JPH022957A - Probe apparatus for testing printed wiring - Google Patents

Abstract

PURPOSE:To make it possible to provide conduction to all test points of a wiring pattern to which a metal plate corresponds by providing a relay plate on which the metal plate is arranged and a contact plate through which the metal plate and the wiring pattern are conducted. CONSTITUTION:A probe pin 1a is uprightly provided in a prober so as to correspond to the reference grid point of a wiring pattern 2a. A penetrating pin 9a is penetrated through a relay plate 9 that is in contact with the pin 1a. A metal plate 9b is arranged at the lower surface of the plate 9. A contact plate 10 is brought into contact with the relay plate 9 so that the plate 10 can be freely attached or removed. The pin 1a is brought into contact with the corresponding pin 9a by the compression of the prober and conducted to the metal plate 9b. The metal plate 9b is in contact with anisotropic conducting rubber 10c of the contact plate 10 and conducted to a metal ball 10b by the conductivity in the vertical direction. The metal plate 9b is further conducted to rubber 10c at the lower side. Then, the rubber 10c is brought into contact with the test point of the wiring pattern 2a, and the ball 10b and the pattern 2a are conducted. When the contact plate 10 is manufactured in conformity with the irregular pattern 2a and attached in place of the relay 9 in this way, an arbitrary wiring pattern can be handled.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a probe device for printed wiring testing.
Specifically, the present invention relates to a probe device that is applied to a printed circuit board having a mixture of irregularly arranged wiring patterns and performs a continuity test on the wiring patterns.

[Prior art] Printed circuit boards used in electronic computers are large and are equipped with many high-performance IC packages, and defects such as disconnections, sheeting, or insulating paper F are absolutely unacceptable in the printed wiring. Not done. On the other hand, when the printed wiring is completed and no components are mounted, continuity and insulation tests are performed. Figures 3 (a), (b) and (C) show a conventional blow μ used for continuity and insulation testing of printed wiring. Each probe pin is biased downward by a spring 1b. On the other hand, the printed circuit board 2 under test is placed on the base 4 with an insulating plate 3 interposed therebetween, and when the blow μ is pressed down in the direction of arrow A, the probe pins come into elastic contact with the wiring pattern 2a. The probe pins are tested by a test device 6 connected by a cable 5.

As shown in Figure (b), the wiring pattern is formed around reference grid lines Gx and Gy set at regular intervals, and holes are provided for mounting parts at the positions of reference grid points pg. The pins are M corresponding to all of the reference grid points.
It has been J. As a result, the probe pin comes into contact with the normal wiring pattern P shown in Figure (C) using the reference lattice point pg as a test point. However, due to the shape or connection pins of the mounted components, the above reference grid line G
There are probes that are attached on grid lines Hx and Hy that are separate from x and Gy, and the probe pins do not come into contact with the test points ph of the wiring pattern P for these. For large boards used in electronic computers, ~500m
It has a rectangular shape of m, the grid spacing is 2.54 mm, and the total number of probe pins is 30,000. On the other hand, although the so-called irregular wiring patterns mentioned above are small in number, they are arbitrarily designed for each board, and blow μs with probe pins corresponding to various irregular test points are prepared one by one. It is extremely impossible to do so. Therefore, it is necessary to contact irregular test points by some means. As such a means, the inventor of the present invention has filed a patent application No. 60-284207, Grating Converter.

FIGS. 4(a) and 4(b) explain the outline of the lattice converter according to the above patent application. In FIG. Two hole plates 7b and 7c are fixed to the guide rod at regular intervals, and through holes are provided in the hole plate 7b at the positions of all reference grid points pg corresponding to the probe pins 1a. On the other hand, the hole plate 7c has through holes at the positions of the reference grid point pg and the irregular test point ph that are mixed in the printed wiring pattern under test, as shown in Figure (b). When the relay pin 8 is penetrated and its upper end is pressed with a probe pin, the lower end of the relay pin comes into contact with all the test points.

[Problem to be solved] In the probe pin lattice converter using relay pins described above, the hole plate 7c that matches the different wiring patterns is replaced and used, but the relay pins have a certain length. The transducer, and therefore the probe pin, become large due to the large size required.

Further, as mentioned above, since the number of probe pins for a large board is as large as 30,000, the cost of machining and assembling the hole plate and relay pins is high and it is not efficient.

This invention was made in view of the situation in the north, and replaces parts that correspond to wiring patterns that are mixed regularly and irregularly, contacts the wiring pattern and conducts it, and performs the conventional wiring test. It is an object of the present invention to provide a printed wiring test probe device that can be connected to a probe pin of a blow μ or directly to a cable line of a test device.

[Means for Solving the Problems] The present invention is a probe device for printed wiring testing, which includes a probe device having a fixed lattice spacing corresponding to a printed wiring pattern to be tested and is insulated from each other by a gap. A metal plate is arranged in which the probe pins come into contact with the blow μ, which is made by planting probe pins at all of the reference grid points of the test device, and are connected directly to each core wire of the cable of the printed wiring test equipment. and a contact plate that is freely attached and detached in contact with the lower surface of the relay plate, contacts the wiring pattern by pressing the relay plate, and establishes conduction between the metal plate and the wiring pattern.

The contact plate described in - is an insulating material with a through hole in the metal plate at a position corresponding to the test point of the wiring pattern, and a conductive material such as a conductive ball or short pin inserted into the through hole. A conductor array plate is provided, and an anisotropic conductive rubber plate having conductivity in the vertical direction and insulating property in the direction is closely adhered to both or one side of the plate to hold the conductors.

[In the probe device for printed wiring testing of the present invention having the configuration as follows, the metal plates arranged on the relay plate come into contact with each corresponding probe pin, or each metal plate is in contact with the corresponding probe pin. (It is directly connected to the cable core wire of the printed wiring test equipment.During the continuity test, due to the pressure of the relay plate, the contact plate that is in contact with the relay plate falls down and comes into contact with the wiring pattern, and eventually the metal The plate, that is, the probe pin or the cable core wire, and the wiring pattern are electrically connected.The contact plate is detachable.

In the contact between the relay plate and the contact plate in -1- below, due to the conductivity of the anisotropic rubber in the assembly direction, the metal plates arranged on the relay plate and the corresponding conductor of the contact plate become conductive. It goes through. However, since anisotropic conductive rubber has insulating properties in the opposite direction,
Between the temporary metal phase and the conductor phase! j: There is no conduction between.

Next, when the contact plate descends due to the pressure of the relay plate and contacts the wiring pattern, the conductors are arranged at positions corresponding to the test points of the wiring pattern, so that the center of the conductors and the test points are aligned vertically. Therefore, similarly to the above, the conductor and the wiring pattern are electrically connected due to the vertical conductivity of the anisotropic conductive rubber, but the wiring patterns are not electrically connected to each other. In the following, although the test points of the wiring pattern have some degree of unevenness, the conductive rubber and the test points come into good contact due to the elasticity of the conductive rubber. However, in consideration of the contact state, and if the conductor is stably held on the array plate, the conductive rubber may be provided only on one side (lower side) of the contact plate.

As described above in 1-, each metal plate and the corresponding test point are electrically connected, and insulation between each metal plate and between wiring patterns is maintained. In addition, since the position of the conductor U body can be freely placed within the range of the metal plate, it is necessary to manufacture a contact plate of the conductor arrangement plate that corresponds to the irregular wiring pattern and replace it with the relay plate. Therefore, it is possible to correspond to any wiring pattern. The action of the anisotropic conductive rubber is basically necessary to hold the conductor on the array plate and to make good contact with the uneven test points. Anisotropic conductive rubber is recognized for its conductivity in the stacking direction and its insulating effect in the planar direction, and is suitable for this purpose.

[Example 1] Figures 1 (a), (b), (c) and (d) are structural diagrams of one embodiment of a probe device for printed wiring testing according to the present invention, and Figure (a) is a vertical cross section; (b), (c)
Ha-? Surface (d) shows a partially vertical section. figure(
In a), probe pins 1a are implanted in the prober 1 corresponding to all the reference grid points of the wiring pattern, and the relay plate 9 is fixed by a suitable fixture in contact with the probe pins 1a. Penetration pins 9a pass through the relay plate at the positions of the reference grid points corresponding to the respective probe pins, and the T ends of the through pins abut on the respective probe pins.

On the bottom of the relay plate is a square metal plate 9b as shown in Figure (b).
are arranged with narrow gaps along the reference grid lines Gx, Gy, and are connected to the through pins, respectively. In the figure, the relative position of the metal plate to the through pin is 1.
Although it is said to be near the corner, it does not necessarily have to be in this position. Next, the contact plate 10 is brought into contact with the relay plate in a detachable manner.

The contact plate is made of a conductor array plate 10a and a four-sided conductive rubber IOc.
It becomes more. A metal ball lOb is used as a conductor on the conductor array plate, and the base of the printed wiring pattern 2a to be tested is placed at a position corresponding to the grid point 1) gl and the irregular test point ph as shown in Figure (C). A through-hole is provided with a diameter equal to the diameter of the metal ball tab, and the metal ball is inserted into the through-hole. Further, anisotropic conductive rubber IOc is applied to both sides of the contact plate, and the ball is held in close contact with the rubber. Figure (d) is a partial cross-sectional view illustrating the conduction between the probe pin and the wiring pattern with respect to figure (a). The probe pin 1a abuts the corresponding through pin 9a due to the pressure of the prober 1, and this ↓
As mentioned above, conduction is established up to the connected metal plate 9b. Next, the metal plate contacts the anisotropic conductive rubber IOc on the 1·, side, and due to its conductivity in the I+t'f direction, the metal ball IOb, ! : Continuous, and further conductive to the conductive rubber on the do side that is in contact with the metal ball. Here, the contact mimic 0 drops due to the pressure of the prober, and the lower conductive comb comes into elastic contact with the test point of the mating wiring pattern 2a, so that the metal ball and the wiring pattern are electrically connected. In this case, the unevenness of the test point is absorbed by the elasticity of the conductive rubber,
All Tess.

The conductive rubber makes good contact with the to-point.

In the above, since the conductive rubber has insulating properties in the plane direction due to its anisotropy, the metal plate, metal ball, and wiring pattern that come into contact with it are all insulated from adjacent parts.

A dotted line C in the figure indicates a conduction path.

In the production of the contact plate IO described above, metal balls are fitted into the through holes of the conductor array plate, but even if there are as many as 30,000 balls, the fitting work is extremely easy. Note that the anisotropic conductive rubber plate used is a commercially available ordinary one, and the work of adhering it is also easy. Further, in a configuration in which the lower part -L in the figure is replaced, etc., adhesion is not necessarily required. This is selected according to the wiring pattern and brought into close contact with the contact plate. In the above embodiments, the shape of the metal plate is square, but it does not necessarily have to be square.
If it is necessary to provide a test point on the square gap, it is possible to use a metal plate with a corresponding shape. Further, instead of the metal ball, it is also possible to use a short metal pin, or a conductive body such as a ball or short pin made of a material other than metal that has conductivity.

FIG. 2 shows a partial cross section of another embodiment of the probe device for printed wiring testing according to the present invention. In the figure, the core wires 5-1, 5-2 of the cable 5 from the printed wiring test equipment are inserted into the through pins 9a of the relay board 9.
・is connected. However, this connection may be made by removing the probe pin 1a from the prober 1 shown in FIG. 1(a). In addition, when making a 1σ connection to the cable core wire, the relay plate is directly pressed using a conventional pressing mechanism.

Next, in FIG. 2, a conductive short pin l0b- is used as the conductor. In the case of similar bottles, the ease of assembly is slightly impaired, but the contact area with the conductive rubber is increased and the contact resistance is rather reduced, so this does not reduce the effect on continuity tests.

[Effects of the Invention] As is clear from the description below, in the printed wiring test probe device according to the present invention, irregularly arranged test points are mixed within the range of a square or deformed metal plate. A metal plate is electrically connected to all test points of a corresponding wiring pattern by intervening conductors arranged at corresponding positions with respect to a given wiring pattern.

The anisotropic conductive rubber that holds the conductor insulates adjacent metal plates, conductors, and wiring patterns due to its conduction direction characteristics and does not interfere with the operation. Furthermore, although this device can be used by bringing the metal plate into contact with conventional probe pins, it can also be used by directly connecting it to the cable core of a printed wiring test device. In the latter case, the large number of probe pins in the conventional prober is unnecessary and has a great advantage, and the probe device of the present invention can be said to be a new type of prober. In manufacturing the contact plate, it is easy to arrange the conductors, and the attachment/detachment of the contact plate can be done much more easily and quickly than the conventional relay pin assembly process. The thickness of the probe device can be made shorter than that of the conventional relay pin method described above, and the entire mechanism can be made more compact.This has many advantages, such as making a large contribution to the printed wiring testing device.

4. Explanation of drawings Fig. 1 (aL) (b), (c) and (d) are structural diagrams of one embodiment of the probe device for printed wiring testing according to the present invention; Vertical sectional view, Figures (b) and (C) are partial plan views, Figure (c) is a partial vertical sectional view of Figure (a), and Figure 2 is another implementation of the printed wiring test probe device according to the invention. Partial vertical sectional view of the example, Fig. 3 (a), (b)
) and (C) are explanatory diagrams of the structure of the printed wiring test prober and the reference grid points and irregular test points of the printed wiring pattern under test. FIG. 3 is an explanatory diagram of the structure and operation of a lattice converter.

■...Blow μ, ■b...Spring, 2a... Wiring pattern, 4...Base, 6...Test device, 7b, 7c... hole plate, 9... Relay board, 9b...metal plate, 10a... conductor array plate, Summer ob’・・・conductive short pin, la...probe pin, 2...Printed circuit board, 3...Insulating board, 5... Cable, 7a... Guide dedicated, 8...Relay pin, 9a... through pin, 10... contact plate, Seal Ob...metal ball, 10c...Anisotropic conductive rubber.

Claims (2)

[Claims] (1) For a prober that has a fixed grid spacing corresponding to the printed wiring pattern under test, is insulated from each other by gaps, and has probe pins implanted at all reference grid points of the grid spacing, A relay plate with an array of metal plates that the probe pin contacts and conducts, or is directly connected to each core wire of the cable of the printed wiring test equipment; 1. A probe device for printed wiring testing, comprising a contact plate that contacts the wiring pattern by pressing the plate and establishes electrical continuity between the metal plate and the wiring pattern. (2) Within the range of the metal plate, there is a through hole at a position corresponding to the test point of the wiring pattern, and a conductive material such as a conductive ball or short pin is inserted into the through hole. A conductor array plate is provided, and an anisotropic conductive rubber plate that holds the conductor and has conductivity in the vertical direction and insulation in the planar direction is closely attached to both or one side of the conductor array plate. 2. The probe device for printed wiring testing according to claim 1, wherein the contact plate is made of: