JPS5662318A - Semiconductor device and manufacturing of thereof - Google Patents

Semiconductor device and manufacturing of thereof

Info

Publication number
JPS5662318A
JPS5662318A JP13763679A JP13763679A JPS5662318A JP S5662318 A JPS5662318 A JP S5662318A JP 13763679 A JP13763679 A JP 13763679A JP 13763679 A JP13763679 A JP 13763679A JP S5662318 A JPS5662318 A JP S5662318A
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor device
quality control
working data
electronic beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13763679A
Other languages
Japanese (ja)
Inventor
Toshiaki Keikoin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13763679A priority Critical patent/JPS5662318A/en
Publication of JPS5662318A publication Critical patent/JPS5662318A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

PURPOSE:To facilitate quality control, by forming patterns, such as lot number, etc., on surface of a semiconductor chip by electronic beam. CONSTITUTION:Working data 2, together with element patterns 1, are formed by an electronic beam picturing device on nondisturbing part of a circuit element on every chip. And therefore, since respective working data are left on chips separated by wafer scribing, quality control can be facilitated.
JP13763679A 1979-10-26 1979-10-26 Semiconductor device and manufacturing of thereof Pending JPS5662318A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13763679A JPS5662318A (en) 1979-10-26 1979-10-26 Semiconductor device and manufacturing of thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13763679A JPS5662318A (en) 1979-10-26 1979-10-26 Semiconductor device and manufacturing of thereof

Publications (1)

Publication Number Publication Date
JPS5662318A true JPS5662318A (en) 1981-05-28

Family

ID=15203266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13763679A Pending JPS5662318A (en) 1979-10-26 1979-10-26 Semiconductor device and manufacturing of thereof

Country Status (1)

Country Link
JP (1) JPS5662318A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116732A (en) * 1981-12-29 1983-07-12 Fujitsu Ltd Charge beam exposing method and apparatus therefor
JPS58142522A (en) * 1982-02-19 1983-08-24 Hitachi Ltd Semiconductor device
JPS63313812A (en) * 1987-06-16 1988-12-21 Sony Corp Manufacture of semiconductor integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116732A (en) * 1981-12-29 1983-07-12 Fujitsu Ltd Charge beam exposing method and apparatus therefor
JPS58142522A (en) * 1982-02-19 1983-08-24 Hitachi Ltd Semiconductor device
JPS63313812A (en) * 1987-06-16 1988-12-21 Sony Corp Manufacture of semiconductor integrated circuit device

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