JP3076424B2 - Circuit board inspection method, inspection board, and circuit board inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection method, an inspection board, and a circuit board inspection apparatus.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 2, a method for inspecting a circuit board involves covering a plurality of contact needles (probes) 201 arranged on a single insulating plate 202 (probe card). The probe 201 is pressed against the inspection circuit board 203 to make the probe 201 come into contact with the land to be measured 204 (patterned conductor, land, etc. on the circuit board to be inspected 203).
A signal is sent or received by a signal generator 206 via one of the lead wires 205 connected to each other to check whether or not the wiring pattern of the circuit board 203 to be inspected is normal. I was

[0003]

However, in the conventional method, the inspection is first performed on the wiring pattern alone, and the circuit board 203 to be inspected determined to be normal by the inspection is inspected.
Is to perform a comprehensive inspection of the entire circuit after mounting ICs, passive components, etc., but due to a failure in the wiring pattern of the circuit board 203 to be inspected which was overlooked in the previous stage, When such a problem occurs, there is a problem in that the mounted components are wasted, and even if the mounted components are removed, it is extremely troublesome.

In recent years, extremely high-density mounting has been carried out in order to reduce the size of equipment.
It is not unusual for lands to be formed, and the pitch between lands is becoming narrower. For this reason, connecting the lead wire 205 to each of the probes 201 for inspection as in the related art complicates the wiring, and
The inconvenience that inspection becomes difficult has occurred. Also,
Long lead wire allows inspection of high-speed signal circuits
There is a problem that there is no.

The present invention provides a circuit board inspection method, an inspection board, and a circuit board inspection apparatus which can reduce waste and trouble after comprehensive inspection of a mounted circuit board in consideration of the conventional problems as described above. The purpose is to do so.

[0006]

According to the present invention, a probe terminal on one side of a test board is brought into contact with a land to be measured on a circuit board to be tested, and a component to be mounted on the circuit board to be tested, or Parts with the same function are mounted on the other surface of the inspection board, and the probe terminals and those parts are connected as if the parts were mounted on the circuit board to be inspected .
A power supply and a test signal are supplied to the test circuit board to be operated.
This is a circuit board inspection method for inspecting a circuit board to be inspected.

[0007]

According to the present invention, a probe terminal on one surface of an inspection board is brought into contact with a land to be measured on the circuit board to be inspected, and a component to be mounted on the circuit board to be inspected, or a function equivalent thereto. mounted components on the other side of the examination on the substrate with, though as to mounting components on a circuit under test on the board than joining them probe terminals and their parts, operate the actual circuit
Can create almost the same environment as
Almost final implementation for electrical operation such as operation and noise
A result equivalent to a part is obtained. Further, even if there is a defect in the circuit board to be inspected, the mounted components can be used as they are only by discarding the circuit board to be inspected, so that waste and trouble can be saved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A circuit board inspection method, an inspection board and a circuit board inspection apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram illustrating the principle of a circuit board inspection method according to one embodiment of the present invention. That is,
In order to inspect a circuit board, a circuit board inspection apparatus is configured as follows. The lands to be measured (outer wiring such as lands) 106 on the circuit board 101 to be inspected are disposed on both sides, and are connected to other lands to be measured (outer wiring such as lands) on the same surface or another surface by the inner wiring 105. I have. An inspection board 102 for inspecting whether or not the wiring state of the circuit board to be inspected is as desired.
Are formed of, for example, a glass epoxy substrate, and are arranged at intervals on both sides of the circuit board 101 to be inspected.
The inspection substrate 102 is illustrated in a simplified manner in FIG. A probe terminal 103 is provided at a position corresponding to the land 106 to be measured on the circuit board 101 to be inspected, on the surface of the circuit board 101 to be inspected. Through wiring 11 in
2 connects to the connection terminal 107 provided on the opposite surface. A component to be mounted on the circuit board 101 to be inspected, for example, an IC 104 or a passive component 111 is connected to the connection terminal 107 so as to correspond to the terminal to be mounted, and an external inspection signal (for inspection) Connection cable 109 for supplying an external signal, a detection signal to be sent outside (information obtained from the circuit board to be inspected), a power supply, and the like.
Is connected. The connection cables 109 are connected to an inspection signal generator 110 that generates an inspection signal, calculates an inspection result from information of the returned inspection signal, and supplies power to the circuit board 101 to be inspected. I have.
Also, the probe terminals 103 of the test board 102 are connected to the test lands 10 of the circuit board 101 to be tested.
In order to make the test substrate 6 come into contact with, a pressing means (not shown) for aligning and moving the inspection substrate 102 is connected.

Next, the operation of the above embodiment will be described.

First, components such as an IC 104 and a passive component 111 to be mounted on the circuit board 101 to be inspected are connected to the connection terminals 107 of the inspection substrate 102 on both sides so as to correspond to the terminals to be mounted. Further, a connection cable 109 is connected to a connection terminal 107 for supplying an inspection signal and a power supply.
Are connected, and the inspection signal generator 110 is connected to the connection cable 109.

The circuit board 1 to be inspected is to be inspected.
01 is held between the two inspection substrates 102 by the holding unit,
Next, the pressure contacting means is operated to move the inspection substrate 102 while adjusting the position thereof, so that the probe terminals 103 and the lands 106 to be measured are brought into pressure contact with each other to bring them into complete contact. After that, the test signal generator 110 supplies power and a test signal in accordance with a preset program to operate the test board 102, thereby obtaining the circuit board 101 to be tested.
Receive information from. And the inspection signal generator 110
Compares the information with a preset value to determine whether the circuit board 101 to be inspected is normal.

In the above embodiment, the inspection substrate 102 is a glass epoxy substrate which is generally used. However, the inspection substrate 102 is not limited to this and may be, for example, a ceramic substrate.
Alternatively, a glass epoxy multilayer substrate or a ceramic multilayer substrate may be used.

In the above embodiment, the components mounted on the test board 102 have the same shape as the components to be mounted on the circuit board 101 to be tested. However, the present invention is not limited to this. By increasing the interval of 107 and connecting the corresponding probe terminal 103 and connection terminal 107 on both sides of the inspection board 102 by through wiring 112, a component having the same function and easy to connect is mounted. Is also good. For example, although a flip chip is used on the circuit board 101 to be inspected, a package having the same function can be mounted on the inspection board 102.

In the above embodiment, the circuit board under test 1
Although the land 106 to be measured and the probe terminal 103 of the inspection board 102 were brought into direct contact with each other, an anisotropically conductive elastic body or film (often used for drawing out the terminals of a liquid crystal display panel) to facilitate the contact. May be attached so as to cover the surface of the probe terminal 103 of the inspection board 102.

In the above embodiment, the test boards 102 are provided on both sides of the circuit board 101 to be tested. However, the present invention is not limited to this.

The probe terminal 103 is not limited to the flat terminal as in the above embodiment, but may be a needle-like one.

Further, the complexity of wiring in the conventional inspection method is eliminated. Therefore, there is also an advantage that a high-density large-scale circuit board can be easily inspected.

[0019]

As is apparent from the above description, the present invention eliminates waste after comprehensive inspection of a mounted circuit board.
It has the advantage of reducing labor.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating the principle of a circuit board inspection method according to one embodiment of the present invention.

FIG. 2 is a schematic diagram illustrating the principle of a conventional circuit board inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Inspection circuit board 102 Inspection board 103 Probe terminal 104 IC 105 Interior wiring 106 Land under test 107 Connection terminal 109 Connection cable 110 Inspection signal generator 111 Passive component 112 Penetration wiring

Claims (9)

(57) [Claims] 1. A probe terminal on one surface of a test board is brought into contact with a land to be measured on a circuit board to be tested.
A component to be mounted on the circuit board to be inspected, or a component having a function equivalent thereto is mounted on another surface of the inspection substrate,
The probe terminals and the components are connected as if the components were mounted on the circuit board to be inspected , and a power supply and
Supplying an inspection signal to the inspection circuit board for operation
Accordingly, the circuit board inspection method for inspecting the circuit board to be inspected. 2. A test board on which a component to be mounted on a circuit board to be inspected or a component having a function equivalent to the component to be mounted is mounted on both sides of the circuit board to be inspected. 2. The circuit board inspection method according to claim 1, wherein the circuit board to be inspected is inspected by making contact with the lands to be measured on both sides of the circuit board to be inspected. 3. A probe terminal is provided on one surface of an inspection board at a position corresponding to a land to be measured on a circuit board to be inspected, and a component to be mounted on the circuit board to be inspected or an equivalent thereof is provided on another surface. An inspection board on which components having functions are mounted, and the probe terminals and the components are coupled as if the components were mounted on a circuit board to be inspected. 4. The test board according to claim 3, wherein the test board is a ceramic multilayer board. 5. The inspection board according to claim 3, wherein the inspection board has an anisotropic conductive elastic body covering the probe terminal surface. 6. A probe terminal corresponding to a land to be measured on a circuit board to be inspected on one surface, and a component to be mounted on the circuit board to be inspected, or a function equivalent thereto, on the other surface. And a test board in which the probe terminals and the components are combined as if the components were mounted on the circuit board to be tested, and a power supply and a test
Test signal generating means for supplying and operating a test signal to check a connection relationship, and press-contact means for bringing the probe terminals on the test board into contact with corresponding terminals of the circuit board to be tested. Circuit board inspection equipment. 7. The circuit board inspection apparatus according to claim 6, wherein the inspection boards are arranged on both sides of the circuit board to be inspected. 8. The circuit board inspection apparatus according to claim 6, wherein the inspection board is a ceramic multilayer board. 9. The inspection board according to claim 6, wherein the inspection board has an anisotropic conductive elastic body covering the probe terminal surface.
Or the circuit board inspection device according to 8.