JPS6477943A - Substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component

Info

Publication number
JPS6477943A
JPS6477943A JP23572987A JP23572987A JPS6477943A JP S6477943 A JPS6477943 A JP S6477943A JP 23572987 A JP23572987 A JP 23572987A JP 23572987 A JP23572987 A JP 23572987A JP S6477943 A JPS6477943 A JP S6477943A
Authority
JP
Japan
Prior art keywords
pair
sides
electronic component
mutually
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23572987A
Other languages
Japanese (ja)
Other versions
JP2534515B2 (en
Inventor
Nobumasa Goto
Teruo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP23572987A priority Critical patent/JP2534515B2/en
Publication of JPS6477943A publication Critical patent/JPS6477943A/en
Application granted granted Critical
Publication of JP2534515B2 publication Critical patent/JP2534515B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Abstract

PURPOSE:To conduct mechanical recognition sufficiently positively by forming a triangular alignment pattern, two pairs of corresponding both sides of which are mutually parallel while the directions of movement of the positions of these sides by etching, plating, etc., are respectively opposite. CONSTITUTION:A substrate 10 for loading an electronic component has an electronic component loading section 12 shaped onto an insulating substrate 11 and a plurality of conductor patterns 13. A pair of alignment patterns 20 are formed between a pair of the conductor patterns 13 so as to be mutually opposed. At least two pairs of corresponding both sides 21 mutually run parallel in a pair of mutually opposite triangular alignment patterns 20, and the directions of movement of the positions of corresponding both sides 21 by etching, plating, etc., are opposed. Two pairs or more of a pair of these triangular alignment patterns 20 are shaped.
JP23572987A 1987-09-18 1987-09-18 Electronic component mounting board Expired - Lifetime JP2534515B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23572987A JP2534515B2 (en) 1987-09-18 1987-09-18 Electronic component mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23572987A JP2534515B2 (en) 1987-09-18 1987-09-18 Electronic component mounting board

Publications (2)

Publication Number Publication Date
JPS6477943A true JPS6477943A (en) 1989-03-23
JP2534515B2 JP2534515B2 (en) 1996-09-18

Family

ID=16990366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23572987A Expired - Lifetime JP2534515B2 (en) 1987-09-18 1987-09-18 Electronic component mounting board

Country Status (1)

Country Link
JP (1) JP2534515B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007128990A (en) * 2005-11-02 2007-05-24 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007128990A (en) * 2005-11-02 2007-05-24 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacturing method

Also Published As

Publication number Publication date
JP2534515B2 (en) 1996-09-18

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