/
又は合金化により接続されている構成。
■The connection parts of the plurality of electrical connection members exposed on the surface of the holder and the plurality of connection parts of the electric circuit components are metallized and/or
or configurations connected by alloying.

次に上記接続について述べる。Next, the above connection will be described.

接続しようとする電気的導電部材と接続部とが同種の純
金属よりなる場合には、金属化により形成される接続層
は電気的導電部材あるいは接続部と同種の結晶構造とな
る。なお、金属化の方法としては、例えば、電気的導電
部材の端とその端に対応する接続部とを接触させた後、
適宜の温度に加熱すればよい。加熱により接触部近傍に
おいて原子の拡散等が生じ、拡散部が金属化状態となり
接続層が形成される。
When the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the connection layer formed by metallization has the same type of crystal structure as the electrically conductive member or the connecting portion. In addition, as a method of metallization, for example, after bringing an end of an electrically conductive member into contact with a connecting part corresponding to the end,
It may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a connection layer.

接続しようとする電気的導電部材と接続部が異種の純金
属よりなる場合には、形成される接続】は両金属の合金
よりなる。合金化の方法としては、例えば、電気的導電
部材の端とその端に対応する接続部とを接触させた後、
適宜の温度に加熱すればよい。加熱により接触部近傍に
おいて原子の拡散等が生じ接触部近傍に固溶体あるいは
金属間化合物よりなる層が形成される。
When the electrically conductive member to be connected and the connecting portion are made of different types of pure metals, the connection formed is made of an alloy of both metals. As a method of alloying, for example, after bringing an end of an electrically conductive member into contact with a connecting portion corresponding to the end,
It may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and a layer made of a solid solution or an intermetallic compound is formed in the vicinity of the contact portion.

なお、電気的接続部材の金属部材にAuを使用し、電気
回路部品の接続部にAnを使用した場合には、200〜
350℃の加熱温度が好ましい。
In addition, when Au is used for the metal member of the electrical connection member and An is used for the connection part of the electric circuit component, the
A heating temperature of 350°C is preferred.

接続しようとする電気的導電部材と接続部の一方が純金
属よりなり他方が合金よりなる場合、あるいは両者が同
種あるいは異種の合金よりなる場合には、接続層は合金
よりなる。
When one of the electrically conductive member and the connecting portion to be connected is made of a pure metal and the other is made of an alloy, or when both are made of the same or different alloys, the connection layer is made of an alloy.

1個の電気的接続部材中における複数の電気的導電部材
同士についてみると、それぞれの電気的導電部材が同種
の金属あるいは合金よりなる場合、それぞれが異種の金
属あるいは合金からなる場合、またさらに1ケの電気的
導電部材で同種の金属あるいは合金、異種の金属あるい
は合金よりなる場合、その他の場合があるが、そのいず
れの場合であっても上記の金属化あるいは合金化が行な
われる。一方接綾部についても同様である。
Regarding a plurality of electrically conductive members in one electrical connection member, when each electrically conductive member is made of the same kind of metal or alloy, when each is made of different kinds of metal or alloy, There are cases where the electrically conductive members are made of the same kind of metals or alloys, different kinds of metals or alloys, and other cases, but in any case, the above-mentioned metallization or alloying is performed. On the other hand, the same applies to the connecting part.

本発明では、電気回路部品の接続部と電気的導電部材と
の接続を金属化及び/又は合金化によって行っている場
合には、電気回路部品の接続部と電気的導電部材とが強
固(強度的に強く)かつ確実に接続されるので、myt
的に強く、不良率の極めて低いプローブカードを得るこ
とができる。また、接続部における電気的接続も確実で
あり、接触抵抗もより小さくすることができる。
In the present invention, when the connection between the electrical circuit component and the electrically conductive member is made by metallization and/or alloying, the electrical circuit component and the electrically conductive member have strong strength (strength). connection (strongly) and reliably, so myt
It is possible to obtain a probe card that is highly durable and has an extremely low defective rate. Moreover, the electrical connection at the connection part is also reliable, and the contact resistance can be further reduced.

なお、電気的導電部材あるいは接続部は、両者の接触部
において、金属あるいは合金であればよく、その他の部
分は例えば金属にガラス等の無機材料、金属に樹脂等の
有機材料が配合された状態であってもよい。また、接続
される部分の表面に合金化しやすい金属あるいは合金よ
りなるめっき層を設けておいてもよい。
In addition, the electrically conductive member or the connecting part may be a metal or an alloy at the contact part between the two, and the other parts may be, for example, a mixture of metal and an inorganic material such as glass, or a mixture of metal and organic material such as resin. It may be. Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

さらに、ろう付は法は、はんだ付は法のような軟ろう付
けや硬ろう付は法等の方法が挙げられる。金属接続をし
易くするため、電気回路部品の接続部ないし電気的導電
部材の一方または両方にメツキ、クラッド等の処理が施
されてあってもよい。さらに、任意の方法で押圧して機
械的接続を行フても、導電材料を分散させて接着剤によ
り接着させてもよい。
Furthermore, there are methods such as soft brazing and hard brazing, such as brazing and soldering. In order to facilitate metal connection, one or both of the connection portion of the electric circuit component and the electrically conductive member may be subjected to treatments such as plating or cladding. Furthermore, the mechanical connection may be achieved by pressing by any method, or the electrically conductive material may be dispersed and bonded using an adhesive.

(被測定部品) 本発明により測定し得る被測定部品としては、例えば、
半導体素子、樹脂回路基板、セラミック基板、金属基板
、シリコン基板等の回路基板、リードフレーム等があげ
られる。
(Parts to be measured) Examples of parts to be measured that can be measured by the present invention include:
Examples include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, metal boards, and silicon boards, and lead frames.

本発明の被測定部品としては導電性の接続部を有する部
品が本発明の対象となる。接続部の数は問わないが、接
続部の数が多ければ多いほど本発明の効果が顕著となる
The object of the present invention is a component having a conductive connection portion as the component to be measured. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

また、接続部の存在位置も問わないが、電気回路部品の
内部に存在するほど本発明の効果は顕著となる。
Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

また、これらの被測定部品の2つ以上を組合せたもので
あってもよい。
Moreover, a combination of two or more of these parts to be measured may be used.

(振動子) 本発明の他の特徴は振動子を有している点である。(oscillator) Another feature of the present invention is that it includes a vibrator.

・振動子は、保持体の他方の面において露出している電
気的導電部材の一端を振動させ得るものであれば、いか
なるものでもよい。
- The vibrator may be of any type as long as it can vibrate one end of the electrically conductive member exposed on the other surface of the holder.

振動子の個数は1以上であればよい。The number of vibrators may be one or more.

振動子の位置は、電気回路部品の内部、外部、内部と外
部の両方のいずれでもよい。また、電気的接続部材の内
部、外部、内部と外部の両方のいずれでもよい。さらに
、電気回路部品と電気的接続部材の双方に設けてもよい
The position of the vibrator may be inside, outside, or both inside and outside of the electric circuit component. Moreover, it may be inside, outside, or both inside and outside of the electrical connection member. Furthermore, it may be provided on both the electric circuit component and the electrical connection member.

なお、電気的接続部材や電気回路部品に直接取り付ける
か、埋め込むことにより取り付けてもよいし、適当な部
材(例えば板材)を介在させて取り付けてもよい。
Note that it may be attached directly to or embedded in an electrical connection member or electric circuit component, or may be attached with an appropriate member (for example, a plate material) interposed therebetween.

振動子としては、電気、電磁界、光等の外部指令により
振動子自身が物理的、機械的に変位するため振動し、外
部に振動を与えるものがあげられる。
Examples of the vibrator include those that vibrate because the vibrator itself is physically and mechanically displaced by external commands such as electricity, electromagnetic fields, light, etc., and give vibration to the outside.

電気により振動を与える例としては圧電素子がある。こ
れは電気を機械的な運動に変換する例である。温度によ
り振動を与える例としては形状記憶合金がある。これは
温度を機械的な運動に変換する例である。
A piezoelectric element is an example of applying vibration using electricity. This is an example of converting electricity into mechanical motion. An example of a material that causes vibrations depending on temperature is a shape memory alloy. This is an example of converting temperature into mechanical motion.

なお、本例の場合、強誘電体を用いたセラミック圧電素
子が望ましいが、いかなる方法によりて変位させてもよ
い。
In this example, a ceramic piezoelectric element using a ferroelectric material is preferable, but any method may be used for displacement.

本発明の第2及び第4の要旨においては、被測定部品に
振動子を設けてもよい。
In the second and fourth aspects of the present invention, a vibrator may be provided in the component to be measured.

また振動の方向は、被測定部品の面方向、面方向に垂直
方向、面方向に斜め方向のいずれでもよい。
Further, the direction of vibration may be in the plane direction of the part to be measured, in a direction perpendicular to the plane direction, or in a direction diagonal to the plane direction.

また、プローブカードと被測定部品の両方を振動させる
場合には、プローブカードと被測定部品とを同じ方向に
振動させてもよいし、異なフた方向に振動させてもよい
Furthermore, when both the probe card and the component to be measured are vibrated, the probe card and the component to be measured may be vibrated in the same direction, or may be vibrated in different directions.

振動の振幅、振動周波数、振動軌跡等は、電気的導電部
材の他端の、特に被測定部品の接続部の表面に存在する
酸化被膜を破壊し、良好な電気的測定が可能な条件を実
験等によりあらかじめ測定しておき、その条件に適合す
るように任意に選べばよい。
The vibration amplitude, vibration frequency, vibration trajectory, etc. are determined through experiments to determine conditions that will destroy the oxide film present on the other end of the electrically conductive member, especially on the surface of the connection part of the part to be measured, and allow good electrical measurements. etc., and then arbitrarily select one that meets the conditions.

振動させる期間は、プローブカードが被測定部品に接触
してから測定を始める前まででもよく、被測定部品の測
定を始めてから振動させてもよく、プローブカードが被
測定部品に接触してから測定を終えて離れるまで振動さ
せても良く、その他いかなる期間でもよい、望ましくは
、プローブカードが被測定部品に接触してから被測定部
品を電気測定し始める前までがよい。さらに、プローブ
カードが被測定部品に接触する前に振動させてもよい。
The period of vibration may be from the time the probe card contacts the part to be measured to before the start of measurement, the period of vibration may be set from the time the probe card contacts the part to be measured to the time when measurement of the part to be measured starts, or the period from the time the probe card contacts the part to be measured to the time before starting measurement. The probe card may be vibrated for a period of time until it is separated from the probe card, or for any other period of time, preferably from the time the probe card comes into contact with the component to be measured until before it begins to electrically measure the component to be measured. Furthermore, the probe card may be vibrated before it comes into contact with the component to be measured.

また、プローブカードと被測定部品との両方を振動させ
る場合、同時期に両者を振動させてもよく、異った時期
に振動させてもよい。
Furthermore, when both the probe card and the component to be measured are vibrated, they may be vibrated at the same time or at different times.

(電気的特性の測定) 本発明では、本発明で得られたプローブカードを用い電
流、電圧、周波数特性等の電気的特性を測定するもので
ある。
(Measurement of Electrical Characteristics) In the present invention, electrical characteristics such as current, voltage, and frequency characteristics are measured using the probe card obtained in the present invention.

本発明では上述した電気的接続部材と電気回路部品を接
続したプローブカードで被測定部品を測定するもので、
被測定部品は接続部を外周縁部はもとより内部に配置す
ることも可能となり、さらに電気的接続部材の電気的導
電部材のピッチを狭くすることが可能なための接続部の
数を増加させることができ、多ビン接続点を持つ被測定
部品の測定が可能となる。
In the present invention, a part to be measured is measured using a probe card in which the above-mentioned electrical connection member and electrical circuit part are connected.
In the part to be measured, it becomes possible to arrange the connection parts not only on the outer periphery but also inside the part, and furthermore, it is possible to increase the number of connection parts so that the pitch of the electrically conductive members of the electrical connection member can be narrowed. This makes it possible to measure parts under test that have multiple bin connection points.

また、被測定部品側に露出している電気的接続部材の電
気的導電部材の先端部近傍にまで絶縁材料が存在してい
るので先端部を所望の位置に配置することが容易となる
。さらに先端部の形状が路間−になることより被測定部
品の複数の接続部に路間−の力がかかることより両者に
害を与えることなく安定した測定が可能となる。
Further, since the insulating material is present even near the tip of the electrically conductive member of the electrical connection member exposed to the part to be measured, it is easy to arrange the tip at a desired position. Further, since the shape of the tip part is shaped like a gap, a force between the lines is applied to the plurality of connecting parts of the part to be measured, so that stable measurement can be performed without harming both parts.

また、電気的接続部材は薄くすることが可能であり、電
気的接続部材の電気的導電部材の長さが短くなることよ
り、電気抵抗値が小で浮遊容量が減少する外界からのノ
イズを減少できる等電気測定上有利になる。
In addition, the electrical connection member can be made thinner, and by shortening the length of the electrically conductive member of the electrical connection member, the electrical resistance value is small and stray capacitance is reduced, reducing noise from the outside world. It is advantageous for electrical measurements.

以上に本発明の作用を本発明の構成要件ごとに述べたが
、さらに本発明においては、電気的接続部材の電気的導
電部材のピッチを被測定部品の接続部のピッチより狭く
することにより、電気的接続部材の位置決めが粗略でも
よい。その場合、電気的接続部材の位置決めが粗略でよ
いばかりか、被測定部品の接続部が路間−の位置を示す
他の被測定部品も測定でき、プローブカードの汎用性が
増す。
The effects of the present invention have been described above for each component of the present invention, but furthermore, in the present invention, by making the pitch of the electrically conductive members of the electrical connection member narrower than the pitch of the connection portion of the part to be measured, The positioning of the electrical connection member may be rough. In this case, not only the positioning of the electrical connection member may be rough, but also other parts to be measured in which the connection portion of the part to be measured indicates a position between the paths can be measured, increasing the versatility of the probe card.

さらに、被測定部品の接続部の形態がワイヤボンディン
グ方式、TAB方式、CCB方式の形態でも使用可能と
なる。
Furthermore, it is also possible to use wire bonding, TAB, and CCB connections for the parts to be measured.

さらに、電気的接続部材の電気的導電部材が摩耗しても
再生がきくという効果が得られる。
Furthermore, even if the electrically conductive member of the electrical connection member wears out, it can be regenerated.

また、電気的接続部材の絶縁体としてノイズを減少させ
る材料を選ぶことにより、外界から半導体素子に入るノ
イズを減少できるとともに、半導体素子から外界に発す
る電磁気ノイズを減少させることが可能となる。
Furthermore, by selecting a material that reduces noise as the insulator of the electrical connection member, it is possible to reduce the noise that enters the semiconductor element from the outside world, and it also becomes possible to reduce the electromagnetic noise that is emitted from the semiconductor element to the outside world.

さらに、電気的接続部材の絶縁体として熱伝導性のよい
ものを選択すれば、半導体素子が熱を持ってもその熱を
より早く放熱させることができるので、放熱特性の良好
なプローブカードが得られる。
Furthermore, if an insulator with good thermal conductivity is selected for the electrical connection member, even if the semiconductor element has heat, the heat can be dissipated more quickly, resulting in a probe card with good heat dissipation characteristics. It will be done.

被測定部品の測定前及び/又は測定中に、電気的導電部
材の他端及び/又は被測定部品の接続部に振動を与える
と、電気的導電部材の他端及び被測定部品の接続部の表
面に存在する酸化被膜が破壊されるので、電気的導電部
材の他端と被測定部品の接続部との電気的接続は良好に
なり、より良好な電気的測定が可能となる。
If vibration is applied to the other end of the electrically conductive member and/or the connection part of the part to be measured before and/or during measurement of the part to be measured, the other end of the electrically conductive member and the connection part of the part to be measured will be damaged. Since the oxide film existing on the surface is destroyed, the electrical connection between the other end of the electrically conductive member and the connection part of the component to be measured becomes better, and better electrical measurements are possible.

また、振動を与えると、電気的導電部材の他端近傍及び
被測定部品上に付着しているゴミを除去することができ
る。なお、除去されたゴミは吸引等の方法で、排除すれ
ばよい。
Further, by applying vibration, it is possible to remove dust adhering to the vicinity of the other end of the electrically conductive member and on the part to be measured. Note that the removed dust may be removed by a method such as suction.

(以下余白) [実施例] (第1実施例) 本発明の第1実施例を第1図(a)〜(C)及び第2図
(a)〜(C)に基づいて説明する。
(Margin below) [Example] (First Example) A first example of the present invention will be described based on FIGS. 1(a) to (C) and FIGS. 2(a) to (C).

第1図(a)は本発明のプローブカードの斜視図であり
、この図では、構造を理解しやすいように、電気的接続
部材125と電気回路部品である回路基板104とを分
離して描いである。完成された状態では、第1図(b)
の断面図に示すように、電気的接続部材125と回路基
板104とが一体となっており、この全体がプローブカ
ード200である。
FIG. 1(a) is a perspective view of the probe card of the present invention, and in this figure, the electrical connection member 125 and the circuit board 104, which is an electrical circuit component, are shown separated to make it easier to understand the structure. It is. In the completed state, Fig. 1(b)
As shown in the cross-sectional view, the electrical connection member 125 and the circuit board 104 are integrated, and this whole constitutes a probe card 200.

本実施例に係るプローブカード200において、電気的
接続部材125は、有機材料の電気的絶縁材料よりなる
保持体111と保持体111中に埋設された電気的導電
部材である金属部材107とを有し、金属部材107の
一端が保持体111の一方の面において露出しており、
また、金属部材107の他端が保持体の他方の面におい
で露出している。
In the probe card 200 according to this embodiment, the electrical connection member 125 includes a holder 111 made of an electrically insulating organic material and a metal member 107 that is an electrically conductive member embedded in the holder 111. However, one end of the metal member 107 is exposed on one surface of the holding body 111,
Further, the other end of the metal member 107 is exposed on the other surface of the holder.

さらに、回路基板104は接続部102を有し、接続部
102において、保持体111の一方の面において露出
している金属部材107の一端とをろう付けによりろう
接されて接続されており、また、金属部材107の他端
を振動させるための振動子252を有している。
Further, the circuit board 104 has a connecting portion 102, and is connected to one end of a metal member 107 exposed on one surface of the holder 111 by brazing. , has a vibrator 252 for vibrating the other end of the metal member 107.

以下に本実施例をより詳細に説明する。This example will be explained in more detail below.

市ず、電気的接続部材125の一製造例を説明すること
により電気的接続部材125を説明するい 第2図(a)〜(C)に−製造例を示す・。
First, the electrical connection member 125 will be explained by explaining one manufacturing example of the electrical connection member 125.A manufacturing example is shown in FIGS. 2(a) to (C).

まず、第2図(a)に示すように、はんだメツキを施し
た20μmφのW等の金属あるいは合金よりなる金属線
121を、ピッチ40μmとして棒122に巻き付け、
巻き付は後、ポリイミド等の樹脂123中に上記金属線
121を埋め込む。
First, as shown in FIG. 2(a), a solder-plated metal wire 121 of 20 μm diameter made of metal or alloy such as W is wound around a rod 122 at a pitch of 40 μm.
After wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide.

埋め込み後上記樹脂123を硬化させる。硬化した樹脂
123は絶縁体となる。その後、点線124の位置でス
ライス切断(へ電気的接続部材12′;を作製する。こ
のようにして作製された電気的接続部材125を第2図
(b)に示す。
After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, the electrical connection member 12' is sliced at the position of the dotted line 124. The electrical connection member 125 thus prepared is shown in FIG. 2(b).

このように作製された電気的接続部材125において、
金属線121が金属部材107を構成17、樹脂123
が保持体(絶縁体)111を構成する。
In the electrical connection member 125 produced in this way,
Metal wire 121 constitutes metal member 107 17, resin 123
constitutes the holding body (insulator) 111.

この電気的接続部材125においては金属部材どなる金
属線121同士は樹脂123により電気的に絶縁されて
いる。また、金属線121の一端は回路基板104側に
露出し、他端は被測定部品側に露出している。回路基板
104側に露出してj・Aる金属線121の一端が回路
基板104との接続部となる。一方、被測定部品側に露
出している部分は被測定部品と電気的に接続するための
接続部となる。
In this electrical connection member 125, the metal wires 121 of the metal members are electrically insulated from each other by the resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 104 side, and the other end is exposed to the measured component side. One end of the metal wire 121 exposed on the circuit board 104 side becomes a connection part with the circuit board 104. On the other hand, the portion exposed to the part to be measured becomes a connection part for electrically connecting to the part to be measured.

本例では被測定部品側に露出している金y4線121の
端は尖頭形状とした第2図(C)、このように尖頭形状
とするためには、樹脂123の被測定部品側の面を樹脂
のエツチング材を用いて約10μmはどエツチングによ
り除去して金属線を突出させ、さらに、この突出した金
属線を金属のエツチング材を用いてエツチングすればよ
い。回路基板側に露出した電気的接続部材125の金属
線の切断面はろう付けし易いように再度はんだメツキし
てもよい。
In this example, the end of the gold Y4 wire 121 exposed on the part to be measured side is shaped like a point as shown in Fig. 2(C). Approximately 10 .mu.m of the surface is removed by etching using a resin etching material to make the metal wire protrude, and then the protruding metal wire is etched using a metal etching material. The cut surface of the metal wire of the electrical connection member 125 exposed on the circuit board side may be soldered again to facilitate brazing.

なお、本例では、被測定部品側に尖頭形状に金属線の一
端を突出させたが、両面で突出させたり(第3図)、あ
るいはその両突出部を尖頭形状にしてもよい(第4図)
In this example, one end of the metal wire was made to protrude in a pointed shape toward the part to be measured, but it may be made to protrude from both sides (Fig. 3), or both protrusions may be made into a pointed shape ( Figure 4)
.

また、本例では金属線121の突出量を10μmとした
が、いかなる量でもよい。
Further, in this example, the amount of protrusion of the metal wire 121 is set to 10 μm, but any amount may be used.

また、金属線121を突出させる方法としてはエツチン
グに限らず、他の化学的な方法又は機成的な方法を使用
してもよい。
Further, the method for protruding the metal wire 121 is not limited to etching, but other chemical methods or mechanical methods may be used.

次に、第1図(a)に示すように、電気回路部品として
回路基板104、電気的接続部材125を用意する。本
例で使用する回路基板104はその内部に多数の接続部
102を有している。
Next, as shown in FIG. 1(a), a circuit board 104 and an electrical connection member 125 are prepared as electrical circuit components. The circuit board 104 used in this example has a large number of connection parts 102 therein.

なお、回路基板104の接続部102は、電気的接続部
材125の接続部ioaに対応する位置に金属が露出し
ている。
Note that metal is exposed in the connection portion 102 of the circuit board 104 at a position corresponding to the connection portion ioa of the electrical connection member 125.

回路基板104の接続部102と、電気的接続部材12
5の接続部108とが対応するように位置決めを行い、
位置決め後、回路基板104の接続部102(本例では
Cu上にはんだ材をメツキしたものよりなる)と、電気
的接続部材125の接続部108(本例ではWにはんだ
材をメツキしたものよりなる)とをろう付けにより接続
した(第1図(b))。なお、第1図(b)において2
30はろう材である。
Connection portion 102 of circuit board 104 and electrical connection member 12
Positioning is performed so that the connecting portion 108 of No. 5 corresponds to the connecting portion 108 of No.
After positioning, the connection portion 102 of the circuit board 104 (in this example, made of Cu plated with solder material) and the connection portion 108 of the electrical connection member 125 (in this example, made of W plated with solder material). (Fig. 1(b)). In addition, in Fig. 1(b), 2
30 is a brazing material.

次いで、支持板251を、回路基板104の裏面に貼り
付けて固定支持した。その後バイモルフ圧電素子252
の一端253の少なくとも一部を支持板251に貼り付
は固定支持し、プローブカード200を構成り、tた。
Next, the support plate 251 was attached to the back surface of the circuit board 104 to fixedly support it. After that, the bimorph piezoelectric element 252
At least a portion of one end 253 of the probe card 200 is attached and fixedly supported to the support plate 251 to constitute the probe card 200.

プローブカード200のバイモルフ圧電素子252の他
端は外部支持板に固定した・。
The other end of the bimorph piezoelectric element 252 of the probe card 200 was fixed to an external support plate.

なお、本例におけるバイモルフ圧′jコ素−f252は
、弾性シム板254の両面に圧電セラミック板255を
貼り合わせた構造となフている。弾性シム板254の裏
の圧電セラミック板255は見えていない。
The bimorph pressure 'j co-f252 in this example has a structure in which piezoelectric ceramic plates 255 are bonded to both surfaces of an elastic shim plate 254. The piezoelectric ceramic plate 255 behind the elastic shim plate 254 is not visible.

このような方法により作製されたプローブカード200
の電気的接続部材125の複数の電気的導電部材107
の露出部を半導体素子101の接続部105に接触させ
る。
Probe card 200 produced by such a method
The plurality of electrically conductive members 107 of the electrical connection member 125 of
The exposed portion is brought into contact with the connection portion 105 of the semiconductor element 101.

その後バイモルフ圧電素子252を図面上において紙面
に対して略直角方向に振動させた。振動は支持板251
、回路基板104、電気的接続部材125に伝わり、半
導体素子101側の複数の電気的導電部材107が振動
し、半導体101の接続部105のAflの表面酸化物
を破壊する。これにより電気的接続部材125の電気的
導電部材107と半導体素子101の接続部105との
間の接触抵抗が小さくなる。その後、振動を止め半導体
素子101を電気的に測定した。
Thereafter, the bimorph piezoelectric element 252 was vibrated in a direction substantially perpendicular to the plane of the drawing. Vibration is caused by support plate 251
, the vibration is transmitted to the circuit board 104 and the electrical connection member 125, and the plurality of electrically conductive members 107 on the semiconductor element 101 side vibrate, destroying the surface oxide of Afl on the connection portion 105 of the semiconductor 101. This reduces the contact resistance between the electrically conductive member 107 of the electrical connection member 125 and the connection portion 105 of the semiconductor element 101. Thereafter, the vibration was stopped and the semiconductor element 101 was electrically measured.

なお、本例の場合、支持板251を設けたが、バイモル
フ圧電素子252の一端253を回路基板104の少な
くとも一部に直接貼り付は固定支持してもよい、また、
本例の場合、バイモルフ圧電素子252を用いたが振動
する材料であればいがなるものでもよい。
Although the support plate 251 is provided in this example, one end 253 of the bimorph piezoelectric element 252 may be directly attached or fixedly supported on at least a portion of the circuit board 104.
In this example, a bimorph piezoelectric element 252 is used, but any vibrating material may be used.

次に、以上のようにして作製したプローブカード200
による被測定部品の電気的特性の測定法を第1図(C)
に基づき述べる。
Next, the probe card 200 produced as described above
Figure 1 (C) shows the method for measuring the electrical characteristics of the part under test.
Based on the following.

本例では被測定部品として半導体素子101を用意した
。この半導体素子101は、40μmのピッチで接続部
が配置されている。
In this example, a semiconductor element 101 was prepared as the component to be measured. In this semiconductor element 101, connection portions are arranged at a pitch of 40 μm.

半導体素子101の接続部105と、電気的接続部材1
25の接続部109とが対応するように位置決めを行い
、位置決め後、半導体素子101の接続部105(本例
ではAiよりなる)と、電気的接続部材125の接続部
109(本例ではWよりなる)とを電気的に接続しく第
1図(e))、電気的特性の測定を行った。なお、この
場合の接続は一時的な接続であり、測定が終了後は脱着
可能である。
Connection portion 105 of semiconductor element 101 and electrical connection member 1
After positioning, the connecting portion 105 of the semiconductor element 101 (made of Ai in this example) and the connecting portion 109 of the electrical connecting member 125 (made of W in this example) are aligned so that they correspond to each other. (Fig. 1(e)), and the electrical characteristics were measured. Note that the connection in this case is a temporary connection and can be detached after the measurement is completed.

半導体素子101のプローブカードへの脱老を繰り返し
つつ測定を繰返し行ったが電気的導電部材の摩耗は少な
かフだ。
Measurements were repeated while repeatedly removing the semiconductor element 101 from the probe card, but there was little wear on the electrically conductive members.

本例では、電気的特性の測定を極めて正確V゛行うこと
かできた。
In this example, the electrical characteristics could be measured extremely accurately.

(第2実施例) 第5図に第2実施例を示す。(Second example) FIG. 5 shows a second embodiment.

本例においては、電気的接続部材125は、第1実施例
に示した電気的接続部材と異なる。すなわち、本例の電
気的接続部材125においては、金属部材同士のピッチ
が第1実施例で示したものよりも狭くなっている。また
、本例では、被測定部品である半導体素子101の接続
部105の間隔よりも狭い間隔に金属部材107同士の
ピッチを設定しである。
In this example, the electrical connection member 125 is different from the electrical connection member shown in the first embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the first example. Further, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the connecting portions 105 of the semiconductor element 101, which is the component to be measured.

つまり、第1実施例では、プローブカードによる測定時
に、半導体素子101と電気的接続部オ(125の正確
な位置決めが必要であったが、本例では、半導体素子の
接続寸法(Ll、Pi)と電気的接続部材の接続寸法(
L2.P2)を適切な値に選ぶことにより正確な位置決
めなしで接続づることも可能である。また、本例ではブ
ローツカード200作製時、回路基板104の接続部1
02と電気的接続部材125の接続部108との正確な
位置決めは不要となる。さらに本例では回路基板104
の接続部102に金を使用し電気的接続部材125の電
気的導電部材107の材料として金または金合金を使用
した。また、電気的導電部材107と回路基板104の
接続部102との接続は金属化及び/又は合金化によっ
た。
In other words, in the first embodiment, accurate positioning of the semiconductor element 101 and the electrical connection part O (125) was required during measurement with the probe card, but in this example, the connection dimensions (Ll, Pi) of the semiconductor element were required. and the connection dimensions of the electrical connection member (
L2. By selecting an appropriate value for P2), it is also possible to connect without accurate positioning. In addition, in this example, when manufacturing the Brotz card 200, the connecting portion 1 of the circuit board 104 is
02 and the connection portion 108 of the electrical connection member 125 becomes unnecessary. Furthermore, in this example, the circuit board 104
Gold was used for the connecting portion 102, and gold or a gold alloy was used as the material for the electrically conductive member 107 of the electrical connecting member 125. Further, the connection between the electrically conductive member 107 and the connecting portion 102 of the circuit board 104 is made by metallization and/or alloying.

さらに、本例においては、振動子を取り付ける位置と振
動方向は第1実施例に示したものとは異なる。すなわち
、本例では振動子はプローブカード200と半導体素子
101近傍の両方に取り付けである。
Furthermore, in this example, the position where the vibrator is attached and the vibration direction are different from those shown in the first example. That is, in this example, the vibrator is attached to both the probe card 200 and the vicinity of the semiconductor element 101.

プローブカード200に取り付けである圧電素子261
は回路基板104に取り付は固定支持した。さらに外部
に固定支持した。振動方向は紙面に対して上下方向に振
動させた。そのため半導体素子101側の電気的導電部
材107も紙面に対して上下方向に振動した。
Piezoelectric element 261 attached to probe card 200
was fixedly supported on the circuit board 104. Furthermore, it was fixedly supported externally. The vibration direction was vertical to the plane of the paper. Therefore, the electrically conductive member 107 on the semiconductor element 101 side also vibrated in the vertical direction with respect to the plane of the paper.

半導体素子101近傍に取り付けであるバイモルフ圧電
素子262の少なくとも一部を支持体263に取り付は
固定支持した。支持体263上に半導体素子101を吸
引等の方法で固定支持した。バイモルフ圧電素子262
の振動方向は紙面に対して略直角方向に振動し、支持体
263を振動させ、半導体素子101の接続部105を
振動させた。
At least a portion of the bimorph piezoelectric element 262, which is attached near the semiconductor element 101, is attached and fixedly supported on a support body 263. The semiconductor element 101 was fixedly supported on the support body 263 by a method such as suction. Bimorph piezoelectric element 262
The vibration direction was approximately perpendicular to the plane of the paper, vibrating the support body 263 and vibrating the connecting portion 105 of the semiconductor element 101.

本例では、被測定部品の測定に際し、被測定部品である
半導体素子101とプローブカード200との位置決め
は必要であるが、電気的接続部材125との正確な位置
決めは本例では不要となる。
In this example, when measuring the component to be measured, it is necessary to position the semiconductor element 101, which is the component to be measured, and the probe card 200, but accurate positioning with the electrical connection member 125 is not necessary in this example.

本例でも、電気的特性の測定を極めて正確に行うことが
できた。
In this example as well, the electrical characteristics could be measured extremely accurately.

他の点は第1実施例と同様である。Other points are similar to the first embodiment.

(第3実施例) 第6図に第3実施例に使用する電気的接続部材を示す。(Third example) FIG. 6 shows an electrical connection member used in the third embodiment.

この電気的接続部材は層状構造をしている。第6図(a
)は電気的接続部材の斜視図、第6図(b)は上記電気
的接続部材の断面図である。
This electrical connection member has a layered structure. Figure 6 (a
) is a perspective view of the electrical connection member, and FIG. 6(b) is a sectional view of the electrical connection member.

第6図に示す電気的接続部材の作製例を以下に述べる。An example of manufacturing the electrical connection member shown in FIG. 6 will be described below.

まず、第1実施例に示した製法で、電気的接続部材12
8,129,130を3枚用意する。
First, the electrical connection member 12 is manufactured using the manufacturing method shown in the first embodiment.
Prepare three pieces of 8, 129, and 130.

1枚目128の金属線121の位置はm行n列目で、m
a、nbだけ中心から変位している。
The position of the metal wire 121 in the first sheet 128 is m row and n column.
It is displaced from the center by a and nb.

2枚目129の金属線12゛1の位置はm行n列目で、
mac、nbcだけ中心から変位している。
The position of the metal wire 12゛1 in the second sheet 129 is at the m row and the n column,
It is displaced from the center by mac and nbc.

3枚目130の金属線121の位置はm行n列で、ma
d、nbdだけ中心から変位している。
The position of the metal wire 121 of the third sheet 130 is m row and n column, and ma
It is displaced from the center by d and nbd.

a、b、c、dの値は上下の金属線121は導通するが
左右には互いに電気的に導通しないような値をとる。3
枚の電気的接続部材を位置決めし、ろう付は等の方法を
用い′vL層し、電気的接続部材125を作製する。
The values of a, b, c, and d are such that the upper and lower metal wires 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. 3
The electrical connection members 125 are manufactured by positioning the two electrical connection members and brazing them using the method described above.

なお、本例においては、電気的接続部材の金属線の位置
をm行n列というように規則をもった位置を選んだが、
上下の金属線が導通し、左右には互いに電気的に導通し
ないようにすればランダムでもよい。
In addition, in this example, the positions of the metal wires of the electrical connection members were selected according to rules such as m rows and n columns.
It may be random as long as the upper and lower metal wires are electrically conductive and the left and right sides are not electrically conductive to each other.

また、本例では3層積層する場合について述べたが、2
枚以上であれば何枚でもよい。また、ろう付は方法を用
いて積層すると述べたが、金属化及び/又は合金化、圧
着、接着等の方法を用いてもよい。さらに、本例の電気
的接続部材を例えば金属線121の切断位置を変える等
の加工をして第3図に示すように突起を設けてもよいし
、第4図に示したように尖頭形状としてもよい。
In addition, although this example describes the case where three layers are laminated, two
Any number of sheets may be used as long as it is more than one sheet. Further, although it has been described that lamination is performed using a brazing method, methods such as metallization and/or alloying, pressure bonding, adhesion, etc. may also be used. Furthermore, the electrical connection member of this example may be processed, for example by changing the cutting position of the metal wire 121, to provide a protrusion as shown in FIG. It may also be a shape.

本例でも、電気的特性の測定を極めて正確に行うことが
できた。
In this example as well, the electrical characteristics could be measured extremely accurately.

(第4実施例) 第7図に第4実施例に使用する電気的接続部材を示す。(Fourth example) FIG. 7 shows an electrical connection member used in the fourth embodiment.

第7図(a)は電気的接続部材の製造途中の断面図、第
7図(b)は上記電気的接続部材の斜視図、第7図(C
)は上記の断面図である。
FIG. 7(a) is a sectional view of the electrical connection member during manufacture, FIG. 7(b) is a perspective view of the electrical connection member, and FIG.
) is the above sectional view.

あらかじめアルミナセラミックよりなる保持体126に
、20μmφより大きい径の穴142をあけておく。次
に穴142に20μmφのAu等の金属あるいは合金よ
りなる金属線121を通し、樹脂123を保持体126
と金属線121との間に入れ、樹脂123を硬化させる
。硬化した樹脂123は介在物となる。その後、金属線
121を点線124の位置でスライス切断し、電気的接
続部材125を作製する。このようにして作製した電気
的接続部材125を第7図(b)。
A hole 142 having a diameter larger than 20 μmφ is drilled in advance in the holder 126 made of alumina ceramic. Next, a metal wire 121 made of a metal such as Au or an alloy with a diameter of 20 μm is passed through the hole 142, and the resin 123 is attached to the holder 126.
and the metal wire 121, and the resin 123 is cured. The hardened resin 123 becomes an inclusion. Thereafter, the metal wire 121 is sliced at the dotted line 124 to produce an electrical connection member 125. The electrical connection member 125 produced in this way is shown in FIG. 7(b).

(C)に示す。Shown in (C).

また、本例の電気的接続部材を例えば金属線121の切
断位置を変える等の加工をして、第3図に示すように突
起を設けてもよいし、第4図に示すように尖頭形状とし
てもよい。
Further, the electrical connection member of this example may be processed, for example by changing the cutting position of the metal wire 121, to provide a protrusion as shown in FIG. 3, or a pointed one as shown in FIG. It may also be a shape.

他の点は第1実施例と同様である。Other points are similar to the first embodiment.

本例でも、電気的特性の測定を極めて正確に行うことが
できた。
In this example as well, the electrical characteristics could be measured extremely accurately.

[発明の効果コ 本発明は、以上のような構成としたことによって、次の
数々の効果が得られた。
[Effects of the Invention] By having the above-described configuration, the present invention has achieved the following numerous effects.

まず、本発明の第1発明では、以下の効果が得られた。First, in the first aspect of the present invention, the following effects were obtained.

■被測定部品、とりわけ半導体素子の接続部がいかなる
位置(特に内部)に配置されていてもブロービングでき
ることから、従来のワイヤボンディング方式、TAB方
式よりもさらに多くの接続点を持つ半導体素子のブロー
ビングが可能となり、多ビン数ブロービング向きのプロ
ーブカードを提供できた。さらに、電気的接続部材の隣
接金属間に絶縁物質が存在することにより、隣接ピッチ
を狭くしても隣接する電気的導電部材が導通しなくなり
、CCB方式よりもさらに多点の半導体素子のブロービ
ングが可能となった。
■Blowing can be performed no matter where the connection part of the component to be measured, especially the semiconductor element, is placed (especially inside), so it is possible to blow the semiconductor element which has more connection points than the conventional wire bonding method or TAB method. This enabled us to provide a probe card suitable for multi-bin probing. Furthermore, due to the presence of an insulating material between adjacent metals of electrical connection members, there is no conduction between adjacent electrically conductive members even if the adjacent pitch is narrowed. became possible.

■電気的接続部材の被測定物側近傍に露出している複数
の電気的導電部材の形状が路間−であることにより、被
測定物の接続部にかかる力が路間−になり、被測定物に
損傷を与えることなく安定して測定できるプローブカー
ドが得られた。さらに、電気的導電部材先端を所望の位
置に容易に配設できるので、プローブカードを低コスト
に作製することが可能となった。
■Because the shape of the electrically conductive members exposed in the vicinity of the object to be measured of the electrical connection member is in the shape of a path, the force applied to the connection part of the object to be measured becomes a path. A probe card that can perform stable measurements without damaging the object to be measured was obtained. Furthermore, since the tip of the electrically conductive member can be easily disposed at a desired position, the probe card can be manufactured at low cost.

■電気的接続部材の厚みを薄くすることにより配線長が
短くなり、これによって電気抵抗が小さくなり、さらに
、浮遊容量および外界からのノイズが減少した。
■Reducing the thickness of the electrical connection member shortens the wiring length, which reduces electrical resistance, and further reduces stray capacitance and noise from the outside world.

■電気的接続部材の電気的導電部材先端が摩耗しても再
生がきくため、耐久性に冨むプローブカードが得られた
■Even if the tip of the electrically conductive member of the electrical connection member wears out, it can be regenerated, resulting in a highly durable probe card.

■プローブカードの電気的接続部材の交換が容易である
ことや、電気的導電部材の径もしくは隣接ピッチを変え
ることで半導体素子の径および隣接ピッチを変化させる
ことができることによりて、路間−の異った半導体素子
がブロービング可能となり汎用性が増した。
■The electrical connecting members of the probe card can be easily replaced, and the diameter of the semiconductor element and the adjacent pitch can be changed by changing the diameter or adjacent pitch of the electrically conductive member. Different semiconductor elements can be blown, increasing versatility.

■電気的接続部材の絶縁体にノイズを減少させるような
材料を選ぶことにより、半導体素子から発生する電磁気
ノイズおよび外界からのノイズを減少でき、すぐれた特
性のプローブカードが得ることが可能となった。
■By selecting a material that reduces noise for the insulator of the electrical connection member, it is possible to reduce electromagnetic noise generated from semiconductor elements and noise from the outside world, making it possible to obtain a probe card with excellent characteristics. Ta.

■電気的接続部材の絶縁体および回路基板に熱伝導性の
良い材料を遭択することにより、測定時に半導体素子か
ら発生する熱を速く逃がすことが可能となった。
■By selecting materials with good thermal conductivity for the insulators of the electrical connection members and the circuit board, it has become possible to quickly dissipate the heat generated from the semiconductor elements during measurement.

0作成工程中において、治具等を使用して電気的導電部
材の各々等をいちいち保持して取り付ける必要がなく、
工程の簡略化および作製時間の短縮が可能となった。
0 during the production process, there is no need to use jigs or the like to hold and attach each electrically conductive member, etc.
It has become possible to simplify the process and shorten the manufacturing time.

■被測定物の接続部に接触した複数の電気的接続部材を
相対的に振動させることにより、複数の電気的接続部材
及び/又は被測定物の接続部にできた表面酸化皮膜を破
壊し、また、付着しているゴミを1lllt敗させ、と
れにより接触抵抗を小さくすることが可能となった。さ
らに、被測定物側の複数の電気的接続部材及び/又は被
測定物を接触面以外に振動させることにより、付着した
ゴミを1敗させ、吸収等の方法でゴミを除去することが
可能となった。
■ By relatively vibrating the plurality of electrical connection members in contact with the connection part of the object to be measured, the surface oxide film formed on the plurality of electrical connection members and/or the connection part of the object to be measured is destroyed, In addition, it became possible to reduce the contact resistance by removing 1lllt of the adhering dust. Furthermore, by vibrating the plurality of electrical connection members on the side of the measured object and/or the measured object other than the contact surface, it is possible to destroy the adhered dust and remove it by absorption or other methods. became.

また、本発明の第2発明では、上記■〜■の効果を有す
るプローブカードを用いることによって、以下の効果が
得られた。
Further, in the second aspect of the present invention, the following effects were obtained by using the probe card having the effects (1) to (4) above.

[相]電気抵抗および浮遊容量および外界からのノイズ
の減少により、半導体素子等の電気的特性をより正確に
高精度で行うことが可能となった。
[Phase] By reducing electrical resistance, stray capacitance, and noise from the outside world, it has become possible to measure the electrical characteristics of semiconductor devices more accurately and with high precision.

■測定時の位置合わせが容易となり、また、略同−の半
導体素子等を同一のプローブカードで測定でき、さらに
、複数の半導体素子等を同時に容易に測定でき、よって
測定作業の効率化を図ることが可能となった。
■Alignment during measurement becomes easier, approximately the same semiconductor elements can be measured with the same probe card, and multiple semiconductor elements can be easily measured simultaneously, thus improving the efficiency of measurement work. It became possible.

■被測定部品の測定前及び/又は測定中に、電気的導電
部材の他端及び/又は被測定物の接続部に振動を与えて
表面酸化皮膜を破壊し、付着しているゴミを離散・除去
し、これによって接触抵抗を小さくすることにより、半
導体素子等の電気的特性をより良好に一信頼性高く測定
することが可能とな・ノた。
■Before and/or during measurement of the part to be measured, vibration is applied to the other end of the electrically conductive member and/or the connection part of the part to be measured to destroy the surface oxide film and to disperse and disperse attached dust. By removing the contact resistance and thereby reducing the contact resistance, it is possible to better and more reliably measure the electrical characteristics of semiconductor devices, etc.

さらに、本発明の第3発明では、上記■〜■の効果に加
え、以下の効果が得られた。
Furthermore, in the third aspect of the present invention, in addition to the effects (1) to (4) above, the following effects were obtained.

くゆ電気回路部品の接続部と電気的接続部材の電気的導
電部材との接続を確実に行うことができ、機械的強度が
強く頑丈なプローブカードを得ることができ、また、作
製後の管理および取り扱いも容易になった。
It is possible to reliably connect the connection part of the electric circuit component and the electrically conductive member of the electrical connection member, and it is possible to obtain a sturdy probe card with strong mechanical strength. And handling has become easier.

■また、上記@の接続部における電気的不良および接触
抵抗を著しく低減することが可能となつた。
(2) Furthermore, it has become possible to significantly reduce electrical defects and contact resistance at the above-mentioned @ connections.

さらに、本発明の第4発明では、上記■〜■及び0〜@
lの効果を有するプローブカードを用いることによって
、上記[相]〜@の効果に加え、以下の効果が得られた
Furthermore, in the fourth aspect of the present invention, the above ■~■ and 0~@
By using a probe card having the effect of 1, the following effects were obtained in addition to the effects of [phase] to @ above.

■電気的不良および接触抵抗の低減により、半導体素子
の電気的特性の測定をさらに正確に高精度で行うことが
でき、信頼性の高い測定が可能となった。
■By reducing electrical defects and contact resistance, the electrical characteristics of semiconductor devices can be measured more accurately and with high precision, making highly reliable measurements possible.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)〜(C)は本発明の第1実施例を示し、第
1図(a)は斜視図、第1図(b)は断面図、第1図(
e)は断面図である。 第2図(a)〜 (C)は本発明の第1実施例を示し、
第2図(a)は斜視断面図、第2図(b)は斜視図、第
2図(C)は断面図である。 第3図(a)〜(&)は本発明の第1実施例の変形例を
示し、第3図(a)は斜視図、第3図(b)は断面図で
ある。 第4図は本発明の第1実施例の変形例を示す断面図であ
る。 第5図は本発明の第2実施例を示す断面図である1、 第6図(a)、(b)は本発明の第3実施例を示し、第
6図(a)は斜視図、第6図(b)は断面図である。 第′7図(a)〜(c)は本発明の第4実施例を示し、
第7図(a)は断面図、第7図(b)は斜視図、第7図
(e)は断面図である。 第8図乃至第10図は従来例を示す断面図である。 101.801・・・半導体素子、102゜105、 
108. 109,802. 807゜814・・・接
続部、104・・・回路基板、107・・・金属部材、
111・・・保持体(絶縁体)、121・・・金属線、
122・・・棒、123・・・樹脂、124・・・点線
、125,128,129,130・・・電気的接続部
材、126・・・保持体、142・・・穴、200.8
09・・・プローブカード、251・・・支持仮、25
2・・・バイモルフ圧電素子、253・・・一端、25
4・・・弾性シム板、255・・・圧電セラミック板、
261・・・圧電素子、262・・・バイモルフ圧電素
子、263・・・支持体、230・・・ろう材、803
・・・針、804,812・・・先端部、805゜81
3・・・回路基板、806・・・固定部材、808・・
・ろう材、810・・・ブロービング部、811・・・
コンタクトスプリングプローブ、815・・・板。 第1図(a) 第2図(a) 第2図(b)    第2図(c) 第3図(a) 第4図 121     III 第6図(a) 第6図(b) 第7図(a) 第7図(b) 第 7  図 (Cン 第8図 第 9 図 第 IQ  図
1(a) to 1(C) show a first embodiment of the present invention, in which FIG. 1(a) is a perspective view, FIG. 1(b) is a sectional view, and FIG.
e) is a cross-sectional view. FIGS. 2(a) to 2(C) show a first embodiment of the present invention,
FIG. 2(a) is a perspective sectional view, FIG. 2(b) is a perspective view, and FIG. 2(C) is a sectional view. 3(a) to 3(&) show a modification of the first embodiment of the present invention, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. FIG. 4 is a sectional view showing a modification of the first embodiment of the present invention. 5 is a cross-sectional view showing a second embodiment of the present invention, FIGS. 6(a) and 6(b) are a third embodiment of the present invention, and FIG. 6(a) is a perspective view. FIG. 6(b) is a sectional view. Figures '7(a) to (c) show a fourth embodiment of the present invention,
FIG. 7(a) is a sectional view, FIG. 7(b) is a perspective view, and FIG. 7(e) is a sectional view. FIGS. 8 to 10 are cross-sectional views showing conventional examples. 101.801...Semiconductor element, 102°105,
108. 109,802. 807° 814... Connection portion, 104... Circuit board, 107... Metal member,
111... Holder (insulator), 121... Metal wire,
122... Rod, 123... Resin, 124... Dotted line, 125, 128, 129, 130... Electrical connection member, 126... Holder, 142... Hole, 200.8
09...Probe card, 251...Temporary support, 25
2... Bimorph piezoelectric element, 253... One end, 25
4... Elastic shim plate, 255... Piezoelectric ceramic plate,
261... Piezoelectric element, 262... Bimorph piezoelectric element, 263... Support body, 230... Brazing material, 803
... Needle, 804,812 ... Tip, 805°81
3... Circuit board, 806... Fixing member, 808...
・Brazing metal, 810...Blowing part, 811...
Contact spring probe, 815...plate. Figure 1 (a) Figure 2 (a) Figure 2 (b) Figure 2 (c) Figure 3 (a) Figure 4 121 III Figure 6 (a) Figure 6 (b) Figure 7 (a) Figure 7 (b) Figure 7 (C Figure 8 Figure 9 Figure IQ

Claims (5)

【特許請求の範囲】[Claims] (1)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の電気的導電部材とを有し、該電気的導
電部材の一端が該保持体の一方の面において露出してお
り、また、該電気的導電部材の他端が該保持体の他方の
面において露出している電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該保持体の一方の面において露出している該電気的導電
部材のうちの少なくとも1つの一端が接続されている少
なくとも1以上の電気回路部品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有していることを特徴とするプローブカー
ド。
(1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one or more electrical circuit components to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; A probe card comprising: means for vibrating one end of the electrically conductive member (hereinafter referred to as a vibrator); and a probe card.
(2)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の電気的導電部材とを有し、該電気的導
電部材の一端が該保持体の一方の面において露出してお
り、また、該電気的導電部材の他端が該保持体の他方の
面において露出している電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該保持体の一方の面において露出している該電気的導電
部材のうちの少なくとも1つの一端が接続されている少
なくとも1以上の電気回路部品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有しているプローブカードを用い、該保持
体の他方の面において露出している該電気的導電部材の
他端に、少なくとも1以上の接続部を有する少くとも1
以上の被測定部品を電気的に接続して該被測定部品の電
気的特性を測定する被測定部品の測定法であって、 該被測定部品の測定前及び/又は測定中に、該電気的導
電部材の他端及び/又は該被測定部品の接続部に振動を
与えて該被測定部品を測定することを特徴とする被測定
部品の測定法。
(2) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one or more electrical circuit components to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; means for vibrating one end of the electrically conductive member (hereinafter referred to as a vibrator); at least one connection having at least one connection at the other end of the member;
A measuring method for a part to be measured in which the electrical characteristics of the part to be measured are measured by electrically connecting the above parts to be measured, A method for measuring a part to be measured, characterized in that the part to be measured is measured by applying vibration to the other end of a conductive member and/or a connecting portion of the part to be measured.
(3)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の電気的導電部材とを有し、該電気的導
電部材の一端が該保持体の一方の面において露出してお
り、また、該電気的導電部材の他端が該保持体の他方の
面において露出している電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該保持体の一方の面において露出している該電気的導電
部材のうちの少なくとも1つの一端が接続されており、
該接続は、該接続部と該一端とを金属化及び/又は合金
化により接続されている少なくとも1以上の電気回路部
品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有していることを特徴とするプローブカー
ド。
(3) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection includes at least one electrical circuit component connected to the connection portion and the one end by metallization and/or alloying; at least the electrical circuit component exposed on the other surface of the holder; A probe card comprising: means for vibrating one end of a conductive member (hereinafter referred to as a vibrator); and a probe card.
(4)電気的絶縁材料よりなる保持体と、該保持体中に
埋設された複数の電気的導電部材とを有し、該電気的導
電部材の一端が該保持体の一方の面において露出してお
り、また、該電気的導電部材の他端が該保持体の他方の
面において露出している電気的接続部材と; 少なくとも1以上の接続部を有し、該接続部において、
該保持体の一方の面において露出している該電気的導電
部材のうちの少なくとも1つの一端が接続されており、
該接続は、該接続部と該一端とを金属化及び/又は合金
化により接続されている少なくとも1以上の電気回路部
品と; 少なくとも、該保持体の他方の面において露出している
該電気的導電部材の一端を振動させるための手段(以下
振動子という)と; を少なくとも有しているプローブカードを用い、該保持
体の他方の面において露出している該電気的導電部材の
他端に、少なくとも1以上の接続部を有する少くとも1
以上の被測定部品を電気的に接続して該被測定部品の電
気的特性を測定する被測定部品の測定法であって、 該被測定部品の測定前及び/又は測定中に、該電気的導
電部材の他端及び/又は該被測定部品の接続部に振動を
与えて該被測定部品を測定することを特徴とする被測定
部品の測定法。
(4) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection includes at least one electrical circuit component connected to the connection portion and the one end by metallization and/or alloying; at least the electrical circuit component exposed on the other surface of the holder; A means for vibrating one end of the electrically conductive member (hereinafter referred to as a vibrator); and a probe card having at least: a means for vibrating one end of the electrically conductive member; , at least one having at least one connection
A measuring method for a part to be measured in which the electrical characteristics of the part to be measured are measured by electrically connecting the above parts to be measured, A method for measuring a part to be measured, characterized in that the part to be measured is measured by applying vibration to the other end of a conductive member and/or a connecting portion of the part to be measured.
(5)電気回路部品は、半導体素子、回路基板、シリコ
ン基板またはリードフレームである請求項1乃至4のい
ずれか1項に記載のプローブカードおよびそれを用いた
被測定部品の測定法。
(5) The probe card according to any one of claims 1 to 4, wherein the electric circuit component is a semiconductor element, a circuit board, a silicon substrate, or a lead frame, and a method for measuring a component to be measured using the probe card.
JP63119243A 1988-05-18 1988-05-18 Probe card and measuring method for parts to be measured using the same card Pending JPH01291168A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63119243A JPH01291168A (en) 1988-05-18 1988-05-18 Probe card and measuring method for parts to be measured using the same card
DE68917231T DE68917231T2 (en) 1988-05-18 1989-05-17 Probe card, method for measuring a part to be measured with the same and electrical circuit part.
EP89108882A EP0355273B1 (en) 1988-05-18 1989-05-17 Probe card, method for measuring part to be measured by use thereof and electrical circuit member
US08/620,393 US5606263A (en) 1988-05-18 1996-03-22 Probe method for measuring part to be measured by use thereof and electrical circuit member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63119243A JPH01291168A (en) 1988-05-18 1988-05-18 Probe card and measuring method for parts to be measured using the same card

Publications (1)

Publication Number Publication Date
JPH01291168A true JPH01291168A (en) 1989-11-22

Family

ID=14756508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63119243A Pending JPH01291168A (en) 1988-05-18 1988-05-18 Probe card and measuring method for parts to be measured using the same card

Country Status (1)

Country Link
JP (1) JPH01291168A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015108051A1 (en) * 2014-01-17 2017-03-23 株式会社村田製作所 Multilayer wiring board and inspection apparatus including the same
JP2020085534A (en) * 2018-11-19 2020-06-04 株式会社アドバンテスト Tester and test method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795643A (en) * 1980-12-05 1982-06-14 Hitachi Ltd Probing method for large-scale integrated lead pin in mounting substrate
JPS5899760A (en) * 1981-12-09 1983-06-14 Toshiba Corp Probe device
JPS59148345A (en) * 1983-02-15 1984-08-25 Matsushita Electric Ind Co Ltd Lsi chip measuring prober
JPS59214235A (en) * 1983-05-20 1984-12-04 Ibiden Co Ltd Method and apparatus for inspecting semiconductor wafer
JPS61259176A (en) * 1985-05-14 1986-11-17 Yokogawa Electric Corp Probe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795643A (en) * 1980-12-05 1982-06-14 Hitachi Ltd Probing method for large-scale integrated lead pin in mounting substrate
JPS5899760A (en) * 1981-12-09 1983-06-14 Toshiba Corp Probe device
JPS59148345A (en) * 1983-02-15 1984-08-25 Matsushita Electric Ind Co Ltd Lsi chip measuring prober
JPS59214235A (en) * 1983-05-20 1984-12-04 Ibiden Co Ltd Method and apparatus for inspecting semiconductor wafer
JPS61259176A (en) * 1985-05-14 1986-11-17 Yokogawa Electric Corp Probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015108051A1 (en) * 2014-01-17 2017-03-23 株式会社村田製作所 Multilayer wiring board and inspection apparatus including the same
JP2020085534A (en) * 2018-11-19 2020-06-04 株式会社アドバンテスト Tester and test method

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