JPS62294980A - Adaptor for altering pitch of contact array - Google Patents
Adaptor for altering pitch of contact arrayInfo
- Publication number
- JPS62294980A JPS62294980A JP61138481A JP13848186A JPS62294980A JP S62294980 A JPS62294980 A JP S62294980A JP 61138481 A JP61138481 A JP 61138481A JP 13848186 A JP13848186 A JP 13848186A JP S62294980 A JPS62294980 A JP S62294980A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- pitch
- adapter
- changing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 10
- 230000004075 alteration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000397426 Centroberyx lineatus Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
Ｃ産業上の利用分野］
この発明はプリント基板検査装置に用いられる接点配列
のピッチを変更するためのアダプタに関するものである
。Detailed Description of the Invention 3. Detailed Description of the Invention C Field of Industrial Application] This invention relates to an adapter for changing the pitch of a contact arrangement used in a printed circuit board inspection device.
［従来の技術］
プリント基板検査装置は、プリント基板上の任意の２点
間の相互の接続関係を検査するものである。被検査対象
であるプリント基板のターミナル位置に合わせて、検査
用接点を格子状（例えば２゜５４ｍｍピッチ）に配列し
ていた。[Prior Art] A printed circuit board inspection device inspects the interconnection relationship between any two points on a printed circuit board. Inspection contacts were arranged in a grid pattern (for example, at a pitch of 2° and 54 mm) in accordance with the terminal positions of the printed circuit board to be inspected.
しかし、全てのプリン！・基板が一定の規格に統一され
ているわけではなく、個々のプリント基板により多種多
様のターミナル間隔を有している。But all the pudding!・Boards are not standardized to a certain standard, and each printed circuit board has a wide variety of terminal spacings.
したがって、プリント基板ごとに検査用接点を用意しな
ければならなかった。検査用接点としては、通常プロー
ブ等が用いられ、その数は数万本にも及ぶことが多い、
したがって、個々のプリント基板ごとに、検査用接点を
用意し、配列を行うことは極めて煩雑であった。Therefore, it was necessary to prepare inspection contacts for each printed circuit board. Probes, etc. are usually used as inspection contacts, and the number of such contacts often reaches tens of thousands.
Therefore, it is extremely complicated to prepare and arrange test contacts for each printed circuit board.
この問題を解決するため、＠６図に示すような装置が既
に考えられている（特開昭６０−４９２７０号）。In order to solve this problem, a device as shown in Figure @6 has already been considered (Japanese Patent Application Laid-open No. 49270/1983).
格子状に配列されたプローブピン１２に、アダプタピン
５２の根元が接触させられている。アダプタピン５２の
根元は、メツシュボード１５の格子状の穴５０に挿入さ
れている。アダプタピン５２の先端付近は、専用ボード
５６の貫通穴５４に挿入され保持されている０貫通穴５
４は、被検査基板のターミナル位置に合わせて設けられ
ている。したがって、アダプタピン５２の接点５日は、
被検査基板のターミナル位置に合致させられる。The base of the adapter pin 52 is brought into contact with the probe pins 12 arranged in a grid pattern. The base of the adapter pin 52 is inserted into a grid-shaped hole 50 of the mesh board 15. The vicinity of the tip of the adapter pin 52 is inserted into the through hole 54 of the dedicated board 56 and held there.
4 is provided in accordance with the terminal position of the board to be inspected. Therefore, the contact point 5 of the adapter pin 52 is
It is matched with the terminal position of the board to be inspected.
［発明が解決しようとする問題点］
しかしながら、従来の装置では次のような問題点があっ
た。[Problems to be Solved by the Invention] However, the conventional device has the following problems.
第一に、構造が複雑となり組立てが困難であった。First, the structure was complicated and assembly was difficult.
第二に、接点５日を動かし得る範囲が限定されており、
被検査基板のターミナル位置の配置によっては、 対応
できない場合があった。Second, the range in which the contact point can be moved is limited,
This may not be possible depending on the arrangement of the terminals on the board being tested.
この発明は上記のような問題点を解決して、検査用接点
位置を簡易かつ自由に変更できるアダプタを提供するこ
とを目的とする。An object of the present invention is to solve the above-mentioned problems and provide an adapter that allows the position of the test contact to be easily and freely changed.
［問題点を解決するための手段コ
この発明にかかる接点配列のピッチ変更用アダプタは変
換基板を備えており、その第１の而には格子状に配され
た第１の接点ｆｆ−１’が設けられ、第２の面には被検
査基板の測定点に対応する位置に第２の接点君￥が設け
られている。対応する第１と第２の接点群は、第１と第
２の中間接続体により電気的に接続されている。[Means for Solving the Problems] The contact array pitch changing adapter according to the present invention is equipped with a conversion board, the first of which includes first contacts ff-1' arranged in a grid pattern. A second contact point is provided on the second surface at a position corresponding to the measurement point of the board to be inspected. Corresponding first and second contact groups are electrically connected by first and second intermediate connectors.
［作用］
変換基板は、中継用端子の格子状配列を被検査基板の測
定点に対応する位置に変換する作用を持つ。[Function] The conversion board has the function of converting the grid-like arrangement of relay terminals to positions corresponding to measurement points on the board to be inspected.
［実施例コ
この発明の一実施例を第１図に示す、被検査基板１０の
上に、垂直異方導電性を有する感圧導電性ゴム８、変換
基板６、感圧導電性ゴム４．中継用端子１２が格子状に
配された治具２が重ねられる。[Embodiment] An embodiment of the present invention is shown in FIG. 1. On a substrate to be inspected 10, a pressure-sensitive conductive rubber 8 having vertical anisotropic conductivity, a conversion substrate 6, a pressure-sensitive conductive rubber 4. The jigs 2 in which the relay terminals 12 are arranged in a grid pattern are stacked on top of each other.
変換基板６の材質は例えば、フェノール、ガラスエポキ
シ、ポリイミド（フィルム状の物を含む）等が適当であ
る。Suitable materials for the conversion substrate 6 include, for example, phenol, glass epoxy, polyimide (including film-like materials), and the like.
第２図に変換基板６の詳細を示す、この変換基板６の第
１図の面６ａには、格子状に配された第１の接点群１６
が設けらている。第２の面である裏面には第２の接点群
１日が設けられているが、図示されていない、第１の面
、第２の面をそれそ゛れ表したのが第３図（Ａ）と第３
図（Ｂ）である、第２の面には、被検査基板１０の測定
点２０に対応する位置に第３の接点群１８が設けられて
いる。The details of the conversion board 6 are shown in FIG. 2. On the surface 6a of the conversion board 6 shown in FIG.
is provided. A second contact group is provided on the back surface, which is the second surface, but Figure 3 (A) shows the first and second surfaces, which are not shown. Third
On the second surface shown in Figure (B), a third contact group 18 is provided at a position corresponding to the measurement point 20 of the substrate 10 to be inspected.
変換基板６の断面は第１図に示されるようになっており
、第１の接点群１６と第２の接点群］８は電気的に接続
されている。被検査基板１０の測定点２０は、感圧導電
性ゴム８を介して、変換基板Ｇの第２の接点群に接続さ
れる。第２の接点群は、第１の接点群１６、感圧導電性
ゴム４を介して中継用端子２に接続される。各中継用端
子２は接続線１４を通じて、検査回路（図示せず）につ
ながっている。The cross section of the conversion board 6 is shown in FIG. 1, and the first contact group 16 and the second contact group]8 are electrically connected. The measurement point 20 of the substrate to be inspected 10 is connected to the second contact group of the conversion board G via the pressure-sensitive conductive rubber 8. The second contact group is connected to the relay terminal 2 via the first contact group 16 and the pressure-sensitive conductive rubber 4 . Each relay terminal 2 is connected to a test circuit (not shown) through a connection line 14.
ＣＰＵを有する検査回路は、接続線１４を介して各測定
点２０に信号を与え、また各測定点２０からの信号を受
は取り、被検査基板ｌＯの良否を判断する。The inspection circuit including the CPU gives signals to each measurement point 20 via the connection line 14, receives and receives signals from each measurement point 20, and determines the quality of the substrate to be inspected IO.
第４図に、変換基ｕ６の詳細を示す、変換基板６のベー
スはｉｆ！！１１体からなっており、格子状に貫通穴６
Ｃが設けられている。この貫通穴６Ｃは、完全な格子状
となるようにあけてもよいが、必要な部分のみにあける
だけでもよい、また、完全な格子状に貫通穴６ｃをあけ
ておいて、後で不要な貫通穴６ｃをエポキシ樹脂などで
埋めるようにしてもよい０貫通穴６Ｃには、導電性ペー
ストが第２の面６拘の側から注入され第１の中間導電体
となっており、突出した先端は第１の接点１６となって
いる。第２の面６ｂにおいて、貫通穴６Ｃ内の導電ペー
ストにつながるように導電ペーストが付着され、その端
部は第２の接点１８として盛り上げられている。導電ペ
ーストを塗布したのち、熱硬化を行っている。塗布方法
としては、ディスペンサーによる桟面、噴射による付着
、スクリーン印刷などが好ましい。導電ペーストとして
は、銀、銅、カーボンなどの導電物を含んだ物を用いる
ことが出来る０例えば、大阪アサヒ化学（株）ＷＪｔの
ＬＳ−５００、ＡＣＰ−０２０Ｊなどを用いるとよい。FIG. 4 shows details of the conversion group u6, and the base of the conversion board 6 is if! ! Consists of 11 pieces, with 6 through holes arranged in a grid pattern.
C is provided. The through holes 6C may be drilled in a perfect grid pattern, but they may also be drilled only in the necessary areas.Also, the through holes 6C may be drilled in a perfect grid pattern and unnecessary holes may be drilled later. The through hole 6c may be filled with epoxy resin or the like.A conductive paste is injected into the through hole 6C from the side of the second surface 6 to form the first intermediate conductor, and the protruding tip is the first contact point 16. On the second surface 6b, a conductive paste is attached so as to be connected to the conductive paste in the through hole 6C, and the end thereof is raised as a second contact 18. After applying the conductive paste, it is thermally cured. Preferred coating methods include surface application using a dispenser, adhesion by spraying, and screen printing. As the conductive paste, a material containing a conductive material such as silver, copper, or carbon can be used. For example, LS-500, ACP-020J, etc. manufactured by WJt, Osaka Asahi Chemical Co., Ltd. may be used.
この実施例では、第２の接点１日以外の部分は、エポキ
シ樹脂詣３０などの絶縁性材［［により、オーバーコー
トされている。なお、オーバーコートを行う必要がない
場合には、第２の接点１日の部分を盛り上げなくてもよ
い。In this embodiment, the portions other than the second contact point 1 are overcoated with an insulating material such as epoxy resin 30. Note that if there is no need to overcoat, it is not necessary to raise the second contact point on the first day.
上記の実施例では、第１の導電体として導電ペーストを
用いたが、次のようにして形成してもよい。In the above embodiment, a conductive paste is used as the first conductor, but it may be formed as follows.
貫通穴６ｃを通常のプリント基板のようにメッキする。The through hole 6c is plated like a normal printed circuit board.
この場合に、貫通穴６ｃの周囲の第１面（もしくは第２
面）にもメッキ面を設けておけば、これを第１の接点（
第２の接点）として用いることが出来る。In this case, the first surface (or second surface) around the through hole 6c
If you provide a plated surface on the first contact (
It can be used as a second contact point).
他の方法として１貫通穴６ｃに導電性のピンを打ち込ん
で、第１の導電体を形成してもよい、この場合には、ピ
ンの頭を第１の接点（第２の接点）として用いることが
出来る。As another method, a conductive pin may be driven into the first through hole 6c to form the first conductor. In this case, the head of the pin is used as the first contact (second contact). I can do it.
次に、第２の導電体の形成方法について述べる。Next, a method for forming the second conductor will be described.
上記の実施例では、導電ペーストを用いているが、次の
ようにしてもよい。In the above embodiment, a conductive paste is used, but the following method may be used.
先ず、エツチング法がある。即ち、銅張積層板を材料と
して、エツチングにより第２の導電体を形成するもので
ある。First, there is the etching method. That is, the second conductor is formed by etching using a copper-clad laminate as a material.
また、絶縁板を材ｔ１として、無電解銅メッキ等の化学
処理によって第２の導電体を形成してもよい。Alternatively, the second conductor may be formed using the insulating plate as the material t1 by chemical treatment such as electroless copper plating.
銅張積層板の銅箔を工作機誠やンーザ加工機などにより
除去して、第２の導電体を形成する方法もある。There is also a method of removing the copper foil of the copper-clad laminate using a Makoto machine tool, a Nza processing machine, or the like to form the second conductor.
以上説明した各実施例では、第２の面に第２の導電体を
形成する場合について説明したが、第１の面に第２の導
電体を形成してもよい。Ｊだ、第１第２の面の双方に第
２の導電体を形成することも出来る。In each of the embodiments described above, a case has been described in which the second conductor is formed on the second surface, but the second conductor may be formed on the first surface. J, it is also possible to form a second conductor on both the first and second surfaces.
第１の面に第２の導電体を設けた場合の一実施例を第５
図（Ａ）、（Ｂ）に示す。第１の面６ａには、正方形の
銅箔２６が形成され第２の導電体及び接点となっている
。貫通穴６Ｃには導電ペースト／ｌｆ注入され、突出し
た先端は第２の接点１日となっている。この実施例によ
れば、銅箔２６の範囲内であれば、第２の接点１日を形
成するのに導電ペーストを引き回す必要がなく、 容易
に作ることが出来る。An example in which a second conductor is provided on the first surface is shown in the fifth example.
Shown in Figures (A) and (B). A square copper foil 26 is formed on the first surface 6a and serves as a second conductor and contact. A conductive paste/lf is injected into the through hole 6C, and the protruding tip serves as a second contact point. According to this embodiment, as long as it is within the range of the copper foil 26, there is no need to route conductive paste to form the second contact, and it can be easily made.
、［発明の効果］
この発明に係る接点配列のピッチ変更用アダプタによれ
ば、検査装置の格子状に配列された中継用端子を、変換
基板によって、測定点に対応するよう変換している。し
たがって、被検査基板が変わった場合でも、変換基板を
かえるだけで検査を行うことが出来る。すなわち、この
発明によれば、検査用の接点位置を簡易に変更すること
力ｆ出来る。[Effects of the Invention] According to the adapter for changing the pitch of a contact array according to the present invention, the relay terminals arranged in a grid of the inspection device are converted by the conversion board so as to correspond to the measurement points. Therefore, even if the board to be tested is changed, the test can be performed simply by changing the conversion board. That is, according to the present invention, it is possible to easily change the contact position for inspection.
第１図はこの発明の一実施例を示す図、第２１”１は′
Ｉｒ：Ｉｒ：全基板斜視図、第３図（Ａ）は変換基板の
第１の面を示す図、第３図（Ｂ）は変換基板の第２の面
を示す図、第４図は変換基板の詳細を示す断面図、第５
図（Ａ）は他の実施例による変換基板を示す平面図、第
５図（Ｂ）は第５図（Ａ）の断面を示す図、第６図は従
来の接点配列のピッチ変更用アダプタを示す図である。
６ ・・・ 変換基板
６ａ・・・ 第１の面
６ｂ・・・ 第２の而
８ ・・・ 感圧導電性ゴム
１０ ・・・ 被検査基板
１６ ・・・ 第１の接点
１８ ・・・ 第２の接点
２０ ・・・ 測定点
なお、各図中同一符号は同一または相当部分を示す。
代理人 弁理士 束 島 隆 治
第 １ 図
８ ： 、イミ（トニ１已１シｉ＠−コ゛ム ２
０； ラ３＾２・１ 声乙、市、第２図
第３図（Ａ） 第３図（Ｂ）
第４図
第５図（Ａ）
第５図（Ｂ）
図面の浄書（内容に変更なし）
第６図
手 続 補 正 書 （方式）
％式％
１、事件の表示
昭和６１年特許願第１３８４８１号
２、発明の名称
接点配列のピッチ変更用アゲブタ
３、補正をする者 特許出願人
住所 京都府宇治市＋頁島町目川８７番地名称 株
式会社 金子電器製作所
、代理人
住所 〒５３０大阪市北区横用三丁目２番１４号５、補
正命令の日付（発送日）
昭和６１年８月２６日
６、補正の対象
図面 ゝ７、補正の
内容
ｗＪ書に最初に添付した図面第６図の浄書・別紙のとお
り （内容に変更なし）FIG. 1 is a diagram showing an embodiment of the present invention, and No. 21"1 is '
Ir: Ir: Perspective view of the entire board, FIG. 3(A) is a diagram showing the first surface of the conversion board, FIG. 3(B) is a diagram showing the second surface of the conversion board, and FIG. 4 is a diagram showing the conversion board. Cross-sectional view showing details of the substrate, No. 5
Figure (A) is a plan view showing a conversion board according to another embodiment, Figure 5 (B) is a cross-sectional view of Figure 5 (A), and Figure 6 shows a pitch change adapter with a conventional contact arrangement. FIG. 6... Conversion board 6a... First surface 6b... Second surface 8... Pressure-sensitive conductive rubber 10... Substrate to be inspected 16... First contact 18... Second contact point 20...Measurement point Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Takaharu Tsukashima No. 1 Figure 8: , Imi (Toni 1 1 Shii@-Com 2)
0; La 3^2.1 Koetsu, City, Figure 2 Figure 3 (A) Figure 3 (B) Figure 4 Figure 5 (A) Figure 5 (B) Engraving of the drawing (changed in content) None) Figure 6 Procedure Amendment (Method) % Formula % 1. Indication of the case Patent Application No. 138481 of 1988 2. Name of the invention Swallowtail for changing the pitch of contact array 3. Person making the amendment Patent applicant Address: 87 Megawa, Uji City, Kyoto Prefecture Name: Kaneko Denki Seisakusho Co., Ltd., Agent address: 3-2-14-5 Yokoyo, Kita-ku, Osaka 530 Date of amendment order (shipment date): August 1988 June 26th, 6, Drawing subject to amendment 7. Contents of amendment As shown in the engraving and attached sheet of drawing No. 6 originally attached to wJ document (no change in content)
Claims (8)
子状に配された第１の接点群、第２の面に被検査基板の
測定点に対応する位置に配された第２の接点群、第１も
しくは第２の接点群に接続され第１第２の面にほぼ垂直
に設けられた第１の中間接続体、第１の中間接続体と第
２もしくは第１の接点群に接続された第２の中間接続体
を有する変換基板、 変換基板の第２の面と被検査基板との間に設けられ垂直
異方導電性を有する感圧導電性弾力部材、を備えたこと
を特徴とする接点配列のピッチ変更用アダプタ。(1) An insulating substrate having a first and second surface, a first group of contacts arranged in a grid on the first surface, and a group of contacts arranged on the second surface at positions corresponding to measurement points on the substrate to be inspected. a second contact group, a first intermediate connector connected to the first or second contact group and provided substantially perpendicular to the first and second surface, a first intermediate connector and a second or first a conversion board having a second intermediate connection body connected to the contact group; a pressure-sensitive conductive elastic member provided between the second surface of the conversion board and the substrate to be inspected and having vertical anisotropic conductivity; An adapter for changing the pitch of the contact arrangement.
れた導電物であることを特徴とする特許請求の範囲第１
項記載の接点配列のピッチ変更用アダプタ。(2) Claim 1, characterized in that the first intermediate connector is a conductive material plated in the through hole of the conversion board.
Adapter for changing the pitch of the contact arrangement as described in section.
た導電ペーストであることを特徴とする特許請求の範囲
第１項記載の接点配列のピッチ変更用アダプタ。(3) The adapter for changing the pitch of the contact array according to claim 1, wherein the first intermediate connector is a conductive paste injected into the through hole of the conversion board.
とを特徴とする特許請求の範囲第１項記載の接点配列の
ピッチ変更用アダプタ。(4) The adapter for changing the pitch of a contact arrangement according to claim 1, wherein the first contact group is a copper foil formed in a square shape.
体は変換基板に打ち込まれた導電ピンであることを特徴
とする特許請求の範囲第１項記載の接点配列のピッチ変
更用アダプタ。(5) For changing the pitch of the contact arrangement according to claim 1, wherein the first contact or the second contact and the first intermediate connection body are conductive pins driven into the conversion board. adapter.
徴とする特許請求の範囲第２項ないし第５項の何れか１
つに記載の接点配列のピッチ変更用アダプタ。(6) Any one of claims 2 to 5, wherein the second intermediate connector is a conductive paste.
Adapter for changing the pitch of the contact arrangement described in .
特徴とする特許請求の範囲第２項ないし第５項の何れか
１つに記載の接点配列のピッチ変更用アダプタ。(7) The adapter for changing the pitch of a contact arrangement according to any one of claims 2 to 5, wherein the second intermediate connector is electroless copper plated.
されたものであることを特徴とする特許請求の範囲第２
項ないし第５項の何れか１つに記載の接点配列のピッチ
変更用アダプタ。(8) Claim 2, characterized in that the second intermediate connector is formed into a pattern by machining.
An adapter for changing the pitch of the contact arrangement according to any one of items 5 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138481A JPS62294980A (en) | 1986-06-13 | 1986-06-13 | Adaptor for altering pitch of contact array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61138481A JPS62294980A (en) | 1986-06-13 | 1986-06-13 | Adaptor for altering pitch of contact array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62294980A true JPS62294980A (en) | 1987-12-22 |
Family
ID=15223083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61138481A Pending JPS62294980A (en) | 1986-06-13 | 1986-06-13 | Adaptor for altering pitch of contact array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62294980A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243796A (en) * | 1988-08-04 | 1990-02-14 | Toppan Printing Co Ltd | Pattern formation |
| JPH08240635A (en) * | 1995-03-03 | 1996-09-17 | Nec Corp | Inspecting equipment of printed wiring board |
| JP2007071699A (en) * | 2005-09-07 | 2007-03-22 | Rika Denshi Co Ltd | Perpendicular type probe card |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654096A (en) * | 1979-10-05 | 1981-05-13 | Nippon Electric Co | Device for inspecting printed board |
| JPS6071970A (en) * | 1983-09-29 | 1985-04-23 | Japan Synthetic Rubber Co Ltd | Method and device for inspection of printed circuit board |
-
1986
- 1986-06-13 JP JP61138481A patent/JPS62294980A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654096A (en) * | 1979-10-05 | 1981-05-13 | Nippon Electric Co | Device for inspecting printed board |
| JPS6071970A (en) * | 1983-09-29 | 1985-04-23 | Japan Synthetic Rubber Co Ltd | Method and device for inspection of printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0243796A (en) * | 1988-08-04 | 1990-02-14 | Toppan Printing Co Ltd | Pattern formation |
| JPH08240635A (en) * | 1995-03-03 | 1996-09-17 | Nec Corp | Inspecting equipment of printed wiring board |
| JP2007071699A (en) * | 2005-09-07 | 2007-03-22 | Rika Denshi Co Ltd | Perpendicular type probe card |
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