JPS6425441A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6425441A
JPS6425441A JP62181460A JP18146087A JPS6425441A JP S6425441 A JPS6425441 A JP S6425441A JP 62181460 A JP62181460 A JP 62181460A JP 18146087 A JP18146087 A JP 18146087A JP S6425441 A JPS6425441 A JP S6425441A
Authority
JP
Japan
Prior art keywords
wiring
bump
preliminary
bumps
floating state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62181460A
Other languages
Japanese (ja)
Inventor
Takahiko Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62181460A priority Critical patent/JPS6425441A/en
Priority to EP19880305199 priority patent/EP0295065A3/en
Publication of JPS6425441A publication Critical patent/JPS6425441A/en
Priority to US07/584,180 priority patent/US6753253B1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To accurately measure the potential of an internal circuit by providing a preliminary bump in a floating state on a semiconductor chip. CONSTITUTION:Many bumps 2 provided on a whole semiconductor chip 1 are connected to an internal circuit of an LSI through aluminum wirings. Preliminary bumps 2a provided at the four corners of the chip 1 are in an electrically floating state. Preliminary wirings 3, 4 made of aluminum films are in an electrically floating state. Probe styluses 28 are stood on all the bumps 2, 2a to measure the potentials of improper positions. As a result that the probe inspection of the LSI is performed, assume that the improper positions (x) of the circuit are discovered. The positions (x) are connected to the wiring 3 of shortest distance thereto through connecting wirings 29a. The wiring 3 is connected to the bump 2a through wiring 29b. Thus, the improper position is connected to the bump 2a.
JP62181460A 1986-06-18 1987-07-21 Semiconductor integrated circuit device Pending JPS6425441A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62181460A JPS6425441A (en) 1987-07-21 1987-07-21 Semiconductor integrated circuit device
EP19880305199 EP0295065A3 (en) 1987-06-10 1988-06-08 Semiconductor integrated circuit device, method of making same or cutting method for same, and cutting system using energy beam for same
US07/584,180 US6753253B1 (en) 1986-06-18 1990-09-18 Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62181460A JPS6425441A (en) 1987-07-21 1987-07-21 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6425441A true JPS6425441A (en) 1989-01-27

Family

ID=16101144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62181460A Pending JPS6425441A (en) 1986-06-18 1987-07-21 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6425441A (en)

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